JP2006105777A - Substrate inspection device, its parameter-setting method and parameter setting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a technology capable of removing an influence of secondary reflection, when generating parameters used in a substrate inspection device. <P>SOLUTION: This parameter-setting device acquires a plurality of through-hole images acquired by imaging a through hole in a substrate, and estimates a secondary reflection color range which is a color range that can be taken by a pixel, including a secondary reflecting light component of a light having the smallest incident angle among pixels of an nondefective image from a color distribution of through-hole peripheral pixels in the through-hole images. A secondary reflection region, constituted of pixels having a color in the secondary reflection color range is specified from inside the nondefective image, and the specified secondary reflecting region is removed from the nondefective image. Then, the parameter used for substrate inspection is generated by using the nondefective image, after removing the secondary reflecting region as a teaching image. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a technique for automatically generating parameters used in a substrate inspection apparatus.

  Conventionally, there has been proposed a board inspection apparatus for inspecting the mounting quality of a printed circuit board on which a large number of electronic components are mounted. In this type of printed circuit board, “the shape of the solder pile when the electrode part of the electronic component and the land are soldered” is called a solder fillet. However, depending on the wetting of the electrode part of the electronic component, a solder fillet is formed. In some cases, the electronic component and the solder fillet are not in contact with each other. Therefore, in order to inspect the soldering quality, it is necessary to accurately grasp the shape of the solder fillet made of a free curve.

  However, in the conventional board inspection apparatus, since monochrome (single color) single illumination is used as a light source, it is difficult to perform image analysis of the three-dimensional shape of the solder fillet. Therefore, the quality of soldering cannot be determined, and the board inspection apparatus cannot be used practically.

  In order to solve such a problem, the present applicant has proposed a substrate inspection apparatus of the type shown in FIG. 21 (see Patent Document 1). This method is called the three-color light source color highlight method (or simply the color highlight method), and is a technology that obtains the three-dimensional shape of the solder fillet as a pseudo-color image by illuminating the inspection object with light sources of multiple colors. is there.

  It is said that the practical use of automatic inspection of printed circuit boards is practically after the advent of this color highlighting technology. In particular, at the present time when electronic components are miniaturized, it is difficult to visually determine the solder fillet shape, and it can be said that board inspection cannot be realized without a color highlight type substrate inspection apparatus.

  As shown in FIG. 21, the color highlight type substrate inspection apparatus images the light projection unit 105 that irradiates the inspection target 107 on the substrate 110 with the three primary color lights at different incident angles and the reflected light from the inspection target 107. An imaging unit 106. The light projecting unit 105 includes three annular light sources 111, 112, and 113 that have different diameters and that simultaneously emit red light, green light, and blue light based on a control signal from the control processing unit. Yes. The light sources 111, 112, and 113 are arranged in directions corresponding to different elevation angles when viewed from the inspection target 107 while being centered on the position directly above the inspection target 107.

  When the inspection target (solder fillet) 107 is irradiated by the light projecting unit 105 having such a configuration, light of a color corresponding to the inclination of the surface of the inspection target 107 enters the imaging unit 106. Therefore, as shown in FIG. 22, when the soldering of the electronic component is good / when the component is missing / when the solder is insufficient, the color pattern of the captured image depends on the shape of the solder fillet. A clear difference appears. This facilitates image analysis of the three-dimensional shape of the solder fillet, and makes it possible to accurately determine the presence / absence of electronic components and the quality of soldering.

In the color highlight type substrate inspection system, color parameters (color conditions) representing “the color of a good product that should be” and “the color of a defective product that should be” are set in advance, and the corresponding color parameter is selected from the inspection image. The color area to be extracted is extracted, and the quality is determined based on various feature amounts (for example, area and length) of the extracted area. Therefore, prior to the actual inspection, it is necessary to set the color parameters used for the inspection, the types of feature amounts, the determination conditions (for example, threshold values) for separating good products from defective products, and the like. The color parameters, feature amounts, and determination conditions are collectively referred to as inspection logic or inspection parameters, and setting and adjusting the inspection logic is generally referred to as teaching.

  In order to improve the inspection accuracy, it is important to set the color parameter so that a significant and clear difference appears between the feature quantity indicated by the non-defective product and the feature quantity indicated by the defective product. That is, it can be said that the quality of teaching of color parameters directly affects the inspection accuracy.

  Therefore, the present applicant has proposed a tool for supporting the setting of color parameters in the color highlight method as shown in FIG. 23 (see Patent Document 2). In this tool, it is possible to set the upper limit value and the lower limit value of each of the hue ratios ROP, GOP, BOP and lightness data BRT of red, green, and blue as color parameters. The input screen of FIG. 23 is provided with a color parameter setting unit 127 for inputting color parameter setting values, and a setting range display unit 128 for displaying a color range extracted by each set color parameter. ing. The setting range display section 128 displays a hue diagram 134 showing all colors obtained under a predetermined brightness. When the operator sets the upper limit value and lower limit value of each color parameter, Displays a confirmation area 135 surrounding the color extracted by the set color parameter. When the binarization display button 129 is pressed, the extraction result based on the current color parameter is displayed as a binary image. According to this tool, the operator can track the color parameters until an appropriate extraction result is obtained while viewing the confirmation area 135 and the binary image.

By the way, in the double-sided mounting substrate, there is a through hole that plays a role of wiring the surface and the back. The double-sided mounting greatly contributes to the high density of the board, and the through hole plays an important role in connecting both sides of the board. However, in board inspection using a visual sensor based on image processing, through holes tend to cause misrecognition of components and wiring patterns and often have an adverse effect on inspection performance. Therefore, conventionally, in order to prevent deterioration of the inspection performance due to the through hole, it is common to remove the through hole at the pre-processing stage of the substrate inspection. Patent Documents 3 and 4 disclose techniques for erasing a through hole from an image by combining an image before through-hole processing and an image after processing.
Japanese Patent Laid-Open No. 2-78937 JP 9-145633 A Japanese Patent Laid-Open No. 4-120448 Japanese Patent Laid-Open No. 7-20061

  The board inspection apparatus has an advantage that a plurality of inspection items can be inspected at high speed and accurately at once for the mounting quality of the printed board. However, in actual operation of the board inspection device, the over logic that teaches each inspection logic according to the individual inspection object, does not miss the defective product, and determines that the non-defective product is a defective product is an allowable value ( Judgment accuracy must be sufficiently increased until the value can be kept below the value assumed in advance.

  However, in the color highlight type substrate inspection apparatus, although advanced substrate inspection that can withstand practical use is possible, teaching to suppress oversight and overdetection of defective products to a target value is difficult. Even if the color parameter setting support tool described above is used, it is inevitable that the setting of a color parameter will depend on the experience and intuition of the operator. In addition, no matter how good the operator is, the adjustment must be repeated on a trial and error basis, which is inefficient and requires a lot of labor and adjustment time.

In a manufacturing environment where the product life cycle is shortening and the manufacturing environment is changing rapidly, it is strongly desired to reduce teaching work and to further automate teaching.

  In addition, the following phenomenon may occur as a problem specific to the color highlight method. As shown in FIG. 24, normally, only reflected light (primary reflected light) of light emitted from the light source enters the imaging unit 106. However, in some rare cases, light reflected by another solder or through hole in the vicinity is irradiated onto the solder to be imaged, and the reflected light (secondary reflected light) may enter the imaging unit 106. In this case, as shown in FIG. 24, an area of a mixed color (magenta color) of blue and red appears in the solder portion which should be originally imaged in blue, and a color pattern accurately reflecting the solder fillet shape is obtained. Disappear.

