CN104453039B - A temperature control method for a composite temperature control curtain wall - Google Patents

Abstract

The invention discloses a temperature control method for a composite temperature control curtain wall. In the present invention, the upper and lower ends of the inner glass curtain wall and the outer glass curtain wall are equipped with louver grille tuyere assemblies; an independent inner interlayer heat exchange channel is formed between the inner glass curtain wall and the middle partition glass curtain wall; the outer glass curtain wall and the middle partition An independent outer interlayer heat exchange channel is formed between the fault glass curtain walls; semiconductor thermoelectric temperature control units are uniformly distributed on the middle partition glass curtain wall; The reading module provides real-time temperature monitoring data of the target environment; the semiconductor thermoelectric temperature control unit is controlled by the single-chip microcomputer control module. The invention can not only give full play to the dual heat exchange function of natural ventilation technology and semiconductor temperature control technology in different seasons, but also is equivalent to putting on a breathable and adjustable green air-conditioning coat for the building.

Description

A temperature control method for a composite temperature control curtain wall

technical field

The present invention relates to a new type of curtain wall with three-layer glass structure used in the external protective structure of buildings, in particular to a curtain wall composed of two independent air interlayer passages, and the inner and outer interlayers rely on two types of heat exchange and temperature control technology to make the curtain wall The system realizes the curtain wall structure and its composite temperature control method that adjusts the temperature independently according to the seasons.

Background technique

With the improvement of living standards, people's requirements for the comfort of office space are also increasing. How to minimize the operating cost of the air-conditioning system on the basis of satisfying comfort has always been a serious problem plaguing the construction industry. The survey shows that centralized air conditioners are still widely used to run at full capacity for cold source supply in public places, resulting in a large waste of energy; in addition, although the market has begun to use breathing ventilation curtain walls to replace traditional windows as enclosure structures, it can indeed pass The passive heat dissipation method of natural ventilation takes away a certain amount of solar radiation heat, but the ventilation effect is limited by the environment and building size factors, and the actual heat taken away is limited.

Compared with traditional refrigeration methods, semiconductor refrigeration has advantages and disadvantages. First of all, the semiconductor refrigeration device is an all-solid energy conversion device. It does not need refrigerant, and uses the Peltier effect to realize heat absorption and release under the drive of DC current, so there is no problem of refrigerant discharge and leakage, and zero pollution to the environment. Secondly, the semiconductor refrigeration system has no mechanical moving parts such as compressors and water pumps, does not generate large noise, and has high operational reliability. At the same time, the semiconductor refrigeration chip itself has a compact structure, which is very convenient for miniaturization and integrated design, manufacture and processing, so semiconductor refrigeration equipment usually tends to be miniaturized and miniaturized, especially suitable for meeting the needs of confined spaces or special refrigeration environments. In addition, the thermal inertia of the semiconductor cooling chip is small, and cooling or heating can be quickly realized within a few seconds after the current is turned on. According to relevant experiments, it is an ideal and economical cooling method when the cooling capacity provided by the single-chip semiconductor refrigerator is less than 10W, and its cooling performance is basically the same as other traditional cooling methods. Therefore, from the perspective of technical feasibility and energy-saving and emission-reduction effects, choosing to apply semiconductor temperature control technology to glass curtain walls to realize independent temperature control of interlayer temperature with seasonal changes has broad economic market potential.

According to my country's national conditions, energy issues are not optimistic. Therefore, actively promoting the promotion and application of photovoltaic BIPV technology has a promising market value. When the envelope structure is integrated with the photovoltaic power generation components, the building can have the necessary performance and unique decorative function of the building envelope, and at the same time, it can also use solar energy to generate electricity, which fully reflects the development of circular economy and sustainable development. Market trend of architectural ideas.

Contents of the invention

Aiming at the deficiencies of the prior art, the invention provides a composite temperature-control curtain wall with a three-layer glass structure and a temperature control method thereof.

