CN207527871U - Runner gas temperature adjuster and hyperbaric chamber system - Google Patents
Runner gas temperature adjuster and hyperbaric chamber system Download PDFInfo
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- CN207527871U CN207527871U CN201721058884.1U CN201721058884U CN207527871U CN 207527871 U CN207527871 U CN 207527871U CN 201721058884 U CN201721058884 U CN 201721058884U CN 207527871 U CN207527871 U CN 207527871U
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Abstract
The utility model is related to a kind of runner gas temperature adjuster and hyperbaric chamber systems, the adjuster includes hot-side heat dissipation device, cold end radiator, semiconductor cooler between hot-side heat dissipation device and cold end radiator, the hot-side heat dissipation utensil has hot-side heat dissipation pedestal, the cold end radiator has cold end heat dissipation base, hot junction gas flow is equipped in the hot-side heat dissipation pedestal, cold end gas flow is equipped in the cold end heat dissipation base, the hot junction gas flow has hot junction gas access and hot junction gas vent, the cold end gas flow has cold end gas access and cold end gas vent, the hot junction gas vent and cold end gas vent are respectively connected to the hyperbaric oxygen chamber.The runner gas temperature controller structure neat compact, when use, can be set as needed the temperature of hyperbaric oxygen chamber, and directly, actively effectively the air-flow for entering hyperbaric oxygen chamber into trip temperature can be adjusted, be greatly improved cabin comfort.
Description
Technical field
The utility model is related to hyperbaric oxygen chamber technical fields, and in particular to a kind of runner gas temperature adjuster and hyperbaric oxygen
Cabin system.
Background technology
At present, hyperbaric oxygen chamber becomes therapeutic equipment more popular at present, especially for some gassings, altitude sickness
There is preferable medical effect with cardiovascular disease etc..Present minitype high voltage oxygen cabin does not have temp regulating function in cabin, in ring
When border is too high or too low for temperature, due to narrow space in cabin, the compressed machine heating of temperature, human body temperature, air-flow lead to difference etc. in cabin
Multiple factors influence, and lead to cabin comfort degradation.
Conventional use of small-sized or portable high pressure oxygen chamber is without gas cooling device in cabin, since portable compression chamber works
When nacelle volume for 0.72m3 or so, and therapeutic process normally all can be in several hours, and patient is in such narrow space
In time for treating grow, air quality all has a great impact to the safety and health of patient.Conditioner obviously has very much
Necessity, still, because when portable compression chamber works often in transportational process.
Existing conditioner or temperature-adjusting device are all provided in cabin.For example, Chinese utility model patent
CN201620140527.9 provides a kind of movable high-efficiency hyperbaric oxygen chamber, including pedestal, sealing high pressure nacelle, hatch door, guided way,
Carry supporting plate, air filter, air interchanger, supercharging device, oxygen generator, temperature-adjusting device, air wetting dress
It puts and control system, bottom outer surface is evenly distributed with walking mechanism, air interchanger, supercharging device, oxygen generator, temperature adjust dress
Put, air humidifying device is respectively positioned in pedestal, air filter and control system are outside pedestal.Chinese utility model patent
CN201410029893.2 provides a kind of portable cabin conditioner, including the heat sink for reducing temperature in cabin and
For absorbing the CO of carbon dioxide in cabin2Absorption plant.
Present many temperature-adjusting devices are due to being all placed in cabin, and actually passive type temperature is adjusted, i.e., in cabin
It is just adjusted when temperature is too high or too low, can not fundamentally solve the problems, such as nacelle temperature.
Utility model content
In view of this, it is necessary to a kind of compact-sized, temperature be provided and adjust convenient runner gas temperature adjuster and tool
Have the hyperbaric chamber system of the runner gas temperature adjuster, can directly, actively effectively to enter hyperbaric oxygen chamber air-flow
It is adjusted into trip temperature, is greatly improved cabin comfort.