  When teaching a non-defective image including the influence of such secondary reflection as a teacher image, the conventional method is likely to cause a misrecognition that the magenta color due to the secondary reflection is also a “good non-defective color”. Therefore, it is difficult to set a color parameter that can accurately classify a good product and a defective product. In addition, since the influence of the secondary reflection is likely to occur as the distance between the components is reduced, it is becoming an important issue to deal with the secondary reflected light in view of the recent situation where the high-density mounting of the substrate is advanced.

  The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a technique capable of removing the influence of secondary reflection when generating parameters used in a substrate inspection apparatus. It is in.

  When light of a plurality of colors (hereinafter referred to as light source light) is irradiated onto the mounting component on the substrate at different incident angles, secondary reflection may occur for each color of light. However, it is not necessary to consider the secondary reflection of all colors. Primary reflected light that causes secondary reflection (primary reflected light that can reach the mounting components on the board) is limited to those having an optical path substantially parallel to the board, so the incident angle to the component is larger than any light source light. . Therefore, the influence of the secondary reflection appears only in the region where the color of the light source light having the largest incident angle (hereinafter referred to as the maximum incident angle light) is dominant in the captured image of the component. From this, the larger the incident angle of the light source light that is the source of the secondary reflected light, the less noticeable the influence of the secondary reflection, and conversely, the incident angle of the light source light that is the source of the secondary reflected light is The smaller the value, the more pronounced the influence of secondary reflection. Therefore, it can be said that a sufficient effect can be obtained by removing the influence of the secondary reflection of the light source light having the smallest incident angle (hereinafter referred to as the minimum incident angle light).

  In order to remove the influence of the secondary reflection, pixels including the secondary reflected light component may be previously removed from the non-defective image. However, since secondary reflection of light appears only when various conditions such as component placement and light contact condition overlap, a sample image including the influence of such secondary reflection (teacher) is used for teaching. It is almost impossible to prepare a large number of images. However, since the color tone of the image changes depending on the imaging environment, device variations, and the like, it is difficult to accurately predict the color of the pixel including the secondary reflected light component without the teacher image.

  Therefore, the present inventors examined whether a color close to “a color of a pixel including a secondary reflected light component of light having a minimum incident angle” can be extracted from an image obtained by imaging a non-defective substrate. As a result, it has been found that the metal part around the through hole is imaged with a relatively close color. Since the surface of the metal portion around the through hole is flat (parallel to the substrate surface), it exhibits the color of light with the minimum incident angle. A through-hole is always present if it is a double-sided mounting board, and because the through-hole is known for its shape and size, it is easy to discriminate by image recognition and extract colors, making it convenient for use as a teacher image. Good.

  Based on the above study, the present invention employs a configuration that eliminates the influence of secondary reflection by estimating the color of a pixel including a secondary reflected light component from the color that appears around the through hole.

  Specifically, the parameter setting device of the present invention includes an image acquisition unit, a through-hole image acquisition unit, a secondary reflection color range estimation unit, a secondary reflection region specifying unit, a secondary reflection region removal unit, and a parameter generation unit. . These functions are realized by a program of the information processing apparatus.

  In the parameter setting device, the image acquisition unit acquires a plurality of non-defective images obtained by imaging the parts with good soldering, and the through-hole image acquisition unit acquires the through-holes on the board. A plurality of through-hole images are acquired, and the secondary reflected color range estimating means determines the secondary reflected light component of the light having the smallest incident angle among the pixels of the non-defective image from the color distribution of the peripheral pixels in the through-hole in the through-hole image. A secondary reflection color range, which is a color range that can be taken by a pixel including, is estimated. The secondary reflection area specifying means specifies a secondary reflection area composed of pixels having a color within the secondary reflection color range from the non-defective image, and the secondary reflection area removing means is specified. The secondary reflection area is removed from the non-defective image, and the parameter generation means generates a parameter used in the substrate inspection using the non-defective image after the secondary reflection area is removed as a teacher image.

  As a result, when generating parameters used in the substrate inspection apparatus, the influence of secondary reflection can be eliminated, and highly accurate parameter generation is possible.

  Strictly speaking, the color appearing around the through hole is slightly different from the color of the pixel including the secondary reflected light component. Therefore, it is preferable to determine the secondary reflection color range as follows in order to reduce or correct the difference.

  First, as the secondary reflection color range, it is preferable to adopt a range that defines at least the saturation range and the brightness range of the hue of light having the largest incident angle. In a non-defective image, the hue of the light with the maximum incident angle is usually dominant, and the saturation of the hue becomes very high. On the other hand, the colors appearing around the through-holes and the colors of the pixels containing the secondary reflected light component are slightly different from each other, but both are affected by the minimum incident angle light. As a result, both of the saturation values are very small. Therefore, if attention is paid to the saturation of the hue of the maximum incident angle light, it is possible to easily and clearly distinguish between a normal pixel and a pixel including a secondary reflected light component in a non-defective image.

  The secondary reflection color range estimation means may determine the secondary reflection color range by obtaining a color distribution range of the through-hole peripheral pixels and correcting a value range in the brightness direction of the color distribution range. By performing brightness correction in this way, it is possible to obtain a secondary reflection color range that is closer to the real thing (pixels including secondary reflected light components).

  Here, it is preferable that the secondary reflection color range estimation means expands the upper limit of the brightness of the color distribution range of the through-hole peripheral pixels to the maximum brightness value as the secondary reflection color range. Pixels that have the effect of secondary reflection include primary reflected light components and secondary reflected light components, so the brightness is higher than pixels around the through-hole, and the upper limit tends to reach the maximum brightness value. , Based on the knowledge that.

Various methods for generating parameters (color conditions, determination conditions) are conceivable. For example, the image acquisition unit acquires a plurality of defective product images obtained by imaging a component with poor soldering, and the parameter generation unit detects each pixel of the solder region in the non-defective product image after removing the secondary reflection region. A color range that maps each color space as a defective point and a color range of each pixel in the solder area in the defective product image as a defective point, and divides the color space, A color range in which the difference between the number and the number of defective points is maximized may be obtained, and the obtained color range may be set as a color condition used in substrate inspection. In this case, the parameter generation unit extracts a pixel region that satisfies the color condition from each of the good product image and the defective product image, creates a feature amount histogram for the feature amount of the pixel region, and the feature amount Based on the frequency distribution of the histogram, a threshold value for separating the feature amount of the non-defective product image and the feature amount of the defective product image is calculated, and the calculated threshold value is used as a determination condition used in substrate inspection. It is good to set.

  Alternatively, the parameter generation unit may determine a color condition used in the substrate inspection based on a color distribution range of each pixel of the non-defective image after removing the secondary reflection area. In this case, the parameter generation means extracts a pixel region that satisfies the color condition from the solder region in the good product image, generates a feature amount histogram for the feature amount of the pixel region, and the frequency distribution of the feature amount histogram The threshold value for discriminating the feature amount of the solder area in the non-defective image is calculated based on the above, and the calculated threshold value is set as a determination condition used in the board inspection.

  The color space may be a multidimensional color space consisting of at least three axes of brightness, hue, and saturation. For example, the color space is mostly included in a good solder area and almost included in a defective solder area. It is also preferable to use a two-dimensional color space composed of a saturation axis and a lightness axis for hues that tend not to move. Employing the two-dimensional color space simplifies the color range search process. In the two-dimensional color space, if the color condition is composed of a lower limit and an upper limit of saturation and a lower limit and an upper limit of lightness, the color range becomes a rectangular area, and the color range search process is further simplified.

