CN114578277A - Thermal load calibration method for high-low temperature environment test chamber - Google Patents
Thermal load calibration method for high-low temperature environment test chamber Download PDFInfo
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- CN114578277A CN114578277A CN202210247329.2A CN202210247329A CN114578277A CN 114578277 A CN114578277 A CN 114578277A CN 202210247329 A CN202210247329 A CN 202210247329A CN 114578277 A CN114578277 A CN 114578277A
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Abstract
The application relates to a thermal load calibration method for a high-low temperature environment test box. The method comprises the following steps: adjusting the temperature of the high-low temperature environment test chamber to be stabilized at each preset verification temperature; under the condition that the high-low temperature environment test box is stabilized at a preset test temperature, adjusting the working power of the heat load to be stabilized at each preset power; and acquiring verification parameters when the high-low temperature environment test box is stable at each preset verification temperature and the thermal load is at different working powers. By adopting the method, the high-low temperature test box can be accurately verified under the condition that the heat load is placed in the high-low temperature environment test box.
Description
Technical Field
The application relates to the technical field of parameter verification of high-low temperature environment test boxes, in particular to a thermal load verification method of a high-low temperature environment test box.
Background
In the traditional technology, the high-low temperature environment test box thermal load calibration method of the high-low temperature environment test box cannot accurately calibrate the key indexes of the high-low temperature test box. The calibration accuracy of the high-low temperature test chamber directly affects the result of the reliability test of the electronic device by using the high-low temperature environmental test chamber, so that a calibration scheme capable of accurately performing the high-low temperature environmental test chamber is urgently needed.
Disclosure of Invention
In view of the above, it is necessary to provide a method for verifying the thermal load of the high and low temperature environmental test chamber.
The application provides a thermal load calibration method for a high-low temperature environment test chamber, which comprises the following steps:
adjusting the temperature of the high-low temperature environment test chamber to be stabilized at each preset verification temperature;
under the condition that the high-low temperature environment test box is stabilized at a preset test temperature, adjusting the working power of the heat load to be stabilized at each preset power;
and acquiring the verification parameters when the high-low temperature environment test box is stabilized at each preset verification temperature and the heat load is at different working powers.
In one embodiment, the step of adjusting the temperature of the high-low temperature environmental test chamber to be stable at each preset verification temperature includes:
and adjusting the temperature of the high-low temperature environment test chamber to be maintained at a preset verification temperature within a first preset time.
In one embodiment, the step of adjusting the operating power of the thermal load to be stabilized at each preset power includes:
and adjusting the working power of the heat load to be maintained at the preset power within a second preset time.
In one embodiment, before the step of adjusting the temperature of the high-low temperature environmental test chamber to be stable at each preset verification temperature, the method further comprises:
determining the highest verification temperature and the lowest verification temperature according to the design indexes of the high-low temperature environment test box;
and determining each preset verification temperature according to the highest verification temperature and the lowest verification temperature, wherein the preset verification temperature is greater than or equal to the lowest verification temperature and less than or equal to the highest verification temperature.
In one embodiment, the step of adjusting the temperature of the high-low temperature environmental test chamber to be stable at each preset verification temperature includes:
from the ambient temperature, gradually increasing the temperature to each preset temperature until the highest detection temperature;
or from the ambient temperature, gradually reducing the temperature to each preset temperature until the lowest verification temperature.
In one embodiment, the method further includes:
determining the maximum heat load power according to the design index of the high-low temperature environment test box;
and determining each preset power of the heat load according to the maximum heat load power, wherein the preset power is more than or equal to 0 and less than or equal to the maximum heat load power.
In one embodiment, the step of adjusting the operating power of the thermal load to be stabilized at each preset power includes:
and gradually increasing the minimum preset power to the maximum preset power.
In one embodiment, the volume of the heat load is less than or equal to half of the internal volume of the high and low temperature environmental test chamber.
In one embodiment, the method further comprises the steps of:
and generating a verification result of the high-low temperature environment test box under a thermal load working condition according to the verification parameters.
According to the method for checking the thermal load of the high-low temperature environment test box, firstly, the temperature of the high-low temperature environment test box is adjusted to be stabilized at each preset checking temperature, then, under the condition that the high-low temperature environment test box is stabilized at one preset test temperature, the working power of the thermal load is adjusted to be stabilized at each preset power, and finally, the checking parameters of the high-low temperature environment test box stabilized at each preset checking temperature and the thermal load at different working powers are obtained, so that the accurate checking of each parameter of the high-low temperature environment test box is realized under the condition that the thermal load exists in the high-low temperature environment test box.
