CN112731238B - Performance test method, system, equipment and medium of test device - Google Patents
Performance test method, system, equipment and medium of test device Download PDFInfo
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- CN112731238B CN112731238B CN202011489474.9A CN202011489474A CN112731238B CN 112731238 B CN112731238 B CN 112731238B CN 202011489474 A CN202011489474 A CN 202011489474A CN 112731238 B CN112731238 B CN 112731238B
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Abstract
The application discloses a performance test method, a system, equipment and a medium of a test device, wherein the performance test method of the test device comprises the following steps: providing a heating module, wherein the input power of the heating module is adjustable; providing a testing device for maintaining thermal balance of the heating module; presetting input power, test time, initial temperature and a temperature threshold of a heating module; connecting the testing device with the heating module, heating the heating module to an initial temperature, adjusting input power and maintaining testing time; acquiring the real-time temperature of the contact position of the testing device and the heating module; judging whether the real-time temperatures exceed a temperature threshold value or not in the test time; if not, increasing the input power of the heating module, maintaining the test time, and continuously acquiring the real-time temperature in the test time; if yes, outputting a heat balance performance evaluation result and ending the flow.
Description
Technical Field
The present disclosure relates generally to the field of semiconductor testing technologies, and in particular, to a performance testing method, system, device, and medium for a testing device.
Background
Electronic devices of Integrated Chips (ICs) are subjected to various forms of testing during development of the device and during part of the manufacturing process of the device. Development testing may include testing to determine the suitability or ability of a device to operate in a desired manner under desired operating conditions (e.g., a range of ambient temperature conditions). Related tests include tests that determine the operational characteristics, acceptability, and ability of the device to operate under different temperature conditions.
In related tests, the test head is typically employed to heat or cool the chip to maintain a thermal balance of the chip at a set temperature, such as a desired or design ambient temperature range for development testing, a temperature range for manufacturing testing, and a design operating temperature for determining operating characteristics of the electronic device.
There is currently no suitable way to test the test capability of existing test heads, and in particular no data between specific power and temperature is available. Without knowing the test performance capabilities of the test head, it is inconvenient to select the correct test head to test the product at the corresponding power, and in addition, the selection errors can affect the product yield.
Disclosure of Invention
In view of the foregoing drawbacks or shortcomings of the prior art, it is desirable to provide a performance testing method, system, device and medium for a testing device, which can perform performance testing on a testing device or a testing head of a chip, and determine the maximum capability of the testing device at a certain temperature.
In a first aspect, the present application provides a performance testing method of a testing device, including:
providing a heating module, wherein the input power of the heating module is adjustable;
presetting input power, test time, initial temperature and a temperature threshold of a heating module;
connecting the testing device with the heating module, heating the heating module to an initial temperature, adjusting input power and maintaining testing time;
acquiring the real-time temperature of the contact position of the testing device and the heating module;
judging whether the real-time temperatures exceed a temperature threshold value or not in the test time; if not, increasing the input power of the heating module, maintaining the test time, and continuously acquiring the real-time temperature in the test time; if yes, outputting a heat balance performance evaluation result and ending the flow.
Further, the method for adjusting the input power comprises the following steps: the input power value is adjusted by changing the voltage and/or current.
Preferably, the method adjusts the input power and maintains the test time, and the method comprises: setting a voltage-time curve, and controlling the voltage input of the heating module.
Preferably, the method for increasing the input power of the heating module includes setting an input power step value to increase the input power each time the step value is increased.
Further, the testing device is configured to heat or cool the heating module when the heating module reaches an initial temperature, so that the heating module is maintained within the temperature threshold.
Further, the outputting the heat balance performance evaluation result includes: the maximum capacity of the testing device at the initial temperature is the maximum input power of the real-time temperature maintained within a temperature threshold value in a certain proportion in the testing time.
Further, the method further comprises: the initial temperature is adjusted and the test procedure is re-executed.
In a second aspect, the present application provides a performance testing system for a testing apparatus, wherein a performance testing method for the testing apparatus as described above is adopted, the system comprising: the heating module is respectively connected with a testing device, a direct current power supply device, a control device and a display device; wherein, the liquid crystal display device comprises a liquid crystal display device,
the direct-current power supply device is used for adjusting the input power of the heating module;
the control device is used for presetting input power, test time, initial temperature and temperature threshold of the heating module; the real-time temperature of the contact position of the current testing device and the heating module is obtained in real time; the real-time temperature detecting device is used for timing, judging whether the real-time temperature exceeds a temperature threshold value or not, and calculating the proportion of the real-time temperature exceeding the temperature threshold value to the real-time temperature acquired in the test time; the input power value is used for controlling the input heating module;
the display device is used for displaying the data test result.
In a third aspect, the present application provides a performance testing apparatus for a testing device, employing a performance testing method for a testing device as described above, the apparatus comprising: comprising a memory, a processor and a computer program stored on the memory and executable on the processor, characterized in that the processor implements the performance testing method of the testing device as described above when executing the program.
In a fourth aspect, the present application provides a computer readable storage medium having stored thereon a computer program which, when executed by a processor, implements a performance testing method of a testing apparatus as described above.
The technical scheme provided by the embodiment of the application can comprise the following beneficial effects:
according to the performance test method of the test device, the heating module simulates the heating condition and the power condition of the chip during test, the real-time temperature measurement of the contact position between the test device and the heating module is realized by continuously changing the power and combining the temperature control of the test device, whether the test device can take away the heating energy consumption of the chip or not is judged by judging whether the real-time temperature is in the temperature threshold range, and the maximum capability of the test device at different temperatures is obtained.
Drawings
Other features, objects and advantages of the present application will become more apparent upon reading of the detailed description of non-limiting embodiments, made with reference to the following drawings, in which:
FIG. 1 is a flow chart of a performance testing method of a testing device according to an embodiment of the present application;
FIG. 2 is a graph of test results provided by embodiments of the present application;
FIG. 3 is a schematic structural diagram of a performance testing system of a testing device according to an embodiment of the present disclosure;
fig. 4 is a schematic structural diagram of a control device according to an embodiment of the present application;
fig. 5 is a schematic structural diagram of a performance testing apparatus for a testing device according to an embodiment of the present application.
Detailed Description
The present application is described in further detail below with reference to the drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be noted that, for convenience of description, only the portions related to the invention are shown in the drawings.
It should be noted that, in the case of no conflict, the embodiments and features in the embodiments may be combined with each other. The present application will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.
Referring to fig. 1 in detail, the present application provides a performance testing method of a testing device, including:
s01, providing a heating module, wherein the input power of the heating module is adjustable;
s02, providing a testing device for maintaining heat balance of the heating module;
s03, presetting input power, test time, initial temperature and a temperature threshold of a heating module;
s04, connecting the testing device with the heating module, heating the heating module to an initial temperature, adjusting input power and maintaining testing time;
s05, acquiring the real-time temperature of the contact position of the testing device and the heating module;
s06, judging whether the real-time temperatures exceed a temperature threshold value or not in the test time; if not, increasing the input power of the heating module, maintaining the test time, and continuously acquiring the real-time temperature in the test time; if yes, outputting a heat balance performance evaluation result and ending the flow.
The heating device in step S01 is configured to simulate heating and power of a chip, a heating plate is disposed on the heating device, the heating device is electrically connected with the positive electrode and the negative electrode of a dc power supply, and the input power of the heating module is adjustable by adjusting the current and/or the voltage of the power supply.
The testing device in step S02 is configured to heat or cool the heating module when the heating module reaches an initial temperature, so that the heating module is maintained within the temperature threshold.
In the step S03, the test time is the test time maintained at the same input power value each time, and in the subsequent measurement, the test time is the input power duration time by adjusting the power of the heating module, and the real-time temperature is measured in the time period, and the test time is required to be continuously maintained after the power is adjusted, so that the test time is the time maintained at the power value each time, and is not the total test time of the whole test.
In step S03, the temperature threshold=initial temperature±temperature floating value, and the temperature floating value may be selectively set according to the chip test item in the specific setting, and in some test items, the temperature condition requirement is higher, and a smaller temperature floating value may be preferably set.
In step S03, the initial temperature is an initial temperature value for heating the heating module, and after the heating module reaches the initial temperature, the testing device is started to maintain the temperature of the heating module, where the temperature maintaining mode includes heating or cooling, for example, the testing environment needs to be heated under the condition of low temperature so as to maintain the initial temperature; in the case of a high test environment temperature, a temperature reduction is required to maintain the initial temperature.
It should be noted that, the initial temperature may be set multiple times, and the method further includes: the initial temperature is adjusted and the test procedure is re-executed. And (5) obtaining the maximum capability of the testing device at different temperatures by adjusting the initial temperature.
The method for adjusting the input power in step S04 includes: the input power value is adjusted by changing the voltage and/or current. Optionally, the method adjusts the input power and maintains the test time, and the method includes: setting a voltage-time curve, and controlling the voltage input of the heating module.
In step S05, the obtained real-time temperature is the contact position between the testing device and the heating module, and when the chip performance is tested, the testing device is in direct contact with the chip, and whether the testing device can effectively maintain heat of the chip can be intuitively reflected through the contact position. Of course, in some chip performance tests, the test device is not in direct contact with the chip, and in the new testing process of the test device disclosed in the application, the real-time temperature of the outer surface of the heating module can be obtained to reflect the performance of the test device.
Wherein the method for increasing the input power of the heating module in step S06 includes setting an input power step value, and increasing the input power by increasing the step value each time. The same step value may be added each time when specifically set, and of course, different step values may also be added, for example, when the power is smaller, the step value may be increased, and when the power is larger, or when the power is close to the limit power, the step value may be decreased, so as to obtain more accurate maximum power.
In step S06, the outputting the result of the thermal balance performance evaluation includes: the maximum capacity of the testing device at the initial temperature is the maximum input power of the real-time temperature maintained within a temperature threshold value in a certain proportion in the testing time.
In step S06, it is determined that the testing device cannot take away the power consumption of the chip under the test by observing the difference between the actual temperature and the set temperature, if the heating condition of the chip can be maintained, the observed actual temperature is always within the temperature threshold, if the observed actual temperature exceeds the temperature threshold, which indicates that the performance of the testing device has been exceeded, the chip cannot be effectively maintained at the temperature, so that the maximum capacity of the testing device at the initial temperature is the maximum input power of the real-time temperature maintained within the temperature threshold in a certain proportion within the testing time.
It should be noted that during the test time, there may be a part of the acquired real-time temperature exceeding the temperature threshold, but it meets the power requirements of the test, and the test process is not directly ended, because the temperature conduction requires a certain time, which may cause the temperature of the contact position at a certain moment to exceed the temperature threshold, but it is not the maximum capability of the test device.
When calculating the maximum capability of the test device, the ratio of the implemented temperature to the temperature threshold is determined in the period, and when the acquired real-time temperature mostly exceeds the temperature threshold, only a small part of the acquired real-time temperature is maintained within the threshold, the performance of the test device can be considered to be saturated and insufficient to maintain the temperature of the chip.
Examples
A performance test method of a test device comprises the following steps:
connecting the testing device to the heating module, heating the heating module to an initial temperature, for example, 25 ℃, and starting the testing device to cool the heating module;
acquiring the real-time temperature of the contact position of the testing device and the heating module, and judging whether the real-time temperature exceeds a temperature threshold value;
if the real-time temperature is maintained within the temperature threshold according to a certain proportion, the heating module is connected with the direct current power supply, the input power is adjusted in a voltage adjusting mode, the power takes 5w as a stepping value, and the test time of 6 minutes is maintained;
if the real-time temperature does not exceed the temperature threshold in the test time period, continuously increasing the power value and testing;
if the real-time temperature exceeds the temperature threshold value in the test time period, stopping the test and outputting the result.
The test results are shown in fig. 2. In the figure, an L1 curve represents a power curve, the power increases stepwise, 5w is used as a step length, and the maintenance time is 6min; the L2 curve is an obtained real-time temperature curve, and the calibration temperature threshold is 25+/-3 ℃.
When the power is 60w, stopping the test when the real-time temperature exceeds 28 ℃ in the test period; and taking the quantity of the real-time temperature exceeding the temperature threshold value in the test time as the maximum capability of the test device, wherein the quantity of the real-time temperature exceeding the temperature threshold value in the test time is 80% of the quantity of the real-time temperature tested in the test time. For example, in a 50w test period, the real-time temperature falls within the temperature threshold range by 22% and exceeds the temperature threshold by 78% of the total acquired temperature, taking 50w as the maximum capacity of the test device at 25 ℃.
And replacing the initial temperature of the same test equipment, and continuing to test to obtain different performances at different temperatures.
According to the performance test method of the test device, the heating module simulates the heating condition and the power condition of the chip during test, the real-time temperature measurement of the contact position between the test device and the heating module is realized by continuously changing the power and combining the temperature control of the test device, whether the test device can take away the heating energy consumption of the chip or not is judged by judging whether the real-time temperature is in the temperature threshold range, and the maximum capability of the test device at different temperatures is obtained.
In a second aspect, the present application provides a test device performance test system 100 comprising: a heating module 101, wherein the heating module 101 is respectively connected with a testing device 102, a direct current power supply device 103, a control device 104 and a display device 105, and the heating module
The testing device 102 is configured to maintain a thermal balance for the heating module;
the dc power supply 103 is configured to adjust an input power of the heating module;
the control device 104 is configured to preset an input power, a test time, an initial temperature and a temperature threshold of the heating module; the real-time temperature of the contact position of the current testing device and the heating module is obtained in real time; the real-time temperature detecting device is used for timing, judging whether the real-time temperature exceeds a temperature threshold value or not, and calculating the proportion of the real-time temperature exceeding the temperature threshold value to the real-time temperature acquired in the test time; the input power value is used for controlling the input heating module;
the display device 105 is configured to display the data test result.
The control device 104 includes an initialization module 114, a temperature acquisition module 124, a timing module 134, a judgment module 144, a counting module 154, and a power adjustment module 164.
The initialization module 114 is configured to preset an input power, a test time, an initial temperature, and a temperature threshold of the heating module;
the temperature acquisition module 124 is configured to acquire, in real time, a real-time temperature of a contact position between the current testing device and the heating module;
the timing module 134 is configured to time the test time;
the judging module 144 is configured to judge whether the real-time temperature is maintained within a temperature threshold;
the counting module 154 is configured to calculate a proportion of the real-time temperature exceeding the temperature threshold to the real-time temperature acquired in the test time;
the power adjustment module 164 is configured to control the input power value input to the heating module by the dc power device.
It should be noted that, in correspondence with each embodiment of the performance testing method, the performance testing system 100 may include some or all of the functional modules shown in fig. 3 and 4, and the functions of each module will be described in detail below. The same noun-related nouns and their specific explanations in the various embodiments of the performance-testing method described above may also be applied to the functional descriptions of the modules below. For the sake of space saving and repetition avoidance, the description is omitted.
In a third aspect, the present application provides a performance testing apparatus for a testing device, employing a performance testing method for a testing device as described above, the device comprising: comprising a memory, a processor and a computer program stored on the memory and executable on the processor, characterized in that the processor implements the performance testing method of the testing device as described above when executing the program.
The device 200 may be a computing device such as a desktop computer, a notebook computer, a palm top computer, and a cloud server. The apparatus 200 may include, but is not limited to, a processor 10 and a memory 20. It will be appreciated by those skilled in the art that the schematic diagram is merely an example of the apparatus 200 for implementing the image processing method of the present application, and does not constitute a limitation of the apparatus 200, and may include more or less components than those illustrated, or may combine some components, or different components, for example, the device 200 may further include an input/output device, a network access device, a bus, and so on.
The processor 10 may be a central processing unit (Central Processing Unit, CPU), but may also be other general purpose processors, digital signal processors (Digital Signal Processor, DSP), application specific integrated circuits (Application Specific Integrated Circuit, ASIC), off-the-shelf programmable gate arrays (Field Programmable Gate Array, FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, or the like. The general purpose processor may be a microprocessor or the processor may be any conventional processor or the like, and the processor 10 is a control center of the computer device 1, and connects the various parts of the entire computer device 1 using various interfaces and lines.
The memory 20 may be used to store the computer program and/or module, and the processor 10 may implement various functions of the computer device 1 by running or executing the computer program and/or module stored in the memory 20 and invoking data stored in the memory 20. The memory 20 may mainly include a storage program area and a storage data area, wherein the storage program area may store an operating system, application programs required for at least one function (such as a sound playing function, an image playing function, etc.), and the like. In addition, the memory 20 may include high-speed random access memory, and may also include nonvolatile memory, such as a hard disk, memory, plug-in hard disk, smart Media Card (SMC), secure Digital (SD) Card, flash Card (Flash Card), at least one disk storage device, flash memory device, or other volatile solid state storage device.
In a fourth aspect, the present application provides a computer readable storage medium having stored thereon a computer program which, when executed by a processor, implements a performance testing method of a testing apparatus as described above.
The modules integrated with the device 200 described herein, if implemented in the form of software functional units and sold or used as a stand-alone product, may be stored in a computer readable storage medium. Based on such understanding, the present application may implement all or part of the flow of the method of the above embodiment, or may be implemented by instructing related hardware by a computer program, where the computer program may be stored on a computer readable storage medium, and the computer program may implement the steps of each method embodiment described above when executed by a processor. Wherein the computer program comprises computer program code which may be in source code form, object code form, executable file or some intermediate form etc. The computer readable medium may include any entity or device capable of carrying the computer program code, a recording medium, a U disk, a removable hard disk, a magnetic disk, an optical disk, a computer Memory, a Read-Only Memory (ROM), a random access Memory (RAM, random Access Memory), an electrical carrier signal, a telecommunications signal, a software distribution medium, and so forth.
It is to be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate or are based on the orientation or positional relationship shown in the drawings, merely to facilitate description of the present application and simplify description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be configured and operated in a particular orientation, and therefore should not be construed as limiting the present application.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
Unless defined otherwise, technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular implementations only and is not intended to be limiting of the present application. Terms such as "disposed" or the like as used herein may refer to either one element being directly attached to another element or one element being attached to another element through an intermediate member. Features described herein in one embodiment may be applied to another embodiment alone or in combination with other features unless the features are not applicable or otherwise indicated in the other embodiment.
The present application has been illustrated by the above embodiments, but it should be understood that the above embodiments are for the purpose of illustration and description only and are not intended to limit the present application to the embodiments described. Those skilled in the art will appreciate that many variations and modifications are possible in light of the teachings of this application, which variations and modifications are within the scope of what is claimed.
Claims (9)
1. A performance testing method of a testing apparatus, comprising:
providing a heating module, wherein the input power of the heating module is adjustable;
providing a testing device, wherein the testing device is used for heating or cooling the heating module when the heating module reaches an initial temperature so as to maintain the heating module within a temperature threshold;
presetting input power, test time, initial temperature and a temperature threshold of a heating module;
connecting a testing device with the heating module, heating the heating module to an initial temperature, adjusting input power and maintaining testing time;
acquiring the real-time temperature of the contact position of the testing device and the heating module;
judging whether the real-time temperatures exceed a temperature threshold value or not in the test time; if not, increasing the input power of the heating module, maintaining the test time, and continuously acquiring the real-time temperature in the test time; if yes, outputting a heat balance performance evaluation result and ending the flow.
2. The performance testing method of a testing apparatus according to claim 1, wherein the method of adjusting the input power comprises: the value of the input power is adjusted by varying the voltage and/or current.
3. The performance testing method of a testing apparatus according to claim 2, wherein the adjusting the input power and maintaining the testing time, the method comprising: setting a voltage-time curve, and controlling the voltage input of the heating module.
4. The performance testing method of a testing apparatus according to claim 1, wherein the method of increasing the input power of the heating module includes setting an input power step value to increase the input power every time the step value is increased.
5. The performance test method of the test apparatus according to claim 1, wherein the outputting the result of the thermal balance performance evaluation includes: the maximum capacity of the testing device at the initial temperature is the maximum input power of the real-time temperature maintained within a temperature threshold value in a certain proportion in the testing time.
6. The performance testing method of a testing apparatus according to claim 1, further comprising: the initial temperature is adjusted and the test procedure is re-executed.
7. A test device performance test system employing the test device performance test method of any one of claims 1-6, the system comprising: the heating module is respectively connected with a testing device, a direct current power supply device, a control device and a display device; wherein, the liquid crystal display device comprises a liquid crystal display device,
the direct-current power supply device is used for adjusting the input power of the heating module;
the control device is used for presetting input power, test time, initial temperature and temperature threshold of the heating module; the real-time temperature of the contact position of the current testing device and the heating module is obtained in real time; the real-time temperature detecting device is used for timing, judging whether the real-time temperature exceeds a temperature threshold value or not, and calculating the proportion of the real-time temperature exceeding the temperature threshold value to the real-time temperature acquired in the test time; the input power value is used for controlling the input heating module;
the display device is used for displaying the data test result.
8. A test device performance test apparatus comprising: computer program comprising a memory, a processor and a computer program stored on the memory and executable on the processor, characterized in that the processor implements the performance testing method of the testing apparatus according to any one of claims 1-6 when executing the program.
9. A computer readable storage medium having stored thereon a computer program which, when executed by a processor, implements a performance testing method of a testing apparatus according to any of claims 1-6.
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| CN114489187B (en) * | 2021-12-30 | 2023-06-16 | 中航华东光电有限公司 | Temperature control method and system for rapid temperature change test box |
| CN114578277A (en) * | 2022-03-14 | 2022-06-03 | 广州五所环境仪器有限公司 | Thermal load calibration method for high-low temperature environment test chamber |
| CN114326868B (en) * | 2022-03-17 | 2022-06-17 | 北京象帝先计算技术有限公司 | Chip temperature feedback method and device, storage medium and chip temperature control method |
| CN116580752B (en) * | 2023-04-26 | 2024-03-19 | 深圳市晶存科技有限公司 | Incubator for test and test method thereof |
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