A kind of runner gas temperature adjuster, including hot-side heat dissipation device, cold end radiator, positioned at hot-side heat dissipation device and cold end
Semiconductor cooler between radiator, the hot-side heat dissipation utensil have hot-side heat dissipation pedestal, and the cold end radiator has cold
Heat dissipation base is held, hot junction gas flow is equipped in the hot-side heat dissipation pedestal, cold end gas is equipped in the cold end heat dissipation base
Runner, the hot junction gas flow have hot junction gas access and hot junction gas vent, and the cold end gas flow has cold end
Gas access and cold end gas vent, the hot junction gas vent and cold end gas vent are respectively connected to the hyperbaric oxygen chamber.
Further, the hot junction gas flow and the cold end gas flow are S-shaped gas channel.
Further, the hot-side heat dissipation pedestal includes hot junction seat and hot junction cover board, and the cold end heat dissipation base includes cold
End seat and cold end cover board, the hot junction seat is corresponding with cold end seat to have hot junction seat bottom surface and cold end seat bottom surface, the hot junction cover board
With the hot junction cover board top surface that the bottom surface with hot junction seat engages, there is the cold end cover board bottom surface with the cold end seat to connect
The cold end cap plate top surface of conjunction, hot junction seat bottom surface and cold end seat bottom surface are equipped with the first S-shaped groove, the hot junction cover board top surface and
Cold end cap plate top surface is equipped with the second S-shaped groove, and the S-shaped is formed after the first S-shaped groove and the second S-shaped groove combination
Gas channel.
Further, side of the hot-side heat dissipation pedestal far from hot junction seat bottom surface is extended with multiple hot-side heat dissipation pieces, institute
It states side of the cold end heat dissipation base far from cold end seat bottom surface and is extended with multiple cold end cooling fins, in multiple hot-side heat dissipation pieces and multiple
It is corresponding equipped with hot junction fan and cold end fan on cold end cooling fin.
Further, each S-shaped gas channel includes more than two S-shapeds, and each S-shaped gas channel has respectively
Entrance and exit, as the hot junction gas access, hot junction gas vent, cold end gas access and cold end gas vent.
Further, the entrance and exit of each S-shaped gas channel is respectively by corresponding hot-side heat dissipation base side
Or cold end heat dissipation base side is exposed, each rest part of the S-shaped gas channel in addition to entrance and exit dissipates in hot junction
Extend in hot pedestal or in cold end heat dissipation base.
Further, the semiconductor cooler has for semiconductor chilling plate and respectively hot end surface and cold end surface, institute
It states hot junction cover board and cold end cover board correspondence is combined with the hot end surface and cold end surface of semiconductor chilling plate.
Further, the hot junction gas vent and cold end gas vent are respectively connected in the gas circuit of the hyperbaric oxygen chamber
Equipped with air way switch valve, enter oxygen cabin for switching hot gas or cold air as needed, the air way switch valve is by a controller
Or microcontroller control, the controller or microcontroller connect with control interface, this control interface can be button, touch screen,
The control interface communication connection of remote controler, APP, Internet of Things or other forms, passes through control interface setting refrigeration or heating instruction
To controller or microcontroller, with the gas circuit of setting control air way switch valve switching hot gas and cold air, realize hot junction gas vent or
Cold end gas vent air-flow enters in oxygen cabin.
Further, the semiconductor cooler has cathode power supply wiring and negative power supply wiring, the cathode power supply
Wiring and negative power supply wiring are corresponding with the entrance and exit of the S-shaped gas channel respectively, the controller further with just
Pole power supply wiring is connected with negative power supply wiring and double fan, to control the electric current of semiconductor cooler and double fan rotating speed,
To carry out airflow temperature-control.
And a kind of hyperbaric chamber system, including oxygen cabin and the admission line in the oxygen cabin is connected to, wherein, institute
It states admission line and is connected to runner gas temperature adjuster as described above.
In above-mentioned runner gas temperature adjuster, hot-side heat dissipation device and cold end heat spreader structures almost symmetry, centre utilize
Semiconductor cooler adjusts temperature, compact-sized, and temperature adjusts facility.Due to directly carrying out temperature to the air-flow for entering hyperbaric oxygen chamber
Degree adjust, more directly, actively effectively, be greatly improved cabin comfort.In addition, since temperature adjusting is placed in hyperbaric oxygen
Cabin Ru Qi front ends it is more convenient directly effectively can to adjust temperature according to temperature in the setting adjusting cabin of user.
