CN113478101A - Processing protector that chip substrate cutting equipment used - Google Patents
Processing protector that chip substrate cutting equipment used Download PDFInfo
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- CN113478101A CN113478101A CN202110824495.XA CN202110824495A CN113478101A CN 113478101 A CN113478101 A CN 113478101A CN 202110824495 A CN202110824495 A CN 202110824495A CN 113478101 A CN113478101 A CN 113478101A
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- China
- Prior art keywords
- substrate
- fixing table
- tail gas
- chip substrate
- substrate cutting
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
- B01D53/14—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols by absorption
- B01D53/18—Absorbing units; Liquid distributors therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0869—Devices involving movement of the laser head in at least one axial direction
- B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/16—Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
- B23K26/703—Cooling arrangements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
- B23K37/0408—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work for planar work
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D2258/00—Sources of waste gases
- B01D2258/02—Other waste gases
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses a processing protective device for chip substrate cutting equipment, which relates to the field of chip substrate processing equipment and comprises a machine body, wherein a substrate fixing table is arranged in the machine body, and a laser cutting assembly is arranged in the machine body and above the substrate fixing table, and has the advantages that: the invention places a substrate on a placing table top consisting of a plurality of supporting plates at the upper end of a substrate fixing table, controls a pair of telescopic rods driven by a positioning hydraulic drive to extend to push the substrate by a push plate at the end of the telescopic rod, positions and positions the substrate, places the substrate on the placing table top consisting of a plurality of supporting plates at the upper end of the substrate fixing table, accelerates the air to pass through the gaps of the supporting plates by controlling an exhaust pump to perform air extraction during the cutting process of the substrate, rapidly dissipates heat of the cut part of the substrate, and simultaneously guides tail gas generated by cutting into a tail gas treatment tank through an air duct to be treated.
Description
Technical Field
The invention relates to the field of chip substrate processing equipment, in particular to a processing protection device for chip substrate cutting equipment.
Background
The PCB substrate is a substrate for bonding the chip, and the PCB substrate original plate needs to be cut into a desired shape by a cutting device so as to be conveniently bonded with the chip. In the traditional substrate cutting device, the substrate is cut by the laser beam, so that the temperature of the substrate is increased rapidly due to strong heat energy, the point is melted or vaporized rapidly due to high temperature, and the purpose of processing is achieved by matching with the running track of the laser head. During laser cutting, the point position of the substrate after cutting needs to be ensured to be rapidly cooled so as to prevent the cutting part from being deformed due to high temperature and influencing the cutting strength; the PCB substrate is cut to have some stink, and the PCB substrate needs to be treated and discharged, so that the production workshop environment is prevented from being influenced.
Disclosure of Invention
The present invention is directed to a processing protection device for a chip substrate cutting apparatus, so as to solve the problems in the background art.
In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides a processing protector that chip substrate cutting equipment was used, includes the organism, the inside base plate fixed station that is equipped with of organism, the organism is inside and be located the base plate fixed station top and be equipped with the laser cutting subassembly, the cutting subassembly is including Y axle slide bar, the Y axle lead screw that is equipped with in the inside upper end of organism, is connected with laser drive machine case on Y axle slide bar, the Y axle lead screw, and the bottom of laser drive machine case is equipped with vertical decurrent laser generator, the one end of Y axle lead screw is connected with the drive assembly transmission of the Y axle drive incasement portion of organism inside wall, the front side of organism is equipped with control box, and the collection has display screen and button control panel on the control box.
Preferably, the base plate fixed station is the top and is equipped with the open-ended case type body, and the last port of base plate fixed station is equipped with the vertical backup pad that just is horizontal arranging of polylith.
Preferably, the front side and the rear side of the upper port of the substrate fixing table are welded with positioning hydraulic support plates, positioning hydraulic drives are fixed on the positioning hydraulic support plates, two positioning hydraulic drive telescopic rods are oppositely directed to the middle of the substrate fixing table, and push plates are arranged at the end parts of the positioning hydraulic drive telescopic rods.
Preferably, the other two side walls of the substrate fixing table are both fixed with pressing hydraulic drives, the telescopic rods driven by the pressing hydraulic drives vertically upwards, the upper ends of the telescopic rods driven by the pressing hydraulic drives are provided with pressing plates extending towards the middle of the substrate fixing table, and elastic rubber pads are bonded and fixed below the inner ends of the pressing plates.
