CN112620976A - PCB laser cutting machine and cutting method thereof - Google Patents
PCB laser cutting machine and cutting method thereof Download PDFInfo
- Publication number
- CN112620976A CN112620976A CN202011587502.0A CN202011587502A CN112620976A CN 112620976 A CN112620976 A CN 112620976A CN 202011587502 A CN202011587502 A CN 202011587502A CN 112620976 A CN112620976 A CN 112620976A
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- positioning
- pcb
- cutting machine
- plate
- laser cutting
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- 238000005520 cutting process Methods 0.000 title claims abstract description 48
- 238000003698 laser cutting Methods 0.000 title claims abstract description 36
- 238000000034 method Methods 0.000 title claims abstract description 12
- 239000000428 dust Substances 0.000 claims abstract description 35
- 238000001179 sorption measurement Methods 0.000 claims abstract description 15
- 230000007246 mechanism Effects 0.000 claims abstract description 12
- 239000002699 waste material Substances 0.000 claims abstract description 10
- 239000011159 matrix material Substances 0.000 claims abstract description 4
- 238000004064 recycling Methods 0.000 claims abstract description 3
- 239000000779 smoke Substances 0.000 claims description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- 238000009434 installation Methods 0.000 claims description 3
- 238000007599 discharging Methods 0.000 claims description 2
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 238000010521 absorption reaction Methods 0.000 abstract description 2
- 238000003801 milling Methods 0.000 description 3
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000011084 recovery Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/142—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
- B23K37/04—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work
- B23K37/0408—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work for planar work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention provides a PCB laser cutting machine and a cutting method thereof, wherein the cutting machine comprises a cutting machine body and an industrial integrator, wherein a laser cutting mechanism is arranged on the cutting machine body, and a positioning tool is arranged below the laser cutting mechanism; the positioning tool comprises a base, wherein a supporting stand column is arranged on the base and is connected with a connecting plate, a dust absorption box is arranged below the connecting plate, a positioning plate is arranged on the connecting plate, a supporting plate is arranged on the positioning plate, matched positioning bosses distributed in a matrix manner are arranged on the supporting plate and the positioning plate, a blanking port is arranged between the end parts of the adjacent positioning bosses, and an adsorption port is arranged in each rectangle enclosed by the positioning bosses; and a dust removal pipe is connected between the industrial integrator and the dust collection box. The PCB cutting machine integrates positioning, clamping, dust removing and waste recycling of PCB cutting, and improves cutting precision.
Description
Technical Field
The invention belongs to the technical field of cutting machines, and particularly relates to a PCB laser cutting machine and a cutting method thereof.
Background
In recent years, electronic products and electronic processing industries at home and abroad tend to be miniaturized, the size of a used PCB is smaller and smaller, and enterprises generally splice a plurality of PCBs with the same specification into a large board. Therefore, the division of the PCB into large boards becomes a key process in production. In the traditional PCB cutting technology, a large board is usually cut by using a contact method such as high-pressure water or a mechanical cutter, and the like, and in the cutting process, the large board bears a certain cutting force, so that the clamping force applied by a clamp is increased, and a tiny circuit in the board is easily damaged. For example, a milling cutter is used for cutting a PCB, manual operation, tool setting and the like are usually needed, so that the cutting precision is difficult to guarantee, and the diameter of the milling cutter is small because the gap between PCBs is small, so that the phenomenon of cutter changing due to shutdown caused by the breakage of the milling cutter often occurs, and the cutting efficiency is difficult to guarantee.
The laser cutting PCB board is processed in a non-contact mode, and compared with the traditional cutting mode, the laser cutting PCB board has the advantages of high processing precision, high processing speed, low cost and the like. The positioning mode of laser cutting of the PCB mostly adopts a mechanical mode to clamp the PCB for positioning, and the MARK point on the PCB is automatically identified by a high-resolution CCD probe to assist in positioning, but a large amount of smoke dust is generated in the process of cutting the PCB and is attached to the PCB, so that the appearance of the PCB is influenced, the positioning accuracy is influenced, and the cutting processing accuracy is influenced.
Disclosure of Invention
The invention aims to provide a PCB laser cutting machine and a cutting method thereof, which integrate the positioning, clamping, dust removal and waste recovery of PCB cutting and improve the cutting precision.
