CN112702905A - Method and system for tracing yield and error rate of printed circuit board - Google Patents
Method and system for tracing yield and error rate of printed circuit board Download PDFInfo
- Publication number
- CN112702905A CN112702905A CN202011141852.4A CN202011141852A CN112702905A CN 112702905 A CN112702905 A CN 112702905A CN 202011141852 A CN202011141852 A CN 202011141852A CN 112702905 A CN112702905 A CN 112702905A
- Authority
- CN
- China
- Prior art keywords
- code
- circuit board
- printed circuit
- information
- area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 28
- 238000004519 manufacturing process Methods 0.000 claims abstract description 83
- 230000007547 defect Effects 0.000 claims abstract description 23
- 238000007689 inspection Methods 0.000 claims description 5
- 238000012423 maintenance Methods 0.000 claims description 4
- 230000002950 deficient Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 4
- 238000004458 analytical method Methods 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007405 data analysis Methods 0.000 description 1
- 238000013480 data collection Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/084—Product tracking, e.g. of substrates during the manufacturing process; Component traceability
Landscapes
- Engineering & Computer Science (AREA)
- Operations Research (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Supply And Installment Of Electrical Components (AREA)
- General Factory Administration (AREA)
Abstract
A method and system for tracing back the yield and error rate of Printed Circuit Board (PCB) production equipment, which comprises assigning a circuit board with a board code, dividing the circuit board into multiple manufacturing areas according to the PCB, and assigning an area code to each manufacturing area; marking an information graphic code for each printed circuit board produced by the circuit main board; the method is used for detecting the printed circuit board, and if the printed circuit board does not meet the product standard, a defect characteristic is generated to record the yield of the printed circuit board and the error rate of production equipment, so that when the printed circuit board has a defect, the position of the printed circuit board with the defect can be judged, the process of the circuit main board on the printed circuit board can be judged, and the production yield of the subsequent printed circuit board can be greatly improved and the error rate of the production equipment can be reduced.
Description
Technical Field
A method and system for tracing back the yield and error rate of printed circuit board, especially the information graphic code of printed circuit board contains the code of circuit main board and the area code of printed circuit board on the circuit main board, so that when the printed circuit board is defective, the manufacturing process and the printed circuit board generated by the circuit main board can be known in real time.
Background
According to the method, the printed circuit board is cut into the printed circuit board with specific size after a plurality of processes by a circuit main board according to the required size, in order to improve the product quality and the yield, the printed circuit board is subjected to various tests after being manufactured, in order to prevent the defective products from being produced continuously or reduce the probability of producing the defective products, the production parameters or processes are generally marked on the printed circuit board in a bar code mode, once the defective products or the printed circuit board have problems at a client end, the defect generation reasons can be known by the marked recorded parameters and processes, and the quality and the yield of subsequent production products can be improved. However, the printed circuit board is formed by cutting the circuit board after a plurality of processes, and therefore, the position of the printed circuit board on the circuit board is important for the "backtracking analysis" and the "analysis of the cause of the defect", but the marking of the printed circuit board cannot know the position of the printed circuit board on the circuit board, so that the cause of the defect cannot be effectively and accurately determined, and the improvement of the yield and the quality is limited.
Disclosure of Invention
Technical problem to be solved
In view of the above problems and reasons to be solved, the present invention provides a method and a device for tracing back the yield of printed circuit boards and the error rate of production equipment, wherein the information graphic codes on the printed circuit boards include the board codes of the circuit board and the area codes of the manufacturing areas of the printed circuit boards on the circuit board, so that when the printed circuit boards are defective, the positions of the printed circuit boards where the defects occur can be determined, the manufacturing process of the circuit board on the printed circuit boards can be determined, and the yield of the subsequent printed circuit boards can be greatly increased and the error rate of the production equipment can be reduced.
(II) technical scheme and beneficial effect
The present invention relates to a method for tracing back the yield of printed circuit boards and the error rate of production equipment, which comprises assigning a motherboard code to a circuit board having a plurality of printed circuit boards, dividing the circuit board into a plurality of manufacturing areas according to the printed circuit boards, and assigning an area code corresponding to each manufacturing area, wherein the information of the area code includes the motherboard code and the location information of the area code, and an information graphic code is marked on each printed circuit board produced by the circuit motherboard, wherein the information of the information graphic code includes the information of the main board code and the area code, and identifies the appearance of each printed circuit board, and detecting the printed circuit board, if the printed circuit board does not conform to a product standard, generating a defect characteristic for recording the yield of the printed circuit board and the error rate of the production equipment, and displaying the information of the information graphic code of the printed circuit board and the defect characteristic on a display interface.