  Also, various features such as the area, area ratio, length, maximum width, center of gravity, and shape of the pixel region are assumed as the feature amount. What is necessary is just to employ | adopt one or two or more preferable feature-values according to the object which should be detected by test | inspection.

  The automatically generated parameters (color conditions and determination conditions) are stored in the storage unit of the substrate inspection apparatus and used for substrate inspection processing.

  Note that the present invention can be understood as a parameter setting method for a substrate inspection apparatus including at least a part of the above processing, or a program for realizing the method. The present invention can also be understood as a parameter setting device of a substrate inspection apparatus having at least a part of the means for executing the above processing, or a substrate inspection apparatus equipped with such a device. Each of the above means and processes can be combined with each other as much as possible to constitute the present invention.

  According to the present invention, since the influence of secondary reflection can be removed, parameters used in the substrate inspection apparatus can be generated with high accuracy, teaching work can be reduced, and teaching can be automated.

  Exemplary embodiments of the present invention will be described in detail below with reference to the drawings.

<First Embodiment>
(Configuration of board inspection system)
FIG. 1 shows a hardware configuration of a board inspection system according to an embodiment of the present invention.

The substrate inspection system includes a substrate inspection device 1 that executes substrate inspection processing and a parameter setting device 2 that automatically generates parameters used in the substrate inspection processing of the substrate inspection device 1. The board inspection apparatus 1 and the parameter setting apparatus 2 can exchange electronic data such as images and parameters via a wired or wireless network, or a recording medium such as an MO or a DVD. In the present embodiment, the board inspection apparatus 1 and the parameter setting apparatus 2 are configured separately, but it is also possible to integrate the function of the parameter setting apparatus into the board inspection apparatus main body.

(Configuration of board inspection equipment)
The board inspection apparatus 1 is an apparatus for automatically inspecting the mounting quality (soldering state, etc.) of the mounting component 21 on the board 20 by a color highlight method. The substrate inspection apparatus 1 generally includes an X stage 22, a Y stage 23, a light projecting unit 24, an imaging unit 25, and a control processing unit 26.

  Each of the X stage 22 and the Y stage 23 includes a motor (not shown) that operates based on a control signal from the control processing unit 26. By driving these motors, the X stage 22 moves the light projecting unit 24 and the imaging unit 25 in the X axis direction, and the Y stage 23 moves the conveyor 27 that supports the substrate 20 in the Y axis direction.

  The light projecting unit 24 includes three annular light sources 28, 29, and 30 that have different diameters and that simultaneously emit red light, green light, and blue light based on a control signal from the control processing unit 26. . The light sources 28, 29, and 30 are arranged in directions corresponding to different elevation angles when centered on the position directly above the observation position and viewed from the observation position. With this arrangement, the light projecting unit 24 irradiates the mounting component 21 on the substrate 20 with light of a plurality of colors (in this embodiment, three colors of R, G, and B) at different incident angles.

  The imaging unit 25 is a color camera, and is positioned downward at a position directly above the observation position. As a result, the reflected light on the substrate surface is imaged by the imaging unit 25, converted into color signals R, G, and B of the three primary colors and supplied to the control processing unit 26.

  The control processing unit 26 includes an A / D conversion unit 33, an image processing unit 34, an inspection logic storage unit 35, a determination unit 36, an imaging controller 31, an XY stage controller 37, a memory 38, a control unit (CPU) 39, and a storage unit 32. , An input unit 40, a display unit 41, a printer 42, a communication I / F 43, and the like.

  The A / D conversion unit 33 is a circuit that receives the color signals R, G, and B from the imaging unit 25 and converts them into digital signals. The digital grayscale image data for each hue is transferred to the image data storage area in the memory 38.

  The imaging controller 31 is a circuit including an interface for connecting the control unit 39 to the light projecting unit 24 and the image capturing unit 25, and the light amount of each light source 28, 29, 30 of the light projecting unit 24 based on the output of the control unit 39. And control such as maintaining the mutual balance of the hue light outputs of the imaging unit 25 is performed.

  The XY stage controller 37 is a circuit including an interface for connecting the control unit 39 to the X stage 22 and the Y stage 23, and controls driving of the X stage 22 and the Y stage 23 based on the output of the control unit 39.

  The inspection logic storage unit 35 is a storage unit that stores inspection logic used for substrate inspection processing. The board inspection apparatus 1 can perform a plurality of types of inspection processes such as a fillet inspection for inspecting a solder shape and a lack inspection for inspecting a missing part. The inspection logic is prepared for each type of inspection, and includes color parameters (color conditions) for extracting a predetermined color pattern (pixel area) from the image, types of feature values extracted from the color pattern, Consists of pass / fail judgment conditions related to the feature amount.

The image processing unit 34 performs a process of extracting a region satisfying the color parameter from an image obtained by imaging the component 21 on the substrate 20 and a process of calculating a predetermined feature amount from the extracted region. It is. The determination unit 36 is a circuit that receives the feature amount calculated by the image processing unit 34 and executes processing for determining whether the component mounting state is good or not based on whether or not the feature amount satisfies a predetermined determination condition.

  The input unit 40 includes a keyboard, a mouse, and the like necessary for inputting operation information and data related to the substrate 20. The input data is supplied to the control unit 39. The communication I / F 43 is for transmitting and receiving data to and from the parameter setting device 2 and other external devices.

  The control unit (CPU) 39 is a circuit that executes various arithmetic processes and control processes. The storage unit 32 is a storage device composed of a hard disk and a memory, and stores the CAD information of the substrate, the determination result of the substrate inspection process, and the like in addition to the program executed by the control unit 39.

  FIG. 2 shows a functional configuration of the substrate inspection apparatus 1. The board inspection apparatus 1 includes an instruction information reception function 10, a board carry-in function 11, a CAD information reading function 12, a stage operation function 13, an imaging function 14, an inspection logic reading function 15, an inspection function 16, a determination result writing function 17, and a board. An unloading function 18 is provided. These functions are realized by the control unit 39 controlling the hardware according to a program stored in the storage unit 32. In addition, a CAD information storage unit 32 a that stores CAD information and a determination result storage unit 32 b that stores determination results are provided inside the storage unit 32.

(Board inspection processing)
Next, substrate inspection processing in the substrate inspection apparatus 1 will be described. Here, fillet inspection will be described as an example of substrate inspection processing. Fillet inspection is processing for determining whether or not the shape of a solder fillet is good.

  As shown in the upper part of FIG. 3, in the good solder fillet, a wide inclined surface like a mountain skirt is formed from the component 21 to the land on the substrate 20. On the other hand, in the case of missing defects, the solder fillet is raised on the land.

  When these solder fillets are imaged by the substrate inspection apparatus 1, images as shown in the middle of FIG. 3 are obtained. Since the red, green, and blue irradiation lights are incident on the solder fillet at different angles, the hue of the reflected light that is incident on the imaging unit 25 changes according to the inclination of the solder fillet. That is, the reflected light of the blue light having the largest incident angle is dominant in the steep portion, whereas the reflected light of the red light is dominant in the portion having almost no inclination. Therefore, the region of the blue hue is large in the non-defective solder fillet, and the region of the hue other than blue is large in the defective solder fillet.

  In the fillet inspection according to the present embodiment, the quality of the solder fillet is determined based on the size (area) of the blue region using such a tendency of the color pattern. Hereinafter, the flow of fillet inspection processing will be described in detail with reference to the flowchart of FIG.

  The instruction information receiving function 10 is in a waiting state until instruction information for instructing execution of substrate inspection is input (step S100; NO, step S101). When instruction information is input from an external device by operating the input unit 40 or via the communication I / F 43, the instruction information receiving function 10 receives the instruction information, the board carry-in function 11, the CAD information reading function 12, and the inspection logic. The data is sent to the reading function 15 (step S100; YES). The instruction information includes information (model number, etc.) of the board to be inspected.

