CN112747498A - Personal thermal management method based on Peltier effect - Google Patents
Personal thermal management method based on Peltier effect Download PDFInfo
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- 238000007726 management method Methods 0.000 title claims abstract description 21
- 230000005679 Peltier effect Effects 0.000 title claims abstract description 16
- 230000017525 heat dissipation Effects 0.000 claims abstract description 65
- 210000002569 neuron Anatomy 0.000 claims abstract description 35
- 238000006243 chemical reaction Methods 0.000 claims abstract description 17
- 238000004806 packaging method and process Methods 0.000 claims abstract description 17
- 238000010438 heat treatment Methods 0.000 claims abstract description 13
- 238000000034 method Methods 0.000 claims abstract description 9
- 230000005855 radiation Effects 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 10
- 230000033228 biological regulation Effects 0.000 claims description 9
- 238000013461 design Methods 0.000 claims description 8
- 238000005457 optimization Methods 0.000 claims description 8
- 238000009423 ventilation Methods 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- 238000005538 encapsulation Methods 0.000 claims description 7
- 239000004065 semiconductor Substances 0.000 claims description 7
- 229910052797 bismuth Inorganic materials 0.000 claims description 6
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 6
- 230000001105 regulatory effect Effects 0.000 claims description 6
- XSOKHXFFCGXDJZ-UHFFFAOYSA-N telluride(2-) Chemical compound [Te-2] XSOKHXFFCGXDJZ-UHFFFAOYSA-N 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
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- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 3
- 238000005265 energy consumption Methods 0.000 abstract description 9
- 238000004378 air conditioning Methods 0.000 abstract description 4
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- 238000011161 development Methods 0.000 description 4
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
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- A—HUMAN NECESSITIES
- A41—WEARING APPAREL
- A41D—OUTERWEAR; PROTECTIVE GARMENTS; ACCESSORIES
- A41D13/00—Professional, industrial or sporting protective garments, e.g. surgeons' gowns or garments protecting against blows or punches
- A41D13/002—Professional, industrial or sporting protective garments, e.g. surgeons' gowns or garments protecting against blows or punches with controlled internal environment
- A41D13/005—Professional, industrial or sporting protective garments, e.g. surgeons' gowns or garments protecting against blows or punches with controlled internal environment with controlled temperature
- A41D13/0053—Cooled garments
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D17/00—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces
- F25D17/04—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating air, e.g. by convection
- F25D17/06—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating air, e.g. by convection by forced circulation
- F25D17/08—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating air, e.g. by convection by forced circulation using ducts
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- Thermal Sciences (AREA)
- Combustion & Propulsion (AREA)
- Chemical & Material Sciences (AREA)
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- Devices That Are Associated With Refrigeration Equipment (AREA)
- Devices For Blowing Cold Air, Devices For Blowing Warm Air, And Means For Preventing Water Condensation In Air Conditioning Units (AREA)
Abstract
The invention relates to a personal thermal management method based on the Peltier effect. The method mainly comprises the following four steps: 1) combining a thermoelectric module with a heat dissipation plate and a heat dissipation fan to form a thermoelectric energy conversion device, and packaging the thermoelectric energy conversion device; 2) the micro air pump is used for guiding air to flow through the thermoelectric energy conversion device through a pipeline for heat exchange, and the air after heat exchange is sent into a micro hose network embedded into the wearable garment through the pipeline; 3) sending the target voltage to a single neuron PID controller, acquiring control parameters output by the controller, and giving out control voltage of the thermoelectric module according to the control parameters; 4) and a microcontroller is adopted for control, and PWM waves are adopted to adjust the power of the thermoelectric module according to data given by the single neuron PID controller. Aiming at the characteristics of large energy consumption and poor personal thermal comfort of the current heating, ventilating and air conditioning system, the invention improves the personal thermal comfort and simultaneously reduces the energy consumption of the air conditioner by introducing the personal thermal management device.
Description
Technical Field
The invention relates to a personal heat management method based on the Peltier effect, and belongs to the technical field of thermoelectric conversion.
Background
With the improvement of living standard, the living quality requirements of people are continuously improved, and more attention is paid to how to coordinate and optimize the human body comfort level and the energy consumption of an air conditioner. Heating and cooling of buildings consume a large amount of energy, and a conventional HAVC (heating ventilation and air conditioning) system is intended to create a uniform thermal environment in a certain space for pursuing collective thermal comfort, and a large amount of energy is consumed because heating and cooling temperatures of a building space are generally set in a range of about 21.1 to 23.9 ℃, and even at such a small range of temperature set values, more than 20% of residents feel discomfort due to individual differences. The building energy consumption is large, the thermal comfort level is not good, and the improvement of the thermal management of the building and the improvement of the comfort level of the residents are urgently needed.
