CN114326868B - Chip temperature feedback method and device, storage medium and chip temperature control method - Google Patents
Chip temperature feedback method and device, storage medium and chip temperature control method Download PDFInfo
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Abstract
The disclosure provides a chip temperature feedback method, a device, a storage medium and a chip temperature control method. The chip temperature feedback method comprises the following steps: reading the security before the chip temperature control is startedThe stored feedback temperature sequence TF (n) is sent to a temperature control device, so that the temperature control device can control the temperature of the chip to be tested according to the feedback temperature sequence TF (n); in the chip temperature control process, collecting the temperature of the chip to be detected according to a preset sampling frequency; after the temperature sampling is finished, whether a sampling value TR meeting the set condition exists in the current sampling temperature sequence TR (n) obtained by the current temperature samplingiThe setting condition includes at least one of: the sampling value reaches a preset sampling value; the difference value between the target sampling value and the target sampling value reaches a preset sampling difference value; using said sampled value TRiFor the temperature values TF in the feedback temperature sequence TF (n)jAnd correcting and storing the corrected value, wherein i is larger than j.
Description
Technical Field
The present disclosure relates to the field of chip testing technologies, and in particular, to a method and an apparatus for feeding back a chip temperature, a storage medium, and a method for controlling a chip temperature.
Background
During the process of testing chips such as a Central Processing Unit (CPU), a Graphics Processing Unit (GPU), and the like, the chips are prone to self-heating, which results in inaccurate chip testing parameters. Performance tuning of chips according to inaccurate parameters cannot meet performance requirements, and performance of chips is estimated incorrectly, resulting in higher rejection rate. In conclusion, the requirement on temperature control in the chip testing process also reflects the grasp on the yield and performance of the product, and a more accurate temperature control scheme can bring more accurate testing parameters, so that the yield and performance of the product can be better controlled.
The temperature control process in the existing chip automatic test process is as follows:
after the test is started, the temperature control device heats the chip to a preset temperature through a Thermal head and stabilizes the chip for a period of time; and then, on one hand, the test is executed according to a preset test flow, on the other hand, in the test process, the temperature feedback device acquires the current temperature of the chip in real time and feeds the current temperature back to the temperature control device, and the temperature control device adjusts the temperature according to the current temperature of the chip so as to maintain the temperature of the chip at the preset temperature.
In the test process, thereby partial test item can make the chip produce the heavy current and lead to chip self to have great generating heat, and present temperature control means needs certain process to the regulation of chip temperature, is difficult to make the chip that generates heat reply to predetermineeing the temperature fast.
Disclosure of Invention
The disclosure aims to provide a chip temperature feedback method, a device and a storage medium, and a chip temperature control method, so as to achieve the purpose of avoiding the chip temperature change too fast in a short time as much as possible.
According to a first aspect of the present disclosure, a chip temperature feedback method is provided, which is applied to a chip testing stage, and the method includes:
reading a stored feedback temperature sequence TF (n) of a target chip product and sending the feedback temperature sequence TF (n) to a temperature control device before the chip temperature control is started, so that the temperature control device can control the temperature of a current chip to be tested of the target chip product according to the feedback temperature sequence TF (n);
in the chip temperature control process, acquiring the temperature of the current chip to be detected according to a preset sampling frequency;
after the temperature sampling is finished, whether a sampling value TR meeting the set condition exists in the current sampling temperature sequence TR (n) obtained by the current temperature sampling is judgediThe setting condition includes at least one of: the sampling value reaches a preset sampling value; the difference value between the target sampling value and the target sampling value reaches a preset sampling difference value; using sampled values TRiFor the temperature values TF in the feedback temperature sequence TF (n)jAnd correcting and storing the corrected value, wherein i is larger than j.
The temperature of the current chip to be tested is collected according to a preset sampling frequency, which may be collecting the junction temperature of the current chip to be tested according to the preset sampling frequency.
Wherein use is made of the sampling value TRiFor the temperature values TF in the feedback temperature sequence TF (n)jThere are various ways to implement the correction, one of which is as follows:
feeding back the temperature values TF in the temperature sequence TF (n)jSubstituted by the sampled value TRi。
Except using sampled values TRiFor the temperature values TF in the feedback temperature sequence TF (n)jAfter the temperature sampling is finished, the sampling value TR in the current sampling temperature sequence TR (n) can be usedxFor the temperature values TF in the feedback temperature sequence TF (n)xCorrection is performed, and the correction value, x ≠ i, is stored.
On the basis of the above, the sampling value TR in the current sampling temperature sequence TR (n) is usedxFor the temperature values TF in the feedback temperature sequence TF (n)xStill further implementations of making the correction may include: deleting the historical sampling temperature sequence with the longest storage time; calculating the sampling value TR in the current sampling temperature sequence TR (n)xThe median value of the x-th temperature value in each stored historical sampling temperature sequence is compared, and the temperature value TF in the temperature sequence TF (n) is fed backxThe median value is replaced.
On the basis of any one of the above method embodiments, in the chip temperature control process, the difference operation can be performed on the temperature of the current chip to be tested, which is acquired in real time, and the corresponding temperature value in the feedback temperature sequence tf (n); and if the difference value is larger than the preset difference value threshold value, sending the temperature of the current tested chip acquired in real time and a temperature control switching instruction to the temperature control device, wherein the temperature control switching instruction is used for instructing the temperature control device to control the temperature of the current tested chip according to the temperature of the current tested chip acquired in real time.