According to another embodiment of the present invention, the method further comprises obtaining the corresponding manufacturing area according to the information graphic code, and retrieving the printed circuit boards produced by the manufacturing area.
According to another embodiment of the present invention, the method further includes maintaining or adjusting the information icon to obtain the corresponding circuit board.
According to another embodiment of the present invention, the content of the information icon further includes production information.
According to another embodiment of the present invention, the information graph code is a one-dimensional code or a two-dimensional code.
The invention relates to a backtracking system for the yield of printed circuit boards and the error rate of production equipment, which comprises a circuit mainboard, an appearance detection module, a picture code identification module and a display module. The circuit main board is used for producing a plurality of printed circuit boards and comprises a main board code and a plurality of manufacturing areas. The manufacturing areas are separated from the circuit board by the printed circuit board, each manufacturing area has a corresponding area code, wherein the information of the area code includes the board code and the position information of the area code. Wherein each printed circuit board has an information graphic code, and the information of the information graphic code includes the information of the printed circuit board and the area code. The appearance detection module identifies the appearance of each printed circuit board and detects the printed circuit board according to the appearance, and if the appearance does not conform to a product standard, a defect characteristic is generated to record the yield of the printed circuit board and the error rate of the production equipment. The pattern code identification module is used for identifying the information pattern code of the printed circuit board. The display module is used for displaying the information of the information image code and the defect characteristics.
According to another embodiment of the present invention, the system further includes a backtracking module for retrieving the printed circuit boards produced by the manufacturing area according to the information icon.
According to another embodiment of the present invention, the system further includes a maintenance module for maintaining or adjusting the information icon to obtain the corresponding circuit board.
According to another embodiment of the present invention, the content of the information icon of the system further comprises production information.
According to another embodiment of the present invention, the information graph code of the system is a one-dimensional code or a two-dimensional code.
In summary, the present invention provides a method and system for tracing back the yield and error rate of printed circuit board, which can find the production equipment with defect characteristics in real time according to the information graphic code of the printed circuit board, trace back the printed circuit board produced by the production equipment in real time, automatically provide adjustment countermeasures, shorten the time for producing bad printed circuit boards, greatly save the materials and the related costs, greatly increase the yield of the subsequent printed circuit boards and reduce the error rate of the production equipment.
Drawings
In order to make the aforementioned and other objects, features, advantages and embodiments of the invention more comprehensible, the following description is given:
FIG. 1 is a diagram illustrating the relationship between devices and modules in a trace-back system for the yield and the error rate of a printed circuit board according to an embodiment of the present invention.
FIG. 2 is a flow chart illustrating a method for tracing the yield and the error rate of the production equipment of the printed circuit board according to an embodiment of the present invention.
FIG. 3 is a schematic diagram illustrating a printed circuit board formed on a circuit board according to an embodiment of the invention.
Description of the reference numerals
100: system for tracing printed circuit board yield and production equipment error rate
110: circuit main board
112: mainboard code
114: manufacturing area
115: region code
116: printed circuit board
117: information graph code
120: appearance detection module
130: pattern code identification module
140: display module
150: backtracking module
160: maintenance module
201-206: step (ii) of
Detailed Description
For the purpose of understanding the features, contents and advantages of the present invention, the present invention will be described in detail with reference to the following embodiments, wherein the drawings are used for illustrative purposes and for supporting the specification, and are not necessarily to scale and precise arrangements after the practice of the present invention, and the appended drawings are not to be construed as limiting the scope of the present invention in any way.
Referring to fig. 1 and fig. 3, fig. 1 is a diagram illustrating a relationship architecture of devices and modules in a trace-back system for the yield rate and the error rate of production equipment of a printed circuit board according to an embodiment of the invention, and fig. 3 is a diagram illustrating a printed circuit board formed on a circuit board according to an embodiment of the invention. The trace-back system 100 for the yield and the error rate of the production equipment of the printed circuit board of fig. 1 includes a circuit board 110, an appearance inspection module 120, a pattern code identification module 130 and a display module 140.