The last decades have seen a major part of the development of modeling building HVAC systems based on large environmental data to adjust their temperature settings for collective comfort. The definition and prediction of thermal comfort has been internationally over 50 years old. The evaluation of thermal comfort was also developed quite well. Aiming at improving the thermal comfort of the residents, a lot of research is carried out, and the theory developed to the present is quite mature.
However, even within such a narrow range of temperature settings, more than 20% of people may feel uncomfortable due to individual differences (such as age, gender, clothing, or physiology). Also, in practice, for most air conditioning systems, there are large spatial differences in the environmental parameters of the room. Ignoring such differences can lead to an optimization effect that is inconsistent with the actual experience of the personnel in each area of the room, leading to various comfort complaints.
Therefore, the personal heat management technology, namely, the technology of creating a local heat environment around the human body instead of heating or cooling the whole building space, has the potential of greatly reducing the energy consumption of the building and has important practical significance and application value for improving the heat comfort of individuals.
Disclosure of Invention
Aiming at the characteristics of large heat management energy consumption and poor thermal comfort of the existing building, the invention utilizes the Peltier thermoelectric effect to control the current and voltage loaded to the thermoelectric module through the microprocessor so as to adjust the temperature of the cold side and the hot side; the miniature air pump is used for guiding air flow to flow through the surface of the thermoelectric module for heat exchange, and the guide hose in the wearable garment is used for regulating the temperature of a human body, so that the comfort level is improved, and the energy consumption of an air conditioner is reduced.
The technical scheme of the invention is as follows: a method of personal thermal management based on the peltier effect, comprising the steps of: 1) combining a thermoelectric module with a heat dissipation plate and a heat dissipation fan to construct a thermoelectric energy conversion device, and packaging the thermoelectric energy conversion device through an external packaging module; 2) the micro air pump is used for guiding air to flow through the thermoelectric energy conversion device through a pipeline for heat exchange, and the air after heat exchange is sent into a micro hose network embedded into the wearable garment through the pipeline; 3) sending the target voltage to a single neuron PID controller, acquiring control parameters output by the controller, and giving out control voltage of the thermoelectric module according to the control parameters; 4) and a microcontroller is adopted for control, and PWM waves are adopted to adjust the power of the thermoelectric module according to data given by the single neuron PID controller.
Furthermore, the thermoelectric module comprises a three-layer structure, a middle layer monomer is formed by connecting a thermocouple formed by a bismuth telluride semiconductor and a flow deflector in series, and two sides of the middle layer are provided with alumina ceramic layers.
Further, the heat dissipation plates are respectively attached to the hot and cold sides of the thermoelectric module; comprises a hot side heat dissipation plate and a cold side heat dissipation plate;
the material of the heat dissipation plate at the hot side is red copper, and the flaky fins are straight-through type;
the cold-side heat dissipation plate is an aluminum or copper heat dissipation plate, and the fins of the heat dissipation plate are divided into straight-through type one-row, four-row and multi-row dense teeth; the thickness optimization range of the cold-side radiating plate fins is 0.5-1.5mm, and the distance optimization range is 0.5-1.5 mm.
Furthermore, the whole size of the hot-side heat dissipation plate is 40 × 11mm, the base is 3mm thick, and the thickness of each base is 0.5 mm;
the fins of the cold-side heat dissipation plate are four rows of fins, the thickness of the fins is 0.8mm, and the distance between the fins is 0.6 mm.
Further, the external packaging module comprises a device main frame package, and an external airflow air inlet, a packaging rear cover and an air outlet which are respectively communicated with two sides of the device main frame package;
the external airflow air inlet comprises a circular hole cylinder air inlet 4 of a circular hole cylinder, a rectangular main frame and air inlet connecting body 5, a smooth curved surface 6, a preformed hole 7 and an inner side air inlet 8; the air inlet 4 is connected with the main frame and the connecting body 5 of the air inlet through a smooth curved surface 6; two ends of two adjacent side surfaces of the main frame and the connecting body 5 of the air inlet are provided with reserved holes 7, and linear positions are reserved for the thermoelectric module; in addition, the bottom surface of one side of the main frame and air inlet connecting body 5 is also provided with an inner side air inlet 8;
the device is characterized in that the device main frame is packaged into a shell structure, the top end of the device main frame is provided with a round small cooling fan air outlet 12, the left side surface and the right side surface of the device main frame are symmetrically provided with second hot side cooling plate heat dissipation ventilation openings 16, the rear side surface of the device main frame is sequentially provided with a small cooling fan line position hole 13, a first hot side cooling plate heat dissipation ventilation opening 15, two horizontally symmetrically arranged thermoelectric module line position holes 14 and a corresponding opening 17 of an inner side air inlet 8 from top to bottom; the front side of the device main frame package is a front side shell 10, and the front side is an open end face; the interior of the device main frame package is divided into an upper side and a lower side through a hot side heat dissipation plate and a small heat dissipation fan interval 11; the upper side is provided with a heat radiation main cavity body of a heat radiation plate at the hot side and an air outlet of a heat radiation fan; the lower side is provided with a heat exchange main cavity body of a cold side heat dissipation plate;
lid and air outlet behind the encapsulation are including the lid after the encapsulation, connect smooth curved surface 20, round hole post air outlet 21, and the lid designs into the bilayer after above-mentioned encapsulation, and the side direction cross-section is type L casing, and the block of type L casing vertical face one side is on front shell 10, and the protruding rectangle end in type L casing vertical face opposite side bottom is through connecting smooth curved surface 20 and connecting round hole post air outlet 21, and in addition, still open the corresponding mouth 22 of first hot side heating panel heat dissipation vent 15 on type L casing vertical face opposite side.