On the basis, the feedback temperature sequence can be corrected by using the current sampling temperature sequence TR (n) obtained by the current temperature sampling on the premise that the difference value is not greater than the preset difference value threshold. Including but not limited to any of the following modifications: using values TR meeting set conditionsiFor the temperature values TF in the feedback temperature sequence TF (n)jCorrecting; the feedback temperature sequence is modified using the current sample temperature sequence and the historical sample temperature sequence in the manner described above in the embodiments.
In addition, on the premise that the current chip to be tested is not confirmed to be a failed chip, the current sampling temperature sequence TR (n) obtained by the current temperature sampling can be used for repairing the feedback temperature sequenceIs positive. Including but not limited to any of the following modifications: using values TR meeting set conditionsiFor the temperature values TF in the feedback temperature sequence TF (n)jCorrecting; the feedback temperature sequence is modified using the current sampled temperature sequence and the historical sampled temperature sequence in the manner of the above-described embodiment.
According to a second aspect of the present disclosure, there is provided a chip temperature feedback device, applied to a chip testing stage, the device including:
the storage module is used for storing a feedback temperature sequence TF (n) of a target chip product and a current sampling temperature sequence TR (n) obtained by the current temperature sampling;
the temperature feedback module is used for reading the feedback temperature sequence TF (n) stored in the storage module before the chip temperature control is started, and sending the feedback temperature sequence TF (n) to the temperature control device, so that the temperature control device can control the temperature of the current chip to be tested of the target chip product according to the feedback temperature sequence TF (n);
the temperature acquisition module is used for acquiring the temperature of the current chip to be detected according to a preset sampling frequency in the chip temperature control process;
a data processing module for judging whether a sampling value TR meeting the set condition exists in the current sampling temperature sequence TR (n) obtained by the current temperature sampling after the temperature sampling is finishediThe setting condition includes at least one of: the sampling value reaches a preset sampling value; the difference value between the target sampling value and the target sampling value reaches a preset sampling difference value; using sampled values TRiFor the temperature values TF in the feedback temperature sequence TF (n)jAnd correcting and storing the corrected value, wherein i is larger than j.
Wherein, the temperature acquisition module is used for: and collecting the junction temperature of the current chip to be tested according to a preset sampling frequency.
Wherein, the data processing module is used for: feeding back temperature values TF in the temperature sequence TF (n)jSubstituted by the sampled value TRi。
Wherein, the data processing module can be further configured to: in the chip temperature control process, carrying out difference operation on the temperature of the current chip to be detected, which is acquired in real time, and the corresponding temperature value in the feedback temperature sequence TF (n); if the difference is greater than the preset difference threshold, the temperature feedback module may be further configured to: and sending the temperature of the current tested chip acquired in real time and a temperature control switching instruction to the temperature control device, wherein the temperature control switching instruction is used for instructing the temperature control device to carry out temperature control on the current tested chip according to the temperature of the current tested chip acquired in real time.
Wherein, the data processing module can be further configured to: after the temperature sampling is finished, sampling values TR in the current sampling temperature sequence TR (n) are utilizedxFor the temperature values TF in the feedback temperature sequence TF (n)xCorrection is performed, and the correction value, x ≠ i, is stored.
On this basis, the data processing module is used for: deleting the historical sampling temperature sequence with the longest storage time; calculating the sampling value TR in the current sampling temperature sequence TR (n)xThe median value of the x-th temperature value in each stored historical sampling temperature sequence is compared, and the temperature value TF in the temperature sequence TF (n) is fed backxThe above median value is substituted.
Wherein the data processing module may be configured to: under the condition that the current tested chip is not confirmed to be a failed chip and the difference value between the temperature of the current tested chip and the corresponding temperature value in the feedback temperature sequence TF (n) is not larger than a preset difference value threshold value, the sampling value TR in the current sampling temperature sequence TR (n) is utilizedxFor the temperature values TF in the feedback temperature sequence TF (n)xCorrecting, and judging whether a sampling value TR meeting the set condition exists in the current sampling temperature sequence TR (n) obtained by the current temperature samplingi。
According to a third aspect of the present disclosure, there is provided a computer-readable storage medium having a chip temperature feedback program stored thereon, the chip temperature feedback program, when executed, implementing the chip temperature feedback method according to any one of the embodiments of the first aspect.
According to a fourth aspect of the present disclosure, there is provided a chip temperature control method applied to a chip testing stage, the method including:
receiving a feedback temperature sequence TF (n) of a target chip product, wherein the feedback temperature sequence TF (n) is sent by a chip temperature feedback device in any embodiment of the second aspect;
and controlling the temperature of the current chip to be tested of the target chip product according to the feedback temperature sequence TF (n).
The temperature control switching device comprises a chip temperature feedback device, a chip temperature feedback device and a temperature control switching device, wherein in the process of controlling the temperature of the current chip to be tested, the temperature control switching device can also receive a temperature control switching instruction sent by the chip temperature feedback device; and responding to the temperature control switching instruction, and controlling the temperature of the current chip to be tested according to the temperature of the current chip to be tested, which is acquired by the chip temperature feedback device in real time.
According to a fifth aspect of the present disclosure, there is provided a chip temperature control apparatus applied to a chip testing stage, the apparatus including:
the data receiving module is used for receiving a feedback temperature sequence TF (n) of a target chip product, and the feedback temperature sequence TF (n) is sent by the chip temperature feedback device in any embodiment of the second aspect;
and the temperature control module is used for controlling the temperature of the current chip to be tested according to the feedback temperature sequence TF (n).
