CN112714549A - Intelligent production equipment and method for producing PCB - Google Patents

Intelligent production equipment and method for producing PCB Download PDF

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Publication number
CN112714549A
CN112714549A CN202011567353.1A CN202011567353A CN112714549A CN 112714549 A CN112714549 A CN 112714549A CN 202011567353 A CN202011567353 A CN 202011567353A CN 112714549 A CN112714549 A CN 112714549A
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CN
China
Prior art keywords
pcb
substrate
pressing
plate
fixedly connected
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Pending
Application number
CN202011567353.1A
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Chinese (zh)
Inventor
林卫权
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Hangzhou Shengda Electronics Co ltd
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Hangzhou Shengda Electronics Co ltd
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Publication date
Application filed by Hangzhou Shengda Electronics Co ltd filed Critical Hangzhou Shengda Electronics Co ltd
Priority to CN202011567353.1A priority Critical patent/CN112714549A/en
Publication of CN112714549A publication Critical patent/CN112714549A/en
Pending legal-status Critical Current

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0044Mechanical working of the substrate, e.g. drilling or punching
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0015Orientation; Alignment; Positioning
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/0404Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408Incorporating a pick-up tool
    • H05K13/0409Sucking devices
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0008Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0058Laminating printed circuit boards onto other substrates, e.g. metallic substrates

Abstract

The invention discloses intelligent production equipment for producing a PCB (printed circuit board), which mainly solves the problems that the functions of the existing PCB production equipment are single and the PCB production process is rough. The intelligent production equipment comprises a base station, a substrate cutting device arranged on the base station, a vacuum adsorption gripping device arranged on the base station and positioned behind the substrate cutting device and used for transferring a substrate after cutting, a pressing device arranged on the base station and positioned behind the substrate cutting device and used for pressing the multilayer substrate, and a labeling machine used for performing RFID label sticking on the substrate after pressing. The invention utilizes the substrate cutting device to cut the substrate for producing the PCB into the specified size, then transfers the cut substrate to the laminating device through the vacuum adsorption gripping device, utilizes the laminating device to laminate a plurality of substrates to form a multilayer PCB, and then pastes the RFID passive electronic tag on each PCB through the labeling machine, thereby realizing the intelligent tracking in the PCB production process. The production process is more standard and standard, and the cutting and pressing precision is higher.