  The inspection logic reading function 15 reads the inspection logic corresponding to the model number of the board from the inspection logic storage unit 35 (step S102). Here, the inspection logic for the fillet inspection is read. The inspection logic includes a color parameter (color condition) and a threshold value (determination condition).

  The board carry-in function 11 carries the board 20 to be inspected from the printed board carry-in section onto the conveyor 27 based on the instruction information (step S103), and the CAD information reading function 12 loads the CAD corresponding to the board model number. Information is read from the CAD information storage unit 32a (step S104).

  Next, the stage operation function 13 obtains information such as the dimensions, shape, and component arrangement of the substrate 20 from the read CAD information, and the plurality of components 21 mounted on the substrate 20 are sequentially observed positions (imaging positions). The X stage 22 and the Y stage 23 are operated via the XY stage controller 37 (step S105).

  On the other hand, the imaging function 14 causes the three light sources 28, 29, and 30 of the light projecting unit 24 to emit light via the imaging controller 31, and simultaneously irradiates red, green, and blue light onto the substrate 20. In addition, the imaging function 14 controls the imaging unit 25 via the imaging controller 31, and images the component 21 on the substrate 20 in synchronization with the operation of the stages 22 and 23 (step S106). The captured image is taken into the memory 38.

  Next, the inspection function 16 extracts a solder region from the captured image by the image processing unit 34 (step S107). The extraction of the solder region can be automatically performed by template matching, for example.

  Subsequently, the inspection function 16 binarizes the extracted solder region using the color parameter (step S108). The color parameters used here are composed of four values: a lower limit and an upper limit of blue saturation, and a lower limit and an upper limit of lightness. In the binarization process, pixels included in the color range defined by the color parameter are converted to white pixels, and other pixels are converted to black pixels.

  The lower part of FIG. 3 shows the solder area after binarization. By binarizing with the color parameter, it can be seen that only the blue color region in the solder region is extracted as a white pixel, and the difference (feature) between the non-defective image and the defective product image is clarified.

  Subsequently, the inspection function 16 uses the image processing unit 34 to extract the feature amount of the white pixel region. Here, the area (number of pixels) of the white pixel region is calculated as the feature amount. Then, the inspection function 16 passes the area value of the white pixel region to the determination unit 36, and the determination unit 36 compares the area value of the white pixel region with a threshold value (step S109). When the area value exceeds the threshold value (step S109; YES), it is determined that the mounting quality of the component 21 is good (step S110), and when the area value is equal to or less than the threshold value (step S109; NO), it is determined that the mounting quality of the component 21 is defective (step S111).

  The determination result writing function 17 writes the determination result together with the location ID (information for specifying a part) in the determination result storage unit 32b (step S112).

  When all the components on the board 20 have been inspected, the board carry-out function 18 carries out the board 20 by the printed board carrying section, and the board inspection process is finished (step S113).

According to the board inspection process described above, it is possible to accurately grasp the three-dimensional shape of the solder fillet from the color pattern appearing in the two-dimensional image, and to accurately determine whether the solder mounting quality is good or not.

  By the way, in order to achieve high determination accuracy so that defective products are not overlooked and overdetection is less than an allowable value, the color parameters (color conditions) and threshold values (determination conditions) of the inspection logic are set in advance. It is necessary to set the optimum value according to the inspection object. In the present embodiment, the generation (teaching) of these parameters is automatically performed by the parameter setting device 2. This will be described in detail below.

(Configuration of parameter setting device)
As shown in FIG. 1, the parameter setting device 2 is a general-purpose device including a CPU, a memory, a hard disk, an I / O control unit, a communication I / F, a display unit, an information input unit (keyboard and mouse), etc. as basic hardware. It is composed of a computer (information processing device).

  5 and 6 show the functional configuration of the parameter setting device 2. FIG. 5 shows a functional part for estimating a color range (secondary reflected color range) that a pixel including a secondary reflected light component can take, and FIG. 6 shows a functional part for generating a parameter. .

  As shown in FIG. 5, the parameter setting device 2 includes a substrate image reading function 50, a CAD information reading function 51, a through-hole image acquisition function 52, a through-hole peripheral pixel mapping function 53, an outlier deletion function 54, and a color distribution range setting. A function 55, a color distribution range correction function 56, and a secondary reflection color information writing function 57 are provided. Among these, the through-hole peripheral pixel mapping function 53, the outlier removal function 54, the color distribution range setting function 55, and the color distribution range correction function 56 constitute a secondary reflection color range estimation function. Further, as shown in FIG. 6, the parameter setting device 2 includes an instruction information reception function 60, a teacher image information reading function 61, an image acquisition function 62, a sorting function 63, a secondary reflection color information reading function 64, and a secondary reflection. Area identification function 65, secondary reflection area removal function 66, mapping function 67, color range search function 68, binarization function 69, feature amount histogram generation function 70, threshold value determination function 71, inspection logic generation function 72, inspection A logic writing function 73 is provided. Among these, the mapping function 67, the color range search function 68, the binarization function 69, the feature amount histogram generation function 70, the threshold value determination function 71, and the inspection logic generation function 72 constitute a parameter generation function. These functions are realized by a program stored in a memory or a hard disk being read and executed by a CPU.

  Further, in the hard disk of the parameter setting device 2, a secondary reflection color information storage unit 58 that stores the secondary reflection color range estimated by the secondary reflection color range estimation function and teacher image information used for teaching are stored. A teacher image information DB 74 is provided. The teacher image information includes an image of a mounted component imaged by the board inspection apparatus 1 and teacher information (teaching data) indicating whether the image is a non-defective product or a defective product. In order to increase the reliability of teaching, it is preferable to prepare tens to thousands of teacher image information.

(Secondary reflection color range estimation process)
In the substrate inspection apparatus 1 of the present embodiment, since the three light sources 30, 29, and 28 of blue, green, and red are used in descending order of the incident angle with respect to the substrate, secondary reflection may occur for light of each color. However, it is not necessary to consider secondary reflection of blue light and green light, and it is sufficient to consider the influence of secondary reflection of red light having the smallest incident angle. The reason is shown in FIG.

Primary reflected light that causes secondary reflection (primary reflected light that can reach the mounting components on the board) is limited to those having an optical path substantially parallel to the board, so the incident angle to the component is larger than any light source light. . Therefore, the possibility that the secondary reflected light reflected by the solder surface having a flat or small inclination angle enters the imaging unit is extremely low. That is, the influence of secondary reflection appears only in the region where the color of blue light having the largest incident angle is dominant in the captured image of the component.

  Since the color components of the pixels in such a region are originally configured as blue> green> red, even if a blue or green secondary reflected light component is added thereto, the effect is not so noticeable. . On the other hand, when a red secondary reflected light component is added to a pixel that was originally a blue-based color, the influence appears remarkably. From the above, it can be said that a sufficient effect can be obtained by removing the influence of secondary reflection of red light having the smallest incident angle.

  Then, according to the flowchart of FIG. 8, the pixel including the secondary reflected light component of the light (red light) having the smallest incident angle among the pixels of the non-defective image is determined based on the color distribution of the pixels around the through hole in the through hole image. A process for estimating the obtained color range (secondary reflection color range) will be described.

  First, the board image reading function 50 reads a captured image (board image) of a printed board from the imaging unit 25 or the image information DB of the board inspection apparatus 1 (step S200). As a printed board to be imaged here, a good sample board in a good solder state may be used, or a bare board before component mounting may be used.