To achieve the above object, the present invention adopts the following technical solutions:

The intelligent temperature-controlled glass curtain wall suitable for the building envelope structure provided by the present invention includes (1) a curtain wall encapsulation unit with a three-layer glass structure, which is characterized in that two independent interlayer air ducts are formed by three layers of glass, And rely on the single-chip microcomputer to drive the motor to drive the louver grilles on the inner and outer glass to open and close, so as to realize the external circulation ventilation of the outer air channel in summer and transitional season conditions and the internal circulation ventilation of the inner air channel in winter conditions. ; In addition, if the outer glass is replaced by thin-film photovoltaic glass with built-in photovoltaic power generation components, it can not only be used as the outer envelope of the building but also provide daily electricity for the electrical control components of the above-mentioned temperature control system; The semi-conductor thermoelectric temperature control module under dual working conditions of heating/heating is characterized in that the array is arranged on the aluminum connection frame of the middle partition of the curtain wall (it can be used as a heat sink for heat dissipation or cooling of the semiconductor module), and through cooling and cooling The switching of thermal working conditions respectively pre-cools or pre-heats the air in the inner interlayer air duct, so that the curtain wall as a whole realizes the active heat insulation or heat preservation function; (3) The single-chip microcomputer control module is characterized in that, Real-time monitoring of the real-time monitoring, which respectively realizes the parallel drive of the opening (closing) of the inner and outer dampers and the switching of the cold (hot) working mode of the semiconductor module; The acquisition module provides real-time temperature monitoring data of the target environment.

In the above technical solution, according to different seasons, the intelligent temperature-controlled curtain wall of the present invention can implement three driving strategies.

Driving strategy 1: When the temperature sensor detects that the ambient temperature is in the range of 5°C-28°C (that is, the spring and autumn transitional season conditions), the external circulation ventilation mode is only realized in the outer interlayer air duct. At this time, the single-chip microcomputer only drives the upper and lower dampers of the outer glass curtain wall to open (the semiconductor temperature control module does not start at this time), and under the action of the chimney effect, the external circulation ventilation method of the outer interlayer air duct is used to reduce solar radiation from being transmitted to the indoor room through the window side The heat in the inner closed air channel plays a role of heat insulation, thereby reducing the cooling period of the air conditioning system to a certain extent.

Driving strategy 2: When the ambient temperature is detected to be higher than 28°C (i.e. summer working conditions), the outer interlayer air duct will be circulated and ventilated and the semiconductor thermoelectric temperature control sheet will be used to seal and cool the inner interlayer space. At this time, the single-chip microcomputer drives the upper and lower air doors of the outer glass curtain wall to open, and the cooling mode of the semiconductor module runs in parallel. The air cooling in the tunnel can further offset the indoor air conditioning cooling load demand caused by the window side, thereby reducing the actual cooling energy consumption of the indoor building air conditioning system to a certain extent.

Driving strategy three: When the ambient temperature is lower than 5°C (i.e. winter working conditions), the outer interlayer air duct is closed for heat preservation and the inner interlayer air duct is internally circulated and ventilated. At this time, the single-chip microcomputer drives the upper and lower dampers of the outer glass curtain wall to close + the upper and lower dampers of the inner glass curtain wall to open + the heating mode of the semiconductor module to run in parallel. The air in the inner air duct is heated by the semiconductor hot end and then brought into the indoor environment through internal circulation to further offset the indoor air conditioning heat load demand caused by the window side, which reduces the actual heating energy of the indoor building air conditioning system to a certain extent consumption.

In the above technical solution, a porous deflector (a total of two pieces) is arranged at the lower end of the two interlayer passages respectively, so as to ensure that the circulating air in the two interlayer passages is evenly flowed under the action of the deflector. Uniform diffusion, thereby further ensuring the uniform distribution of air temperature in the curtain wall interlayer, and avoiding heat accumulation caused by air stagnation in local locations.

The invention can not only give full play to the double heat exchange function of natural ventilation technology and semiconductor temperature control technology in different seasons, but also is equivalent to putting on a breathable and adjustable green air-conditioning coat for the building, which is expected to be able to To alleviate the energy consumption of air conditioners caused by the large-scale arrangement of glass curtain walls.