The circuit board 110 is used for producing a plurality of printed circuit boards 116 (shown in fig. 3), which include a board code 112 and a plurality of manufacturing areas 114. According to another embodiment of the present invention, the motherboard code 112 can be any type of numbers or graphic codes, and the production information of the motherboard code 112 can be retrieved according to the any type of numbers or graphic codes.
The manufacturing area 114 is separated from the circuit board 110 according to the printed circuit board, and each manufacturing area 114 has a corresponding area code 115, wherein the information of the area code 115 includes the board code 112 and the position information of the area code 115. According to another embodiment of the present invention, the area code 115 can be any type of number or graph code, for example, and the coordinate position of the manufacturing area 114 can be deduced according to the any type of number or graph code.
Each of the printed circuit boards 116 has an information graphic code 117, and the information of the information graphic code 117 includes the information of the printed circuit board 116 and the area code 115. According to another embodiment of the present invention, the content of the information icon 117 further includes production information. The production information can be, for example, production time, product lot number, inspection parameters, whether the product is good or not, and the like. The information map code 117 is a one-dimensional code or a two-dimensional code.
The appearance inspection module 120 identifies the appearance of each printed circuit board 116, and inspects the printed circuit board 116 accordingly, if the appearance does not meet a product standard, a defect feature is generated for recording the yield of the printed circuit board and the error rate of the production equipment. The appearance inspection module 120 is an arbitrary device with image recognition function.
The pattern code recognition module 130 is used for recognizing the information pattern code 117 of the printed circuit board 116. According to another embodiment of the present invention, the code recognition module 130 further includes recognizing the motherboard code 112 and the area code 115. The image code recognition module 130 is an arbitrary device having an image code recognition function.
The display module 140 is used for displaying the information of the information icon 117 and the defect feature. According to another embodiment of the present invention, the display module 140 sets the default layout manner through a program, so as to combine the board numbers of the corresponding circuit board 110 and the corresponding manufacturing area 114 on the same screen for displaying, and display the defect feature classification and the coordinate position thereof.
According to another embodiment of the present invention, the tracing system 100 for printed circuit board yield and equipment error rate further includes a tracing module 150 for obtaining the corresponding manufacturing area according to the information icon 117 and retrieving the printed circuit boards 116 produced by the manufacturing area 114.
According to another embodiment of the present invention, the tracing system 100 for printed circuit board yield and production equipment error rate further includes a maintenance module 160 for maintaining or adjusting the information icon 117 to obtain the corresponding circuit board 110.
Referring to fig. 2, fig. 2 is a flow chart illustrating a method for tracing back the yield and the error rate of the production equipment of the pcb according to an embodiment of the invention. Please refer to fig. 1-3. In step 201, a circuit board 110 having a plurality of printed circuit boards 116 is assigned a board code 112.
In step 202, the circuit board 110 is divided into a plurality of manufacturing areas 114 according to the printed circuit boards 116, and an area code 115 corresponding to each of the manufacturing areas 114 is assigned, wherein the information of the area code 115 includes the board code 112 and the position information of the area code 115.
In step 203, an information code 117 is marked on each printed circuit board 116 produced by the circuit board 110, wherein the information of the information code 117 includes the information of the board code 112 and the area code 115. According to another embodiment of the present invention, the content of the information icon 117 further includes production information. The information map code 117 is a one-dimensional code or a two-dimensional code.
In step 204, the appearance of each printed circuit board 116 is identified and the printed circuit board 116 is inspected accordingly.
In step 205, if it is detected that a defect feature is generated that does not meet a product criteria, the yield of the PCB and the error rate of the manufacturing equipment are recorded.
In step 206, the information of the information icon 117 of the printed circuit board 116 and the defect feature are displayed on a display interface. Therefore, it is clear from which circuit board 110 the printed circuit board 116 is located and where the circuit board 110 is located. Through the tracing technique, the defect originally only on the analysis area board can be recalded to the process of the circuit main board 110 before cutting, so that the production history of the product is more complete.
According to another embodiment of the present invention, the method further includes obtaining the corresponding manufacturing area 114 according to the information icon 117, and retrieving the printed circuit boards 116 produced by the manufacturing area 114. As shown in FIG. 3, the message graphic code 117 on the printed circuit board 116 may also include the area code 115 of the manufacturing area 114 to allow for more specific data collection and analysis.