  Next, the CAD information reading function 51 reads the CAD information of the printed board corresponding to the read board image from the CAD information storage unit 32a of the board inspection apparatus 1 (step S201). This CAD information includes information such as the position and size of the through hole on the printed circuit board.

  The through-hole image acquisition function 52 acquires a plurality of through-hole images from the board image (step S202). Specifically, as shown in FIG. 9, the presence range 82 of the through hole 80 in the board image is roughly specified with reference to the CAD information, and then the through hole 80 is detected from the existence range 82 by image recognition processing. The detailed position 83 is specified. Since light is not reflected in the through hole 80, the through hole 80 appears black in the image captured by the color highlight type substrate inspection apparatus 1. Therefore, the detailed position 83 of the through hole 80 can be easily specified by applying a general circular search algorithm for black color (color with low brightness and saturation). When the detailed position 83 is specified, the through-hole image acquisition function 52 extracts a partial image including the periphery of the through-hole 80 as a through-hole image.

  Around the through-hole 80, a metal ring 81 for electrically connecting the wiring pattern on the front surface and the wiring pattern on the back surface is attached. Since the surface of the metal ring 81 is flat (substantially parallel to the substrate surface), blue and green reflected light hardly enters the imaging unit 25, and only red reflected light enters the imaging unit 25. Therefore, as shown in FIG. 9, a reddish color appears around the through hole 80 (the portion of the metal ring 81).

  Next, the through-hole peripheral pixel mapping function 53 samples a plurality of peripheral pixels of the through-hole 80 from the through-hole image, and maps the color of these peripheral pixels to the color histogram (step S203). At this time, it is preferable to sample ten to several hundred peripheral pixels from a plurality of through-hole images.

  The color histogram is obtained by recording the frequency (number) of pixels at each point in the color space. The color distribution of the pixels can be grasped by the color histogram. Note that the pixel referred to here is the minimum resolution of an image. When the mapping process is executed collectively for a plurality of pixels, color mixing occurs, and therefore the process for each pixel is preferable.

In general, the color space is composed of a multidimensional space of at least hue, saturation, and brightness. Therefore, in order to accurately grasp the color distribution of the pixel, it is preferable to use a multidimensional color histogram in which the color of the pixel is mapped in the multidimensional color space. However, since the color highlight method uses red and blue as the light source, colors such as red and blue appear clearly in the obtained color pattern. Therefore, one color (for example, for the purpose of grasping the color distribution of the through-hole peripheral pixels or for determining a color parameter for separating a color appearing in a good solder area from a color appearing in a bad solder area) Blue) or two colors (for example, blue and red) are sufficient.

  Here, in order to easily and clearly distinguish between a normal pixel and a pixel including a secondary reflected light component in a non-defective image, blue that is the hue of light having the largest incident angle is selected. Then, a two-dimensional color histogram is used in which pixel colors are mapped in a two-dimensional color space composed of a blue saturation axis and a lightness axis. This greatly simplifies the algorithm for determining the secondary reflection color range.

  FIG. 10 shows an example of a color histogram. Here, a two-dimensional color histogram including a blue saturation axis and a brightness axis is used. Since the through-hole peripheral pixel is a red color, it does not contain much blue component. Therefore, the blue color saturation is around zero and the lightness is distributed to a certain extent around low to medium lightness. A point (outlier) that clearly deviates from the color distribution is noise.

  The outlier is an obstacle in defining the color distribution of the pixels around the through hole, and is deleted in advance by the outlier deletion function 54 (step S204). Specifically, the outlier removal function 54 grasps the main mass of the color distribution by hierarchical clustering or defines a range of several σ from the color centroid as the main mass of the color distribution, and deviates from the point that deviates from the mass. Consider it as a value and delete it from the color histogram. Then, the color distribution range setting function 55 calculates a rectangular range that surrounds all points remaining after the outlier deletion (step S205). This rectangular range represents the color distribution range 84 of the through-hole peripheral pixels.

  According to the experiments by the present inventors, it has been found that the color appearing around the through hole is different in brightness from the color of the pixel including the secondary reflected light component. Pixels that have the effect of secondary reflection include a primary reflected light component (blue light component) and a secondary reflected light component (red light component), so the brightness is higher than the pixels around the through hole, and the upper limit is It tends to reach near the maximum value of brightness.

  Therefore, the color distribution range correction function 56 calculates the secondary reflection color range 85 by correcting the value range in the brightness direction of the color distribution range 84 of the through-hole peripheral pixels (step S206). In the present embodiment, the secondary reflection color range 85 is obtained by expanding the upper limit of the brightness of the color distribution range 84 to the maximum brightness LMax.

  Through the above processing, the secondary reflection color range can be approximated based on the color distribution of the through-hole peripheral pixels. The secondary reflection color range is stored in the secondary reflection color information storage unit 58 by the secondary reflection color information writing function 57 (step S207), and is used for the following parameter setting processing.

(Parameter setting process)
A flow of parameter setting processing using the estimated secondary reflection color range will be described with reference to the flowchart of FIG. In the present embodiment, an example of generating inspection parameters used in the above-described fillet inspection will be described.

  The instruction information reception function 60 is in a waiting state until instruction information for instructing automatic generation of inspection logic is input (step S300; NO, step S301). When the instruction information is input from the information input unit, the instruction information receiving function 60 transmits the instruction information to the teacher image information reading function 61 (step S300; YES). This instruction information includes information for specifying teacher image information to be subjected to inspection logic generation, the type of inspection logic, and the like.

  The teacher image information reading function 61 reads teacher image information corresponding to the examination logic to be created from the teacher image information DB 74 in accordance with the instruction information (step S302). The teacher image information includes a non-defective image (an image in which the component mounting position is normal) and a defective product image (an image in which the component mounting position is not normal). Teacher information is given to these images.

  FIG. 12 shows an example of a good product image and a defective product image. In the non-defective image, the component 90 is mounted at the position as designed, and good solder fillets are formed in the land areas 91 at both ends of the component 90. The teacher information “good” is given to this image. On the other hand, in the defective product image, parts are missing, and a flat solder fillet is formed in the land region 92. The teacher information “bad” is given to this image.

  When the teacher image information is read, the image acquisition function 62 extracts a solder area from the image to which the teacher information is added (step S303). As shown in FIG. 13, the image acquisition function 62 has a template composed of a land window 93 and a component main body window 94, and enlarges / reduces the template, or relative to the land window 93 and the component main body window 94. While shifting the position, the windows 93 and 94 are aligned with the land areas 91 and 92 and the component 90 in the image. When a part is missing as in the defective product image of FIG. 13, a part main body window 94 is temporarily placed in the middle of the land windows 93 at both ends. For example, a method such as template matching may be used for matching the windows. As a result, the land areas 91 and 92 are specified for the non-defective product image and the defective product image, respectively. And the area | region except the overlap part with the component main body window 94 from the land window 93 is extracted as a solder area | region (refer the shaded part of FIG. 13). Note that the land area itself (the entire land window 93) may be handled as a solder area.

  Next, the distribution function 63 distributes the extracted solder area into a good product image and a defective product image based on the teacher information (step S304). That is, the solder area to which the teacher information “good” is given is regarded as a non-defective image, and the solder area to which the teacher information “defective” is given is regarded as a defective product image.

  The non-defective product image extracted here represents a solder fillet in a good mounting state, and the defective product image represents a solder fillet in a poor mounting state. Therefore, creating optimal color parameters for fillet inspection includes as many pixel colors (blue color) as possible in a non-defective image, and a color range that can almost eliminate the color of pixels in a defective image. Is equivalent to finding the optimal solution.