Drawings
FIG. 1 is a schematic flow chart of a thermal load verification method for a high-low temperature environment test chamber in one embodiment;
FIG. 2 is a schematic flow chart of a thermal load verification method for a high-low temperature environmental test chamber according to another embodiment;
FIG. 3 is a schematic diagram of the structure of the assay device in one embodiment;
FIG. 4 is a diagram illustrating an internal structure of a computer device according to an embodiment.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
In one embodiment, as shown in fig. 1, a method for verifying a thermal load of a high and low temperature environmental test chamber is provided, which is applied to the high and low temperature environmental test chamber, and the thermal load is placed in the high and low temperature environmental test chamber, and the method includes the following steps:
and S300, adjusting the temperature of the high-low temperature environment test chamber to be stabilized at each preset verification temperature.
S400, under the condition that the high-low temperature environment test box is stabilized at a preset test temperature, the working power of the heat load is adjusted to be stabilized at each preset power.
In order to ensure the uniformity of the wind speed inside the high-low temperature test chamber, the volume of the heat load used is regulated according to the internal volume of the high-low temperature environment test chamber, and the volume of the heat load is less than or equal to half of the internal volume of the high-low temperature environment test chamber.
S600, obtaining the verification parameters when the high-low temperature environment test box is stable at each preset verification temperature and the heat load is at different working powers.
The verification parameters comprise deviation, fluctuation degree and uniformity.
The temperature deviation D, the fluctuation degree F and the uniformity U of the high-low temperature environment test chamber can be measured and recorded by adopting the method specified in JJF 1101-2019.
After obtaining the identification parameters of the high-low temperature environment test box which is stable at each preset verification temperature and the thermal load is at different working powers, respectively taking the maximum values of the deviation, the fluctuation degree and the uniformity degree obtained in all the steps to obtain the maximum deviation, the maximum fluctuation degree and the maximum uniformity degree. And comparing the maximum deviation, the maximum fluctuation degree and the maximum uniformity with the values specified in GB/T5170.2-2017 to judge whether the high-low temperature environment test box is qualified under the condition of thermal load.
According to the thermal load calibration method of the high and low temperature environment test box, firstly, the temperature of the high and low temperature environment test box is regulated to be stabilized at each preset calibration temperature, then, under the condition that the high and low temperature environment test box is stabilized at one preset test temperature, the working power of the thermal load is regulated to be stabilized at each preset power, and finally, calibration parameters of the high and low temperature environment test box are obtained when the high and low temperature environment test box is stabilized at each preset calibration temperature and the thermal load is at different working powers, so that the high and low temperature environment test box can be accurately calibrated under the thermal load condition.
In one embodiment, as shown in fig. 2, step S300 includes:
s310, adjusting the temperature of the high-low temperature environment test chamber to be maintained at a preset verification temperature within a first preset time.
The first preset time may be determined according to the electronic product to be tested, which is often detected by the high-low temperature environmental test chamber, and may be, for example, 1 hour. After the temperature of the high-low temperature environment test box is adjusted to be a preset verification temperature, the high-low temperature environment test box is maintained at the temperature for 1 hour, then the high-low temperature environment test box is considered to be stable at the temperature value, verification parameters of the thermal load under each preset power under the temperature can be carried out, then the high-low temperature environment test box is adjusted to other preset temperatures, and the verification parameters of the thermal load under each preset power are further measured.
In one embodiment, as shown in fig. 2, step S400 includes:
and S410, adjusting the working power of the heat load to be maintained at a preset power within a second preset time.
The second preset time may be set according to a characteristic of the thermal load, and is to determine that the thermal load is stabilized at a certain operating power, so as to avoid a problem of inaccurate verification result due to power fluctuation, for example, the second preset time may be 1 hour. After the working power of the heat load is adjusted to be a preset power, the heat load is maintained at the preset power for 1 hour, and then the heat load is adjusted to be other preset powers.
In one embodiment, as shown in fig. 2, the method further comprises the steps of:
and S100, determining the highest verification temperature and the lowest verification temperature according to the design indexes of the high-low temperature environment test box.
And S200, determining each preset verification temperature according to the highest verification temperature and the lowest verification temperature.