According to another embodiment of the present invention, the method further includes maintaining or adjusting the information icon 117 to obtain the corresponding circuit board 110. By this way, the plurality of printed circuit boards 116 can be reduced to the main circuit board 110, and it can be inferred through big data statistics which manufacturing area 114 of the circuit main board 110 is easy to be defective in the production process, whether the defective manufacturing area 114 is related to the production equipment or fixture, thereby providing more reliable data for the producer to prevent or improve the subsequent production quality. Meanwhile, if the subsequent shipment arrives at the client, the product is found out and called back in the future when encountering product flaws, and the scope and the number of the products needing to be called back can be accurately judged through the tracking system, so that the loss is reduced.
In summary, the method and system for tracing the yield of printed circuit boards and the error rate of production equipment provided by the present invention can find the production equipment and the manufacturing area with defect characteristics in real time according to the information graphic code of the printed circuit board, and can trace the printed circuit board produced by the production equipment in real time, automatically provide adjustment countermeasures, shorten the time for producing bad printed circuit boards, greatly save materials and related costs, greatly increase the production yield of the subsequent printed circuit boards and reduce the error rate of the production equipment.
While the foregoing is directed to embodiments of the present invention, other and further embodiments of the invention may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.
Claims (10)
1. A method for tracing the yield of printed circuit board and the error rate of production equipment includes:
assigning a circuit board having a plurality of printed circuit boards to a board code;
dividing the circuit board into a plurality of manufacturing areas according to the printed circuit boards, and assigning an area code corresponding to each manufacturing area, wherein the information of the area code includes the board code and the position information of the area code;
marking an information graphic code for each printed circuit board produced by the circuit main board, wherein the information of the information graphic code includes the main board code and the area code;
identifying the appearance of each PCB and detecting the PCB to generate a defect feature for recording the yield of the PCB and the error rate of the production equipment if the PCB does not conform to a product standard; and
the information of the information graphic code and the defect of the printed circuit board are displayed on a display interface.
2. The method of claim 1 further comprises retrieving the corresponding manufacturing area according to the information pattern code, and retrieving the printed circuit boards produced by the manufacturing area.
3. The method as claimed in claim 1, further comprising repairing or adjusting the information code to obtain the corresponding circuit board.
4. The method of claim 1, wherein the information graphic code further comprises production information.
5. The method of claim 1, wherein the information graphic code is a one-dimensional code or a two-dimensional code.
6. A tracing system for printed circuit board yield and production equipment error rate includes:
a circuit board for producing a plurality of printed circuit boards, comprising:
a main board code; and
a plurality of manufacturing areas, which are separated from the circuit board according to the printed circuit board, each manufacturing area has a corresponding area code, wherein the information of the area code includes the main board code and the position information of the area code;
wherein each printed circuit board has an information graphic code, and the information of the information graphic code includes the information of the printed circuit board and the area code;
an appearance inspection module for identifying the appearance of each PCB and inspecting the PCB to generate a defect feature for recording the yield of the PCB and the error rate of the production equipment if the PCB does not conform to a product standard;
a pattern code identification module for identifying the information pattern code of the printed circuit board; and
a display module for displaying the information of the information icon and the defect feature.
7. The system of claim 6, further comprising a trace back module for retrieving the PCB produced in the manufacturing area according to the information graphic code.
8. The system for tracing back yield and error rate of manufacturing equipment of printed circuit board as claimed in claim 6, further comprising a maintenance module for maintaining or adjusting the information graphic code to obtain the corresponding circuit board.
9. The system for tracing back yield and error rate of production equipment of claim 6, wherein the content of said information graphic code further comprises production information.