Wherein, the data receiving module may be further configured to: receiving a temperature control switching instruction sent by a chip temperature feedback device; the temperature control module may be further operable to: and responding to the temperature control switching instruction, and controlling the temperature of the current chip to be tested according to the temperature of the current chip to be tested, which is acquired by the chip temperature feedback device in real time.
Drawings
FIG. 1 is a flow chart of a method for feeding back a temperature of a chip according to an embodiment of the present disclosure;
FIG. 2 is a flowchart of a method for controlling chip temperature according to an embodiment of the disclosure;
FIG. 3 is a schematic diagram illustrating the effect of chip temperature control according to an embodiment of the disclosure;
FIG. 4 is a schematic diagram of a device for feeding back chip temperature according to an embodiment of the present disclosure;
fig. 5 is a schematic diagram of a chip temperature control device according to an embodiment of the disclosure.
Detailed Description
Before the embodiments of the present disclosure are described, it should be noted that:
some embodiments of the disclosure are described as a process flow, and although various operational steps of the flow may be referred to by sequential step numbers, the operational steps therein may be performed in parallel, concurrently, or simultaneously.
The terms "first", "second", etc. may be used in embodiments of the disclosure to describe various features, but these features should not be limited by these terms. These terms are used merely to distinguish one feature from another.
The term "and/or," "and/or," may be used in embodiments of the present disclosure to include any and all combinations of one or more of the associated listed features.
It should be understood that when a connection or communication between two components is described, the connection or communication between the two components may be understood as either a direct connection or communication or an indirect connection or communication through intermediate components, unless a direct connection or direct communication between the two components is explicitly indicated.
In order to make the technical solutions and advantages of the embodiments of the present disclosure more clearly understood, the following detailed description of the exemplary embodiments of the present disclosure with reference to the accompanying drawings makes it obvious that the described embodiments are only a part of the embodiments of the present disclosure, rather than an exhaustive list of all the embodiments. It should be noted that, in the present disclosure, the embodiments and features of the embodiments may be combined with each other without conflict.
The purpose of the disclosure is to provide a chip temperature feedback method and a chip temperature control method, which are applied to a chip testing stage to realize a stable temperature control effect and avoid the chip temperature change in a short time as fast as possible. Specifically, for the same chip product (referred to as a target chip product in the disclosure), the feedback temperature sequence tf (n) is iteratively modified by adopting the chip temperature feedback method provided by the disclosure for multiple times. Accordingly, during the chip testing process, the feedback temperature sequence tf (n) is used to control the chip temperature.
Specifically, the disclosure provides a chip temperature feedback method, which is applied to a chip test stage. In the chip testing stage, temperature control needs to be performed on the current chip to be tested, and the chip temperature feedback method provided by the present disclosure can be divided into three sub-processes before the chip temperature control starts, during the chip temperature control process and after the temperature sampling ends, as shown in fig. 1, each sub-process includes the following operations:
before the subprocess 100 and the chip temperature control are started, the stored feedback temperature sequence tf (n) of the target chip product is read and sent to the temperature control device, so that the temperature control device performs temperature control on the current chip to be tested of the target chip product according to the feedback temperature sequence tf (n).
In the disclosure, the feedback temperature sequence tf (n) can reflect the temperature change rule of the target chip product in the testing process. Therefore, the temperature control device can control the temperature according to the feedback temperature sequence TF (n), and does not need to control the temperature according to the chip temperature acquired in real time in the temperature control process.
The initial feedback temperature sequence tf (N) may be generated according to temperature sequences collected during the previous testing process of the target chip product, for example, a sampling value of each sampling point in the initial feedback temperature sequence is a median value of corresponding sampling points of the N historical sampling temperature sequences of the target chip product. The initial feedback temperature sequence tf (n) can also be seen by simulation means.
Although the feedback temperature sequence tf (n) can reflect the temperature change rule of the target chip product in the testing process, there still exists a possibility that the difference between the feedback temperature sequence tf (n) and the actual chip temperature of the current chip to be tested is large, and at this time, if the temperature of the current chip to be tested is still controlled according to the feedback temperature sequence tf (n), the temperature control result is seriously affected. Therefore, in the chip temperature control process, the difference value operation can be carried out on the temperature of the current chip to be tested which is acquired in real time and the corresponding temperature value in the feedback temperature sequence TF (n); and if the difference value is greater than the preset difference value threshold value, sending the temperature of the current detected chip acquired in real time and a temperature control switching instruction to the temperature control device, wherein the temperature control switching instruction is used for instructing the temperature control device to control the temperature of the current detected chip according to the temperature of the current detected chip acquired in real time.
In the sub-process 200 and the chip temperature control process, the temperature of the current chip to be tested is collected according to a preset sampling frequency.
In the method provided by the embodiment of the present disclosure, in order to achieve stable temperature control, the feedback temperature sequence tf (n) needs to be dynamically optimized multiple times according to the real-time temperature of the chip, so that the temperature of the current chip to be tested needs to be sampled in real time.
Preferably, the junction temperature of the current chip under test can be acquired according to a preset sampling frequency.
After the sub-process 300 and the temperature sampling are finished, whether a sampling value TR meeting the set condition exists in the current sampling temperature sequence TR (n) obtained by the temperature sampling at this time or not is judgediThe setting condition includes at least one of: the sampling value reaches a preset sampling value; the difference value between the target sampling value and the target sampling value reaches a preset sampling difference value; using sampled values TRiFor the temperature values TF in the feedback temperature sequence TF (n)jAnd correcting and storing the corrected value, wherein i is larger than j.