Description of the drawings
Fig. 1 is the dimensional structure diagram of the runner gas temperature adjuster of the utility model embodiment one.
Fig. 2 is the dimensional decomposition structure diagram of the runner gas temperature adjuster of the utility model embodiment one.
Fig. 3 is the dimensional decomposition structure diagram of the runner gas temperature adjuster of the utility model embodiment two.
Fig. 4 is the dimensional structure diagram of the hyperbaric chamber system of the utility model embodiment.
Specific embodiment
The utility model is described in detail below with reference to specific embodiments and the drawings.
It please refers to Fig.1 and Fig. 2, a kind of runner gas temperature adjuster 100 of the utility model embodiment one is shown, including
Hot-side heat dissipation device 10, cold end radiator 20, the semiconductor cooler 30 between hot-side heat dissipation device 10 and cold end radiator 20,
The hot-side heat dissipation device 10 has hot-side heat dissipation pedestal 11, and the cold end radiator 20 has cold end heat dissipation base 21, the heat
It holds and hot junction gas flow 15 is equipped in heat dissipation base 11, cold end gas flow 25 is equipped in the cold end heat dissipation base 21, it is described
Hot junction gas flow 15 has hot junction gas access 151 and hot junction gas vent 152, and the cold end gas flow 25 has cold end
Gas access 251 and cold end gas vent 252, the hot junction gas vent 152 and cold end gas vent 252 are respectively connected to one
A hyperbaric oxygen chamber.
Specifically, as shown in Fig. 2, the hot junction gas flow 15 and the cold end gas flow 25 are S-shaped gas channel.
Further, each S-shaped gas channel includes more than two S-shapeds, is three S-shapeds.By setting full of twists and turns air-flow
Channel so that gas passes through sufficient refrigeration or pyrogenicity.The hot-side heat dissipation pedestal 11 includes hot junction seat 112 and hot junction cover board
113, the cold end heat dissipation base 21 includes cold end seat 212 and cold end cover board 213, and the hot junction seat 112 and cold end seat 212 correspond to
With hot junction seat bottom surface 114 and cold end seat bottom surface 214, the hot junction cover board 113 has the bottom surface 114 with hot junction seat 112
The hot junction cover board top surface 115 of engagement, the cold end cover board 213 have the cold end cap engaged with the bottom surface 214 of the cold end seat 212
Plate top surface 215, the hot junction seat bottom surface 114 and cold end seat bottom surface 214 are respectively provided with the first S-shaped groove 140,240, the hot junction lid
Plate top surface 115 and cold end cap plate top surface 215 are equipped with the second S-shaped groove 150,250, the first S-shaped groove 140,240 and second
The S-shaped gas channel is formed after S-shaped groove 150,250 combinations.
The each S-shaped gas channel of diagram has entrance and exit respectively, as illustrated in fig. 1 and 2, i.e., as the hot junction gas
Body entrance 151, hot junction gas vent 152, cold end gas access 251 and cold end gas vent 252.
Further, side of the hot-side heat dissipation pedestal 11 far from hot junction seat bottom surface 114 is extended with multiple hot-side heat dissipations
Piece 16, side of the cold end heat dissipation base 21 far from hot junction cover board bottom surface 215 is extended with multiple cold end cooling fins 26, multiple
It is corresponding equipped with hot junction fan 17 and cold end fan 27 on hot-side heat dissipation piece 16 and multiple cold end cooling fins 26.Specifically, hot junction dissipates
Hot device 10 and cold end radiator 20 are preferably made, such as aluminium, copper, ceramics etc. of the good material material of heat conduction, i.e., above-mentioned each cold and hot
Each components such as end pedestal 11,21, cold and hot end casing 113,213 and cooling fin are all made of Heat Conduction Material.
As shown in the figure, the entrance and exit of each S-shaped gas channel, i.e. hot junction gas access 151, hot junction gas go out
Mouth 152, cold end gas access 251 and cold end gas vent 252 are dissipated respectively by corresponding 11 side of hot-side heat dissipation pedestal or cold end
Hot 21 side of pedestal is exposed, and each rest part of the S-shaped gas channel in addition to entrance and exit is in hot-side heat dissipation pedestal
Extend in 11 or in cold end heat dissipation base 21.That is, from appearance, entrance and exit is only seen, internal bending S-shaped pipeline simultaneously can not
See, entire gas channel is closed.