Further, in the step 3), a single neuron PID algorithm is built in the single neuron PID controller, and the PID control formula formed by the single neurons is
Δu(k)＝K{ω1(e(k)-e(k-1))+ω2e(k)+ω3(e(k)-2e(k-1)+e(k-2))}
Where K is the neuron gain coefficient, e (K) is the bias signal, x1＝e(k)－e(k－1)，x2＝e(k)，x3＝e(k)－2e(k－1)+e(k－2)，ωi(i-1, 2,3) is the corresponding input xiThe weight value of (i ═ 1,2,3), Δ u (k) is the increment of the output value. The weighting coefficients in the formula are adjusted on line by using a supervised Hebb learning rule, so that the self-adaption function of the uncertainty of the system is realized, and the learning algorithm is
ω1(k+1)＝ω1(k)+ηpe(k)u(k)(e(k)+Δe(k))
ω2(k+1)＝ω2(k)+ηie(k)u(k)(e(k)+Δe(k))
ω3(k+1)＝ω3(k)+ηde(k)u(k)(e(k)+Δe(k))
In the formula etap、ηi、ηdThe learning rates of the proportional, integral, and differential quantities, respectively.
Wherein x1(k),x2(k),x3(k) Three parameters required for neuron learning, r (t) and n (k) are respectively required temperature and actual voltage output, e (k) is temperature deviation, an expected set temperature value r (k) is used as an input signal, an actual set temperature value n (k) is used as a feedback signal, e (k) is a temperature deviation signal, namely e (k) ═ r (k) -n (k), xi(k) And (i ═ 1,2 and 3) is a neuron input signal obtained by converting the temperature error, the weight coefficient of the neuron input signal is adjusted on line through an algorithm, and u (k) is a single neuron PID control output signal used for controlling and regulating a voltage signal of the thermoelectric module, a target voltage is sent to the single neuron PID controller, the output value of the controller is made to track the target voltage, and the output value is supplied to the microcontroller to regulate and control the thermoelectric module.
Further, in the step 4), different voltage values are output by PWM pulse width modulation to control the thermoelectric module to emit different powers, the PWM wave of the microcontroller adopted in the design can only realize voltage regulation within the range of 0-5V, the PWM module and an external power supply are introduced, the external power supply supplies power, the introduced external power supply is modulated by receiving PWM signals with different periods and different duty ratios, which are emitted by the microprocessor, so that different voltages are output to supply power to the thermoelectric module.
The invention has the technical effects that: aiming at the characteristics of large energy consumption and poor personal thermal comfort of the current heating, ventilating and air conditioning system, the invention expands the temperature setting range of the central air conditioner by introducing the personal thermal management device while improving the personal thermal comfort, thereby effectively reducing the energy consumption of the air conditioner. Compared with the existing personal hose management methods, the single neuron PID control algorithm introduced by the invention can effectively improve the comfort of the human body and has great application potential. The self-adaption and self-organization functions of system structure, parameters and uncertainty are realized.
The thermoelectric module based on the Peltier effect has a three-layer structure, a middle layer monomer is formed by connecting a thermocouple formed by a bismuth telluride semiconductor and a flow deflector in series, and the bismuth telluride semiconductor has natural anisotropy and is a very good thermoelectric material with wide application. And the two sides of the middle layer are provided with the alumina ceramic layers, so that the heat conductivity, the mechanical strength and the high-temperature resistance are better. The cold source is provided for cooling in summer, and the effect is obvious. The external packaging module is used for packaging the thermoelectric module, the heating panel and the cooling fan into the simple thermoelectric energy conversion device, the module is integrated, an external airflow air inlet, an external airflow air outlet and each device are designed to be wired and a heat dissipation vent, the thermoelectric conversion device is portable and detachable after packaging, the external airflow circularly flows in the shell through the design of the staggered L-shaped shell, and cold measurement energy storage can be fully taken away by the external airflow.