Description

Intelligent production equipment and method for producing PCB
Technical Field
The invention relates to the technical field of PCB processing and manufacturing, in particular to intelligent production equipment and method for producing a PCB.
Background
PCBs are also known as printed circuit boards, and are providers of electrical connections for electronic components. The design of the method is mainly layout design; the circuit board has the main advantages of greatly reducing errors of wiring and assembly, and improving the automation level and the production labor rate.
With the popularization of electronic intelligent devices, the demand of PCBs is higher and higher, and the requirements on the manufacturing process and the manufacturing precision of the PCBs are also higher and higher. The existing PCB production equipment has single function and rough production process, and cannot meet the requirement of electronic equipment on the precision of the PCB. Therefore, there is a need for an improvement of the existing PCB production equipment.
Disclosure of Invention
The invention aims to provide intelligent production equipment and method for producing a PCB (printed Circuit Board), which mainly solve the problems that the functions of the existing PCB production equipment are single and the PCB production process is rough.
In order to achieve the purpose, the technical scheme adopted by the invention is as follows:
an intelligent production device for producing PCBs comprises a base platform, a substrate cutting device arranged on the base platform, a vacuum adsorption gripping device arranged on the base platform and positioned behind the substrate cutting device and used for transferring cut substrates, a laminating device arranged on the base platform and positioned behind the substrate cutting device and used for laminating multilayer substrates, and a labeling machine used for RFID label sticking of the laminated substrates; the substrate cutting device comprises a first conveying mechanism and a second conveying mechanism which are arranged on the base platform, an isolation cover which is arranged on the base platform and covers the rear half section of the first conveying mechanism and the front half section of the second conveying mechanism, a laser cutting mechanism arranged above the interior of the isolation cover, and a smoke dust absorption device which is arranged below the base platform and is right opposite to the cutting part of the laser cutting mechanism; and sieve pores through which the smoke passes are arranged on the table top of the base station opposite to the smoke absorbing device.
Furthermore, the laser cutting mechanism comprises two beams arranged above the inside of the isolation cover, slide rails arranged on the front side faces of the two beams, a transmission chain arranged on the top face of the beam at the top end, a driving motor arranged on the side wall of the isolation cover and used for driving the transmission chain, and a laser cutting machine fixedly connected with the transmission chain and connected with the slide rails in a clearance embedding manner.
Furthermore, a dust hood, a smoke filter sieve, a smoke purification device and a fan are sequentially arranged in the air passage circulation direction of the smoke absorption device.
Furthermore, the vacuum adsorption gripping device comprises a portal frame arranged on the base station, a track arranged at the upper end of the portal frame, a first moving trolley running on the track, a vacuum generator carried on the first moving trolley, an electric telescopic rod connected with the lower end of the first moving trolley, a gas conveying hose arranged inside the electric telescopic rod and connected with the vacuum generator, and a sucker arranged at the end head of the electric telescopic rod and communicated with the gas conveying hose.
Furthermore, the pressing device comprises a mounting plate which is fixed on the base platform through a support leg and is provided with an opening in the center, a first hydraulic cylinder which is installed on the base platform and is opposite to the opening, a pressing heating support plate which is fixedly connected with the other end of the first hydraulic cylinder, an upward pressing mechanism which is arranged on the mounting plate and can move on the mounting plate, and a correcting mechanism which is arranged on the mounting plate and is used for correcting the position of the substrate to be pressed.
Furthermore, the upper pressing mechanism comprises a pair of track sliding grooves arranged on the mounting plate, a second moving trolley running in each track sliding groove, a support frame fixedly connected to the second moving trolley, a mounting beam connected between the support frames, a second hydraulic cylinder fixedly connected to the lower side of the mounting beam, and a lower pressing plate connected to the lower end of the second hydraulic cylinder.
Furthermore, the correcting mechanism comprises a bracket fixed on the mounting plate, an L-shaped positioning plate fixedly connected to the bracket and aligned with the edge of the pressing heating support plate, and a moving alignment mechanism matched with the L-shaped positioning plate for use.