In practical applications, the target sampling value may be determined based on experience, requirements, and the like. For example, the target sample value refers to an adjacent sample value, or the target sample value refers to a sample value with an interval number of M, or the target sample value refers to a plurality of sample values with an interval number within L. Since the purpose of the present disclosure is to avoid the chip from heating up too fast, the target sampling value is usually the sampling value before the sampling point i.
In the embodiment of the present disclosure, there is a sampling value TR in the current sampling temperature sequence tf (n)iWhen the preset sampling value is reached, the temperature of the current chip to be tested is increased to a higher level at the sampling point i; and the sampling value TRiAnd the difference value between the target sampling value and the target sampling value reaches a preset sampling difference value, which means that the temperature change of the current chip to be tested is quicker. When the temperature of the chip to be tested rises to a higher temperature, the temperature changes faster, which often means that a longer time is needed to adjust the temperature of the chip to the preset temperature. The method provided by the embodiment of the present disclosure,when this occurs, the sampling value TR is usediFor the earlier temperature value TF in the feedback temperature sequence TF (n)jThe correction is made, and then, the temperature control device can perform temperature control in advance during the next test for the target chip product. By continuously iterating and optimizing the feedback temperature sequence in the mode, the aim of stable temperature control can be achieved, and finally the conditions of too fast temperature change and large temperature change amplitude of the tested chip are avoided as much as possible in the testing process.
In the disclosed embodiment, the sampling value TR is utilizediFor the temperature values TF in the feedback temperature sequence TF (n)jThe implementation of the correction is various. One implementation is as follows: feeding back temperature values TF in the temperature sequence TF (n)jSubstituted by the sampled value TRi. Besides, the temperature values TF in the feedback temperature sequence TF (n) can be usedjSubstitution to TFjAnd TRiOr the temperature values TF in the feedback temperature sequence TF (n)jSubstituted by the sampled value TRiThe calculation mode of the calculation value may be determined according to actual requirements, and the disclosure does not limit this.
If there are a plurality of sampling values TR meeting the set conditioniThen, each sampled value TR is used separatelyiFor the temperature values TF in the feedback temperature sequence TF (n)jA correction is made wherein the separation of i and j is fixed. For example, the sampled value TR6And the sampling value TR10All meet the set condition, then, the sampling value TR is utilized6For TF in feedback temperature sequence5Correction is made using the sampled value TR10For TF in feedback temperature sequence9And (6) correcting.
Except using sampled values TRiFor the temperature values TF in the feedback temperature sequence TF (n)jAfter the temperature sampling is finished, the sampling value TR in the current sampling temperature sequence TR (n) can be usedxFor the temperature values TF in the feedback temperature sequence TF (n)xCorrection is performed, and a correction value is stored, where x ≠ i.
Using the current sampling temperature sequence TR (n)Of the sampled value TRxFor the temperature values TF in the feedback temperature sequence TF (n)xThe implementation of the correction is various. By way of example, and not limitation, one implementation is as follows: deleting the historical sampling temperature sequence with the longest storage time; calculating the sampling value TR in the current sampling temperature sequence TR (n)xThe median value of the x-th temperature value in each stored historical sampling temperature sequence is compared, and the temperature value TF in the temperature sequence TF (n) is fed backxThe median value is replaced. In practical applications, a mean value or other statistical values may be used instead of the median value. Another possible implementation is as follows: calculating the sampling value TR in the current sampling temperature sequence TR (n)xWith temperature values TF in the feedback temperature sequence TF (n)xIs fed back to the temperature values TF in the temperature sequence TF (n)xThe median value is replaced.
In practical applications, if the difference between the temperature of the current chip to be tested acquired in real time and the corresponding temperature value in the feedback temperature sequence tf (n) is greater than the preset difference threshold, it may mean that the current chip to be tested is a failed chip, or the temperature change of the chip cannot represent the general temperature change rule of the same chip product, so it is not desirable to modify the feedback temperature sequence by using the temperature value in the current sampling temperature sequence. That is, in some embodiments, the sub-process 300 is executed on the premise that the difference between the temperature of the current chip under test acquired in real time and the corresponding temperature value in the feedback temperature sequence tf (n) is not greater than the preset difference threshold; and using the sampling values TR in the current sampling temperature sequence TR (n)xFor the temperature values TF in the feedback temperature sequence TF (n)xThe premise of correction is that the difference between the temperature of the current chip to be tested acquired in real time and the corresponding temperature value in the feedback temperature sequence TF (n) is not greater than a preset difference threshold.
It should be noted that if the current chip under test is identified as a failed chip during the test, it is also undesirable to modify the feedback temperature sequence with the temperature values in the current sample temperature sequence. Thus, in some embodiments, the sub-process 300 described above is performed on the premise that the current chip under test is not confirmed as a failed chip; and, utilizing the currentSampling values TR in the sampling temperature sequence TR (n)xFor the temperature values TF in the feedback temperature sequence TF (n)xThe precondition for the correction is that the current chip under test is not confirmed as a failed chip.
There are various ways for the temperature feedback device to know whether the current chip under test is determined to be a failed chip. For example, after the test is completed, the temperature feedback device reads a test result from the chip testing device, where the test result indicates whether the current chip under test is determined to be a failed chip; as another example, the temperature feedback device detects (actively listening or passively receiving) a real-time temperature sampling interrupt signal or a temperature control interrupt signal.