Drawings
FIG. 1 is a schematic diagram of the Peltier effect;
FIG. 2 is a structural diagram of the thermoelectric module and the heat dissipation fan; (a) is a thermoelectric module; (b) the structure is the appearance structure of a heat radiation fan;
FIG. 3 is a block diagram of an external package; (a) packaging a drawing of an external airflow air inlet; (b) encapsulating the main frame for the device; (c) a rear cover and an air outlet;
FIG. 4, a thermoelectric energy conversion device packaging diagram;
FIG. 5 shows a copper heat sink structure on the hot side;
FIG. 6, cold side aluminum heat sink structure;
FIG. 7 is a schematic diagram of a structure of the micro air pump;
FIG. 8, hose network layout within a garment; (a) is Y-shaped; (b) is O type;
FIG. 9 is a diagram of a hose network in a garment;
FIG. 10 is a schematic diagram of the whole device;
FIG. 11, single neuron PID control algorithm block diagram;
FIG. 12 is a detailed flow chart for adjusting the temperature of the cold and hot sides.
In the figure, 1-first alumina ceramic layer; 2-interlayer monomer; 3-a second ceramic layer of alumina; 4-round hole cylinder air inlet; 5-a rectangular main frame and air inlet connector; 6-smooth curved surface; 7-preparing a hole; 8-inner air inlet; 9-side shell; 10-a front side housing; 11-heat side heat dissipation plate is spaced from small fan; 12-round small fan air outlet; 13-small fan line position holes; 14-line site holes; 15-first hot side heat dissipation plate heat dissipation ventilation opening; 16-second hot side heat sink heat dissipation vent; 17-corresponding opening of the inner side air inlet 8; a vertical face top end of the 18-like L-shaped shell; 19-vertical face rear end of type L housing; 20-connecting the smooth curved surfaces; 21-round hole column air outlet; 22-corresponding to the first hot side heat sink heat dissipation vent 15.
Detailed Description
The invention provides a personal thermal management method based on the Peltier effect, which comprises the following steps:
the method comprises the following steps: combining a thermoelectric module with a heat dissipation plate and a heat dissipation fan to construct a thermoelectric energy conversion device, and packaging the thermoelectric energy conversion device;
as shown in fig. 1, the peltier thermoelectric effect principle: when a circuit formed by different conductors is passed by a current, in addition to irreversible joule heating, at the junctions of the different conductors there occur phenomena of heat absorption and heat release due to the difference in the direction of the current. If the current flows from the end A with a larger number of free electrons to the end B with a smaller number of free electrons, the temperature at the end A is lowered.
The thermoelectric module based on the Peltier thermoelectric effect principle is assembled by the bismuth telluride semiconductor material and the heat-conducting alumina ceramic, and is high in thermoelectric conversion efficiency and wide in application range. The thermoelectric module comprises a semiconductor thermocouple arm, and a single body is formed by connecting flow deflectors with better heat conductivity and electrical conductivity in series and is arranged between two ceramic substrates. During the process of heating or cooling the module, the absorbed or released heat is in direct proportion to the magnitude of the direct current voltage loaded by the module. By adjusting the voltage, the temperature can be controlled.
The thermoelectric module based on the Peltier effect is composed of three layers (shown in figure 2), wherein a first aluminum oxide ceramic layer and a second aluminum oxide ceramic layer are arranged on two sides (shown in figures 1 and 3), and a middle layer single body 2 is formed by connecting a thermocouple formed by a bismuth telluride semiconductor and a flow deflector with good thermal conductivity and electrical conductivity in series (shown in figure 2). The thermoelectric modules are model TEC1-12710, FIG. 2. Is a high performance thermoelectric module. The external dimension is 40X 3.4 MM; specification of a lead: the lead length is 300MM +/-5 MM; internal resistance value: 1.2-1.5 omega; maximum temperature difference: Δ TMAX (Qc ═ 0) at 58 ℃ or higher; working current: IMAX ═ 10A (at 15VMAX voltage start); rated voltage: DC12V (VMAX: 15.5V); refrigeration power: QCMAX 120 w; assembling pressure: 85N/CM 2; the working environment is as follows: the temperature range is-55 ℃ to 83 ℃.