The invention provides the following technical scheme:
a laser cutting machine for a PCB comprises a cutting machine body and an industrial integrator, wherein a laser cutting mechanism is arranged on the cutting machine body, and a positioning tool is arranged below the laser cutting mechanism; the positioning tool comprises a base, a supporting stand column is arranged on the base and connected with a connecting plate, a dust collection box is arranged below the connecting plate, a positioning plate is arranged on the connecting plate, a supporting plate is arranged on the positioning plate, matched positioning bosses distributed in a matrix form are arranged on the supporting plate and the positioning plate, blanking ports are arranged between the end parts of the adjacent positioning bosses, an adsorption port is arranged in each rectangle enclosed by the positioning bosses, the blanking ports and the adsorption ports are communicated with the dust collection box, positioning pins and positioning holes are further arranged on the positioning plate respectively, and positioning pins are arranged between the positioning holes and the supporting plate in a penetrating manner; and a dust removal pipe is connected between the industrial integrator and the dust collection box.
Preferably, laser cutting mechanism includes laser instrument, coaxial camera, beam expanding lens, shakes mirror, camera lens, annular light source and operation module, the operation module includes X axle module, Y axle module and Z axle module, laser instrument slidable mounting be in on the Z axle module, the laser instrument front end is connected with coaxial camera, coaxial camera is connected with the mirror that shakes, be equipped with the camera lens on the mirror that shakes, the camera lens has annular light source, still be connected with the beam expanding lens on the mirror that shakes, X axle module slidable mounting be in on the Y axle module, base slidable mounting be in on the X axle module, annular light source with the location frock is corresponding.
Preferably, the industrial integrator is provided with an air outlet, the positioning tool is provided with an air inlet, and the dust removal pipe is connected with the air inlet and the air outlet.
Preferably, the number of the positioning pins is at least 3.
Preferably, the cutting machine body is further connected with a water tank.
A cutting method of a PCB laser cutting machine comprises the following steps:
during feeding, a PCB is placed on the supporting plate, the positioning pins on the positioning plate complete supporting plate installation and guiding, the supporting plate is matched with the positioning bosses of the positioning plate to complete coarse positioning of the PCB, and a coaxial camera automatically identifies MARK points to perform fine positioning of the PCB;
after positioning, vacuum clamping is adopted for clamping, the industrial integrator is connected with the dust collection box and tightly sucks the PCB from the adsorption port through the dust collection box, and laser cutting is carried out;
and waste materials and smoke dust generated after cutting pass through the blanking port and enter the industrial integrator through a vacuum adsorption path for recycling or discharging.
The invention has the beneficial effects that: the industrial dust collector is used for combining positioning, clamping, dust removal and waste recovery in the whole PCB cutting process on the tool, vacuum adsorbing, positioning and clamping the PCB, recovering smoke and waste in the cutting process, timely cleaning the smoke and improving the cutting accuracy; the laser cutting mechanism adopts the coaxial camera, so that the setting of the offset parameter of the camera is reduced, and the cutting precision is improved.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
FIG. 1 is a schematic diagram of the overall structure of the present invention;
FIG. 2 is a schematic view of the internal structure of the cutting machine body of the present invention;
FIG. 3 is an exploded view of the positioning tool of the present invention;
FIG. 4 is a rear structural view of the positioning tool of the present invention;
FIG. 5 is a schematic view of the positioning plate of the present invention;
FIG. 6 is a schematic view of the assembly of the supporting plate and the positioning plate according to the present invention;
labeled as: 1. a cutter body; 2. an industrial integrator; 4. a laser; 5, a Z-axis module; 6. a coaxial camera; 7. a beam expander; 8. a galvanometer; 9. a lens; 10. an annular light source; 11. positioning a tool; 12, a Y-axis module; an X-axis module; 14. an air inlet; 17. a base; 18. supporting the upright post; 19. a dust collection box; 20. a connecting plate; 21. positioning a plate; 22. a support plate; 23. a positioning pin; 24. positioning a pin; 25. positioning holes; 26. a blanking port; 27. an adsorption port; 28. and (5) positioning the boss.