In order to provide a chip temperature feedback method and a chip temperature control method in cooperation with the above embodiments, the embodiments of the present disclosure also provide a chip temperature control method, which is also applied to a chip test stage. As shown in fig. 2, the chip temperature control method provided by the embodiment of the present disclosure includes the following operations:
step 201, receiving a feedback temperature sequence TF (n) of a target chip product.
Wherein, the feedback temperature sequence tf (n) is sent by the chip temperature feedback device to obtain and update the feedback temperature sequence tf (n) according to the chip temperature feedback method described in any of the above embodiments.
And step 202, controlling the temperature of the current chip to be tested of the target chip product according to the feedback temperature sequence TF (n).
In practical application, the temperature value can be read from the feedback temperature sequence tf (n) according to the same frequency as the preset sampling frequency in the chip temperature feedback process, and the temperature of the current chip to be tested of the template chip product is controlled in real time according to the read temperature value. On the basis of the embodiments of the present disclosure, those skilled in the art may also adopt various other means to control the temperature of the current chip to be tested of the target chip product without creative work, and details are not described herein.
As described above, although the feedback temperature sequence tf (n) can reflect the temperature change rule of the target chip product during the testing process, there is still a possibility that the difference between the feedback temperature sequence tf (n) and the actual chip temperature of the current chip to be tested is large, and at this time, if the temperature of the current chip to be tested is still controlled according to the feedback temperature sequence tf (n), the temperature control result is seriously affected. Therefore, the temperature control switching instruction sent by the chip temperature feedback device can be received in the process of controlling the temperature of the current chip to be tested; and responding to the temperature control switching instruction, and controlling the temperature of the current chip to be tested according to the temperature of the current chip to be tested, which is acquired by the chip temperature feedback device in real time.
The following describes in detail the implementation of the cooperation of the chip temperature feedback device and the chip temperature control device with reference to a specific application scenario.
In the application scenario, a certain SOC chip product needs to be tested, and in the testing process, the temperature of the SOC chip product needs to be controlled, so that the SOC chip is at a stable temperature (preset temperature) in the testing process.
To achieve this, an initial feedback temperature sequence needs to be acquired first. In this embodiment, the implementation of obtaining the initial feedback temperature sequence is as follows: in the engineering stage, aiming at the SOC chip product, temperature values of a certain batch of chips in the whole test process are collected according to a preset sampling frequency under the same test condition, and a plurality of sampling temperature sequences are obtained. And if not, the sampling temperature sequence is regarded as an invalid sampling temperature sequence, and the initial feedback temperature sequence is generated according to the valid sampling temperature sequence.
And assuming that N groups of effective sampling temperature sequences are provided, storing the N groups of effective sampling temperature sequences into a storage module of the temperature feedback device. In addition, an initial feedback temperature sequence is generated from the N valid sets of sampled temperature sequences. And the ith temperature value in the initial feedback temperature sequence is the median of the ith temperature values in the N groups of effective sampling temperature sequences. Likewise, the initial feedback temperature sequence is also saved to a memory module of the temperature feedback device. In this embodiment, the storage module of the temperature feedback device is an erasable module so as to update the feedback temperature sequence stored therein.
After the initial feedback temperature sequence is obtained, the temperature control process accompanying a complete chip test process is as follows:
after the test is started, the temperature control device (also called as a thermostat) raises the temperature of the current chip to be tested to a preset temperature through the heating head.
After the temperature of the current chip to be tested is raised to a preset temperature and maintained for a certain period of time, a temperature feedback device (also called a temperature acquisition card) is started, and in addition, a chip testing device (for example, ATE) tests the current chip to be tested according to a preset testing flow.
After the temperature acquisition card is started, on one hand, the stored feedback temperature sequence TF (n) is sent to the temperature control device, the temperature control device reads temperature values from the feedback temperature sequence TF (n) according to the same frequency as the sampling frequency, and power control is carried out according to the read temperature values, so that the purpose of controlling the temperature of the current chip to be detected is achieved, and the temperature of the current chip to be detected is stabilized at the preset temperature. And on the other hand, collecting and storing the junction temperature of the current chip to be tested in real time according to the preset sampling frequency.
In this embodiment, the stability of temperature control is improved, the timing of junction temperature acquisition needs to be kept consistent in each test process, and the timing of reading the temperature value from the feedback temperature sequence by the temperature control device is kept consistent with the timing of junction temperature acquisition. There are various implementation ways to ensure that the time of each junction temperature acquisition is consistent, and to ensure that the time of reading the temperature value is consistent with the time of junction temperature acquisition, which is not limited and developed by the present disclosure.
Further, the temperature acquisition card performs difference operation on the real-time junction temperature of the current chip to be detected and the corresponding temperature value in the feedback temperature sequence TF (n), compares the difference value with a difference threshold value, and if the difference value is greater than the difference threshold value, the feedback temperature sequence is considered to not reflect the actual temperature of the chip, temperature control is required to be performed according to the actual temperature of the chip, so that a temperature control switching instruction is sent to the temperature control device, and the acquired real-time junction temperature is sent to the temperature control device. And after receiving the temperature control switching instruction, the temperature control device switches to control the temperature of the current chip to be tested according to the real-time junction temperature of the current chip to be tested. If the difference is not larger than the difference threshold, the feedback temperature sequence can reflect the actual temperature of the chip, and temperature control is still performed according to the feedback temperature sequence.
On the premise that the difference is not greater than the difference threshold, after the real-time junction temperature sampling is finished (usually after the temperature control is finished), the temperature feedback device judges whether a sampling value TR exists in a sampling temperature sequence TR (n) obtained by samplingiGreater than a predetermined sampling value and TRi-1Is greater than a preset sampling difference value; if there is a sample value satisfying the condition, the i-1 th temperature value in the feedback temperature sequence TF (n) is replaced by the sample value. In addition, the historical sampling temperature sequence with the longest storage time (or the historical sampling temperature sequence with the longest sampling time) in the temperature feedback device is deleted, and the rest N-1 historical sampling temperature sequences and the sampling value TR in the current sampling temperature sequence are utilizedxFor the temperature values TF in the feedback temperature sequence TF (n)xCorrection is performed, where x ≠ i.
In this embodiment, each test dynamically adjusts the feedback temperature sequence according to the current sampling temperature sequence under the condition that the above-mentioned premise is met. On one hand, aiming at sampling values with too fast temperature change and too high temperature, the sampling value is utilized to correct the temperature value closer to the front in the feedback temperature sequence, so that the temperature change in the adjusted feedback temperature sequence can be ahead of the actual temperature change, and the effect of pre-controlling the temperature is achieved; and on the other hand, the temperature value in the feedback temperature sequence is updated by using the current sampling temperature sequence and the historical sampling temperature sequence. The effect of stable temperature control is achieved by repeatedly iterating and optimizing the feedback temperature sequence, and the aim is to prevent the temperature of the chip from changing too fast in a short time through temperature control.
Taking the temperature curve change shown in fig. 3 as an example, the leftmost side is the temperature curve obtained after the last test (i.e., the feedback temperature sequence obtained after the last test), the middle is the temperature sequence obtained by the current test sampling (i.e., the sampling temperature sequence acquired by the current test), and the right side is the temperature curve obtained by correcting the feedback temperature sequence by using the temperature sequence obtained by the current test sampling (i.e., the 2 feedback temperature sequences after the current correction). Therefore, the method provided by the embodiment of the disclosure can enable the temperature control to be more stable, thereby effectively avoiding the conditions of too fast temperature change and too high temperature of the chip.
Based on the same inventive concept as the chip temperature feedback method, the disclosure also provides a chip temperature feedback device. The device is applied to the chip testing stage, and as shown in fig. 4, the device comprises: the storage module 401 is configured to store a feedback temperature sequence tf (n) of a target chip product and a current sampling temperature sequence tr (n) obtained by this time of temperature sampling; the temperature feedback module 402 is configured to read the feedback temperature sequence tf (n) stored in the storage module before chip temperature control starts, and send the feedback temperature sequence tf (n) to the temperature control device, so that the temperature control device performs temperature control on a current chip to be tested of the target chip product according to the feedback temperature sequence tf (n); the temperature acquisition module 403 is configured to acquire a current temperature of the chip to be tested according to a preset sampling frequency in the chip temperature control process; a data processing module 404, configured to determine, after temperature sampling is finished, whether a sampling value TR meeting a set condition exists in a current sampling temperature sequence TR (n) obtained by this time of temperature samplingiThe setting condition includes at least one of: the sampling value reaches a preset sampling value; the difference value between the target sampling value and the target sampling value reaches a preset sampling difference value; using the value of the sample TRiFor the temperature values TF in the feedback temperature sequence TF (n)jAnd correcting and storing the corrected value, wherein i is larger than j.
Wherein, the temperature collecting module 403 is configured to: and collecting the junction temperature of the current chip to be tested according to a preset sampling frequency.
Wherein the data processing module 404 is configured to: feeding back the temperature values TF in the temperature sequence TF (n)jSubstituted by the sampled value TRi。
Wherein the data processing module 404 is further configured to: in the chip temperature control process, carrying out difference operation on the temperature of the current chip to be detected, which is acquired in real time, and the corresponding temperature value in the feedback temperature sequence TF (n); if the difference is greater than the preset difference threshold, the temperature feedback module may be further configured to: and sending the temperature of the current tested chip acquired in real time and a temperature control switching instruction to the temperature control device, wherein the temperature control switching instruction is used for instructing the temperature control device to control the temperature of the current tested chip according to the temperature of the current tested chip acquired in real time.
Wherein the data processing module 404 is further configured to: after the temperature sampling is finished, sampling values TR in the current sampling temperature sequence TR (n) are utilizedxFor the temperature values TF in the feedback temperature sequence TF (n)xCorrection is performed, and the correction value, x ≠ i, is stored.
On this basis, the data processing module 404 is configured to: deleting the historical sampling temperature sequence with the longest storage time; calculating the sampling value TR in the current sampling temperature sequence TR (n)xThe average value of the x-th temperature value in each stored historical sampling temperature sequence is calculated, and the temperature value TF in the temperature sequence TF (n) is fed backxThe average value is replaced.
Wherein the data processing module may be configured to: under the condition that the current tested chip is not confirmed to be a failed chip and the difference value between the temperature of the current tested chip and the corresponding temperature value in the feedback temperature sequence TF (n) is not larger than a preset difference value threshold value, the sampling value TR in the current sampling temperature sequence TR (n) is utilizedxFor the temperature values TF in the feedback temperature sequence TF (n)xCorrecting, and judging whether a sampling value TR (n) meeting the set condition exists in the current sampling temperature sequence TR (n) obtained by the current temperature samplingi。
Based on the same inventive concept as the temperature feedback method, the present disclosure also provides a computer-readable storage medium having a chip temperature feedback program stored thereon, the chip temperature feedback program, when executed, implementing the chip temperature feedback method as described in any of the above embodiments.