The actual effect of attaching the thermoelectric modules to both sides of the heat sink is as shown in fig. 2. And a heat radiation fan is arranged on the heat radiation plate, so that the heat radiation of the hot side surface of the thermoelectric module is further facilitated. The specific models are as follows: the DC BRUSHLESS AFB0412SHB FOO (DC 12V0.35A) three-wire (. specific parameters: double ball bearings, long service life, sufficient heat dissipation air volume and air pressure, capability of working in an environment with a relative humidity of 45-85%, large air volume (14.83CFM), low working noise, high rotating speed of a heat dissipation fan of 11000RPM and external dimension of 40 × 15 mm. two heat dissipation plates are attached to the heating and refrigerating sides of the thermoelectric module, the heat dissipation fan is arranged on the heat dissipation plates, the heat dissipation fan is packaged by using a 3D printing technology, and a heat exchange cavity, an air inlet and an air outlet are designed on the refrigerating side.
In the packaging process designed by the invention, ABS consumables are selected for 3D printing; the designed external packaging module comprises three parts: an external airflow air inlet, a device main frame package, a package rear cover and an air outlet.
The external air inlet part is shown in fig. 3(a), and the specific dimensions are as follows:
4, a circular hole cylinder air inlet with the inner diameter of 7mm, the outer diameter of 11mm, the wall thickness of 2mm, the length of the cylinder of 13mm and the deviation of one side of the air inlet to the center of 8 mm;
5, a connector of the main frame and the air inlet is 8.5mm in total width and 2mm in wall thickness, so that the middle of the material is saved;
6, smooth curved surface, the wall thickness is 2 mm;
7-preformed holes, wherein the two ends of the connecting part of the air inlet and the main frame are 5.5mm away from the edge, the preformed holes with the diameter of 3.2mm are formed, the hole depth is 6mm, and linear positions are reserved for the thermoelectric module;
8-inner side air inlet, which is communicated with 4 and 6 through 5, has length of 32mm and width of 9mm, is tangent to the semicircle with diameter of 9mm at two sides, deviates to the same side with the cylinder of the round hole of the air inlet, and is 2.8mm away from the bottom; 3mm from the edge.
② the packaging part of the main frame of the device is shown in figure 3 (b). The upper side of the part is provided with a heat radiation main cavity body of a heat radiation plate at the hot side and an air outlet of a heat radiation fan; the lower side of the part is provided with a heat exchange main cavity of a cold-side heat dissipation plate. The specific parameters are as follows:
main frame 47 × 50 mm; 9-side shell, left and right wall thickness 3 mm; 10-front side shell, the upper and lower wall thickness is 2.8 mm;
11-the heat dissipation plate at the hot side is spaced from the small fan, the spacing is 2mm, the distance from the bottom is 29.3mm, and the distance from the top is 18.7 mm;
12-small fan air outlet, 38mm small fan air outlet on top;
13-small fan line position holes with the distance of 12mm from the edge, the center distance interval 11 of 9.5mm and the side length of 7 mm;
14-thermoelectric module line position holes, 5.5mm from the edge, 15.8mm from the bottom and symmetrical at two sides;
15-first hot side heating panel heat dissipation vent, 15 sizes: the length is 34mm, the width is 10mm, and the lower end of the pipe is tightly attached to the center of the lower end of the pipe 11; a
16 — second hot side heat sink heat dissipation vent, 16 sizes: the length is 38mm, the width is 10mm, four corners are processed in an arc shape, the height position is the same as 15, the center position of the side wall is symmetrical on two sides;
17-the corresponding port of the inner side air inlet 8, and the air inlet is communicated with 8.
And the packaging rear cover and the air outlet part are shown in figure 3 (c). The cover is designed into a double-layer shell after being packaged by considering the hardness of materials and the stability of the structure. The back cover is attached to the groove of the frame, the wall thickness of the double layers is 2.5mm, and the width of the middle cavity is 8 mm. The design of the outer end air outlet is the same as that of the figure 7, and the round hole column air outlet 21 and the inner measuring air outlet are opposite to the other end of the air inlet in deviation. Make the air current form the backward flow in the device, be convenient for abundant heat transfer carries the cold energy that thermoelectric module produced to blow tree-like pipeline again. The dimensional parameters were as follows:
18-the top end (one side) of the vertical surface of the L-shaped shell has the same wall thickness of 2.8mm as 10, and the rear end (the other side) of the vertical surface of the L-shaped shell has the wall thickness of 2.5mm and 20-is connected with a smooth curved surface and has the thickness of 2 mm;
22-the corresponding opening of the first hot side heat dissipation plate heat dissipation ventilation opening 15, the size is the same as that of the first hot side heat dissipation plate heat dissipation ventilation opening 15, and the angle is processed in a semicircular mode.
The encapsulation effect is as in fig. 4.
As shown in fig. 5, the heat-side heat dissipation plate mainly aims at rapid and sufficient cooling. The material is red copper, the flaky fin is straight-through, and other design parameters are as follows: overall size 40 x 11mm, base thickness 3mm, 25 fins, each thickness 0.5 mm. The structure diagram is shown in figure 5.
As shown in fig. 6, the cold side needs to store sufficient cold energy, and its topology and size are critical factors. The parameters of the cold side cold plate selection (plate size and fin layout) were optimized using fluid dynamic (CFD) simulations. The method comprises the following basic steps: and manufacturing a geometric model of the heat dissipation plate by utilizing UG software, and performing CFD simulation and optimization on the heat dissipation effect by utilizing Fluent software. The optimization parameters comprise three aspects of the layout, the thickness and the distance of the fins of the heat dissipation plate, wherein the layout is divided into three types: straight-through type one-row, four-row and multi-row dense teeth; the optimized range of the thickness of the fins is 0.5-1.5mm, and the optimized range of the spacing is 0.5-1.5 mm. The optimization target is that the cold measurement energy storage effect is optimal. The results show that: the four rows of fins, the heat dissipation plates with the thickness of 0.8mm and the distance of 0.6mm can ensure that the temperature of the airflow at the air outlet is the lowest. The comparison shows that the energy storage effects of the aluminum and copper heat dissipation plates are not greatly different, and the aluminum heat dissipation plate structure shown in figure 6 is selected by considering the cost factor, and the overall size is 40 × 11 mm.
Step two: the micro air pump is used for guiding air to flow through the thermoelectric energy conversion device for heat exchange, and the air after heat exchange is sent into a micro hose network embedded into the wearable garment through a pipeline;
the miniature air pump is used for guiding airflow to flow through the gaps of the heat dissipation plates on the surface of the thermoelectric module for heat exchange, and the temperature of a human body is regulated through the diversion hose in the wearable garment.
As shown in fig. 7, the air pump directs air through the thermoelectric module and the hose network of the wearable device. The type of the air pump: WM7040DC 24V (fig. eight), characteristics: the volume is small (the diameter is 70mm, the height is 37.5mm), the noise is small, the high rotating speed-the no-load rotating speed reaches 36000RPM, the large air volume-the maximum air volume is 280L/m, sufficient air volume can be provided, the speed can be adjusted, the high air pressure-the maximum air pressure is 7KPa, the external driver is convenient to install and maintain, the speed can be adjusted, the NSK ball bearing is adopted, the brushless direct current motor is light in weight. The physical diagram is shown in FIG. 7.
The inner diameter of the adopted silica gel hose is 8mm, the outer diameter is 10mm, the material is silica gel, and the platinum vulcanization process is adopted, so that the silica gel hose is resistant to the temperature of-60-200 ℃, high in toughness, high in transparency, difficult to deform in stretching, and capable of changing color and whitening. Pass FDA food certification.
Designing the network layout of the hose in the garment, and selecting two network topologies: "Y" type and "O" type, as shown in FIG. 8.
The miniature hose network is embedded into the wearable garment, the pipeline is perforated, airflow can flow to the chest and the back of a human body quickly and uniformly, and the comfort of the human body is adjusted, as shown in fig. 9.
In summary, the personal thermal management device frame is shown in FIG. 10.
Step three: sending the target voltage to a single neuron PID controller, acquiring control parameters output by the controller, and giving out control voltage of the thermoelectric module according to the control parameters;
as shown in fig. 11, the PID control has the characteristics of simple structure principle, easy engineering implementation, and good robustness, and is widely used in practical applications. The PID controller introduces the neural network into PID control, improves the coefficient of the neural network in real time, deals with the influence caused by environmental noise, load disturbance and the like, avoids the phenomenon of poor regulation and control effect, introduces a supervised Hebb learning rule to update the weight coefficient of the temperature regulation and control system in the regulation and control process of the temperature control system, can be used as a PID controller for parameter self-tuning, and realizes the self-adaptation and self-organization functions of system structure, parameters and uncertainty.
In order to achieve the purpose of constant output of a temperature setting value, the single neuron PID algorithm is applied to a temperature regulation and control system to enhance the stability and the rapidity of the temperature regulation and control system, the neuron network has the advantages of good fault tolerance, strong anti-interference capability and the like, and is combined with a classical PID control algorithm, as shown in the following figure, the temperature of the thermoelectric module is controlled by controlling the regulation and control voltage of the thermoelectric module, and the precision of temperature output is improved.
Wherein x1(k),x2(k),x3(k) Three parameters required for neuron learning, r (t) and n (k) are respectively required temperature and actual voltage output, e (k) is temperature deviation, an expected set temperature value r (k) is used as an input signal, an actual set temperature value n (k) is used as a feedback signal, e (k) is a temperature deviation signal, namely e (k) ═ r (k) -n (k), xi(k) And (i is 1,2 and 3) is a neuron input signal obtained by converting the temperature error, the weight coefficient of the neuron input signal is adjusted on line through an algorithm, and u (k) is an output signal controlled by a single neuron PID and used for controlling and regulating a voltage signal of the thermoelectric module.