And the preset verification temperature is greater than or equal to the lowest verification temperature and less than or equal to the highest verification temperature.
The maximum verification temperature is Tmax, the minimum verification temperature is Tmin, the preset verification temperature can be any value within a temperature range determined by the minimum verification temperature and the maximum verification temperature, and the selection of the preset verification temperature can be set according to the test temperature frequently used when the high-low temperature environmental test box is used for testing the reliability of the electronic product. For example, the preset certification temperatures may be set at Tmin (less than-70 ℃), -70 ℃, -40 ℃, -20 ℃, +40 ℃, +85 ℃, and Tmax (greater than +85 ℃).
The maximum verification temperature and the minimum verification temperature can be set according to the working temperature range of the high-low temperature test box to be tested.
In one embodiment, step S300 includes:
and from the ambient temperature, gradually increasing the temperature to each preset temperature until the highest detection temperature.
Specifically, for better illustration of the implementation of the embodiments of the present application, the temperature adjustment is illustrated with the preset certification temperatures being Tmin (less than-70 ℃), -70 ℃, -40 ℃, -20 ℃, +40 ℃, +85 ℃ and Tmax (greater than +85 ℃), but not limiting the actual protection scope of the present application. Firstly, adjusting the environmental temperature to +40 ℃ and maintaining the temperature for 1 hour to obtain the verification parameters when the high-low temperature environmental test box is stable at the temperature and the thermal load is at different working powers; then adjusting the temperature to +85 ℃ and maintaining the temperature for 1 hour to obtain the verification parameters when the high-low temperature environment test box is stable at the temperature and the thermal load is at different working powers; and finally, adjusting the temperature to Tmax and maintaining the temperature for 1 hour, obtaining the verification parameters when the high-low temperature environment test box is stable at the temperature and the thermal load is at different working powers, and completing the verification of the thermal load at the high temperature.
Or from the ambient temperature, gradually reducing the temperature to each preset temperature until the lowest verification temperature.
Specifically, for better illustration of the implementation of the embodiments of the present application, the temperature adjustment is described herein with the preset certification temperatures set to Tmin (less than-70 ℃), -70 ℃, -40 ℃, -20 ℃, +40 ℃, +85 ℃ and Tmax (greater than +85 ℃), but does not limit the actual protection scope of the present application. And adjusting the temperature to Tmax, acquiring verification parameters when the high-low temperature environment test box is stable at the temperature and the thermal load is at different working powers, and completing the verification of the thermal load at the high temperature. The temperature of the high-low temperature environmental test box can be reduced to the environmental temperature, then the environmental temperature is adjusted to-20 ℃ and maintained for 1 hour, and the verification parameters of the high-low temperature environmental test box which is stable at the temperature and the thermal load which is under different working powers are obtained; then adjusting the temperature to-40 ℃ and maintaining the temperature for 1 hour to obtain the verification parameters when the high-low temperature environment test box is stable at the temperature and the thermal load is at different working powers; then adjusting the temperature to-70 ℃ and maintaining the temperature for 1 hour to obtain the verification parameters when the high-low temperature environment test box is stable at the temperature and the thermal load is at different working powers; and finally, adjusting the temperature to Tmin and maintaining the temperature for 1 hour, obtaining calibration parameters when the high-low temperature environment test box is stabilized at the temperature and the thermal load is at different working powers, and completing the calibration of the thermal load at the low temperature.
In one embodiment, the method further comprises:
and determining the maximum heat load power according to the design index of the high-low temperature environment test box.
And determining each preset power of the heat load according to the maximum heat load power.
The maximum thermal load power is determined according to the equipment index of the high-low temperature test chamber, and may be set in combination with the upper limit value of the high temperature resistance of the material of the test chamber, for example.
The preset power is greater than or equal to 0 and less than or equal to the maximum thermal load power, so that the range from 0 to the maximum thermal load power is a setting interval of the preset power. For example, the power from 0 to the maximum thermal load may be equally divided into a plurality of preset powers, for example, the power may be equally divided into three parts to obtain the first preset power P1, the second preset power P2 and the maximum thermal load power.
In one embodiment, the step of adjusting the operating power of the thermal load to be stabilized at the preset powers comprises:
and gradually increasing the minimum preset power to the maximum preset power.
Specifically, for better illustration of the implementation process of the embodiment of the present application in the case of adjusting the temperature to a certain preset verification temperature, the preset power including the first preset power P1, the second preset power P2 and the maximum thermal load power is taken as an example for illustration, but the actual protection scope of the present application is not limited. Firstly, adjusting the thermal load power to a first preset power P1 and maintaining the preset power for 1 hour, and obtaining the verification parameters of the high-low temperature environmental test box at the preset verification temperature when the thermal load power is P1; then adjusting the heat load power to a first preset power P2 and maintaining the preset power for 1 hour, and obtaining the verification parameters of the high-low temperature environment test box at the preset verification temperature when the heat load power is P2; and finally, adjusting the thermal load power to the maximum thermal load power and maintaining the preset power for 1 hour, and obtaining the verification parameters of the high-low temperature environment test box at the preset verification temperature when the thermal load power is the maximum thermal load power. The preset verification temperature is adjusted to another preset verification temperature, and the preset power adjusting process is repeatedly executed at the adjusted preset verification temperature, so that verification parameters of the high-low temperature environment test box, which is stable at the preset verification temperature and the thermal load is at different working powers, are obtained, and the verification of the thermal load at the low temperature is completed.
It should be understood that, although the steps in the flowcharts related to the embodiments described above are shown in sequence as indicated by the arrows, the steps are not necessarily performed in sequence as indicated by the arrows. The steps are not performed in the exact order shown and described, and may be performed in other orders, unless explicitly stated otherwise. Moreover, at least a part of the steps in the flowcharts related to the embodiments described above may include multiple steps or multiple stages, which are not necessarily performed at the same time, but may be performed at different times, and the execution order of the steps or stages is not necessarily sequential, but may be rotated or alternated with other steps or at least a part of the steps or stages in other steps.
Based on the same inventive concept, the embodiment of the application also provides a calibrating device for realizing the thermal load calibration method of the high-low temperature environment test box. The implementation scheme for solving the problem provided by the device is similar to the implementation scheme recorded in the method, so the specific limitations in one or more embodiments of the verification device provided below can be referred to the limitations on the thermal load device of the high and low temperature environmental test chamber, and details are not repeated here.
In one embodiment, as shown in fig. 3, there is provided an assay device comprising: temperature regulation module, power regulation module and examination parameter acquisition module, wherein:
and the temperature adjusting module 300 is used for adjusting the temperature of the high-low temperature environment test box to be stabilized at each preset verification temperature.
The power adjusting module 400 is configured to adjust the working power of the thermal load to be stabilized at each preset power when the high-low temperature environmental test chamber is stabilized at a preset test temperature.
The calibration parameter obtaining module 600 is configured to obtain calibration parameters when the high-low temperature environmental test chamber is stable at each preset calibration temperature and the thermal load is at different working powers.
In one embodiment, the temperature adjustment module 300 includes:
and the temperature adjusting unit is used for adjusting the temperature of the high-low temperature environment test chamber to be maintained at a preset verification temperature within a first preset time.
In one embodiment, the power conditioning module 400 includes:
and the power regulating unit is used for regulating the working power of the heat load to be maintained at a preset power within a second preset time.
In one embodiment, as shown in fig. 4, the verification apparatus further comprises:
and the temperature interval setting module 100 is used for determining the highest verification temperature and the lowest verification temperature according to the design indexes of the high-low temperature environment test box.
And a preset temperature determining module 200, configured to determine each preset verification temperature according to the highest verification temperature and the lowest verification temperature.
In one embodiment, the temperature adjustment module 300 further comprises:
the first gradual temperature adjusting unit is used for increasing the temperature from the ambient temperature to each preset temperature step by step until the highest detection temperature is reached.
In one embodiment, the temperature adjustment module 300 further comprises:
and the second gradual temperature regulating unit is used for reducing the temperature from the ambient temperature to each preset temperature step by step until the lowest verification temperature is reached.
In one embodiment, the above apparatus further comprises:
the maximum power setting module is used for determining the maximum heat load power according to the design index of the high-low temperature environment test box;
and the preset power setting module is used for determining each preset power of the heat load according to the maximum heat load power.
In one embodiment, the power conditioning module 400 further comprises:
and the step-by-step power adjusting unit is used for increasing the minimum preset power to the maximum preset power step by step.