Based on the same inventive concept as the chip temperature control method, the present disclosure also provides a chip temperature control apparatus applied to a chip test stage, as shown in fig. 5, the apparatus includes: a data receiving module 501, configured to receive a feedback temperature sequence tf (n) of a target chip product, where the feedback temperature sequence tf (n) is sent by a chip temperature feedback apparatus according to any embodiment of the second aspect; and the temperature control module 502 is configured to perform temperature control on the current chip to be tested according to the feedback temperature sequence tf (n).
The data receiving module 501 may further be configured to: receiving a temperature control switching instruction sent by a chip temperature feedback device; the temperature control module may be further operable to: and responding to the temperature control switching instruction, and controlling the temperature of the current chip to be tested according to the temperature of the current chip to be tested, which is acquired by the chip temperature feedback device in real time.
Based on the same inventive concept as the above temperature control method, the present disclosure also provides a computer-readable storage medium having a chip temperature control program stored thereon, the chip temperature control program, when executed, implementing the chip temperature control method according to any of the above embodiments.
As will be appreciated by one skilled in the art, embodiments of the present disclosure may be provided as a method, system, or computer program product. Accordingly, the present disclosure may take the form of an entirely hardware embodiment, an entirely software embodiment or an embodiment combining software and hardware aspects. Furthermore, the present disclosure may take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, and so forth) having computer-usable program code embodied therein.
The present disclosure is described with reference to flowchart illustrations and/or block diagrams of methods, apparatus (systems) and computer program products according to embodiments of the disclosure. It will be understood that each flow and/or block of the flow diagrams and/or block diagrams, and combinations of flows and/or blocks in the flow diagrams and/or block diagrams, can be implemented by computer program instructions. These computer program instructions may be provided to a processor of a general purpose computer, special purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, create means for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be stored in a computer-readable memory that can direct a computer or other programmable data processing apparatus to function in a particular manner, such that the instructions stored in the computer-readable memory produce an article of manufacture including instruction means which implement the function specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer implemented process such that the instructions which execute on the computer or other programmable apparatus provide steps for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
While preferred embodiments of the present disclosure have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including preferred embodiments and all alterations and modifications as fall within the scope of the disclosure.
It will be apparent to those skilled in the art that various changes and modifications can be made in the present disclosure without departing from the spirit and scope of the disclosure. Thus, if such modifications and variations of the present disclosure fall within the scope of the claims of the present disclosure and their equivalents, the present disclosure is intended to include such modifications and variations as well.
Claims (15)
1. A chip temperature feedback method is applied to a chip testing stage, wherein the method comprises the following steps:
reading a stored feedback temperature sequence TF (n) of a target chip product and sending the feedback temperature sequence TF (n) to a temperature control device before chip temperature control begins, so that the temperature control device can control the temperature of a current chip to be tested of the target chip product according to the feedback temperature sequence TF (n);
in the chip temperature control process, acquiring the temperature of the current chip to be tested according to a preset sampling frequency; carrying out difference operation on the temperature of the current tested chip acquired in real time and the corresponding temperature value in the feedback temperature sequence TF (n); if the difference value is larger than a preset difference value threshold value, sending the temperature of the current chip to be tested acquired in real time and a temperature control switching instruction to the temperature control device, wherein the temperature control switching instruction is used for instructing the temperature control device to control the temperature of the current chip to be tested according to the temperature of the current chip to be tested acquired in real time;
after the temperature sampling is finished, whether a sampling value TR meeting the set condition exists in the current sampling temperature sequence TR (n) obtained by the current temperature samplingiThe setting condition includes at least one of: the sampling value reaches a preset sampling value; the difference value between the target sampling value and the target sampling value reaches a preset sampling difference value; using said sampled value TRiFor the temperature values TF in the feedback temperature sequence TF (n)jCorrecting and storing a correction value, wherein i is larger than j; when the sampling value TRi in the current sampling temperature sequence TR (n) reaches the preset sampling value, the fact that the temperature of the current chip to be tested is increased to a higher level at the sampling point i is meant.
2. The method of claim 1, wherein said utilizing the sampled value TRiFor the temperature values TF in the feedback temperature sequence TF (n)jAnd correcting, including:
feeding back the temperature values TF in the temperature sequence TF (n)jIs replaced by the sampling value TRi。
3. The method of claim 1, wherein after the temperature sampling is completed, the method further comprises: using the sampled values TR in the current sampled temperature sequence TR (n)xFor the temperature values TF in the feedback temperature sequence TF (n)xCorrection is performed, and the correction value, x ≠ i, is stored.
4. The method according to claim 3, wherein said using of the sampled values TR in said current sampled temperature sequence TR (n)xFor the temperature values TF in the feedback temperature sequence TF (n)xPerforming a correction comprising:
deleting the historical sampling temperature sequence with the longest storage time;
calculating the sampling value TR in the current sampling temperature sequence TR (n)xThe median value of the x-th temperature value in each stored historical sampling temperature sequence is compared, and the temperature value TF in the feedback temperature sequence TF (n) is comparedxThe median value is replaced.
5. The method according to claim 3, wherein said using of the sampled values TR in said current sampled temperature sequence TR (n)xFor the temperature values TF in the feedback temperature sequence TF (n)xAnd correcting, including: under the condition that the current tested chip is not confirmed to be a failed chip and the difference value between the temperature of the current tested chip and the corresponding temperature value in the feedback temperature sequence TF (n) is not larger than a preset difference value threshold value, utilizing the sampling value TR in the current sampling temperature sequence TR (n)xFor the temperature values TF in the feedback temperature sequence TF (n)xCorrecting;
judging whether a sampling value TR meeting set conditions exists in a current sampling temperature sequence TR (n) obtained by the current temperature samplingiThe method comprises the following steps: under the condition that the current tested chip is not confirmed to be a failed chip and the difference value between the temperature of the current tested chip and the corresponding temperature value in the feedback temperature sequence TF (n) is not larger than a preset difference value threshold value, judging whether a sampling value TR meeting a set condition exists in the current sampling temperature sequence TR (n) obtained by the current temperature samplingi。
6. The method of claim 1, wherein the acquiring the temperature of the current chip under test according to a preset sampling frequency comprises:
and collecting the junction temperature of the current chip to be tested according to a preset sampling frequency.
7. A chip temperature feedback device is applied to a chip testing stage, wherein the device comprises:
the storage module is used for storing a feedback temperature sequence TF (n) of a target chip product and a current sampling temperature sequence TR (n) obtained by the current temperature sampling;
the temperature feedback module is used for reading the feedback temperature sequence TF (n) stored in the storage module before the chip temperature control is started, and sending the feedback temperature sequence TF (n) to the temperature control device, so that the temperature control device can control the temperature of the current chip to be tested of the target chip product according to the feedback temperature sequence TF (n);
the temperature acquisition module is used for acquiring the temperature of the current chip to be detected according to a preset sampling frequency in the chip temperature control process;
a data processing module for judging whether a sampling value TR meeting the set condition exists in the current sampling temperature sequence TR (n) obtained by the current temperature sampling after the temperature sampling is finishediThe setting condition includes at least one of: the sampling value reaches a preset sampling value; the difference value between the target sampling value and the target sampling value reaches a preset sampling difference value; using said sampled value TRiFor the temperature values TF in the feedback temperature sequence TF (n)jCorrecting and storing a correction value, wherein i is larger than j; if a sampling value TRi in the current sampling temperature sequence TR (n) reaches a preset sampling value, the temperature of the current chip to be tested is increased to a higher level at the sampling point i;
the data processing module is further configured to: in the chip temperature control process, carrying out difference operation on the temperature of the current chip to be detected acquired in real time and the corresponding temperature value in the feedback temperature sequence TF (n); if the difference is greater than the preset difference threshold, the temperature feedback module is further configured to: and sending the temperature of the current tested chip acquired in real time and a temperature control switching instruction to the temperature control device, wherein the temperature control switching instruction is used for instructing the temperature control device to control the temperature of the current tested chip according to the temperature of the current tested chip acquired in real time.
8. The apparatus of claim 7, wherein the data processing module is to: feeding back temperature values TF in the temperature sequence TF (n)jIs replaced by the sampling value TRi。
9. The apparatus of claim 7, wherein the data processing module is further to: after the temperature sampling is finished, sampling values TR in the current sampling temperature sequence TR (n) are utilizedxFor the temperature values TF in the feedback temperature sequence TF (n)xCorrection is performed, and the correction value, x ≠ i, is stored.
10. The apparatus of claim 9, wherein the data processing module is to: deleting the historical sampling temperature sequence with the longest storage time; calculating the sampling value TR in the current sampling temperature sequence TR (n)xThe median value of the x-th temperature value in each stored historical sampling temperature sequence is compared, and the temperature value TF in the feedback temperature sequence TF (n) is comparedxThe median value is replaced.
11. The apparatus of claim 9, wherein the data processing module is to: under the condition that the current tested chip is not confirmed to be a failed chip and the difference value between the temperature of the current tested chip and the corresponding temperature value in the feedback temperature sequence TF (n) is not larger than a preset difference value threshold value, utilizing the sampling value TR in the current sampling temperature sequence TR (n)xFor the temperature values TF in the feedback temperature sequence TF (n)xCorrecting, and judging whether a sampling value TR meeting the set condition exists in the current sampling temperature sequence TR (n) obtained by the current temperature samplingi。
12. The apparatus of claim 7, wherein the temperature acquisition module is to: and collecting the junction temperature of the current chip to be tested according to a preset sampling frequency.
13. A computer-readable storage medium, wherein the computer-readable storage medium has stored thereon a chip temperature feedback program which, when executed, implements the chip temperature feedback method according to any one of claims 1-6.
14. A chip temperature control method is applied to a chip testing stage, wherein the method comprises the following steps:
receiving a feedback temperature sequence TF (n) of a target chip product, wherein the feedback temperature sequence TF (n) is sent by the chip temperature feedback device of any one of claims 7 to 12;
and controlling the temperature of the current chip to be tested of the target chip product according to the feedback temperature sequence TF (n).
15. A chip temperature control device is applied to a chip testing stage, wherein the device comprises:
a data receiving module, configured to receive a feedback temperature sequence tf (n) of a target chip product, where the feedback temperature sequence tf (n) is sent by the chip temperature feedback apparatus according to any one of claims 7 to 12;
and the temperature control module is used for controlling the temperature of the current chip to be tested of the target chip product according to the feedback temperature sequence TF (n).
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