Detailed Description
As shown in fig. 1-6, a laser cutting machine for a PCB comprises a cutting machine body 1 and an industrial integrator 2, wherein a laser cutting mechanism is arranged on the cutting machine body 1, and a positioning tool 11 is arranged below the laser cutting mechanism; the positioning tool 11 comprises a base 17, a supporting upright column 18 is arranged on the base 17, the supporting upright column 18 is connected with a connecting plate 20, a dust collection box 19 is arranged below the connecting plate 20, a positioning plate 21 is arranged on the connecting plate 20, a supporting plate 22 is arranged on the positioning plate 21, matched positioning bosses 28 distributed in a matrix are arranged on the supporting plate 22 and the positioning plate 21, blanking ports 26 are arranged between the end parts of the adjacent positioning bosses 28, an adsorption port 27 is arranged in each rectangle enclosed by the positioning bosses 28, the blanking ports 26 and the adsorption ports 27 are communicated with the dust collection box 19, positioning pins 24 and positioning holes 25 are respectively arranged on the positioning plate 21, and positioning pins 23 penetrate between the positioning holes 25 and the supporting plate 22; a dust removal pipe is connected between the industrial integrator 2 and the dust collection box 19.
As shown in fig. 2, laser cutting mechanism includes laser 4, coaxial camera 6, beam expander 7, the mirror 8 shakes, camera lens 9, annular light source 10 and operation module, the operation module includes X axle module 13, Y axle module 12 and Z axle module 5, 4 slidable mounting of laser is on Z axle module 5, 4 front ends of laser are connected with coaxial camera 6, coaxial camera 6 is connected with the mirror 8 that shakes, be equipped with camera lens 9 on the mirror 8 that shakes, camera lens 9 has annular light source 10, still be connected with beam expander 7 on the mirror 8 that shakes, X axle module 13 slidable mounting is on Y axle module 12, base 17 slidable mounting is on X axle module 13, annular light source 10 is corresponding with location frock 11, whole operation module, it carries out position adjustment to drive location frock 11, make things convenient for laser cutting device to carry out suitable position cutting, and make things convenient for coaxial camera 6 to carry out accurate location.
As shown in fig. 1-6, in the using process of the laser cutting machine for PCB boards, when loading, the PCB boards are placed on the supporting plate 22, and the guiding is completed by 3 positioning pins 24 on the positioning plate 21; the positioning is divided into two parts, the positioning is completed by the positioning pin 23 and the boss 28 on the positioning plate, and then the MARK point is automatically identified by the coaxial camera for fine positioning; the clamping adopts vacuum clamping, air in the adsorption port 27, the dust collection box 19 and the connecting plate 20 enters through the air inlet 14 of the industrial dust collector 2 and then is discharged through the air outlet 15, and a simple vacuum environment is generated to tightly adsorb the PCB; the waste generated after the cutting is finished passes through the blanking port 26 on the positioning plate 21 and enters the waste box inside the industrial integrator 2 through a vacuum adsorption path. The smoke and dust in the cutting process is discharged out through the air outlet 15 in the same path as the waste recovery.
Further, the cutting machine body still is connected with the water tank for laser cutting equipment's cooling, opens industry dust arrester 2 and water tank, puts the PCB board on layer board 22, puts layer board 22 on locating plate 21 again, snatchs 4 MARK points on the PCB board, and after camera discernment MARK point, each parameter of laser has set up, presses the start key, and the PCB board is cut apart to the laser instrument beginning, picks up layer board 22 after the cutting is accomplished, realizes whole cutting.
A cutting method of a PCB laser cutting machine comprises the following steps:
during feeding, the PCB is placed on the supporting plate 22, the positioning pins 24 on the positioning plate 22 are used for completing the installation and the guiding of the supporting plate 22, the supporting plate 22 is matched with the positioning bosses 28 of the positioning plate 21 for completing the coarse positioning of the PCB, and the coaxial camera 6 is used for automatically identifying MARK points for performing the fine positioning of the PCB;
after positioning, the clamping adopts vacuum clamping, the industrial integrator 2 is connected with the dust collection box 19 and tightly sucks the PCB from the adsorption port 27 through the dust collection box 19 for laser cutting;
waste and smoke generated after cutting are recycled or discharged from the industrial integrator 2 through the vacuum absorption path through the blanking port 26.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (6)
1. A laser cutting machine for a PCB is characterized by comprising a cutting machine body and an industrial integrator, wherein a laser cutting mechanism is arranged on the cutting machine body, and a positioning tool is arranged below the laser cutting mechanism; the positioning tool comprises a base, a supporting stand column is arranged on the base and connected with a connecting plate, a dust collection box is arranged below the connecting plate, a positioning plate is arranged on the connecting plate, a supporting plate is arranged on the positioning plate, matched positioning bosses distributed in a matrix form are arranged on the supporting plate and the positioning plate, blanking ports are arranged between the end parts of the adjacent positioning bosses, an adsorption port is arranged in each rectangle enclosed by the positioning bosses, the blanking ports and the adsorption ports are communicated with the dust collection box, positioning pins and positioning holes are further arranged on the positioning plate respectively, and positioning pins are arranged between the positioning holes and the supporting plate in a penetrating manner; and a dust removal pipe is connected between the industrial integrator and the dust collection box.