10. The system of claim 6, wherein the information graphic code is a one-dimensional code or a two-dimensional code.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW109212512 | 2019-10-22 | ||
| TW109212512U TWM614195U (en) | 2019-10-22 | 2019-10-22 | Printed circuit board (pcb) with a product information label |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112702905A true CN112702905A (en) | 2021-04-23 |
| CN112702905B CN112702905B (en) | 2022-09-13 |
Family
ID=75505872
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011141852.4A Active CN112702905B (en) | 2019-10-22 | 2020-10-22 | Method and system for tracing yield and error rate of printed circuit board |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN112702905B (en) |
| TW (1) | TWM614195U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112752387A (en) * | 2019-10-29 | 2021-05-04 | 联策科技股份有限公司 | Printed circuit board production marking method for counting and recasting production defects |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1354620A (en) * | 2000-11-17 | 2002-06-19 | 由田新技股份有限公司 | Quality maintenance and backtracking system in course of manufacturing printed circuit board |
| TWM252935U (en) * | 2003-12-05 | 2004-12-11 | Inventec Appliances Corp | Inspecting apparatus of circuit board |
| CN101426341A (en) * | 2008-11-10 | 2009-05-06 | 康佳集团股份有限公司 | Analysis method for printed circuit board manufacturing process |
| CN102740667A (en) * | 2011-04-11 | 2012-10-17 | 鸿骐新技股份有限公司 | Placement method for integrating circuit board information |
| CN102856214A (en) * | 2011-06-27 | 2013-01-02 | 鸿骐新技股份有限公司 | Circuit board mounting method |
-
2019
- 2019-10-22 TW TW109212512U patent/TWM614195U/en unknown
-
2020
- 2020-10-22 CN CN202011141852.4A patent/CN112702905B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1354620A (en) * | 2000-11-17 | 2002-06-19 | 由田新技股份有限公司 | Quality maintenance and backtracking system in course of manufacturing printed circuit board |
| TWM252935U (en) * | 2003-12-05 | 2004-12-11 | Inventec Appliances Corp | Inspecting apparatus of circuit board |
| CN101426341A (en) * | 2008-11-10 | 2009-05-06 | 康佳集团股份有限公司 | Analysis method for printed circuit board manufacturing process |
| CN102740667A (en) * | 2011-04-11 | 2012-10-17 | 鸿骐新技股份有限公司 | Placement method for integrating circuit board information |
| CN102856214A (en) * | 2011-06-27 | 2013-01-02 | 鸿骐新技股份有限公司 | Circuit board mounting method |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112752387A (en) * | 2019-10-29 | 2021-05-04 | 联策科技股份有限公司 | Printed circuit board production marking method for counting and recasting production defects |
Also Published As
| Publication number | Publication date |
|---|---|
| TWM614195U (en) | 2021-07-11 |
| CN112702905B (en) | 2022-09-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4155496B2 (en) | Classification support device, classification device, and program | |
| CN105510348A (en) | Flaw detection method and device of printed circuit board and detection equipment | |
| CN112053318A (en) | Two-dimensional PCB defect real-time automatic detection and classification device based on deep learning | |
| TW202001795A (en) | Labeling system and method for defect classification | |
| US10719655B2 (en) | Method and system for quickly diagnosing, classifying, and sampling in-line defects based on CAA pre-diagnosis database | |
| CN113222913B (en) | Circuit board defect detection positioning method, device and storage medium | |
| US20230262903A1 (en) | Inspection and production of printed circuit board assemblies | |
| CN112702905B (en) | Method and system for tracing yield and error rate of printed circuit board | |
| CN113111903A (en) | Intelligent production line monitoring system and monitoring method | |
| Anitha et al. | SMT component inspection in PCBA’s using image processing techniques | |
| KR20120086410A (en) | Teaching data auto-generation apparatus of automated inspection machine and method for teaching data auto-generation the same | |
| US20220292661A1 (en) | Automated inspection system and operating method thereof | |
| KR20230126163A (en) | Training data generation apparatus, training data generation method, and program recorded on recording medium | |
| JP2018091771A (en) | Method for inspection, preliminary image selection device, and inspection system | |
| CN111260378A (en) | MES-based quality tracing method and system | |
| JP2006105777A (en) | Substrate inspection device, its parameter-setting method and parameter setting device | |
| CN112964723B (en) | Visual detection method and system for double-sided multi-target equidistant array | |
| CN113034496A (en) | PCB testing system | |
| TWI745131B (en) | Printed circuit board yield rate and production equipment error rate backtracking method and system thereof | |
| JP2007115038A (en) | Printed board quality information management system | |
| CN1459628A (en) | Circuit board plate material surface defect instant informing device | |
| EP4165592A1 (en) | System and method for tracing components of electronic assembly | |
| KR20190046225A (en) | Method and apparatus for inspecting PCB pannel based on big data and artificial intelligence | |
| JP2002031605A (en) | Defect-confirming apparatus and automatic visual inspection apparatus | |
| KR100472776B1 (en) | Reviewing method of wafer defect |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |