CN111625433A - Server thermal test method, device and related equipment - Google Patents
Server thermal test method, device and related equipment Download PDFInfo
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Abstract
The application discloses a server thermal test method, which comprises the steps of determining a working mode according to a received test instruction; triggering a temperature control circuit to control the temperature of the server element according to the working mode; acquiring temperature through a temperature sensor circuit to obtain a temperature value; judging whether the temperature value meets a standard temperature threshold value corresponding to the working mode, if so, outputting test passing information; the server thermal test method can realize more comprehensive server thermal test and simultaneously ensure the test efficiency. The application also discloses a server thermal test device, equipment, a system and a computer readable storage medium, which all have the beneficial effects.
Description
Technical Field
The present application relates to the field of server technologies, and in particular, to a server thermal test method, and further, to a server thermal test apparatus, device, system, and computer-readable storage medium.
Background
With the rapid development of the server industry, the requirements of various industries on the stability and performance of the server are higher and higher, and the testing link is essential for ensuring the quality of the server. The heat dissipation test and the heating test are the most important in the server test link, and the relation between the performance of a CPU (Central processing Unit) or the performance of a memory and the temperature can be obtained by carrying out the server thermal test, so that the CPU is matched with a proper radiator or fan, or the inside of a case, particularly the CPU, is actively heated, and the stability of the server can be tested. However, the existing technologies such as liquid cooling heat dissipation, immersion heat dissipation, oven heating, etc. are all applied to the server deployment level, and are not implemented in the server testing level, and the implementation cost is high.
Therefore, how to provide a server hot test method with multiple functionalities and ensure the test efficiency is a problem to be urgently solved by those skilled in the art.
Disclosure of Invention
The server thermal test method can realize more comprehensive server thermal test and simultaneously ensure the test efficiency; it is another object of the present application to provide a server thermal testing apparatus, device, system and computer readable storage medium, also having the above-mentioned benefits.
In order to solve the above technical problem, in a first aspect, the present application provides a server thermal test method, including:
determining a working mode according to the received test instruction;
triggering a temperature control circuit to control the temperature of the server element according to the working mode;
acquiring temperature through a temperature sensor circuit to obtain a temperature value;
and judging whether the temperature value meets a standard temperature threshold value corresponding to the working mode, and if so, outputting test passing information.
Preferably, the operation modes include a heating mode, a cooling mode and a constant temperature mode, and the triggering the temperature control circuit to perform temperature control according to the operation modes includes:
when the working mode is a heating mode, the temperature control circuit starts the hot resistance wire to heat the server element;
when the working mode is a cooling mode, starting the semiconductor refrigeration piece through the temperature control circuit to cool the server element;
and when the working mode is a constant temperature mode, acquiring a target temperature corresponding to the constant temperature mode, and starting the hot resistance wire and the semiconductor refrigerating sheet through the temperature control circuit so as to enable the temperature value to be the same as the target temperature.
Preferably, the acquiring the temperature through the temperature sensor circuit to obtain the temperature value includes:
acquiring a preset number of temperature acquisition times through the temperature sensor circuit to obtain a preset number of initial temperature values;
and calculating each initial temperature value according to a preset calculation strategy to obtain the temperature value.
Preferably, before outputting the test passing information, the method further includes:
obtaining temperature change information according to the temperature value;
and judging whether the temperature change information corresponds to the working mode or not, and if so, executing the step of outputting the test passing information.
Preferably, the server thermal test method further includes:
and sending the temperature value to a display device for real-time display.
Preferably, the server thermal test method further includes:
and when the temperature value does not meet the standard temperature threshold value corresponding to the working mode, or the temperature change information does not correspond to the working mode, sending an alarm instruction to alarm equipment.
In a second aspect, the present application further provides a server thermal testing apparatus, including:
the working mode determining module is used for determining a working mode according to the received test instruction;
the temperature control module is used for triggering the temperature control circuit to control the temperature of the server element according to the working mode;
the temperature acquisition module is used for acquiring temperature through the temperature sensor circuit to obtain a temperature value;
and the temperature judgment module is used for judging whether the temperature value meets a standard temperature threshold corresponding to the working mode, and if so, outputting test passing information.
In a third aspect, the present application further discloses a server, including:
a memory for storing a computer program;
a processor for executing the computer program to implement the steps of any of the server thermal test methods described above.
In a fourth aspect, the application also discloses a server thermal test system, including as above server thermal test equipment to and temperature control mechanism, motor water pump, temperature controller, wherein, temperature control mechanism pass through the heat preservation tubular metal resonator with the motor water pump links to each other, the motor water pump passes through the heat preservation tubular metal resonator with the temperature controller links to each other, server thermal test equipment pass through temperature control circuit with temperature control mechanism links to each other, server thermal test equipment passes through temperature sensor circuit and links to each other with the temperature controller.
In a fifth aspect, the present application further discloses a computer readable storage medium having a computer program stored therein, which when executed by a processor is configured to implement the steps of any one of the server thermal test methods described above.
The server thermal test method comprises the steps of determining a working mode according to a received test instruction; triggering a temperature control circuit to control the temperature of the server element according to the working mode; acquiring temperature through a temperature sensor circuit to obtain a temperature value; and judging whether the temperature value meets a standard temperature threshold value corresponding to the working mode, and if so, outputting test passing information.
Therefore, the server thermal test method provided by the application realizes temperature control on the server element by arranging the temperature control circuit, and simultaneously realizes real-time temperature acquisition by arranging the temperature sensor circuit, so that whether the acquired temperature value meets the corresponding requirement can be judged in a specified temperature control mode, and then the thermal test on the server is realized.
The server thermal testing device, the equipment, the system and the computer readable storage medium provided by the application all have the beneficial effects, and are not repeated herein.
Drawings
In order to more clearly illustrate the technical solutions in the prior art and the embodiments of the present application, the drawings that are needed to be used in the description of the prior art and the embodiments of the present application will be briefly described below. Of course, the following description of the drawings related to the embodiments of the present application is only a part of the embodiments of the present application, and it will be obvious to those skilled in the art that other drawings can be obtained from the provided drawings without any creative effort, and the obtained other drawings also belong to the protection scope of the present application.
Fig. 1 is a schematic flowchart of a server thermal testing method provided in the present application;
FIG. 2 is a top view of a mechanical structure portion of a server thermal testing system provided in the present application;
FIG. 3 is a bottom view of the mechanical structure of a server thermal testing system provided in the present application;
FIG. 4 is a main control circuit diagram of a server thermal test system provided in the present application;
FIG. 5 is a circuit diagram of a server thermal test system provided in the present application;
FIG. 6 is a circuit diagram of a temperature sensor of a server thermal testing system according to the present application;
FIG. 7 is a circuit diagram of a temperature control circuit of a server thermal test system provided in the present application;
FIG. 8 is a key circuit diagram of a server thermal test system provided in the present application;
FIG. 9 is a motor driving circuit diagram of a server thermal testing system provided in the present application;
FIG. 10 is an alarm circuit diagram of a server thermal test system provided herein;
FIG. 11 is a power circuit diagram of a server thermal test system provided in the present application;
FIG. 12 is a schematic structural diagram of a server thermal testing apparatus provided in the present application;
fig. 13 is a schematic structural diagram of a server thermal testing apparatus provided in the present application.
Detailed Description
The core of the application is to provide a server thermal test method, which can realize more comprehensive server thermal test and ensure the test efficiency; at the other core of the application, the server thermal testing device, the equipment, the system and the computer readable storage medium have the beneficial effects.