  In the present embodiment, first, pre-processing for removing pixels including the influence of secondary reflection from a non-defective image is executed. Specifically, the secondary reflection color information reading function 64 reads the secondary reflection color range from the secondary reflection color information storage unit 58 (step S305). Then, as shown in FIG. 14, the secondary reflection area specifying function 65 binarizes the non-defective image, and converts pixels included in the secondary reflection color range into white pixels and other pixels into black pixels. After that, “labeling” is performed in which adjacent white pixels are connected and regarded as one area (step S306). Among the labeled regions, those having an area (number of pixels) equal to or smaller than a predetermined reference value are ignored as noise, and a region having an area exceeding the reference value is specified as a secondary reflection region (step S307).

  The labeling process is performed based on the knowledge that the secondary reflection region appears as a lump having a certain size. Also, white pixels below the reference value are not caused by secondary reflection, but are only few and scattered in white noise, so it is considered that there is almost no influence on the parameter accuracy. It is. The reference value may be a fixed value or may be determined dynamically according to the land area. The format of the reference value may be the number of pixels or a ratio to the land area.

  Subsequently, the secondary reflection area removing function 66 removes the identified secondary reflection area from the non-defective image (step S308). As a result, only the pixels that are not affected by the secondary reflection remain in the non-defective image.

  Next, the mapping function 67 maps the colors of all the pixels of the non-defective product image and the defective product image after removing the secondary reflection area to the color histogram (step S309). At this time, the pixels of the non-defective product image are “good points” and the pixels of the defective product image are “defective points”, and mapping is performed in a mutually distinguishable format. Here, blue is selected as a hue that tends to be included in a non-defective product image (good solder region) and hardly included in a defective product image (defective solder region), and the saturation and lightness axes of red are selected. A two-dimensional color histogram in which pixel colors are mapped in a two-dimensional color space consisting of This greatly simplifies the algorithm for finding the optimal color parameter solution.

  FIG. 15A shows an example of a two-dimensional color histogram. The horizontal axis represents blue saturation. The larger the positive value, the stronger the blue component, and the larger the negative value, the stronger the yellow component, which is the complementary color of blue. The vertical axis represents the brightness, and the brightness increases as the value increases. A white circle (◯) in the histogram represents a good point, and a black triangle (▲) represents a defective point. It can be seen that there is a difference in color distribution between good points and bad points.

  FIG. 15B shows, as a comparative example, a color histogram in which the colors of all the pixels of the non-defective product image and the defective product image before the secondary reflection area removal are mapped. It can be seen that the pixels in the secondary reflection region have blue saturation distributed in the vicinity of around zero, making it difficult to distinguish from defective points. In this embodiment, the secondary reflection area is removed from the non-defective image before mapping. However, after mapping, a part corresponding to the secondary reflection area is removed from the good points, or the secondary reflection area is applicable. The same result can be obtained by changing the good point to the bad point.

  Next, the color range search function 68 searches for a color range that optimally separates the good point color distribution and the bad point color distribution based on the two-dimensional color histogram (step S310). In this embodiment, for simplification of the algorithm, as shown in FIG. 16A, the lower limit (BInf) and upper limit (BSup) of saturation and the lower limit (LInf) and upper limit (LSup) of lightness are included. Consider a rectangular color range. The optimum solution to be obtained here is a color range that includes as many good points (◯) as possible and hardly includes defective points (▲).

Specifically, the color range search function 68 calculates the frequency total value E for each color range while changing the values of BInf, BSup, LInf, and LSup (see Equation 1), and the frequency total value E is maximized. Find the color range. The frequency total value E is an index representing the difference between the number of good points (frequency) and the number of defective points (frequency) included in the color range. FIG. 16B shows a color range in which the frequency total value E is maximum.

  Then, the color range search function 68 sets a color range in which the frequency total value E is maximum as a color parameter (color condition) for inspection. As described above, according to this embodiment, it is possible to automatically generate color parameters for appropriately separating a non-defective product image and a defective product image.

  Next, processing for automatically generating an inspection threshold value (determination condition) is executed using the color parameter.

  First, the binarization function 69 binarizes all solder regions of the non-defective product image and the defective product image using the color parameter (step S311). In this binarization processing, pixels included in the color range defined by the color parameter are converted to white pixels, and other pixels are converted to black pixels.

  As shown in FIG. 17, the white pixel area is very large in the non-defective image, and the white pixel area is extremely small in the defective image. Therefore, when such a binarized image is used, it becomes easy to quantitatively calculate a feature amount for identifying a non-defective product or a defective product. Examples of the feature amount include the area, area ratio, center of gravity, length, maximum width, and shape of the white pixel region. Here, the area is selected as the feature amount.

  The feature quantity histogram generation function 70 grasps the difference between the feature quantity distribution tendency of the non-defective product image and the feature quantity distribution trend of the defective product image, and therefore the area value of the white pixel region for each of the good product image and the defective product image. An area histogram is created (step S312). FIG. 18 shows an example of an area histogram of a non-defective product image and a defective product image (hereinafter simply referred to as “good product histogram” or “defective product histogram”). It can be seen that a clear difference appears between the feature quantity distribution of the non-defective image and the feature quantity distribution of the defective product image.

  Next, the threshold value determination function 71 calculates a threshold value for optimally separating the feature quantity of the non-defective product image and the feature quantity of the defective product image based on the frequency distribution of the non-defective product histogram and the defective product histogram ( Step S313). Various methods for optimally separating the two peaks appearing in the feature amount histogram have been proposed, and any method may be adopted here. For example, Otsu's discriminant analysis method may be used, or a point separated by 3σ from the edge of a non-defective image peak may be determined as a threshold based on experience. In this way, a threshold value for discriminating between non-defective products and defective products is generated.

  Then, the inspection logic generation function 72 generates inspection logic from the color parameter, the type of feature quantity (area in this example), and the threshold value (step S314), and the inspection logic writing function 73 loads the inspection logic on the substrate. The data is written in the inspection logic storage unit 35 of the inspection apparatus 1 (step S315).

  According to the processing described above, since inspection logic (parameters) used in the fillet inspection of parts is automatically generated, the time and load required for teaching can be greatly reduced.

  In addition, the influence of secondary reflection is removed by the above-described algorithm, and optimal color parameters and threshold values are calculated. Therefore, it is possible to perform quality determination by the color highlight method with high accuracy. Note that the reliability of the color parameter and the threshold value is improved as the number of teacher image information to be given first increases.

Second Embodiment
In the first embodiment, a non-defective image and a defective image are used as the teacher image. But,
In reality, it is difficult to predict a defect that may occur in the board mounting line, or to manufacture a large number of defective products just for teaching. Therefore, teaching is often performed only from a non-defective image. Therefore, in the second embodiment of the present invention, a method for generating a parameter only from a non-defective image is proposed.

  Since the configuration of the parameter setting device 2 is almost the same as that of the first embodiment, the illustration is omitted. The secondary reflection color range estimation process is also the same algorithm as in the first embodiment.

(Parameter setting process)
The flow of parameter setting processing in the second embodiment will be described below with reference to the flowchart of FIG. In addition, the same step number is attached | subjected about the process similar to 1st Embodiment, and detailed description is abbreviate | omitted.

  When instruction information for instructing automatic generation of inspection logic is input, teacher image information corresponding to the inspection logic is read from the teacher image information DB 74 (steps S300 to S302). The teacher image information includes only non-defective images.

  The image acquisition function 62 extracts a solder area from the good product image by template matching or the like (step S400). On the other hand, the secondary reflection color information reading function 64 reads the secondary reflection color range from the secondary reflection color information storage unit 58 (step S305). Then, the secondary reflection area specifying function 65 specifies a secondary reflection area from the non-defective image by the same algorithm as in the first embodiment (steps S306 and S307), and the secondary reflection area removing function 66 is The next reflection area is removed (step S308).

  Subsequently, the mapping function 67 maps the colors of all the pixels of the non-defective image after removing the secondary reflection area to the color histogram (step S401). Then, the color range search function 68 calculates a color range composed of a minimum rectangle including all the points on the color histogram, and sets the color range as a color parameter (color condition) for inspection ( Step S402).

  Subsequently, a process of automatically generating a threshold value (determination condition) for inspection using the color parameter is executed.

  The binarization function 69 binarizes all solder areas of the non-defective image using the color parameters (step S403), and the feature amount histogram generation function 70 displays an area histogram relating to the area value of the white pixel area of the non-defective image. Is created (step S404). FIG. 20 shows an example of an area histogram.

  The threshold value determination function 71 calculates a threshold value for determining the feature amount (area value) of the solder region in the non-defective image based on the frequency distribution of the area histogram (step S405). However, in the case of this processing, since only the non-defective image peaks are included in the area histogram, the method of separating two peaks as in the Otsu discriminant analysis method cannot be used. Therefore, in this case, it is only necessary to determine a threshold value by securing a sufficient margin so that a non-defective product is erroneously determined to be defective (overdetection). Specifically, an empirical margin may be taken from the end point (upper limit) of the good product histogram, or a statistical method such as setting a threshold at a distance of 6σ from the center of the good product histogram may be used. In this way, a threshold value for discriminating between non-defective products and defective products is generated.

Then, the inspection logic generation function 72 generates inspection logic from the color parameter, the type of feature amount (area in this example), and the threshold value (step S314), and the inspection logic writing function 73
However, the inspection logic is written in the inspection logic storage unit 35 of the substrate inspection apparatus 1 (step S315).

  Also by the processing described above, the same operational effects as those of the first embodiment can be obtained. Moreover, this process has an advantage that even when there is no defective sample, inspection logic (parameters) used in solder fillet inspection can be automatically generated.

<Modification>
The above-described embodiment is merely an example of the present invention. The scope of the present invention is not limited to the above embodiment, and various modifications can be made within the scope of the technical idea.

  For example, in the above embodiment, a two-dimensional color histogram (color space) is used, but a multi-dimensional (hue, saturation, brightness) color histogram may be used. Also for the two-dimensional color histogram, the saturation axis of other hues such as blue, green, and yellow may be used instead of the blue saturation axis, or the hue axis may be used instead of the saturation axis. The selection of the axis of the color histogram may be determined according to the tendency of the color pattern of the component image captured by the board inspection apparatus.

  Further, the color range is not limited to a rectangle, and a circle, a polygon, a free curve figure, or the like may be used. Furthermore, when the color histogram is multidimensional, the color range may be multidimensional.

  In the above embodiment, the process for generating the parameters for the fillet inspection is given as an example. However, the present invention is a process for generating other inspection parameters as long as it is a parameter generation process in which the influence of secondary reflection is a problem. It is also applicable to.

  In the above embodiment, the area is used as the feature amount. However, as the feature amount used for the pass / fail judgment, an area ratio, a length, a maximum width, a center of gravity, and the like can be preferably used. The area ratio is the occupation ratio of the binarized area in the land window. For example, if a component is soldered with a deviation from the land area, the area of the solder area increases and the area ratio changes. If this is regarded as a feature amount, it is effective for inspection of component displacement. The length is the length in the vertical direction or the horizontal direction of the white pixel region, and the maximum length is the maximum value among the lengths of the white pixel region. The center of gravity is a relative position of the center of gravity of the white pixel region with respect to the land window.

  Any feature amount may be used as long as it can accurately determine pass / fail, and it is also preferable to combine a plurality of types of feature amounts to improve accuracy. It is also possible to extract a plurality of types of feature amounts in the parameter setting process, and to adopt a feature amount that best separates non-defective products and defective products among them. In the above embodiment, an area histogram (area value histogram) is used to determine the determination condition (threshold value). However, if the type of feature amount is different, a feature amount histogram (area ratio histogram, length histogram, Maximum width histogram, centroid histogram, etc.). For example, if an area ratio histogram is used instead of the area value histogram, the pass / fail judgment is executed based on the pixel occupation rate binarized by the color parameter in the land window. Even when the size becomes smaller or larger, a determination process that is not affected by the size of the land window is possible.

  Also, the parameter setting device refers to the instruction information or the teacher information to determine the presence or absence of a defective product image. If there is a defective product image, the parameter setting process of the first embodiment is executed. The process may be automatically switched, such as executing the parameter setting process of the second embodiment.

The figure which shows the hardware constitutions of the board | substrate inspection system which concerns on embodiment of this invention. The figure which shows the function structure of a board | substrate inspection apparatus. The figure which shows the relationship between the shape of a solder fillet, an imaging pattern, and a binarized image. The flowchart which shows the flow of a board | substrate inspection process. The figure which shows the function structure of the parameter setting apparatus which concerns on 1st Embodiment. The figure which shows the function structure of the parameter setting apparatus which concerns on 1st Embodiment. The figure explaining the influence of secondary reflection. The flowchart which shows the flow of a secondary reflection color range estimation process. The figure which shows the extraction process of a through-hole image. The figure which shows a secondary reflection color range estimation process. The flowchart which shows the flow of the parameter setting process in 1st Embodiment. The figure which shows an example of a quality product image and a defective product image. The figure which shows the extraction process of a solder area | region. The figure which shows a secondary reflection area | region specific process. The figure which shows an example of the two-dimensional color histogram in a parameter setting process. The figure which shows the search process of a color range. The figure which shows an example of the binarization result of a non-defective product image and a defective product image. The figure which shows the area histogram and threshold value determination process of a good article and inferior goods. The flowchart which shows the flow of the parameter setting process in 2nd Embodiment. The figure which shows the threshold value determination process in 2nd Embodiment. The figure which shows the structure of the board | substrate inspection apparatus of a color highlight system. The figure which shows an example of the color pattern which appears in a captured image. The figure which shows the setting support tool of a color parameter. The figure explaining the influence of secondary reflection.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Board | substrate inspection apparatus 2 Parameter setting apparatus 10 Instruction information reception function 11 Board | substrate carrying-in function 12 CAD information reading function 13 Stage operation function 14 Imaging function 15 Inspection logic reading function 16 Inspection function 17 Judgment result writing function 18 Board | substrate unloading function 20 Board | substrate 21 Mounted parts 22 X stage 23 Y stage 24 Projection unit 25 Imaging unit 26 Control processing unit 27 Conveyor 28 Red light source 29 Green light source 30 Blue light source 31 Imaging controller 32 Storage unit 32a CAD information storage unit 32b Judgment result storage unit 33 A / D Conversion unit 34 Image processing unit 35 Inspection logic storage unit 36 Determination unit 37 XY stage controller 38 Memory 39 Control unit 40 Input unit 41 Display unit 42 Printer 50 Substrate image reading function 51 CAD information reading function 52 Through-hole image acquisition function 53 Through-hole peripheral pixel mapping function 54 Outlier removal function 55 Color distribution range setting function 56 Color distribution range correction function 57 Secondary reflection color information writing function 58 Secondary reflection color information storage unit 60 Instruction information reception function 61 Teacher image information reading Function 62 Image acquisition function 63 Distribution function 64 Secondary reflection color information reading function 65 Secondary reflection area specifying function 66 Secondary reflection area removal function 67 Mapping function 68 Color range search function 69 Binarization function 70 Feature amount histogram generation function 71 Threshold decision function 72 Inspection logic generation function 73 Inspection logic write function 80 Through hole 81 Metal ring 82 Existence range of through hole 83 Detailed position of through hole 84 Color distribution range of peripheral pixel of through hole 85 Defect color range 90 Parts 91, 92 Land area 93 Land window 94 Component body window

Claims (17)

A region satisfying a predetermined color condition is extracted from an image obtained by irradiating a component mounted on the board with light of multiple colors at different angles of incidence and imaging the reflected light, and the features of the extracted region Is a method for generating a parameter used in a board inspection apparatus that inspects the mounting state of the component depending on whether or not a predetermined determination condition is satisfied,
Information processing device
Acquire multiple non-defective images obtained by imaging parts with good soldering,
Acquire multiple through-hole images obtained by imaging through-holes on the board,
From the color distribution of pixels around the through-hole in the through-hole image, a secondary reflected color range that is a color range that can be taken by a pixel including a secondary reflected light component of light having the smallest incident angle among pixels of a non-defective image is estimated. ,
Identify a secondary reflection region composed of pixels having a color within the secondary reflection color range from the non-defective image,
Removing the identified secondary reflection area from the non-defective image;
A parameter setting method for a substrate inspection apparatus that generates a parameter used in substrate inspection using a non-defective image after removal of the secondary reflection region as a teacher image. 2. The parameter setting method for a substrate inspection apparatus according to claim 1, wherein the secondary reflection color range defines at least a saturation range of a hue of light having the largest incident angle and a brightness range. The information processing apparatus includes:
3. The parameter setting method for a substrate inspection apparatus according to claim 1, wherein the secondary reflection color range is determined by obtaining a color distribution range of the through-hole peripheral pixels and correcting a value range in the brightness direction of the color distribution range. The information processing apparatus includes:
4. The parameter setting method for a substrate inspection apparatus according to claim 3, wherein an upper limit of the brightness of the color distribution range of the through-hole peripheral pixels is expanded to the maximum brightness value as the secondary reflection color range. The information processing apparatus includes:
Acquire multiple defective product images obtained by imaging defective soldering parts,
The color of each pixel of the solder area in the non-defective product image after the secondary reflection area is removed as a good point, and the color of each pixel of the solder area in the defective product image is mapped as a defective point to the color space,
Finding a color range that divides the color space so that the difference between the number of good points and the number of defective points contained therein is maximized,
The parameter setting method of the board | substrate inspection apparatus of any one of Claims 1-4 which sets the calculated | required said color range as a color condition used by board | substrate inspection. The information processing apparatus includes:
Extracting a pixel region that satisfies the color condition from each of the good product image and the defective product image, and creating a feature amount histogram for a feature amount of the pixel region,
Calculating a threshold value for separating the feature amount of the non-defective image and the feature amount of the defective product image based on the frequency distribution of the feature amount histogram;
6. The parameter setting method for a substrate inspection apparatus according to claim 5, wherein the calculated threshold value is set as a determination condition used in substrate inspection. The information processing apparatus includes:
The parameter setting of the board | substrate inspection apparatus of any one of Claims 1-4 which determines the color conditions used by board | substrate inspection based on the color distribution range of each pixel of the said non-defective image after secondary reflection area removal. Method. The information processing apparatus includes:
Extracting a pixel region that satisfies the color condition from the solder region in the non-defective image, and generating a feature amount histogram for the feature amount of the pixel region,
Based on the frequency distribution of the feature amount histogram, a threshold value for determining the feature amount of the solder area in the good product image is calculated,
8. The parameter setting method for a substrate inspection apparatus according to claim 7, wherein the calculated threshold value is set as a determination condition used in substrate inspection. A region satisfying a predetermined color condition is extracted from an image obtained by irradiating a component mounted on the board with light of multiple colors at different angles of incidence and imaging the reflected light, and the features of the extracted region Is an apparatus for automatically generating parameters used in a board inspection apparatus that inspects the mounting state of the component depending on whether or not a predetermined determination condition is satisfied,
Image acquisition means for acquiring a plurality of non-defective images obtained by imaging components with good soldering;
Through-hole image acquisition means for acquiring a plurality of through-hole images obtained by imaging through-holes on a substrate;
From the color distribution of pixels around the through-hole in the through-hole image, a secondary reflection color range that is a color range that can be taken by a pixel including a secondary reflected light component of light having the smallest incident angle among pixels of a non-defective image is estimated. Secondary reflection color range estimation means;
Secondary reflection area specifying means for specifying a secondary reflection area composed of pixels having a color within the secondary reflection color range from the non-defective image;
Secondary reflection area removing means for removing the identified secondary reflection area from the non-defective image;
A non-defective image after removing the secondary reflection region as a teacher image, a parameter generating means for generating parameters used in substrate inspection;
A parameter setting device for a substrate inspection apparatus comprising: 10. The parameter setting device for a substrate inspection apparatus according to claim 9, wherein the secondary reflection color range defines at least a saturation range of a hue of light having the largest incident angle and a brightness range. The secondary reflection color range estimation means includes
11. The parameter setting device for a substrate inspection apparatus according to claim 9, wherein the secondary reflection color range is determined by obtaining a color distribution range of the through-hole peripheral pixels and correcting a value range in the brightness direction of the color distribution range. The secondary reflection color range estimation means includes
12. The parameter setting device for a substrate inspection apparatus according to claim 11, wherein the secondary reflection color range is obtained by expanding the upper limit of the brightness of the color distribution range of the through-hole peripheral pixels to the maximum brightness value. The image acquisition means acquires a plurality of defective product images obtained by imaging a component with poor soldering;
The parameter generation means includes
The color of each pixel of the solder area in the non-defective product image after the secondary reflection area is removed as a good point, and the color of each pixel of the solder area in the defective product image is mapped as a defective point to the color space,
Finding a color range that divides the color space so that the difference between the number of good points and the number of defective points contained therein is maximized,
The parameter setting device for a substrate inspection apparatus according to any one of claims 9 to 12, wherein the obtained color range is set as a color condition used in substrate inspection. The parameter generation means includes
Extracting a pixel region that satisfies the color condition from each of the good product image and the defective product image, and creating a feature amount histogram for a feature amount of the pixel region,
Calculating a threshold value for separating the feature amount of the non-defective image and the feature amount of the defective product image based on the frequency distribution of the feature amount histogram;
14. The parameter setting device for a substrate inspection apparatus according to claim 13, wherein the calculated threshold value is set as a determination condition used in substrate inspection. The parameter generation means includes
The parameter setting of the substrate inspection apparatus according to any one of claims 9 to 12, wherein a color condition used in the substrate inspection is determined based on a color distribution range of each pixel of the non-defective image after removing the secondary reflection region. apparatus. The parameter generation means includes
Extracting a pixel region that satisfies the color condition from the solder region in the non-defective image, and generating a feature amount histogram for the feature amount of the pixel region,
Based on the frequency distribution of the feature amount histogram, a threshold value for determining the feature amount of the solder area in the good product image is calculated,
16. The parameter setting device for a substrate inspection apparatus according to claim 15, wherein the calculated threshold value is set as a determination condition used in substrate inspection. A storage unit for storing color conditions and determination conditions set by the parameter setting device according to claim 14 or 16,
A light projecting means for irradiating light of a plurality of colors at different incident angles on a mounting component on the substrate;
A region extracting means for extracting a region that satisfies the color condition from an image obtained by imaging the reflected light;
An inspection means for inspecting a soldering state of the component based on whether or not a feature value of the extracted region satisfies the determination condition;
A board inspection apparatus comprising:

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