Description of drawings

Fig. 1 is a schematic diagram of a curtain wall packaging structure of the present invention;

Fig. 2 is the example and working schematic diagram of transition season working condition of the present invention;

Fig. 3 is the example and working schematic diagram of working condition in summer of the present invention;

Fig. 4 is the example and working schematic diagram of working condition in winter of the present invention;

Among them: 1. Inner glass curtain wall (ordinary single-layer toughened glass); 2. Intermediate partition glass curtain wall (ordinary single-layer toughened glass); 3. Outer glass curtain wall (ordinary single-layer toughened glass or photovoltaic film glass); 4. Inner side Glass louver damper; 5. Outer glass louver damper; 6. Semiconductor thermoelectric temperature control module with cooling/heating dual working conditions; 7. Porous deflector; 8. Single-chip microcomputer control module.

detailed description

Referring to Fig. 1, this embodiment includes three layers of glass curtain wall (i.e. inner glass curtain wall 1, middle partition glass curtain wall 2 and outer glass curtain wall 3), louver grille tuyere assembly (including inner glass louver damper 4, outer glass louver Damper 5), a semiconductor thermoelectric temperature control unit 6 with cooling and heating dual working conditions, an environmental monitoring system, a single-chip microcomputer control module 8 and other components constitute a glass curtain wall structure system, which is characterized in that: two Independent interlayer heat exchange channels give full play to the dual heat exchange functions of natural ventilation technology and semiconductor temperature control technology. During installation, the outer glass adjacent to the outdoor environment can also choose to use ordinary glass or photovoltaic glass according to the regional climate characteristics and cost control. In addition, a porous deflector 7 (a total of two pieces) is arranged at the lower end of the two interlayer passages respectively to ensure that the circulating air in the two interlayer passages diffuses evenly under the flow equalization of the deflector. .

The three-layer glass curtain wall constitutes two independent mezzanine heat exchange channels. The outer mezzanine space is a natural ventilation passive heat exchange air channel, and the inner mezzanine space is a semi-conductor cooling (or heat releasing) active with precooling and preheating dual working conditions. The type heat exchange channel realizes the active control of the direction of solar radiation heat flow through the opening and closing of the louvers of the upper and lower tuyeres of the inner and outer glass of the glass curtain wall and the start and stop of the semiconductor thermoelectric temperature control module. In addition, selecting a suitable semiconductor cooler according to the end surface temperature of the thermoelectric module in the summer precooling condition and winter preheating condition is more ideal and economical. According to the three seasons, three operating modes are implemented correspondingly to realize the temperature adjustment and flow direction control of the air in the two independent interlayers of the curtain wall, and realize the indirect influence on the temperature of the small indoor area adjacent to the curtain wall. If the ordinary single-layer tempered glass on the outermost layer is replaced with thin-film photovoltaic glass, part of its photovoltaic power generation can drive the built-in temperature control component and ventilation component of the curtain wall to jointly realize the active temperature control of the interlayer air. In addition, the surplus photovoltaic power generation capacity is also It can be stored and used to provide daily electricity inside the building, reflecting the idea of energy saving. The semiconductor chips are attached to the aluminum connection frame of the intermediate partition glass curtain wall in an array for installation and fixation. The aluminum connection frame can be used as a heat sink component of the semiconductor chip, which is convenient for cooling or heat dissipation, and does not affect the visual range and visual appearance of the curtain wall.