The modules in the calibration device can be implemented in whole or in part by software, hardware and a combination thereof. The modules can be embedded in a hardware form or independent from a processor in the computer device, and can also be stored in a memory in the computer device in a software form, so that the processor can call and execute operations corresponding to the modules.
In one embodiment, a computer device is provided, which may be a server, and the internal structure thereof may be as shown in fig. 4. The computer device includes a processor, a memory, and a network interface connected by a system bus. Wherein the processor of the computer device is configured to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system, a computer program, and a database. The internal memory provides an environment for the operation of an operating system and computer programs in the non-volatile storage medium. The database of the computer device is used for storing each preset verification temperature, each preset power and verification parameters. The network interface of the computer equipment is used for communicating with an external high-low temperature environmental test box through network connection. The computer program is executed by a processor to implement a high and low temperature environmental test chamber thermal load verification method.
Those skilled in the art will appreciate that the architecture shown in fig. 4 is merely a block diagram of some of the structures associated with the disclosed aspects and is not intended to limit the computing devices to which the disclosed aspects apply, as particular computing devices may include more or less components than those shown, or may combine certain components, or have a different arrangement of components.
In one embodiment, a computer device is provided, comprising a memory and a processor, the memory having a computer program stored therein, the processor implementing the following steps when executing the computer program:
adjusting the temperature of the high-low temperature environment test box to be stabilized at each preset verification temperature;
under the condition that the high-low temperature environment test box is stabilized at the preset test temperature, the working power of the heat load is adjusted to be stabilized at each preset power;
and acquiring calibration parameters when the high-low temperature environment test box is stabilized at each preset calibration temperature and the heat load is at different working powers.
In one embodiment, the processor, when executing the computer program, further performs the steps of:
and adjusting the temperature of the high-low temperature environment test chamber to be maintained at a preset verification temperature within a first preset time.
In one embodiment, the processor, when executing the computer program, further performs the steps of:
and adjusting the working power of the heat load to be maintained at a preset power within a second preset time.
In one embodiment, the processor, when executing the computer program, further performs the steps of:
determining the highest verification temperature and the lowest verification temperature according to the design indexes of the high-low temperature environment test box;
and determining each preset verification temperature according to the highest verification temperature and the lowest verification temperature.
In one embodiment, the processor when executing the computer program further performs the steps of:
and from the ambient temperature, gradually increasing the temperature to each preset temperature until the highest detection temperature.
In one embodiment, the processor, when executing the computer program, further performs the steps of:
and from the ambient temperature, gradually reducing the temperature to each preset temperature until the lowest verification temperature.
In one embodiment, the processor when executing the computer program further performs the steps of:
determining the maximum heat load power according to the design index of the high-low temperature environment test box;
and determining each preset power of the heat load according to the maximum heat load power.
In one embodiment, the processor, when executing the computer program, further performs the steps of:
and gradually increasing the minimum preset power to the maximum preset power.
In one embodiment, a computer-readable storage medium is provided, having a computer program stored thereon, which when executed by a processor, performs the steps of:
adjusting the temperature of the high-low temperature environment test box to be stabilized at each preset verification temperature;
under the condition that the high-low temperature environment test box is stabilized at the preset test temperature, the working power of the heat load is adjusted to be stabilized at each preset power;
and acquiring the verification parameters when the high-low temperature environment test box is stabilized at each preset verification temperature and the heat load is at different working powers.
In one embodiment, the computer program when executed by the processor further performs the steps of:
and adjusting the temperature of the high-low temperature environment test chamber to be maintained at a preset verification temperature within a first preset time.
In one embodiment, the computer program when executed by the processor further performs the steps of:
and adjusting the working power of the heat load to be maintained at a preset power within a second preset time.
In one embodiment, a computer program product is provided, comprising a computer program which, when executed by a processor, performs the steps of:
determining the highest verification temperature and the lowest verification temperature according to the design indexes of the high-low temperature environment test box;
and determining each preset verification temperature according to the highest verification temperature and the lowest verification temperature.
In one embodiment, the computer program when executed by the processor further performs the steps of:
from the ambient temperature, the temperature is increased step by step to each preset temperature to the maximum detection temperature.
In one embodiment, the computer program when executed by the processor further performs the steps of:
and from the ambient temperature, gradually reducing the temperature to each preset temperature until the lowest verification temperature.
In one embodiment, the computer program when executed by the processor further performs the steps of:
determining the maximum heat load power according to the design index of the high-low temperature environment test box;
and determining each preset power of the heat load according to the maximum heat load power.