Further, the semiconductor cooler 30 is preferably semiconductor chilling plate, and has hot end surface 31 and cold respectively
End surfaces 32, the hot junction cover board 113 and the cold end cover board 213 correspond to the hot end surface 31 and cold end with semiconductor chilling plate
Surface 32 combines.Preferably, heat conduction is equipped between the hot junction cover board 113 and the hot end surface 31 of semiconductor cooler 30
Glue is equipped with heat-conducting glue between the cold end cover board 213 and the cold end surface 32 of semiconductor cooler 30, improve heat transfer efficiency.
Further, the semiconductor cooler 30 have cathode power supply wiring 33 and negative power supply wiring 34, it is described just
Pole power supply wiring 33 and negative power supply wiring 34 are corresponding with the entrance and exit of the S-shaped gas channel respectively.
Referring to Fig. 3, the runner gas temperature adjuster 100 ' of the utility model embodiment two is shown, embodiment two
Runner gas temperature adjuster 100 ' and runner gas temperature 100 structures of adjuster of embodiment one are essentially identical, difference
It essentially consists in and has additional metal tube.Element identical with Fig. 1, Fig. 2 Fig. 3 uses identical label, and details are not described herein.
In runner gas temperature adjuster 100 ', the S-shaped gas channel is S-shaped metal tube, including hot side metal pipe
51 and cold side metal pipe 52.S-shaped groove, example are respectively equipped in the hot-side heat dissipation pedestal 11 and in the cold end heat dissipation base 21
Heat is such as embedded in using aforementioned first S-shaped groove 140,240 and the second S-shaped groove 150,250, the S-shaped metal tube 50 respectively
It holds in heat dissipation base 11 and the cold end heat dissipation base 21, that is, is embedded in the first S-shaped groove 140,240 and the second S-shaped groove
150th, 250, S-shaped metal tube 51,52 is used as gas circuit.The material of S-shaped metal tube 51,52 is copper or aluminium and respective alloy
Deng having thermally conductive grease filling between in, S-shaped metal tube 51,52 and hot-side heat dissipation pedestal 11 and the cold end heat dissipation base 21, with
Promote heat conduction efficiency.At this point, hot junction gas access 151, hot junction gas vent 152, cold end gas access 251 and cold end gas
Outlet 252 is respectively the nozzle of metal tube rather than the entrance of the first S-shaped groove 140,240 and the second S-shaped groove 150,250
Or outlet.
As shown in figure 4, the utility model embodiment also provides a kind of hyperbaric chamber system 200, including oxygen cabin 60 and
The admission line 61 in the oxygen cabin 60 is connected to, wherein the admission line 61 is connected to runner gas temperature tune as described above
Save device 100.The hyperbaric oxygen chamber of the utility model embodiment is preferably portable or minitype high voltage oxygen cabin, it is suitable for volume 2
Portable or minitype high voltage oxygen cabin below cubic meter, 60 material material of nacelle include the hardwares cabin such as metal, fiberglass and various fill
Soft cabin made of gas material material.
As shown in the figure, runner gas temperature and humidity controller 100 is additionally provided with an air way switch valve 62.Specifically, the heat
The gas circuit that end gas vent 152 and cold end gas vent 252 are respectively connected to the hyperbaric oxygen chamber is equipped with air way switch valve 62,
Set in admission line 61 there are one air way switch valve 62, preferably three-way magnetic valve, for switch as needed hot gas or
Cold air enters oxygen cabin.Specifically, hot junction gas vent 152 and cold end gas vent 252 are coupled with three-way magnetic valve inlet end
Mouthful, cold air is switched by circuit controling electromagnetic valve or hot gas enters in oxygen cabin 60.The solenoid valve of triple valve (can such as be compiled by controller
Range controller PLC) or microcontroller control.Preferably, the controller or microcontroller are connect with control interface, the control
Interface is the APP or Internet of Things of button, touch screen, remote controler or intelligent terminal, sets refrigeration by control interface or heating refers to
It enables to controller or microcontroller, with the gas circuit of setting control air way switch valve switching hot gas and cold air.Using a cell phone application as
Example sets refrigeration or heating instruction to programmable controller or microcontroller, programmable controller by cell phone application（PLC）It is or single
Program in piece machine is according to this setting control solenoid valve switching gas circuit channel, with setting control air way switch valve switching hot gas and cold
The gas circuit of gas realizes that hot junction gas vent or cold end gas vent air-flow enter in oxygen cabin 60.The controller or microcontroller with just
Pole power supply wiring 33 and negative power supply wiring 34 and double fan 18,28 connect, to control the electric current of semiconductor cooler 30, control
Device or microcontroller are controlled by cell phone application or host is by key control, pass through cell phone application or host button selection cooling or heating width
Degree adjusts the size of current of semiconductor chilling plate 30 and double fan 18,28 rotating speeds according to setting, is realized with this warm in a certain range
Degree control.