Taking a room with a size of 4m (length) × 3m (width) × 3.7m (height) as an example to select the model, the total cooling load of the room is calculated to be about 1440W, of which the heat gain of solar radiation transmitted through the window accounts for about 25% of the total cooling load provided is about 360W according to statistics. When the designed and calculated ambient temperature is 28°C, if the cold end temperature of the semiconductor chip needs to be 18°C, the performance parameters of the semiconductor chip are: hot end temperature 29.66°C, cooling capacity 10.31W, COP1.65, electric power 6.32 W. At this time, from the perspective of economy, semiconductor chips in 2 columns x 5 rows can be arranged in an array on the aluminum connecting rods of the glass curtain wall, which can provide a total cooling capacity of 10.31 x 10 = 103W, and the power consumption is 63W. At this time, only the semiconductor chips can contribute about 34.3% of the cooling load required by the air conditioner on the window side. At the same time, the optimized calculation shows that when the thickness of the outer glass interlayer of the curtain wall is in the range of 100mm-200mm, the heat taken away by natural ventilation is the most, and the heat dissipation effect is the best; in addition, the effective influence of the indoor temperature caused by the heat exchange and convection of the inner air interlayer is calculated The distance is within 150mm. Therefore, comprehensively weighing the economics of the curtain wall area, the thermal influence distance of the semiconductor module precooling and preheating double working conditions, and the external natural ventilation intensity and other factors, the scheme chooses 100mm as the thickness of the inner and outer interlayer air ducts respectively. .

According to the above implementation, the effect is as follows:

a) The outer interlayer channel adopts external circulation ventilation to realize natural ventilation and heat exchange.

b) The inner mezzanine channel uses a semiconductor thermoelectric temperature control module to realize the double working mode of precooling or preheating the air in the mezzanine, and performs internal circulation ventilation and heat exchange with the indoor environment.

c) According to different seasons, the curtain wall actively implements three operation strategies and corresponds to three system operation modes.

d) The single-chip microcomputer control system can choose to implement two working modes of real-time environmental monitoring drive and manual input drive, and realize independent temperature control operation or independent temperature control operation of the curtain wall system.

In the transitional season working conditions in this example, as shown in Figure 2, when the temperature sensor detects that the ambient temperature is within 5-28°C, the single-chip microcomputer control module 8 drives the inner glass shutter damper 4 to open, and the outer glass shutter damper 5 to close, and the distribution Type semiconductor thermoelectric temperature control module 6 does not work. At this time, the working mode of the two interlayers is: only the upper and lower dampers of the outer interlayer air duct are opened to realize external circulation ventilation; the inner interlayer air duct dampers are closed to realize closed heat insulation.

In the summer working condition in this example, when the temperature sensor detects that the ambient temperature is higher than 28°C as shown in Figure 3, the single-chip microcomputer control module 8 drives the outer glass shutter damper 4 to open, the inner glass shutter damper 5 to close, and the distributed semiconductor The cooling/heating module 6 turns on the cooling mode. At this time, the working mode of the two interlayers is: the upper and lower dampers of the outer interlayer air duct are opened to realize external circulation ventilation; the inner interlayer space uses semiconductor thermoelectric temperature control sheets to seal and cool the air in the interlayer, and at the same time, the semiconductor thermoelectric temperature control sheets The heat dissipation of the hot end diffuses heat to the outer interlayer air duct through the aluminum connecting frame that is closely attached to the middle glass partition layer, thereby intensifying the "chimney effect" of the natural ventilation process in the outer air duct and making the ventilation and heat exchange effect better. At this time, the heat in the two mezzanine channels is brought to the outdoor environment by means of external circulation ventilation.

In the winter working condition in this example, as shown in Figure 4, when the temperature sensor detects that the ambient temperature is lower than 5°C, the single-chip microcomputer control module 8 drives the outer glass louver damper 4 to close, and the inner glass louver damper 5 to open, and the distributed semiconductor The cooling/heating module 6 turns on the heating mode. At this time, the working mode of the two interlayers is: the upper and lower dampers of the outer interlayer air duct are closed to achieve closed insulation; the upper and lower dampers of the inner interlayer space are opened, and the semiconductor thermoelectric temperature control sheet is used to heat the circulating air in the interlayer , and under the action of the "chimney effect", the hot air is sent to the indoor environment in the way of internal circulation ventilation.