Furthermore, the moving alignment mechanism comprises a front and rear horizontal moving mechanism arranged on the mounting plate, two groups of guard plates fixedly connected to the mounting plate, a moving plate fixedly connected with one side of the front and rear horizontal moving mechanism and slidably connected with the guard plates at two sides, a left and right horizontal moving mechanism arranged on the moving plate, and an L-shaped correcting push plate fixedly connected with one end of the left and right horizontal moving mechanism; the front and back horizontal moving mechanism and the left and right horizontal moving mechanism have the same structure.
Further, the front and rear horizontal moving mechanism comprises a fixed block fixedly connected to the mounting plate and an electric push rod fixedly connected with one side of the fixed block, wherein the moving plate is fixedly connected to one end of the electric push rod; in the left and right horizontal moving mechanism, the L-shaped correcting push plate is fixedly connected to one end of the electric push rod.
The invention also provides a method for producing the PCB, which adopts the intelligent production equipment for producing the PCB and comprises the following steps:
(S1) cutting the substrate into a designated size of the PCB board using the substrate cutting apparatus;
(S2) transferring the cut substrates onto a pressing heating support plate of a pressing device by a vacuum suction gripping device;
(S3) pressing the plurality of substrates by using the pressing mechanism of the pressing device to cooperate with the pressing heating support plate to form the PCB with the multilayer structure;
(S4) grabbing and transferring the laminated PCB with the multilayer structure to a labeling machine by using the vacuum adsorption grabbing device again;
(S5) RFID label sticking is carried out on the PCB by using a labeling machine, and intelligent tracking of the PCB production process is realized.
Compared with the prior art, the invention has the following beneficial effects:
(1) according to the invention, a substrate cutting device is used for cutting a substrate for producing the PCB into a specified size, then the cut substrate is transferred to a laminating device through a vacuum adsorption gripping device, a plurality of substrates are laminated to form a multilayer PCB through the laminating device, and then an RFID passive electronic tag is attached to each PCB through a labeling machine, so that the intelligent tracking in the PCB production process is realized.
(2) According to the substrate cutting device, the isolation cover is arranged, so that smoke dust is blocked in the isolation cover when the cutting device performs cutting, and is absorbed under the absorption action of the smoke dust absorption device, so that the situation that the production workshop is polluted by the smoke dust, the threat to the body health of operators is caused, and the abrasion is caused to equipment is avoided.
(3) According to the laminating device, the correcting mechanism is arranged, the L-shaped positioning plate is matched with the mobile alignment mechanism, the position of the multilayer substrate on the laminating heating supporting plate is corrected, the edges of the multilayer substrates to be laminated are aligned when the multilayer substrates are sequentially laminated, the production standard of the multilayer PCB is higher, and the high requirement of electronic equipment on the PCB is met.
(4) The pressing mechanism is convenient to move on the mounting plate by arranging the movable trolley, so that when the vacuum adsorption gripping device transfers the substrate, the problem that the substrate material is blocked by the pressing plate and cannot be discharged is avoided, and the use is convenient.
Drawings
Fig. 1 is a schematic front structural view of the present invention.
Fig. 2 is a schematic top view of the present invention.
Fig. 3 is a schematic structural diagram of a substrate cutting apparatus according to the present invention.
FIG. 4 is a schematic view of the installation position of the laser cutting machine and the beam according to the present invention.
Fig. 5 is a schematic top view of the pressing device of the present invention.
Fig. 6 is a schematic cross-sectional view of the pressing device according to the present invention.
Wherein, the names corresponding to the reference numbers are:
1-base station, 2-substrate cutting device, 3-vacuum adsorption gripping device, 4-pressing device, 5-labeling machine, 10-first conveying mechanism, 11-second conveying mechanism, 12-isolation cover, 13-laser cutting mechanism, 14-smoke absorbing device, 15-dust absorbing cover, 16-smoke filtering screen, 17-smoke purifying device, 18-fan, 131-beam, 132-slide rail, 133-driving chain, 134-driving motor, 135-laser cutting machine, 21-portal frame, 22-rail, 23-first moving trolley, 24-vacuum generator, 25-electric telescopic rod, 26-gas hose, 27-suction cup, 41-mounting plate, 42-first hydraulic cylinder, 43-pressing and heating supporting plate, 44-pressing mechanism, 45-correcting mechanism, 441-rail sliding groove, 442-second moving trolley, 443-supporting frame, 444-second hydraulic cylinder, 445-lower pressing plate, 446-mounting beam, 451-bracket, 452-L-shaped positioning plate, 453-moving aligning mechanism, 454-front and back horizontal moving mechanism, 455-moving plate, 456-left and right horizontal moving mechanism, 457-L-shaped correcting push plate, 458-guard plate, 4541-fixing block and 4542-electric push rod.