In one embodiment, the computer program when executed by the processor further performs the steps of:
and gradually increasing the minimum preset power to the maximum preset power.
It will be understood by those skilled in the art that all or part of the processes of the methods of the embodiments described above can be implemented by hardware instructions of a computer program, which can be stored in a non-volatile computer-readable storage medium, and when executed, can include the processes of the embodiments of the methods described above. Any reference to memory, database, or other medium used in the embodiments provided herein may include at least one of non-volatile and volatile memory. The nonvolatile Memory may include Read-Only Memory (ROM), magnetic tape, floppy disk, flash Memory, optical Memory, high-density embedded nonvolatile Memory, resistive Random Access Memory (ReRAM), Magnetic Random Access Memory (MRAM), Ferroelectric Random Access Memory (FRAM), Phase Change Memory (PCM), graphene Memory, and the like. Volatile Memory can include Random Access Memory (RAM), external cache Memory, and the like. By way of illustration and not limitation, RAM can take many forms, such as Static Random Access Memory (SRAM) or Dynamic Random Access Memory (DRAM), among others. The databases referred to in various embodiments provided herein may include at least one of relational and non-relational databases. The non-relational database may include, but is not limited to, a block chain based distributed database, and the like. The processors referred to in the embodiments provided herein may be general purpose processors, central processing units, graphics processors, digital signal processors, programmable logic devices, quantum computing based data processing logic devices, etc., without limitation.
The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present application. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present application shall be subject to the appended claims.
Claims (10)
1. A thermal load calibration method for a high-low temperature environment test chamber is characterized by being applied to the high-low temperature environment test chamber, wherein a thermal load is placed in the high-low temperature environment test chamber, and the method comprises the following steps:
adjusting the temperature of the high-low temperature environment test box to be stabilized at each preset verification temperature;
under the condition that the high-low temperature environment test box is stabilized at the preset test temperature, the working power of the heat load is adjusted to be stabilized at each preset power;
and acquiring the verification parameters when the high-low temperature environment test box is stabilized at each preset verification temperature and the heat load is at different working powers.
2. The method of claim 1, wherein the step of adjusting the temperature of the high and low temperature environmental test chamber to stabilize at each of the predetermined assay temperatures comprises:
and adjusting the temperature of the high-low temperature environment test chamber to be maintained at the preset verification temperature within a first preset time.
3. The method of claim 1, wherein the step of adjusting the operating power of the thermal load to stabilize at the respective predetermined powers comprises:
and adjusting the working power of the heat load to be maintained at the preset power within a second preset time.
4. The method according to any one of claims 1 to 3, further comprising, before the step of adjusting the temperature of the high-low temperature environmental test chamber to stabilize at each of the preset assay temperatures:
determining the highest verification temperature and the lowest verification temperature according to the design indexes of the high-low temperature environment test box;
and determining each preset verification temperature according to the highest verification temperature and the lowest verification temperature, wherein the preset verification temperature is more than or equal to the lowest verification temperature and less than or equal to the highest verification temperature.
5. The method of claim 4, wherein the step of adjusting the temperature of the high and low temperature environmental test chamber to stabilize at each predetermined verification temperature comprises:
from the ambient temperature, gradually increasing the temperature to each preset temperature until the highest detection temperature;
or from the ambient temperature, gradually reducing the temperature to each preset temperature until the lowest verification temperature.
6. The method of claim 1 or 2 or 3 or 5, further comprising:
determining the maximum heat load power according to the design index of the high-low temperature environment test box;
and determining each preset power of the heat load according to the maximum heat load power, wherein the preset power is greater than or equal to 0 and less than or equal to the maximum heat load power.
7. The method of claim 6, wherein the step of adjusting the operating power of the thermal load to stabilize at the respective predetermined powers comprises:
and gradually increasing the minimum preset power to the maximum preset power.
8. The method of claim 1 or 2 or 3 or 5 or 7, wherein the volume of the thermal load is less than or equal to half of the internal volume of the high and low temperature environmental test chamber.
9. The method of claim 1 or 2 or 3 or 5 or 7, further comprising the step of:
and generating a verification result of the high-low temperature environment test box under a thermal load working condition according to the verification parameters.
10. The method of claim 1, 2, 3, 5 or 6, wherein the assay parameters comprise: temperature deviation, fluctuation, and uniformity.
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