The above is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto, any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention , should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims (1)

1. A temperature control method for a composite temperature-controlled curtain wall, the composite temperature-controlled curtain wall comprising an inner glass curtain wall, a middle partition glass curtain wall, an outer glass curtain wall, a louver grille tuyere assembly, and a double working condition of cooling and heating The semiconductor thermoelectric temperature control unit, environmental monitoring system, single-chip microcomputer control module, the upper and lower ends of the inner glass curtain wall are equipped with louver grille air outlet assemblies, and the upper and lower ends of the outer glass curtain wall are also equipped with louver grille air outlet assemblies; An independent inner interlayer heat exchange channel is formed between the curtain wall and the middle partition glass curtain wall; an independent outer interlayer heat exchange channel is formed between the outer glass curtain wall and the middle partition glass curtain wall; uniformly distributed on the middle partition glass curtain wall There is a semiconductor thermoelectric temperature control unit; the environmental monitoring system is composed of a plurality of temperature sensors, which provide real-time temperature monitoring data of the target environment for the temperature reading module in the microcontroller control module; the semiconductor thermoelectric temperature control unit is controlled by The single-chip microcomputer control module is characterized in that the method is specifically: a) The outer interlayer heat exchange channel adopts the external circulation ventilation method to realize natural ventilation heat exchange; b) The inner interlayer heat exchange channel adopts the semiconductor thermoelectric temperature control unit to realize the dual working mode function of precooling or preheating the air in the interlayer, and performs internal circulation ventilation and heat exchange with the indoor environment; c) According to different seasons, the curtain wall actively implements three operation strategies and corresponds to three system operation modes; d) The single-chip microcomputer control module can choose to implement two working modes of environment real-time monitoring drive and manual input drive, so as to realize the independent temperature control operation or independent temperature control operation of the curtain wall system; The three operation strategies described above are implemented in three operation modes corresponding to the three seasons, to realize the temperature adjustment and flow direction control of the air in the two independent interlayers of the curtain wall, and to realize the temperature control of the indoor small-scale area next to the curtain wall. Indirect effects; The three operating strategies described are: Operation strategy 1: When the temperature sensor detects that the ambient temperature is in the range of 5°C-28°C, that is, the spring and autumn transitional season conditions, the external circulation ventilation mode is only realized in the outer interlayer heat exchange air duct; at this time, the single-chip control module only drives The dampers at the upper and lower ends of the outer glass curtain wall are opened, and the semiconductor thermoelectric temperature control unit is not activated. Under the action of the chimney effect, the outer circulation ventilation mode of the outer interlayer heat exchange air duct is used to reduce the heat transmitted from solar radiation to the indoor room through the window side, while the inner interlayer The heat exchange air duct is closed, and the air in the air duct plays a role of heat insulation, thereby reducing the cooling period of the air conditioning system to a certain extent; Operation strategy 2: When the ambient temperature is detected to be higher than 28°C, that is, the summer working condition, the outer interlayer heat exchange air duct is realized for external circulation ventilation and the semiconductor thermoelectric temperature control unit closes and cools the inner interlayer heat exchange air duct; at this time, the single-chip microcomputer control The module drives the upper and lower dampers of the outer glass curtain wall to open, and the cooling mode of the semiconductor thermoelectric temperature control unit runs in parallel. The unit cools the air in the inner interlayer heat exchange air duct to further offset the indoor air conditioning cooling load demand caused by the window side, thereby reducing the actual cooling energy consumption of the indoor building air conditioning system to a certain extent; Operation strategy 3: When the ambient temperature is lower than 5°C, that is, the winter working condition, the outer interlayer heat exchange air channel is closed for heat preservation and the inner interlayer heat exchange air channel is circulated and ventilated; at this time, the single-chip microcomputer control module drives the outer glass curtain wall. The upper and lower dampers are closed, the upper and lower dampers of the inner glass curtain wall are opened, and the heating mode of the semi-thermoelectric temperature control unit operates. The air in the tunnel is heated by the hot end of the semi-thermoelectric temperature control unit and then brought into the indoor environment through internal circulation to further offset the heat load demand of the indoor air conditioner caused by the window side, which reduces the actual supply of the indoor building air conditioning system to a certain extent. Thermal energy consumption.