Preferably, an X-axis slide bar and an X-axis screw rod are arranged inside the machine body and located on two sides of the bottom of the substrate fixing table, connecting seats are arranged on two sides of the bottom of the substrate fixing table and connected with the corresponding X-axis slide bar and the corresponding X-axis screw rod respectively, and one end of the X-axis screw rod is in transmission connection with an output shaft of the X-axis positioning motor.
Preferably, an infrared locator is arranged on one side of the laser driving case, and a detection end of the infrared locator is vertically directed downwards.
Preferably, the bottom of the substrate fixing table is provided with an exhaust interface, the lower end of the exhaust interface is connected with an exhaust pump, and an exhaust joint of the exhaust pump is connected to the bottom inside the tail gas treatment tank through an air guide pipe.
Preferably, the tail gas absorption liquid is stored in the tail gas treatment tank, an exhaust pipe is arranged on one side of the upper end of the tail gas treatment tank, and the exhaust pipe extends out along one side of the machine body.
Preferably, the inside bottom of tail gas treatment jar is equipped with the gas distribution plate, and is located the gas distribution plate top and is equipped with the air guide plate that the polylith slant set up.
Preferably, a pair of sliding doors is slidably connected to the front side of the machine body, and an observation window sealed by toughened glass is formed in each sliding door.
The invention has the technical effects and advantages that:
1. the invention places a substrate on a placing table top consisting of a plurality of supporting plates at the upper end of a substrate fixing table, pushes the substrate by a push plate at the end of a telescopic rod of the telescopic rod by controlling the extension of a pair of telescopic rods driven by positioning hydraulic pressure, positions and positions the substrate, and then quickly presses and fixes two ends of the substrate by controlling the retraction of the telescopic rod driven by pressing hydraulic pressure;
2. the substrate is placed on the placing table top formed by the support plates at the upper end of the substrate fixing table, gaps exist among the support plates, heat dissipation is convenient to conduct during substrate cutting, air is quickened to conduct air pumping work through the exhaust pump in the substrate cutting process, the part, cut by the substrate, is quickly dissipated, and meanwhile tail gas generated by cutting is guided into the tail gas treatment tank through the air guide pipe to be treated;
3. according to the tail gas treatment tank, the tail gas absorption liquid is stored in the tail gas treatment tank, the cutting tail gas connected through the gas guide pipe is introduced into the tail gas hand sanitizer to absorb harmful substances in the tail gas, the gas dispersing plate is arranged at the bottom inside the tail gas treatment tank, the gas guide pipe separates the introduced tail gas into fine bubbles under the separation filter screen of the gas dispersing plate, the treatment efficiency of the tail gas by the absorption liquid is ensured, the gas guide plates which are obliquely arranged are arranged above the gas dispersing plate, the contact time of the tail gas and the absorption liquid is prolonged, and the absorption effect is ensured.
Drawings
Fig. 1 is a schematic perspective view of the present invention.
Fig. 2 is a front cross-sectional view of the structure of the present invention.
Fig. 3 is a cross-sectional view taken at a-a in fig. 2.
Fig. 4 is a cross-sectional view at B-B in fig. 2.
Fig. 5 is an enlarged view at C in fig. 2.
In the figure: 1. a body; 101. a sliding door; 1011. an observation window; 2. a substrate fixing table; 201. a support plate; 202. a connecting seat; 3. pressing and hydraulic driving; 301. pressing the plywood; 4. position-adjusting hydraulic drive; 401. pushing the plate; 5. an X-axis slide bar; 501. an X-axis lead screw; 5011. an X-axis positioning motor; 6. a Y-axis slide bar; 601. a Y-axis lead screw; 6011. a Y-axis drive box; 7. a laser driver chassis; 701. a laser generator; 8. an infrared locator; 9. an exhaust pump; 10. an air duct; 11. a tail gas treatment tank; 1101. an exhaust pipe; 1102. a gas distribution plate; 1103. a gas guide plate; 12. a control cabinet; 1201. a display screen; 1202. and a key control panel.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The invention provides a processing protection device for chip substrate cutting equipment as shown in figures 1-5, which comprises a machine body 1, wherein a substrate fixing table 2 is arranged in the machine body 1, a laser cutting assembly is arranged in the machine body 1 and above the substrate fixing table 2, the substrate fixing table 2 is a box-shaped body with an opening arranged above the substrate fixing table, a plurality of vertical and transversely arranged supporting plates 201 are arranged at an upper end opening of the substrate fixing table 2, and the substrate is placed on the plurality of supporting plates 201, so that heat dissipation is facilitated when the substrate is cut due to gaps among the supporting plates 201, as shown in figures 1 and 2.
Referring to fig. 1, fig. 2 and fig. 4, a positioning hydraulic support plate is welded to the front and rear sides of the upper port of the substrate fixing table 2, a positioning hydraulic driver 4 is fixed on the positioning hydraulic support plate, the telescopic rods of the two positioning hydraulic drivers 4 are directed to the middle of the substrate fixing table 2 relatively, a push plate 401 is arranged at the end of each telescopic rod of the positioning hydraulic driver 4, after a chip is placed on the supporting plate 201, the telescopic rods of the positioning hydraulic drivers 4 are controlled to extend, so that the push plate 401 at the end of each telescopic rod pushes the substrate, and the substrate is positioned and aligned.
Referring to fig. 1, 2 and 4, the other two side walls of the substrate fixing table 2 are fixed with the pressing hydraulic drives 3, the telescopic rods of the pressing hydraulic drives 3 are vertically upward, and the upper ends of the telescopic rods of the pressing hydraulic drives 3 are provided with the pressing plates 301 extending to the middle of the substrate fixing table 2, after the substrate is straightened, the telescopic rods of the pressing hydraulic drives 3 are controlled to retract, so that the pressing plates 301 at the upper ends of the telescopic rods are pressed and fixed at the two ends of the substrate, elastic rubber pads are bonded and fixed below the inner ends of the pressing plates 301, and the substrate is protected in the substrate pressing process.
Referring to fig. 1, 2 and 3, an X-axis slide bar 5 and an X-axis screw 501 are disposed inside a machine body 1 and located at two sides of the bottom of a substrate fixing table 2, and two sides of the bottom of the substrate fixing table 2 are both provided with a connecting seat 202 respectively connected with the corresponding X-axis slide bar 5 and the corresponding X-axis screw 501, one end of the X-axis screw 501 is in transmission connection with an output shaft of an X-axis positioning motor 5011, the X-axis positioning motor 5011 drives the X-axis screw 501 to move, so that the substrate fixing table 2 moves along a Y-middle direction, a cutting assembly includes a Y-axis slide bar 6 and a Y-axis screw 601 disposed at the upper end inside the machine body 1, the Y-axis slide bar 6 and the Y-axis screw 601 are connected with a laser driving machine box 7, a laser generator 701 vertically downward is disposed at the bottom of the laser driving machine box 7, one end of the Y-axis screw 601 is in transmission connection with a driving assembly inside a Y-axis driving box 6011 on the inner side wall of the machine body 1, the Y-axis lead 601 is driven by an internal driving component of a Y-axis driving box 6011, the laser driving box 7 is controlled to move along the X-axis direction in an engraving control mode, the laser driving box 7 is combined with the movement of the laser driving box 7 along the X-axis direction and the movement of the substrate fixing table 2 along the Y-axis direction, various shapes of the substrate can be conveniently cut (the X-axis direction and the Y-axis direction are defined as relative positions), an infrared positioner 8 is arranged on one side of the laser driving box 7, the detection end of the infrared positioner 8 points downwards vertically, the position of the substrate is detected and positioned through the infrared positioner 8, and the initial cutting point position of the laser driving box 7 is determined.
As shown in fig. 2, the bottom of base plate fixed station 2 is equipped with the exhaust interface, and exhaust interface lower extreme is connected with exhaust pump 9, exhaust joint of exhaust pump 9 is connected to 11 inside bottoms of tail gas treatment jar through air duct 10, tail gas absorption liquid has been stored to 11 inside of tail gas treatment jar wherein, the cutting tail gas of inserting by air duct 10 lets in the tail gas liquid soap, absorb the harmful substance in the tail gas, upper end one side of tail gas treatment jar 11 is equipped with blast pipe 1101, blast pipe 1101 extends along one side of organism 1 and runs through, the tail gas after will handling is discharged.
As shown in fig. 5, the inside bottom of the exhaust gas treatment tank 11 is provided with a gas-dredging plate 1102, the exhaust gas introduced from the gas-guiding pipe 10 is separated under the separation sieve of the gas-dredging plate 1102 to form fine bubbles, so as to ensure the treatment efficiency of the absorption liquid on the exhaust gas, and a plurality of gas-guiding plates 1103 obliquely arranged above the gas-dredging plate 1102 are arranged to prolong the contact time between the exhaust gas and the absorption liquid, so as to ensure the absorption effect.
The front side of the machine body 1 is slidably connected with a pair of sliding doors 101, the sliding doors 101 need to be closed when a substrate is cut to prevent cutting tail gas from overflowing, an observation window 1011 sealed by toughened glass is formed in each sliding door 101 and used for observing the cutting process of the substrate, the front side of the machine body 1 is provided with a control cabinet 12, a display screen 1201 and a key control panel 1202 are integrated on the control cabinet 12, and the display screen 1201 and the key control panel 1202 are combined to control each working part of the invention.
The working principle of the invention is as follows: when the device works, a substrate is placed on a placing table top formed by a plurality of supporting plates 201 at the upper end of a substrate fixing table 2, the telescopic rods of a pair of positioning hydraulic drives 4 are controlled to extend, so that the push plates 401 at the ends of the telescopic rods push the substrate, the substrate is positioned and aligned, then the telescopic rods of a pressing hydraulic drive 3 are controlled to retract, so that the pressing plates 301 at the upper ends of the telescopic rods press and fix the two ends of the substrate, and then the substrate can be cut by a laser cutting assembly above the substrate fixing table 2;
in the above, the substrate is placed on the placing table top formed by the plurality of supporting plates 201 at the upper end of the substrate fixing table 2, gaps exist among the supporting plates 201, heat dissipation is convenient to perform during substrate cutting, in the cutting process of the substrate, air is exhausted by controlling the exhaust pump 9, the air passing through the gaps among the supporting plates 201 is accelerated, heat dissipation is performed on the part of the substrate after cutting, and meanwhile, tail gas generated by cutting is guided into the tail gas treatment tank 11 through the air guide pipe 10 to be treated;
the inside tail gas absorption liquid that has stored of foretell tail gas treatment tank 11, the cutting tail gas that inserts by air duct 10 lets in the tail gas liquid soap, absorb the harmful substance in the tail gas, the inside bottom of tail gas treatment tank 11 is equipped with gas distribution plate 1102, the tail gas that is separated by air duct 10 and lets in under gas distribution plate 1102's separation filter sieve is tiny bubble, guarantee the treatment effeciency of absorption liquid to tail gas, be located gas distribution plate 1103 that gas distribution plate 1102 top was equipped with the polylith slant setting, the contact time of extension tail gas and absorption liquid, guarantee the absorption effect, tail gas through the processing is discharged along blast pipe 1101.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.
Claims (10)
1. The utility model provides a processing protector that chip substrate cutting equipment was used, includes organism (1), its characterized in that: organism (1) inside is equipped with base plate fixed station (2), and organism (1) is inside and is located base plate fixed station (2) top and is equipped with the laser cutting subassembly, the cutting subassembly is including Y axle slide bar (6), Y axle lead screw (601) that are located organism (1) inside upper end and are equipped with, is connected with laser drive machine case (7) on Y axle slide bar (6), the Y axle lead screw (601), and the bottom of laser drive machine case (7) is equipped with vertical decurrent laser generator (701), the one end of Y axle lead screw (601) is connected with the inside drive assembly transmission of Y axle drive case (6011) of organism (1) inside wall, the front side of organism (1) is equipped with control box (12), and the set has display screen (1201) and button control panel (1202) on control box (12).
2. The processing guard for a chip substrate cutting apparatus according to claim 1, wherein: the base plate fixed station (2) is a box-shaped body with an opening arranged above, and a plurality of vertical supporting plates (201) which are transversely arranged are arranged at an upper port of the base plate fixed station (2).
3. A processing guard for a chip substrate cutting apparatus according to claim 2, wherein: the front side and the rear side of an upper port of the substrate fixing table (2) are welded with positioning hydraulic support plates, positioning hydraulic drives (4) are fixed on the positioning hydraulic support plates, telescopic rods of the two positioning hydraulic drives (4) are oppositely directed to the middle of the substrate fixing table (2), and the end parts of the telescopic rods of the positioning hydraulic drives (4) are provided with push plates (401).
4. A processing guard for a chip substrate cutting apparatus according to claim 2, wherein: and the other two side walls of the substrate fixing table (2) are respectively fixed with a pressing hydraulic drive (3), a telescopic rod of the pressing hydraulic drive (3) vertically upwards is arranged, the upper end of the telescopic rod of the pressing hydraulic drive (3) is provided with a pressing plate (301) extending towards the middle part of the substrate fixing table (2), and an elastic rubber pad is bonded and fixed below the inner end of the pressing plate (301).
5. The processing guard for a chip substrate cutting apparatus according to claim 1, wherein: the X-axis slide bar (5) and the X-axis screw rod (501) are arranged in the machine body (1) and located on two sides of the bottom of the substrate fixing table (2), connecting seats (202) are arranged on two sides of the bottom of the substrate fixing table (2) and connected with the corresponding X-axis slide bar (5) and the X-axis screw rod (501) respectively, and one end of the X-axis screw rod (501) is in transmission connection with an output shaft of an X-axis positioning motor (5011).
6. The processing guard for a chip substrate cutting apparatus according to claim 1, wherein: an infrared locator (8) is arranged on one side of the laser driving case (7), and the detection end of the infrared locator (8) points downwards vertically.
7. The processing guard for a chip substrate cutting apparatus according to claim 1, wherein: the bottom of base plate fixed station (2) is equipped with the exhaust interface, and the exhaust interface lower extreme is connected with exhaust pump machine (9), and the exhaust joint of exhaust pump machine (9) is connected to the inside bottom of tail gas treatment jar (11) through air duct (10).
8. The processing guard for a chip substrate cutting apparatus according to claim 7, wherein: the tail gas absorption liquid is stored in the tail gas treatment tank (11), an exhaust pipe (1101) is arranged on one side of the upper end of the tail gas treatment tank (11), and the exhaust pipe (1101) extends out along one side of the machine body (1).
9. The processing guard for a chip substrate cutting apparatus according to claim 7, wherein: the inside bottom of tail gas treatment jar (11) is equipped with air-phobic plate (1102), and is located air-phobic plate (1102) top and is equipped with air deflector (1103) that the polylith slant set up.
10. The processing guard for a chip substrate cutting apparatus according to claim 7, wherein: the front side of the machine body (1) is connected with a pair of sliding doors (101) in a sliding mode, and an observation window (1011) sealed by toughened glass is formed in each sliding door (101).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110824495.XA CN113478101A (en) | 2021-07-21 | 2021-07-21 | Processing protector that chip substrate cutting equipment used |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110824495.XA CN113478101A (en) | 2021-07-21 | 2021-07-21 | Processing protector that chip substrate cutting equipment used |
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| CN113478101A true CN113478101A (en) | 2021-10-08 |
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| CN202110824495.XA Pending CN113478101A (en) | 2021-07-21 | 2021-07-21 | Processing protector that chip substrate cutting equipment used |
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| CN207548932U (en) * | 2017-11-29 | 2018-06-29 | 无锡职业技术学院 | A kind of box-type water cutting machine for replacing laser cutting |
| CN208374488U (en) * | 2018-05-25 | 2019-01-15 | 天津市滨海新区华诚机械制造有限公司 | A kind of laser machine cutting bed |
| CN108515279A (en) * | 2018-06-13 | 2018-09-11 | 湖北易同科技发展有限公司 | It laser machines Quick Response Code and automates line laser cutting machine |
| CN208450847U (en) * | 2018-06-30 | 2019-02-01 | 苏州首镭激光科技有限公司 | New pattern laser board separator |
| CN210548917U (en) * | 2019-06-12 | 2020-05-19 | 重庆依斯普激光技术股份有限公司 | Plate pipe laser cutting machine with cutting opening capable of being cooled rapidly |
| CN211759259U (en) * | 2019-12-31 | 2020-10-27 | 帝再恩汽车系统(上海)有限公司 | Laser cutting machine convenient to location |
| CN111085783A (en) * | 2020-01-06 | 2020-05-01 | 柳州职业技术学院 | Automatic marking device of machine parts |
| CN112775541A (en) * | 2020-07-27 | 2021-05-11 | 苏州富润泽激光科技有限公司 | Laser cutting equipment for printed circuit board |
| CN112714549A (en) * | 2020-12-25 | 2021-04-27 | 杭州升达电子有限公司 | Intelligent production equipment and method for producing PCB |
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