Detailed Description
The present invention will be further described with reference to the following description and examples, which include but are not limited to the following examples.
Examples
As shown in fig. 1 to 6, the intelligent production equipment for producing PCBs disclosed by the present invention includes a base table 1, a substrate cutting device 2 disposed on the base table 1, a vacuum suction gripping device 3 disposed on the base table 1 and behind the substrate cutting device 2 for transferring a cut substrate, a laminating device 4 disposed on the base table 1 and behind the substrate cutting device 2 for laminating a multilayer substrate, and a labeling machine 5 for performing RFID label bonding on the laminated substrate. The base plate cutting device cuts the base plate for producing the PCB into a specified size, then transfers the cut base plate to the laminating device through the vacuum adsorption gripping device, utilizes the laminating device to laminate a plurality of base plates to form a multi-layer PCB, and then attaches the RFID passive electronic tag to each PCB through the labeling machine, so that the intelligent tracking in the PCB production process is realized. The labelling machine is obtained by procurement, in this example, under the model LEGI-AIR 5300 RFID.
In this embodiment, the substrate cutting device 2 includes a first conveying mechanism 10 and a second conveying mechanism 11 disposed on the base platform 1, a shielding case 12 disposed on the base platform 1 and covering the rear half section of the first conveying mechanism 10 and the front half section of the second conveying mechanism 11, a laser cutting mechanism 13 disposed above the inside of the shielding case 12, and a smoke absorbing device 14 disposed below the base platform 1 and facing the cutting portion of the laser cutting mechanism 13; the table top of the base table 1 opposite to the smoke dust absorption device 14 is provided with a sieve pore through which smoke dust passes. When carrying out the base plate cutting, at first place on first transport mechanism 10 at the cage base plate, the base plate is sent into the cage along with first transport mechanism 10 and is cut, during the cutting, the smoke and dust is blockked in the cage, and under smoke and dust absorbing device's absorption effect, absorb the processing with the smoke and dust, avoid the smoke and dust to pollute the workshop, bring the threat to operating personnel's health, bring wearing and tearing for equipment, the base plate after the cutting is sent out the cage by second transport mechanism 11, be convenient for follow-up vacuum adsorption grabbing device's the transfer of snatching. The first conveying mechanism 10 and the second conveying mechanism 11 both adopt a conventional crawler-type conveying device.
In this embodiment, the laser cutting mechanism 13 includes two beams 131 disposed above the inside of the isolation hood 12, a slide rail 132 disposed on the front side of the two beams 131, a driving chain 133 disposed on the top surface of the top beam 131, a driving motor 134 disposed on the side wall of the isolation hood 12 for driving the driving chain 133, and a laser cutter 135 fixedly connected to the driving chain 133 and in clearance fit with the slide rail 132. When cutting, the driving motor is used for driving the transmission chain, so that the transmission chain drives the laser cutting machine to move on the cross beam, and the cutting of the substrate is realized.
In this embodiment, a dust hood 15, a smoke filter screen 16, a flue gas purification device 17, and a fan 18 are sequentially installed in the gas path flowing direction of the smoke absorber 14. The solid particles in the smoke are separated when passing through the smoke filter screen 16, and then the smoke is discharged after being filtered by the smoke purifying device 17. Avoid pollution and workshop.
In this embodiment, the vacuum suction gripping device 3 includes a gantry 21 disposed on the base 1, a rail 22 disposed at an upper end of the gantry 21, a first moving cart 23 running on the rail 22, a vacuum generator 24 mounted on the first moving cart 23, an electric telescopic rod 25 connected to a lower end of the first moving cart 23, a gas transmission hose 26 disposed inside the electric telescopic rod 25 and connected to the vacuum generator 24, and a suction cup 27 disposed at an end head of the electric telescopic rod 25 and communicated with the gas transmission hose 26. When the base plate is transferred, the moving trolley is controlled to run on the track on the portal frame to realize transfer, the vacuum generator generates negative pressure at the west sucker to grab the base plate, after the designated position is grabbed, the vacuum generator stops working, the sucker loses adsorption force, the base plate falls, and the transfer is completed. Wherein, the first moving trolley 23 and the vacuum generator 24 are controlled by a PLC control system.
In this embodiment, the pressing device 4 includes a mounting plate 41 fixed to the base 1 by a leg and having an opening at the center, a first hydraulic cylinder 42 mounted on the base 1 and facing the opening, a pressing heating support plate 43 fixedly connected to the other end of the first hydraulic cylinder 42, a pressing mechanism 44 disposed on the mounting plate 41 and movable on the mounting plate 41, and a correcting mechanism 45 disposed on the mounting plate 41 for correcting the position of the substrate to be pressed. After the vacuum adsorption gripping device transfers the cut substrates to the pressing heating supporting plate 43, the L-shaped positioning plate is matched with the moving alignment mechanism to correct the positions of the multilayer substrates on the pressing heating supporting plate, so that the edges of the multilayer substrates to be pressed are aligned when the multilayer substrates are sequentially stacked, the production standard of the multilayer PCB is higher, and the high requirement of electronic equipment on the PCB is met.
In this embodiment, the upper pressing mechanism 44 includes a pair of rail sliding grooves 441 disposed on the mounting plate 41, a second moving cart 442 running in each rail sliding groove 441, a support frame 443 fixedly connected to the second moving cart 442, a mounting beam 446 connected between the support frames 443, a second hydraulic cylinder 444 fixedly connected to the lower side of the mounting beam 443, and a lower pressing plate 445 connected to the lower end of the second hydraulic cylinder 444. Since the lower pressing plate is located right above the pressing and heating support plate 43, if the pressing mechanism is not displaced, the vacuum suction gripping device cannot transfer the substrate onto the pressing and heating support plate 43, and therefore, the second moving cart is provided for the upper pressing mechanism 44, so that the upper pressing mechanism can be moved, the upper pressing mechanism is moved away when the substrate is transferred, and the lower pressing plate is returned when the pressing is performed. Likewise, the second motion vector is also controlled using the PLC control system.
In this embodiment, the straightening mechanism 45 includes a bracket 451 fixed to the mounting plate 41, an L-shaped positioning plate 452 fixedly connected to the bracket 451 and aligned with an edge of the press-fit heating support plate 43, and a moving alignment mechanism 453 cooperating with the L-shaped positioning plate 452. The mobile alignment mechanism 453 comprises a front and rear horizontal moving mechanism 454 arranged on the mounting plate 41, two groups of protection plates 458 fixedly connected to the mounting plate, a moving plate 455 fixedly connected to one side of the front and rear horizontal moving mechanism 454 and slidably connected to the protection plates 458 on the two sides, a left and right horizontal moving mechanism 456 arranged on the moving plate 455, and an L-shaped correcting push plate 457 fixedly connected to one end of the left and right horizontal moving mechanism 456; the front-rear horizontal movement mechanism 454 and the left-right horizontal movement mechanism 456 have the same structure. The front and rear horizontal moving mechanism 454 comprises a fixed block 4541 fixedly connected to the mounting plate 41 and an electric push rod 4542 fixedly connected to one side of the fixed block 4541, wherein the moving plate 455 is fixedly connected to one end of the electric push rod 4542; in the left-right horizontal movement mechanism 456, the L-shaped correcting push plate 457 is fixedly connected to one end of an electric push rod 4542. When the substrate position correction is performed, first, the height of the press-fit heating support plate 43 is adjusted to be flush with the lower end surface of the L-shaped positioning plate 452 by the first hydraulic cylinder, and then the L-shaped correcting push plate 457 is pushed by the front-rear horizontal moving mechanism and the left-right horizontal moving mechanism to align the multilayer substrates, thereby performing the position correction of the substrate stack.
Through the design, the PCB production device utilizes the substrate cutting device to cut the substrate for producing the PCB into the specified size, then transfers the cut substrate to the laminating device through the vacuum adsorption gripping device, utilizes the laminating device to laminate a plurality of substrates to form a multilayer PCB, and then utilizes the labeling machine to label each PCB with the RFID passive electronic tag, thereby realizing the intelligent tracking in the PCB production process. The production process is more standard and standard, and the cutting and pressing precision is higher. Therefore, compared with the prior art, the invention has outstanding substantive features and remarkable progress.
The above-mentioned embodiment is only one of the preferred embodiments of the present invention, and should not be used to limit the scope of the present invention, but all the insubstantial modifications or changes made within the spirit and scope of the main design of the present invention, which still solve the technical problems consistent with the present invention, should be included in the scope of the present invention.

Claims (10)

1. The intelligent production equipment for producing the PCB is characterized by comprising a base platform (1), a substrate cutting device (2) arranged on the base platform (1), a vacuum adsorption gripping device (3) which is arranged on the base platform (1) and is positioned behind the substrate cutting device (2) and used for transferring a cut substrate, a laminating device (4) which is arranged on the base platform (1) and is positioned behind the substrate cutting device (2) and used for laminating a multilayer substrate, and a labeling machine (5) used for performing RFID label pasting on the laminated substrate; the substrate cutting device (2) comprises a first conveying mechanism (10) and a second conveying mechanism (11) which are arranged on the base platform (1), an isolation cover (12) which is arranged on the base platform (1) and covers the rear half section of the first conveying mechanism (10) and the front half section of the second conveying mechanism (11), a laser cutting mechanism (13) which is arranged above the inner part of the isolation cover (12), and a smoke absorbing device (14) which is arranged under the base platform (1) and is opposite to the cutting part of the laser cutting mechanism (13); the table top of the base table (1) opposite to the smoke dust absorption device (14) is provided with a sieve hole (15) through which smoke dust passes.
2. The intelligent production equipment for producing the PCB as recited in claim 1, wherein the laser cutting mechanism (13) comprises two beams (131) arranged above the inside of the isolation hood (12), slide rails (132) arranged on the front sides of the two beams (131), a transmission chain arranged on the top surface of the beam (131) at the top end, a driving motor (133) arranged on the side wall of the isolation hood (12) and used for driving the transmission chain, and a laser cutting machine (134) fixedly connected with the transmission chain and connected with the slide rails (132) in a clearance embedding manner.
3. The intelligent production equipment for producing the PCB as recited in claim 2, wherein a dust hood (16), a dust filter screen (17), a flue gas purification device (18) and a fan (19) are sequentially installed in the gas path circulation direction of the dust absorption device (14).
4. The intelligent production equipment for producing the PCB as recited in claim 3, wherein the vacuum adsorption gripping device (3) comprises a portal frame (21) arranged on the base (1), a rail (22) arranged at the upper end of the portal frame (21), a first moving trolley (23) running on the rail (22), a vacuum generator (24) carried on the first moving trolley (23), an electric telescopic rod (25) connected with the lower end of the first moving trolley (23), a gas hose (26) arranged inside the electric telescopic rod (25) and connected with the vacuum generator (24), and a suction cup (27) arranged at the head end of the electric telescopic rod (25) and communicated with the gas hose (26).
5. An intelligent production apparatus for producing PCBs (printed circuit boards) as claimed in claim 4, wherein the pressing device (4) comprises a mounting plate (41) fixed on the base (1) through a support leg and having an opening at the center, a first hydraulic cylinder (42) mounted on the base (1) and facing the opening, a pressing heating support plate (43) fixedly connected with the other end of the first hydraulic cylinder (42), a pressing mechanism (44) arranged on the mounting plate (41) and movable on the mounting plate (41), and a correcting mechanism (45) arranged on the mounting plate (41) for correcting the position of the substrate to be pressed.
6. An intelligent production apparatus for producing PCBs as claimed in claim 5, wherein said pressing mechanism (44) comprises a pair of rail sliding grooves (441) provided on the mounting plate (41), a second moving carriage (442) running in each rail sliding groove (441), a support frame (443) fixedly connected to the second moving carriage (442), a mounting beam (446) connected between the support frames (443), a second hydraulic cylinder (444) fixedly connected to the lower side of the mounting beam (443), and a lower pressing plate (445) connected to the lower end of the second hydraulic cylinder (444).
7. The intelligent production equipment for producing the PCB of claim 6, wherein the correction mechanism (45) comprises a bracket (451) fixed on the mounting plate (41), an L-shaped positioning plate (452) fixedly connected on the bracket (451) and aligned with the edge of the pressing heating support plate (43), and a moving alignment mechanism (453) used together with the L-shaped positioning plate (452).
8. The intelligent production equipment for producing the PCB of claim 7, wherein the mobile alignment mechanism (453) comprises a front and rear horizontal movement mechanism (454) arranged on the mounting plate (41), two groups of protection plates (458) fixedly connected to the mounting plate, a moving plate (455) fixedly connected to one side of the front and rear horizontal movement mechanism (454) and slidably connected to the protection plates (458) at two sides, a left and right horizontal movement mechanism (456) arranged on the moving plate (455), and an L-shaped correction push plate (457) fixedly connected to one end of the left and right horizontal movement mechanism (456); wherein the front-back horizontal movement mechanism (454) and the left-right horizontal movement mechanism (456) have the same structure.
9. The intelligent production apparatus for producing the PCB of claim 8, wherein the front-to-back horizontal movement mechanism (454) comprises a fixed block (4541) fixedly connected to the mounting plate (41), and an electric push rod (4542) fixedly connected to one side of the fixed block (4541), wherein the moving plate (455) is fixedly connected to one end of the electric push rod (4542); in the left-right horizontal moving mechanism (456), the L-shaped correcting push plate (457) is fixedly connected to one end of an electric push rod (4542).
10. A method for producing a PCB, wherein the intelligent production apparatus for producing a PCB of any one of claims 1 to 9 is used, comprising the steps of:
(S1) cutting the substrate into a designated size of the PCB board using the substrate cutting apparatus;
(S2) transferring the cut substrates onto a pressing heating support plate of a pressing device by a vacuum suction gripping device;
(S3) pressing the plurality of substrates by using the pressing mechanism of the pressing device to cooperate with the pressing heating support plate to form the PCB with the multilayer structure;
(S4) grabbing and transferring the laminated PCB with the multilayer structure to a labeling machine by using the vacuum adsorption grabbing device again;
(S5) RFID label sticking is carried out on the PCB by using a labeling machine, and intelligent tracking of the PCB production process is realized.
CN202011567353.1A 2020-12-25 2020-12-25 Intelligent production equipment and method for producing PCB Pending CN112714549A (en)

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Application Number Priority Date Filing Date Title
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Publication Number Publication Date
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CN113478101A (en) * 2021-07-21 2021-10-08 常州机电职业技术学院 Processing protector that chip substrate cutting equipment used
CN113490346A (en) * 2021-07-28 2021-10-08 苏州斯尔特微电子有限公司 Chip mounter and chip mounting method
CN113814125A (en) * 2021-10-13 2021-12-21 涡阳县华丽木业有限公司 Feeding, gluing and pressing integrated equipment for composite board production
CN114390799A (en) * 2022-03-24 2022-04-22 深圳市联胜电子实业有限公司 Combined processing equipment for producing flexible circuit board
CN114554733A (en) * 2022-04-25 2022-05-27 绵阳新能智造科技有限公司 Pasting device for laminated PCB (printed circuit board)

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CN205471591U (en) * 2015-12-26 2016-08-17 浙江名匠实业股份有限公司 Conveying mechanism is snatched in transfer of heat preservation decorative board
CN109894876A (en) * 2019-03-18 2019-06-18 赣州逸豪新材料股份有限公司 A kind of cutting of aluminum substrate, pressing, deburring integrated production line
CN210899890U (en) * 2019-12-10 2020-06-30 深圳生溢快捷电路有限公司 Press fitting device is used in PCB production
CN212191752U (en) * 2020-05-08 2020-12-22 四川科尔威光电科技有限公司 Cutting device for semiconductor processing

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113478101A (en) * 2021-07-21 2021-10-08 常州机电职业技术学院 Processing protector that chip substrate cutting equipment used
CN113490346A (en) * 2021-07-28 2021-10-08 苏州斯尔特微电子有限公司 Chip mounter and chip mounting method
CN113490346B (en) * 2021-07-28 2022-10-04 苏州斯尔特微电子有限公司 Chip mounter and chip mounting method
CN113814125A (en) * 2021-10-13 2021-12-21 涡阳县华丽木业有限公司 Feeding, gluing and pressing integrated equipment for composite board production
CN114390799A (en) * 2022-03-24 2022-04-22 深圳市联胜电子实业有限公司 Combined processing equipment for producing flexible circuit board
CN114390799B (en) * 2022-03-24 2022-06-07 深圳市联胜电子实业有限公司 Combined processing equipment for producing flexible circuit board
CN114554733A (en) * 2022-04-25 2022-05-27 绵阳新能智造科技有限公司 Pasting device for laminated PCB (printed circuit board)

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