And sending the target voltage to a single neuron PID controller, enabling the output value of the controller to track the target voltage, supplying the output value to a microcontroller, and regulating and controlling a thermoelectric module.
Step four: and a microcontroller is adopted for control, and PWM waves are adopted to adjust the power of the thermoelectric module according to data given by the single neuron PID controller.
The microcontroller selects an Arduino development board which is a single-chip microcontroller with an open source code, uses an Atmel AVR singlechip, adopts a software and hardware platform with an open source code, is constructed on a simple input/output (simple I/O) interface board, and has a Processing/Wiring development environment using similar Java and C languages.
As Arduino can only regulate voltage at 0-5 v, a PWM module is introduced, power is supplied by an external power supply, and a development board inputs PWM signals to acquire different voltages to supply power to a thermoelectric module.
As shown in fig. 12, PWM (Pulse-width modulation), i.e., Pulse width modulation, is used to output different voltage values to control the thermoelectric module to emit different powers, which is the main way to output analog signals in the digital circuit. In Arduino, there are two ways that a PWM wave can be generated. The first method comprises the following steps: the pins with the voltage value can directly output PWM waves, and through using analog write commands, the val range is an integer value within 0-255 and corresponds to the voltage of 0-5V; and the second method comprises the following steps: PWM is implemented manually with a code. The advantages of this approach are evident: the proportion of PWM can be more accurate; the period and the frequency can be controlled; all pins can output. Therefore, the second mode is adopted in the design to output the PWM wave.
A detailed block diagram of the regulation of the temperature on the cold and hot sides by feedback control of the current and voltage applied to the thermoelectric module is shown in fig. 12.
An optimal temperature set point for the personal thermal management system is obtained and the cooling effect is controlled by adjusting the input voltage to the thermoelectric module via pulse width modulation. And then monitoring the body surface and core temperature of the participant wearing the garment in real time, evaluating the current comfort level and updating various parameter indexes of the human body.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.
Claims (7)
1. A method of personal thermal management based on the peltier effect, comprising the steps of: 1) combining a thermoelectric module with a heat dissipation plate and a heat dissipation fan to construct a thermoelectric energy conversion device, and packaging the thermoelectric energy conversion device through an external packaging module; 2) the micro air pump is used for guiding air to flow through the thermoelectric energy conversion device through a pipeline for heat exchange, and the air after heat exchange is sent into a micro hose network embedded into the wearable garment through the pipeline; 3) sending the target voltage to a single neuron PID controller, acquiring control parameters output by the controller, and giving out control voltage of the thermoelectric module according to the control parameters; 4) and a microcontroller is adopted for control, and PWM waves are adopted to adjust the power of the thermoelectric module according to data given by the single neuron PID controller.
2. The personal thermal management method based on the Peltier effect is characterized in that the thermoelectric module comprises a three-layer structure, a middle layer monomer is formed by connecting a thermocouple and a flow deflector which are composed of bismuth telluride semiconductors in series, and two sides of the middle layer are provided with aluminum oxide ceramic layers.
3. The personal thermal management method based on the Peltier effect as claimed in claim 1, wherein the heat dissipation plates are respectively attached to hot and cold sides of the thermoelectric module; comprises a hot side heat dissipation plate and a cold side heat dissipation plate;
the material of the heat dissipation plate at the hot side is red copper, and the flaky fins are straight-through type;
the cold-side heat dissipation plate is an aluminum or copper heat dissipation plate, and the fins of the heat dissipation plate are divided into straight-through type one-row, four-row and multi-row dense teeth; the thickness optimization range of the cold-side radiating plate fins is 0.5-1.5mm, and the distance optimization range is 0.5-1.5 mm.
4. The personal thermal management method based on the Peltier effect of claim 3,
the heat dissipation plate at the hot side has the overall size of 40 × 11mm, the base is 3mm thick, and 25 fins are arranged, wherein each fin is 0.5mm thick;
the fins of the cold-side heat dissipation plate are four rows of fins, the thickness of the fins is 0.8mm, and the distance between the fins is 0.6 mm.
5. The personal thermal management method based on the peltier effect as claimed in claim 1, wherein the external packaging module comprises a device main frame package, and an external airflow inlet, a package back cover and an air outlet which are respectively communicated with two sides of the device main frame package;
the external air inlet comprises a round hole cylinder air inlet (4), a rectangular main frame and air inlet connector (5), a smooth curved surface (6), a preformed hole (7) and an inner side air inlet (8); the air inlet (4) is connected with the main frame and the connecting body (5) of the air inlet through a smooth curved surface (6); two ends of two adjacent side surfaces of the main frame and the connecting body (5) of the air inlet are provided with reserved holes (7) for reserving linear positions for the thermoelectric module; in addition, the bottom surface of one side of the main frame and the air inlet connecting body (5) is also provided with an inner side air inlet (8);
the device is characterized in that the device main frame is packaged into a shell structure, the top end of the device main frame is provided with a round small radiating fan air outlet (12), the left side surface and the right side surface of the device main frame are symmetrically provided with second hot side radiating plate radiating ventilation openings (16), the rear side surface of the device main frame is sequentially provided with a small radiating fan line position hole (13), a first hot side radiating plate radiating ventilation opening (15), two horizontally and symmetrically arranged thermoelectric module line position holes (14) and a corresponding opening (17) of an inner side air inlet (8) from top to bottom; the front side of the device main frame package is a front side shell (10), and the front side is an open end face; the interior of the device main frame package is divided into an upper side and a lower side by a hot side heat dissipation plate and a small heat dissipation fan interval (11); the upper side is provided with a heat radiation main cavity body of a heat radiation plate at the hot side and an air outlet of a heat radiation fan; the lower side is provided with a heat exchange main cavity body of a cold side heat dissipation plate;
lid and air outlet behind the encapsulation are including the lid after the encapsulation, connect smooth curved surface (20), round hole post air outlet (21), the lid designs into the bilayer after above-mentioned encapsulation, the side direction cross-section is type L shell, the block is on preceding side shell (10) of the vertical face one side of type L shell, the protruding rectangle end in type L shell's vertical face opposite side bottom is through connecting smooth curved surface (20) and connecting round hole post air outlet (21), in addition, still open corresponding mouth (22) of first hot side heating panel heat dissipation vent (15) on the vertical face opposite side of type L shell.
6. The personal thermal management method based on the Peltier effect as claimed in claim 1, wherein in the step 3), a single neuron PID controller is built with a single neuron PID algorithm, and the PID control of the single neuron is
Δu(k)＝K{ω1(e(k)-e(k-1))+ω2e(k)+ω3(e(k)-2e(k-1)+e(k-2))}
Where K is the neuron gain coefficient, e (K) is the bias signal, x1＝e(k)－e(k－1)，x2＝e(k)，x3＝e(k)－2e(k－1)+e(k－2)，ωi(i-1, 2,3) is the corresponding input xi(i is 1,2,3) and Δ u (k) is the increment of the output value; the weighting coefficients in the formula are adjusted on line by using a supervised Hebb learning rule, so that the self-adaption function of the uncertainty of the system is realized, and the learning algorithm is
ω1(k+1)＝ω1(k)+ηpe(k)u(k)(e(k)+Δe(k))
ω2(k+1)＝ω2(k)+ηie(k)u(k)(e(k)+Δe(k))
ω3(k+1)＝ω3(k)+ηde(k)u(k)(e(k)+Δe(k))
In the formula etap、ηi、ηdLearning rates of proportional, integral, and differential quantities, respectively;
wherein x1(k),x2(k),x3(k) Three parameters required for neuron learning, r (t) and n (k) are respectively required temperature and actual voltage output, an expected set temperature value r (k) is used as an input signal, an actual set temperature value n (k) is used as a feedback signal, e (k) is a temperature deviation signal, namely e (k) r (k) -n (k),xi(k) and (i ═ 1,2 and 3) is a neuron input signal obtained by converting the temperature error, the weight coefficient of the neuron input signal is adjusted on line through an algorithm, and u (k) is an output signal controlled by the single neuron PID and used for regulating and controlling the voltage signal of the thermoelectric module, the target voltage is sent to the single neuron PID controller, the output value of the controller is made to track the target voltage, and the output value is supplied to the microcontroller to regulate and control the thermoelectric module.
7. The personal thermal management method based on the Peltier effect is characterized in that in the step 4), PWM pulse width modulation is adopted to output different voltage values to control the thermoelectric module to emit different powers, the PWM wave of the microcontroller adopted in the design can only realize voltage regulation within the range of 0-5V, the PWM module and an external power supply are introduced to supply power, the introduced external power supply is modulated by receiving PWM signals with different periods and different duty ratios, which are emitted by the microprocessor, so that different voltages are output to supply power to the thermoelectric module.
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| PCT/CN2021/079741 WO2022160416A1 (en) | 2021-01-29 | 2021-03-09 | Personal thermal comfort device based on peltier effect, and thermal management method |
| GB2305927.2A GB2614682A (en) | 2021-01-29 | 2021-03-09 | Personal thermal comfort device based on Peltier effect, and thermal management method |
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