2. The laser cutting machine for the PCB of claim 1, wherein the laser cutting mechanism comprises a laser, a coaxial camera, a beam expander, a galvanometer, a lens, an annular light source and a running module, the running module comprises an X-axis module, a Y-axis module and a Z-axis module, the laser is slidably mounted on the Z-axis module, the front end of the laser is connected with the coaxial camera, the coaxial camera is connected with the galvanometer, the galvanometer is provided with the lens, the lens is provided with the annular light source, the galvanometer is further connected with the beam expander, the X-axis module is slidably mounted on the Y-axis module, the base is slidably mounted on the X-axis module, and the annular light source corresponds to the positioning tool.
3. The laser cutting machine for the PCB of claim 1, wherein the industrial integrator is provided with an air outlet, the positioning tool is provided with an air inlet, and the dust removal pipe is connected with the air inlet and the air outlet.
4. The laser cutting machine for PCB of claim 1, wherein the number of said positioning pins is at least 3.
5. The laser cutting machine for the PCB of claim 1, wherein the cutting machine body is further connected with a water tank.
6. The cutting method of the PCB laser cutting machine according to any one of claims 1 to 5, characterized by comprising the following steps:
during feeding, a PCB is placed on the supporting plate, the positioning pins on the positioning plate complete supporting plate installation and guiding, the supporting plate is matched with the positioning bosses of the positioning plate to complete coarse positioning of the PCB, and a coaxial camera automatically identifies MARK points to perform fine positioning of the PCB;
after positioning, vacuum clamping is adopted for clamping, the industrial integrator is connected with the dust collection box and tightly sucks the PCB from the adsorption port through the dust collection box, and laser cutting is carried out;
and waste materials and smoke dust generated after cutting pass through the blanking port and enter the industrial integrator through a vacuum adsorption path for recycling or discharging.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011587502.0A CN112620976A (en) | 2020-12-28 | 2020-12-28 | PCB laser cutting machine and cutting method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011587502.0A CN112620976A (en) | 2020-12-28 | 2020-12-28 | PCB laser cutting machine and cutting method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112620976A true CN112620976A (en) | 2021-04-09 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011587502.0A Pending CN112620976A (en) | 2020-12-28 | 2020-12-28 | PCB laser cutting machine and cutting method thereof |
Country Status (1)
| Country | Link |
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| CN (1) | CN112620976A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113478101A (en) * | 2021-07-21 | 2021-10-08 | 常州机电职业技术学院 | Processing protector that chip substrate cutting equipment used |
| CN113500290A (en) * | 2021-09-13 | 2021-10-15 | 深圳双十科技有限公司 | Laser cutting machine |
| CN113843559A (en) * | 2021-11-02 | 2021-12-28 | 深圳市则成电子股份有限公司 | A welding jig for FPC board |
| CN115625429A (en) * | 2022-10-18 | 2023-01-20 | 明光利拓智能科技有限公司 | Laser engraving device in laser engraving production line |
| CN117102697A (en) * | 2023-09-28 | 2023-11-24 | 芜湖雅葆轩电子科技股份有限公司 | PCB (printed circuit board) segmentation sampling device and method |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113478101A (en) * | 2021-07-21 | 2021-10-08 | 常州机电职业技术学院 | Processing protector that chip substrate cutting equipment used |
| CN113500290A (en) * | 2021-09-13 | 2021-10-15 | 深圳双十科技有限公司 | Laser cutting machine |
| CN113843559A (en) * | 2021-11-02 | 2021-12-28 | 深圳市则成电子股份有限公司 | A welding jig for FPC board |
| CN115625429A (en) * | 2022-10-18 | 2023-01-20 | 明光利拓智能科技有限公司 | Laser engraving device in laser engraving production line |
| CN117102697A (en) * | 2023-09-28 | 2023-11-24 | 芜湖雅葆轩电子科技股份有限公司 | PCB (printed circuit board) segmentation sampling device and method |
| CN117102697B (en) * | 2023-09-28 | 2024-03-19 | 芜湖雅葆轩电子科技股份有限公司 | PCB (printed circuit board) segmentation sampling device and method |
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