In above-mentioned runner gas temperature adjuster 100 and hyperbaric chamber system 200, wherein heating part（Hot-side heat dissipation device
10）It is connected with 30 hot junction of semiconductor chilling plate,（Cold end radiator 20）It is connected with 30 cold end of semiconductor chilling plate, when cooling piece 30
After connecting DC power supply, electric current flows to P ends from N-terminal, makes cold and hot both ends that temperature change occur, air is by compressor through passive heat dissipation
Device (hot and cold side fan 17,27) air inlet is pressed into S-shaped gas channel, the gas in gas channel（Such as air）It is heated or cooled,
It is discharged again through gas outlet, when the curent change of cooling piece 30, the temperature at cold and hot both ends also changes with curent change, so as to real
Existing temperature is adjusted.In this way, when in use, user can need set temperature according to oneself, pass through semiconductor cooler 30
Power input controls the size of electric current, you can adjusts cold air and hot gas enters in hyperbaric oxygen chamber.
In above-mentioned runner gas temperature adjuster, 20 structure almost symmetry of hot-side heat dissipation device 10 and cold end radiator is intermediate
Temperature is adjusted using semiconductor cooler 30, compact-sized, temperature adjusts facility.Due to the air-flow directly to entering hyperbaric oxygen chamber
Into trip temperature adjust, more directly, actively effectively, be greatly improved cabin comfort.In addition, due to being set to hyperbaric oxygen
Cabin it is more convenient directly effectively can to adjust temperature according to temperature in the setting adjusting cabin of user.
It should be noted that the utility model is not limited to the above embodiment, it is according to the present utility model to create essence
God, those skilled in the art can also make other variations, these variations done according to the creative spirit of the utility model, all
It should be within the scope of the utility model be claimed.
Claims (10)
1. a kind of runner gas temperature adjuster is adjusted for entering the temperature of hyperbaric oxygen chamber interior air-flow, which is characterized in that including
Hot-side heat dissipation device, cold end radiator, the semiconductor cooler between hot-side heat dissipation device and cold end radiator, the hot junction dissipate
Hot utensil has hot-side heat dissipation pedestal, and the cold end radiator has cold end heat dissipation base, heat is equipped in the hot-side heat dissipation pedestal
Gas flow is held, cold end gas flow is equipped in the cold end heat dissipation base, there is the hot junction gas flow hot junction gas to enter
Mouth and hot junction gas vent, the cold end gas flow have cold end gas access and cold end gas vent, the hot junction gas
Outlet and cold end gas vent are respectively connected to the hyperbaric oxygen chamber.
2. runner gas temperature adjuster as described in claim 1, which is characterized in that the hot junction gas flow and described cold
End gas flow is S-shaped gas channel, and each S-shaped gas channel includes more than two S-shapeds, and each S-shaped air-flow leads to
There is entrance and exit in road respectively, goes out as the hot junction gas access, hot junction gas vent, cold end gas access and cold end gas
Mouthful.
3. runner gas temperature adjuster as claimed in claim 2, which is characterized in that the hot-side heat dissipation pedestal includes hot junction
Seat and hot junction cover board, the cold end heat dissipation base include cold end seat and cold end cover board, and the hot junction seat is corresponding with cold end seat to be had
Hot junction seat bottom surface and cold end seat bottom surface, the hot junction cover board have the hot junction cover board top surface that the bottom surface with hot junction seat engages,
The cold end cover board has the cold end cap plate top surface engaged with the bottom surface of the cold end seat, the hot junction seat bottom surface and cold end seat bottom
Face is equipped with the first S-shaped groove, and the hot junction cover board top surface and cold end cap plate top surface are equipped with the second S-shaped groove, and first S-shaped is recessed
The S-shaped gas channel is formed after slot and the second S-shaped groove combination.
