CN112740391A - 用于排队式基板处理系统的掩模处理模块和用于掩模传送的方法 - Google Patents

用于排队式基板处理系统的掩模处理模块和用于掩模传送的方法 Download PDF

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Publication number
CN112740391A
CN112740391A CN201880097729.1A CN201880097729A CN112740391A CN 112740391 A CN112740391 A CN 112740391A CN 201880097729 A CN201880097729 A CN 201880097729A CN 112740391 A CN112740391 A CN 112740391A
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CN
China
Prior art keywords
mask
substrate
vacuum
substrate carrier
chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201880097729.1A
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English (en)
Chinese (zh)
Inventor
塞巴斯蒂安·巩特尔·臧
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of CN112740391A publication Critical patent/CN112740391A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C23C14/505—Substrate holders for rotation of the substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position

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  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
CN201880097729.1A 2018-09-19 2018-09-19 用于排队式基板处理系统的掩模处理模块和用于掩模传送的方法 Pending CN112740391A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2018/075374 WO2020057738A1 (en) 2018-09-19 2018-09-19 Mask handling module for an in-line substrate processing system and method for mask transfer

Publications (1)

Publication Number Publication Date
CN112740391A true CN112740391A (zh) 2021-04-30

Family

ID=63667919

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201880097729.1A Pending CN112740391A (zh) 2018-09-19 2018-09-19 用于排队式基板处理系统的掩模处理模块和用于掩模传送的方法

Country Status (4)

Country Link
KR (1) KR102553751B1 (ko)
CN (1) CN112740391A (ko)
TW (1) TW202025359A (ko)
WO (1) WO2020057738A1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024003604A1 (en) * 2022-07-01 2024-01-04 Applied Materials, Inc. Mask module, substrate carrier, substrate processing system, and method of processing a substrate

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100842020B1 (ko) * 2007-03-16 2008-06-27 세메스 주식회사 유기 박막 증착 장치 및 방법
US20170250379A1 (en) * 2016-11-28 2017-08-31 Applied Materials, Inc. Evaporation source having multiple source ejection directions
CN108350572A (zh) * 2015-09-22 2018-07-31 应用材料公司 大面积双基板处理系统

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1715078A1 (de) * 2005-04-20 2006-10-25 Applied Films GmbH & Co. KG Kontinuierliche OLED-Beschichtungsanlage
EP2098608A1 (en) * 2008-03-05 2009-09-09 Applied Materials, Inc. Coating apparatus with rotation module
JP2014056830A (ja) * 2013-10-30 2014-03-27 Hitachi High-Technologies Corp 有機ｅｌデバイス製造装置及びその製造方法
CN109715846B (zh) * 2016-12-14 2024-07-23 应用材料公司 沉积系统
KR20180086715A (ko) * 2017-01-23 2018-08-01 어플라이드 머티어리얼스, 인코포레이티드 반송챔버, 이를 포함하는 기판처리시스템 및 이를 이용한 기판처리시스템의 기판처리방법

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100842020B1 (ko) * 2007-03-16 2008-06-27 세메스 주식회사 유기 박막 증착 장치 및 방법
CN108350572A (zh) * 2015-09-22 2018-07-31 应用材料公司 大面积双基板处理系统
US20170250379A1 (en) * 2016-11-28 2017-08-31 Applied Materials, Inc. Evaporation source having multiple source ejection directions

Also Published As

Publication number Publication date
KR102553751B1 (ko) 2023-07-07
KR20210043684A (ko) 2021-04-21
TW202025359A (zh) 2020-07-01
WO2020057738A1 (en) 2020-03-26

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