In order to more clearly and completely describe the technical solutions in the embodiments of the present application, the technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
With the rapid development of the server industry, the requirements of various industries on the stability and performance of the server are higher and higher, and the testing link is essential for ensuring the quality of the server. The heat dissipation test and the heating test are the most important in the server test link, and the relation between the performance of a CPU (Central processing Unit) or the performance of a memory and the temperature can be obtained by carrying out the server thermal test, so that the CPU is matched with a proper radiator or fan, or the inside of a case, particularly the CPU, is actively heated, and the stability of the server can be tested. However, the existing technologies such as liquid cooling heat dissipation, immersion heat dissipation, oven heating, etc. are all applied to the server deployment level, and are not implemented in the server testing level, and the implementation cost is high. Therefore, in order to solve the technical problem, the application provides a server thermal test method, which can realize more comprehensive server thermal test and ensure the test efficiency.
Referring to fig. 1, fig. 1 is a schematic flowchart of a server thermal testing method provided in the present application, including:
s101: determining a working mode according to the received test instruction;
this step is intended to enable the determination of the operating mode, which corresponds to the type of thermal test, cooling if heat dissipation type test, heating mode, etc. Specifically, the staff can launch the test instruction according to actual demand, and from this, the master controller can confirm corresponding mode through carrying out the instruction analysis to the test instruction. It is understood that, since the test type of the thermal test is not unique, the specific operation mode of the test system is also not unique, but the two modes correspond to each other, and the present application does not limit this.
S102: triggering a temperature control circuit to control the temperature of the server element according to the working mode;
the step aims to realize temperature control, and is realized through a temperature control circuit, specifically, after a working mode is determined, the temperature control circuit can be triggered to control the temperature of the server element, as described above, when the working mode is a cooling mode, the server element is cooled through the temperature control circuit, and when the working mode is a heating mode, the server element is heated through the temperature control circuit, and in addition, the temperature control circuit can also be used for keeping constant temperature or regulating and controlling the temperature according to a certain strategy.
As a preferred embodiment, the operation modes may include a heating mode, a cooling mode and a constant temperature mode, and the triggering the temperature control circuit to perform temperature control according to the operation modes may include: when the working mode is a heating mode, the temperature control circuit starts the hot resistance wire to heat the server element; when the working mode is the cooling mode, the semiconductor refrigerating sheet is started through the temperature control circuit to cool the server element; when the working mode is the constant temperature mode, the target temperature corresponding to the constant temperature mode is obtained, and the thermal resistance wire and the semiconductor refrigerating sheet are started through the temperature control circuit, so that the temperature value is the same as the target temperature.
This preferred embodiment provides a comparatively concrete temperature control mode, realizes heating control through the hot-resistance silk promptly, realizes heat dissipation control through the semiconductor refrigeration piece, and the two combines to realize the constant temperature and keep. Specifically, for the heating mode, the working of the thermal resistance wire can be controlled by the temperature control circuit; for the cooling mode, the semiconductor refrigerating sheet can be controlled to work through the temperature control circuit; for the constant temperature mode, the temperature control circuit can control the thermal resistance wire and the semiconductor refrigeration piece to work simultaneously so as to ensure that the acquired temperature value is the same as the preset constant temperature; the preset constant temperature is the target temperature, and the acquired temperature value is the actual temperature value acquired by the temperature sensor circuit in S103, which may be referred to as described later.
As a preferred embodiment, the server elements may include memory banks and CPU banks.
The preferred embodiment provides two specific server components, namely the memory bank and the CPU bank. Of course, the above type is only one implementation manner provided by the preferred embodiment, and the server element may be any component in the server that needs to perform temperature control, and the specific type does not affect the implementation of the present technical solution.
S103: acquiring temperature through a temperature sensor circuit to obtain a temperature value;
the step aims to realize temperature acquisition, namely, in the temperature control process, the temperature sensor circuit is utilized to acquire the temperature to obtain a corresponding temperature value. The temperature value may be a temperature value of the thermal resistance wire, the semiconductor refrigeration chip, the memory bank, the CPU bank, or the like.
As a preferred embodiment, the acquiring the temperature value by the temperature sensor circuit may include: acquiring a preset number of temperature acquisition times through a temperature sensor circuit to obtain a preset number of initial temperature values; and calculating each initial temperature value according to a preset calculation strategy to obtain a temperature value.
The preferred embodiment provides a more specific temperature value acquisition method, that is, the temperature data acquired by multiple times of acquisition is calculated to ensure the accuracy of the final temperature value. Specifically, a preset number of temperature acquisitions may be performed to obtain corresponding initial temperature values, and then the initial temperature values are calculated according to a preset calculation strategy to obtain final temperature values. The specific content of the preset calculation strategy is not unique, for example, the average value of all initial temperature values may be calculated and used as the temperature value, or the median of all initial temperature values may be selected and used as the temperature value. In addition, the specific value of the preset times does not affect the implementation of the technical scheme, and the application does not limit the implementation.
S104: judging whether the temperature value meets a standard temperature threshold corresponding to the working mode, if so, executing S105, and if not, executing S106;
s105: outputting test passing information;
s106: and outputting the test failure information.
This step is intended to achieve a temperature decision to obtain the final thermal test result. Specifically, whether the collected temperature value meets a standard temperature threshold corresponding to the working mode or not can be judged, if yes, the test is passed, test passing information can be output, and if not, a prompt that the test is not passed can be output.
As a preferred embodiment, before outputting the test passing information, the method may further include: obtaining temperature change information according to the temperature value; and judging whether the temperature change information corresponds to the working mode, if so, executing a step of outputting test passing information.
The preferred embodiment provides a more specific server thermal test method, and specifically, the temperature change trend may be determined, a corresponding temperature value is obtained through multiple temperature acquisitions, and then temperature change information is obtained according to multiple temperature values, so that it can be determined whether the temperature change information corresponds to a working mode, for example, whether the temperature value is in an upward trend in a heating mode, whether the temperature value is in a downward trend in a cooling mode, and so on, and then whether the test is passed or not is determined.
As a preferred embodiment, the server thermal test method may further include: and sending the temperature value to a display device for real-time display.
The preferred embodiment aims at realizing temperature display, namely, the acquired temperature value is displayed in real time through the display equipment, so that the working personnel can timely know the current test information.
As a preferred embodiment, the server thermal test method may further include: and when the temperature value does not meet the standard temperature threshold value corresponding to the working mode or the temperature change information does not correspond to the working mode, sending an alarm instruction to alarm equipment.
The preferred embodiment aims to realize test alarm, namely when the server fails in the thermal test, an alarm instruction is sent to alarm equipment to alarm so as to remind workers that the current test fails and the tested server element is unqualified.
Therefore, the server thermal test method provided by the application realizes temperature control on the server element by arranging the temperature control circuit, and simultaneously realizes real-time temperature acquisition by arranging the temperature sensor circuit, so that whether the acquired temperature value meets the corresponding requirement can be judged in a specified temperature control mode, and then the thermal test on the server is realized.
On the basis of the above embodiments, the embodiments of the present application provide a more specific server thermal test method.
Specifically, the server thermal test system is composed of a mechanical structure and a hardware circuit, wherein the mechanical structure is responsible for realizing a heat exchange function, and the hardware circuit is responsible for realizing functions such as control, monitoring and communication.
Firstly, a mechanical structure:
referring to fig. 2 and fig. 3, fig. 2 is a top view of a mechanical structure portion of a server thermal testing system provided in the present application, and fig. 3 is a bottom view of the mechanical structure portion of the server thermal testing system provided in the present application, wherein reference numeral 1 is a cooling mechanism, which can cool a liquid therein by using a semiconductor cooling plate; the reference numeral 2 is a heating mechanism, which can utilize a plurality of thermal resistance wires to heat the liquid in the heating mechanism; reference numeral 3 is a micro direct current motor water pump for promoting the liquid flow in the device; the number 4 is a heat preservation metal hose which plays a communicating role and is used for connecting a water pump and a heating (cooling) mechanism; the number 5 is a heat preservation metal hose which plays a communicating role and is used for connecting the memory heat radiator (heater) and the CPU heat radiator (heater); reference numeral 6 is a controller placement position; reference numeral 7 denotes a memory heat sink (heater) for heating or cooling the memory bank; reference numeral 8 denotes a CPU radiator (heater) for heating or cooling the CPU strip; reference numeral 9 denotes a metal hose for connecting the two CPU radiators (heaters).
II, hardware circuit:
the hardware circuit part comprises a main control circuit, a power supply circuit, a display circuit, an alarm circuit, a motor driving circuit, a cooling module control circuit, a heating module control circuit, a key circuit and a temperature sensor circuit. FIG. 4 is a schematic diagram of a master control circuit of a server thermal test system according to the present application, wherein the controller selects Arduino 328; fig. 5 is a display circuit diagram of a server thermal test system provided in the present application, where a display screen selects 12864, which may be displayed in multiple rows for easy viewing; fig. 6 is a circuit diagram of a temperature sensor of a server thermal test system provided in the present application, which is composed of an amplifier and a thermistor, and has a high measurement range, where a0, a1, a2, and A3 respectively correspond to temperature acquisition of a memory heat spreader (heater), a CPU heat spreader (heater), a cooling mechanism, and a heating mechanism; fig. 7 is a temperature control circuit diagram of a server thermal test system provided in the present application, where D2 and D3 correspond to a cooling module control circuit and a heating module control circuit, respectively, and are each composed of a triode, an electrical relay, and a socket pin, and are controlled by a switching value; FIG. 8 is a key circuit diagram of a server thermal test system provided by the present application for mediating human-computer interaction, wherein D4, D5 and D6 correspond to a heating mode, a cooling mode and a constant temperature mode respectively; fig. 9 is a motor driving circuit diagram of a server thermal testing system provided in the present application, which is composed of L298N, and is used for driving four dc motor water pumps, and the speed of the water pumps can be adjusted by PWM (pulse width modulation) to control the flow rate; fig. 10 is an alarm circuit diagram of a server thermal test system provided in the present application, which is composed of a buzzer for reminding a user when an abnormality is detected; fig. 11 is a power circuit diagram of a server thermal test system provided in the present application, which is composed of LM7805 and LM7812, and is used to supply power to other circuits.
Further, based on the above mechanical structure and hardware circuit, the server thermal test method has the following specific implementation flow:
first, four temperature sensors are respectively installed in a memory radiator (heater), a CPU radiator (heater), a cooling device, and a heating device, and the detected temperatures are denoted as TA, TB, TC, and TD. Second, a separate key may input setting modes including a cooling mode, a heating mode, and a constant temperature mode. Furthermore, after the independent key circuit sets a cooling mode, the cooling module starts to work and cools the liquid in the cooling module, the water pump of the cooling module starts to work, the heating module does not work, and the cooling liquid flows out of the cooling module, sequentially passes through the memory heat radiator (heater), the CPU heat radiator (heater) and the heating device and then returns to the cooling module; after the independent key circuit sets a heating mode, the heating module starts to work and heats liquid in the heating module, a water pump of the heating module starts to work, the cooling module does not work, and heating liquid flows out of the cooling module, sequentially passes through the memory radiator (heater), the CPU radiator (heater) and the heating device and then returns to the heating module; after the independent key circuit sets a constant temperature mode, the working temperature TS needs to be set, if TA is greater than TS, TB is greater than TS, a water pump of the cooling module starts to work, the heating module does not work, the cooling liquid flows out from the cooling module, sequentially passes through the memory heat radiator, the CPU heat radiator and the heating device, and then returns to the cooling module, if TA is less than TS, TB is less than TS, the water pump of the heating module starts to work, the cooling module does not work, the heating liquid flows out from the cooling module, sequentially passes through the memory heat radiator, the CPU heat radiator and the heating device, and then returns to the heating module. Meanwhile, the temperature values inside and outside the server are displayed on the liquid crystal display in real time.
In order to improve the detection accuracy of the temperature sensor, a data processing algorithm can be further arranged to realize temperature detection, taking TB temperature as an example, and other temperatures are consistent with the TB temperature:
and 5, selecting 5 numbers close to TBPZ from TBP 1-TBP 9, calculating an average value, and assigning the average value to TB to obtain the final result.
The server thermal test method provided by the embodiment of the application can realize three modes of server thermal test, is beneficial to improving the test efficiency, provides test data, displays the temperature in real time, stores the test data, and can realize computer communication through the external pin. Meanwhile, the method is applied to the testing layer of the server, can be applied to various types of machines, and has universality; the complexity of related tests can be truly simplified, and the method has practicability; the feedback and alarm functions can be realized, a complete closed-loop system is formed, heat dissipation and heating are unified, and the system has integrity.
To solve the above technical problem, the present application further provides a server thermal testing apparatus, please refer to fig. 12, where fig. 12 is a schematic structural diagram of the server thermal testing apparatus provided in the present application, and the server thermal testing apparatus includes:
a working mode determining module 100, configured to determine a working mode according to the received test instruction;
the temperature control module 200 is used for triggering the temperature control circuit to control the temperature of the server element according to the working mode;
the temperature acquisition module 300 is used for acquiring temperature through the temperature sensor circuit to obtain a temperature value;
and the temperature judgment module 400 is configured to judge whether the temperature value meets a standard temperature threshold corresponding to the working mode, and if so, output test passing information.
It is thus clear that the server heat testing device that this application embodiment provided realizes the temperature control to the server component through setting up the temperature control circuit, sets up the temperature sensor circuit simultaneously and realizes real-time temperature collection, from this, can judge whether the temperature value of gathering satisfies corresponding requirement under appointed temperature control mode, and then realize the heat test to the server, and this kind of implementation not only can effectively guarantee the comprehensiveness of server heat test, and operation flow is simple moreover, has higher efficiency of software testing.
As a preferred embodiment, the temperature control module 200 may include:
the heating unit is used for starting the hot resistance wire through the temperature control circuit to heat the server element when the working mode is a heating mode;
the heat dissipation unit is used for starting the semiconductor refrigeration piece through the temperature control circuit to cool the server element when the working mode is the cooling mode;
and the constant temperature control unit is used for acquiring a target temperature corresponding to the constant temperature mode when the working mode is the constant temperature mode, and starting the thermal resistance wire and the semiconductor refrigerating sheet through the temperature control circuit so as to enable the temperature value to be the same as the target temperature.
As a preferred embodiment, the temperature acquisition module 300 may be specifically configured to perform a preset number of temperature acquisition through the temperature sensor circuit to obtain a preset number of initial temperature values; and calculating each initial temperature value according to a preset calculation strategy to obtain a temperature value.
As a preferred embodiment, the server thermal testing apparatus may further include a temperature change determining module, configured to obtain temperature change information according to the temperature value before the test passing information is output; and judging whether the temperature change information corresponds to the working mode, if so, executing a step of outputting test passing information.
As a preferred embodiment, the server thermal testing apparatus may further include a display module, configured to send the temperature value to a display device for real-time display.
As a preferred embodiment, the server thermal test apparatus may further include an alarm module, configured to send an alarm instruction to an alarm device when the temperature value does not meet the standard temperature threshold corresponding to the operating mode, or the temperature change information does not correspond to the operating mode.
For the introduction of the apparatus provided in the present application, please refer to the above method embodiments, which are not described herein again.
To solve the above technical problem, the present application further provides a server, please refer to fig. 13, where fig. 13 is a schematic structural diagram of a server thermal testing apparatus provided in the present application, and the server thermal testing apparatus may include:
a memory 10 for storing a computer program;
the processor 20, when executing the computer program, may implement the steps of any of the server thermal test methods described above.
For the introduction of the device provided in the present application, please refer to the above method embodiment, which is not described herein again.
In order to solve the problem, the application further provides a server thermal test system, which comprises the server thermal test equipment, a temperature control mechanism, a motor water pump and a temperature controller, wherein the temperature control mechanism is connected with the motor water pump through a heat preservation metal pipe, the motor water pump is connected with the temperature controller through the heat preservation metal pipe, the server thermal test equipment is connected with the temperature control mechanism through a temperature control circuit, and the server thermal test equipment is connected with the temperature controller through a temperature sensor circuit.
For the introduction of the system provided by the present application, please refer to the above method embodiment, which is not described herein again.
To solve the above problem, the present application further provides a computer-readable storage medium, on which a computer program is stored, and the computer program, when executed by a processor, can implement the steps of any one of the server thermal test methods described above.
The computer-readable storage medium may include: various media capable of storing program codes, such as a usb disk, a removable hard disk, a Read-only Memory (ROM), a Random Access Memory (RAM), a magnetic disk, or an optical disk.
For the introduction of the computer-readable storage medium provided in the present application, please refer to the above method embodiments, which are not described herein again.
The embodiments are described in a progressive manner in the specification, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other. The device disclosed by the embodiment corresponds to the method disclosed by the embodiment, so that the description is simple, and the relevant points can be referred to the method part for description.
Those of skill would further appreciate that the various illustrative elements and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware, computer software, or combinations of both, and that the various illustrative components and steps have been described above generally in terms of their functionality in order to clearly illustrate this interchangeability of hardware and software. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the implementation. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present application.
The steps of a method or algorithm described in connection with the embodiments disclosed herein may be embodied directly in hardware, in a software module executed by a processor, or in a combination of the two. A software module may reside in Random Access Memory (RAM), memory, Read Only Memory (ROM), electrically programmable ROM, electrically erasable programmable ROM, registers, hard disk, a removable disk, a CD-ROM, or any other form of storage medium known in the art.
The technical solutions provided by the present application are described in detail above. The principles and embodiments of the present application are explained herein using specific examples, which are provided only to help understand the method and the core idea of the present application. It should be noted that, for those skilled in the art, without departing from the principle of the present application, several improvements and modifications can be made to the present application, and these improvements and modifications also fall into the protection scope of the present application.
Claims (10)
1. A server thermal test method, comprising:
determining a working mode according to the received test instruction;
triggering a temperature control circuit to control the temperature of the server element according to the working mode;
acquiring temperature through a temperature sensor circuit to obtain a temperature value;
and judging whether the temperature value meets a standard temperature threshold value corresponding to the working mode, and if so, outputting test passing information.
2. The server thermal test method according to claim 1, wherein the operation modes include a heating mode, a cooling mode and a constant temperature mode, and the triggering the temperature control circuit to perform temperature control according to the operation modes comprises:
when the working mode is a heating mode, the temperature control circuit starts the hot resistance wire to heat the server element;
when the working mode is a cooling mode, starting the semiconductor refrigeration piece through the temperature control circuit to cool the server element;
and when the working mode is a constant temperature mode, acquiring a target temperature corresponding to the constant temperature mode, and starting the hot resistance wire and the semiconductor refrigerating sheet through the temperature control circuit so as to enable the temperature value to be the same as the target temperature.
3. The server thermal test method according to claim 1, wherein the acquiring the temperature through the temperature sensor circuit to obtain the temperature value comprises:
acquiring a preset number of temperature acquisition times through the temperature sensor circuit to obtain a preset number of initial temperature values;
and calculating each initial temperature value according to a preset calculation strategy to obtain the temperature value.
4. The server thermal test method according to any one of claims 1 to 3, wherein before outputting the test passing information, the method further comprises:
obtaining temperature change information according to the temperature value;
and judging whether the temperature change information corresponds to the working mode or not, and if so, executing the step of outputting the test passing information.
5. The server thermal test method according to claim 4, further comprising:
and sending the temperature value to a display device for real-time display.
6. The server thermal test method of claim 5, further comprising:
and when the temperature value does not meet the standard temperature threshold value corresponding to the working mode, or the temperature change information does not correspond to the working mode, sending an alarm instruction to alarm equipment.
7. A server thermal testing apparatus, comprising:
the working mode determining module is used for determining a working mode according to the received test instruction;
the temperature control module is used for triggering the temperature control circuit to control the temperature of the server element according to the working mode;
the temperature acquisition module is used for acquiring temperature through the temperature sensor circuit to obtain a temperature value;
and the temperature judgment module is used for judging whether the temperature value meets a standard temperature threshold corresponding to the working mode, and if so, outputting test passing information.
8. A server thermal test apparatus, comprising:
a memory for storing a computer program;
a processor for executing the computer program to implement the steps of the server thermal test method according to any of claims 1 to 6.
9. A server thermal test system, which is characterized by comprising the server thermal test device as claimed in claim 8, and a temperature control mechanism, a motor water pump and a temperature controller, wherein the temperature control mechanism is connected with the motor water pump through a heat-preservation metal pipe, the motor water pump is connected with the temperature controller through the heat-preservation metal pipe, the server thermal test device is connected with the temperature control mechanism through a temperature control circuit, and the server thermal test device is connected with the temperature controller through a temperature sensor circuit.
10. A computer-readable storage medium, in which a computer program is stored which, when being executed by a processor, is adapted to carry out the steps of the server thermal testing method according to any one of claims 1 to 6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010377554.9A CN111625433A (en) | 2020-05-07 | 2020-05-07 | Server thermal test method, device and related equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010377554.9A CN111625433A (en) | 2020-05-07 | 2020-05-07 | Server thermal test method, device and related equipment |
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| CN111625433A true CN111625433A (en) | 2020-09-04 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010377554.9A Withdrawn CN111625433A (en) | 2020-05-07 | 2020-05-07 | Server thermal test method, device and related equipment |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112731238A (en) * | 2020-12-16 | 2021-04-30 | 苏州通富超威半导体有限公司 | Performance test method, system, equipment and medium of test device |
| CN112749054A (en) * | 2020-12-29 | 2021-05-04 | 苏州浪潮智能科技有限公司 | Server heat dissipation testing device and method, electronic equipment and storage medium |
| CN113484730A (en) * | 2021-07-22 | 2021-10-08 | 深圳市优界科技有限公司 | Air flow temperature control method and system for chip testing |
| CN114167912A (en) * | 2021-12-07 | 2022-03-11 | 苏州华星光电技术有限公司 | Temperature control device and service life testing method of display panel |
| CN117148124A (en) * | 2023-11-01 | 2023-12-01 | 杭州高坤电子科技有限公司 | Integrated circuit thermal resistance testing method, system and storage medium |
-
2020
- 2020-05-07 CN CN202010377554.9A patent/CN111625433A/en not_active Withdrawn
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112731238A (en) * | 2020-12-16 | 2021-04-30 | 苏州通富超威半导体有限公司 | Performance test method, system, equipment and medium of test device |
| CN112731238B (en) * | 2020-12-16 | 2023-06-06 | 苏州通富超威半导体有限公司 | Performance test method, system, equipment and medium of test device |
| CN112749054A (en) * | 2020-12-29 | 2021-05-04 | 苏州浪潮智能科技有限公司 | Server heat dissipation testing device and method, electronic equipment and storage medium |
| CN113484730A (en) * | 2021-07-22 | 2021-10-08 | 深圳市优界科技有限公司 | Air flow temperature control method and system for chip testing |
| CN113484730B (en) * | 2021-07-22 | 2024-02-20 | 深圳市优界科技有限公司 | Air flow temperature control method and system for chip test |
| CN114167912A (en) * | 2021-12-07 | 2022-03-11 | 苏州华星光电技术有限公司 | Temperature control device and service life testing method of display panel |
| CN117148124A (en) * | 2023-11-01 | 2023-12-01 | 杭州高坤电子科技有限公司 | Integrated circuit thermal resistance testing method, system and storage medium |
| CN117148124B (en) * | 2023-11-01 | 2024-02-20 | 杭州高坤电子科技有限公司 | Integrated circuit thermal resistance testing method, system and storage medium |
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Application publication date: 20200904 |