4. runner gas temperature adjuster as claimed in claim 3, which is characterized in that the hot-side heat dissipation pedestal is far from hot junction
The side of seat bottom surface is extended with multiple hot-side heat dissipation pieces, and side of the cold end heat dissipation base far from cold end seat bottom surface is extended with more
A cold end cooling fin, it is corresponding equipped with hot junction fan and cold end fan on multiple hot-side heat dissipation pieces and multiple cold end cooling fins.
5. runner gas temperature adjuster as claimed in claim 2, which is characterized in that the S-shaped gas channel is S-shaped metal
Pipe, the S-shaped metal tube are embedded in respectively in hot-side heat dissipation pedestal and the cold end heat dissipation base.
6. runner gas temperature adjuster as claimed in claim 5, which is characterized in that each S-shaped gas channel enters
Mouth and outlet are exposed respectively by corresponding hot-side heat dissipation pedestal or cold end heat dissipation base, and each S-shaped gas channel is except entrance
Extend all in hot-side heat dissipation pedestal or in cold end heat dissipation base with the rest part outside outlet.
7. runner gas temperature adjuster as claimed in claim 3, which is characterized in that the semiconductor cooler is semiconductor
Cooling piece simultaneously has hot end surface and cold end surface respectively, and the hot junction cover board and the cold end cover board be corresponding and semiconductor chilling plate
Hot end surface and cold end surface combine.
8. runner gas temperature adjuster as claimed in claim 2, which is characterized in that the hot junction gas vent and cold end gas
Body, which exports to be connected in the gas circuit of the hyperbaric oxygen chamber, is equipped with air way switch valve, enters for switching hot gas or cold air as needed
Oxygen cabin, the air way switch valve are controlled by a controller or microcontroller, and the controller or microcontroller are connect with control interface,
The control interface is the APP or Internet of Things of button, touch screen, remote controler or intelligent terminal, passes through control interface and sets refrigeration
Or heating instruction, with the gas circuit of setting control air way switch valve switching hot gas and cold air, realizes hot junction to controller or microcontroller
Gas vent or cold end gas vent air-flow enter in oxygen cabin.
9. runner gas temperature adjuster as claimed in claim 8, which is characterized in that the semiconductor cooler has anode
Power supply wiring and negative power supply wiring, the cathode power supply wiring and negative power supply wiring respectively with the S-shaped gas channel
Entrance and exit corresponds to, and the controller is further connect with cathode power supply wiring and negative power supply wiring and double fan, with control
The electric current of semiconductor cooler processed and double fan rotating speed, to carry out airflow temperature-control.
10. a kind of hyperbaric chamber system, including oxygen cabin and it is connected to the admission line in the oxygen cabin, which is characterized in that institute
Admission line is stated to be connected to such as claim 1-9 any one of them runner gas temperature adjusters.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721058884.1U CN207527871U (en) | 2017-08-22 | 2017-08-22 | Runner gas temperature adjuster and hyperbaric chamber system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721058884.1U CN207527871U (en) | 2017-08-22 | 2017-08-22 | Runner gas temperature adjuster and hyperbaric chamber system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207527871U true CN207527871U (en) | 2018-06-22 |
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ID=62575042
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721058884.1U Active CN207527871U (en) | 2017-08-22 | 2017-08-22 | Runner gas temperature adjuster and hyperbaric chamber system |
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| Country | Link |
|---|---|
| CN (1) | CN207527871U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107345719A (en) * | 2017-08-22 | 2017-11-14 | 深圳艺点创新科技有限公司 | Runner gas temperature adjuster and hyperbaric chamber system |
-
2017
- 2017-08-22 CN CN201721058884.1U patent/CN207527871U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107345719A (en) * | 2017-08-22 | 2017-11-14 | 深圳艺点创新科技有限公司 | Runner gas temperature adjuster and hyperbaric chamber system |
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