CN112752387A - Printed circuit board production marking method for counting and recasting production defects - Google Patents
Printed circuit board production marking method for counting and recasting production defects Download PDFInfo
- Publication number
- CN112752387A CN112752387A CN201911039571.5A CN201911039571A CN112752387A CN 112752387 A CN112752387 A CN 112752387A CN 201911039571 A CN201911039571 A CN 201911039571A CN 112752387 A CN112752387 A CN 112752387A
- Authority
- CN
- China
- Prior art keywords
- printed circuit
- circuit board
- board
- main board
- production
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Structure Of Printed Boards (AREA)
Abstract
A printed circuit board production marking method for counting and recalling printed circuit board production defects is characterized in that a circuit main board is endowed with a main board code, the circuit main board is divided into a plurality of manufacturing areas, and different area codes are endowed to the manufacturing areas; the printed circuit board produced by the circuit main board is marked, the marking content comprises a main board code of the circuit main board and an area code of the printed circuit board in the manufacturing area, and the marking on the printed circuit board comprises the circuit main board code and the manufacturing code of the printed circuit board in the manufacturing area on the circuit main board, so that when the printed circuit board has a defect, the position of the printed circuit board with the defect can be judged, the manufacturing process of the circuit main board on the printed circuit board can be judged, and the production yield and the quality of the subsequent printed circuit board can be greatly improved.
Description
Technical Field
A method for marking printed circuit board production includes using mark of printed circuit board to contain code of circuit main board and code of production area of printed circuit board on said circuit main board so as to know out production process of printed circuit board when defect is produced by said printed circuit board and to find out reason of defect quickly and to provide method for marking printed circuit board production for improving said defect.
Background
At present, a printed circuit board is cut into a printed circuit board by a circuit main board after a plurality of processes, in order to improve the quality and the qualification rate of the product, the printed circuit board is manufactured and then subjected to various tests, in order to prevent unqualified products from being produced continuously or reduce the probability of producing unqualified products, generally, production parameters or processes are marked on the printed circuit board in a bar code mode, once the unqualified products are detected or the printed circuit board has a problem at a client, the defect generation reason can be known by the parameters and the processes recorded by the marks, and further, the quality and the qualification rate of subsequent production products can be improved, however, after the continuous research of the inventor, the printed circuit board is cut into the circuit main board after a plurality of processes, therefore, the position of the printed circuit board on the main board is very important for the defect retrospective analysis and the defect generation reason analysis, however, the position of the printed circuit board cannot be known by the marking of the printed circuit board, and the cause of the defect cannot be effectively and accurately determined, which is of limited help for improving the yield and quality.
Disclosure of Invention
The main objective of the present invention is to utilize the mark on the printed circuit board to include the code of the circuit board and the manufacturing code of the printed circuit board in the manufacturing area of the circuit board on the circuit board, so that when the printed circuit board has a defect, the position of the printed circuit board itself having the defect can be used for judging, and the manufacturing process of the circuit board on the printed circuit board can be further judged, thereby greatly improving the yield and quality of the subsequent printed circuit board.
To achieve the above object, the present invention provides a method for marking printed circuit board production, which is used for counting defects in the production of plastic printed circuit board, comprising the following steps:
(A) endowing the circuit main board with a main board code, dividing the circuit main board into a plurality of manufacturing areas, and endowing different area codes to the manufacturing areas;
(B) and marking the printed circuit board produced by the circuit main board, wherein the marking content comprises a main board code of the circuit main board and an area code of the printed circuit board in the manufacturing area.
The printed circuit board production marking method for counting and recalling the printed circuit board production defects is characterized in that the marking content of the printed circuit board further comprises production information.
The printed circuit board production marking method for counting and recalling the production defects of the printed circuit board is characterized in that the printed circuit board is marked as a one-dimensional code or a two-dimensional code.
Drawings
Fig. 1 is a schematic diagram of a circuit board according to a first embodiment of the invention.
Fig. 2 is a schematic diagram of a printed circuit board formed on a circuit board according to a first embodiment of the invention.
Fig. 3 is a schematic diagram of a circuit board according to a second embodiment of the invention.
Fig. 4 is a schematic diagram of a printed circuit board formed on a circuit board according to a second embodiment of the invention.
Description of reference numerals: 1. 4-a circuit main board; 11. 41-manufacturing area; 2. 5-a printed circuit board; 3. and 6-marking.
Detailed Description
Referring to fig. 1 and 2, it can be clearly seen that, in the implementation of the present invention, a motherboard code is first assigned to the circuit board 1, the circuit board 1 is divided into a plurality of manufacturing areas 11, different area codes are assigned to the manufacturing areas 11, and then the printed circuit board 2 produced by the circuit board 1 is marked 3, where the marked content includes production information, the motherboard code of the circuit board 1, and the area code of the printed circuit board 2 in the manufacturing area 11. Therefore, when the printed circuit board 2 is defective, the mark 3 on the printed circuit board 2 can be used to clearly know which circuit board 1 the printed circuit board 2 is located on and the position of the circuit board 1, in other words, the method can reduce the printed circuit boards 2 into the main circuit board 1, and can deduce which manufacturing area 11 of the circuit board 1 is easy to be defective in the production process through big data statistics, and whether the defective manufacturing area is related to production equipment and a fixture, thereby providing more reliable data for a producer to prevent or improve the subsequent production quality. Furthermore, the label 3 can be a one-dimensional code or a two-dimensional code.
Referring to fig. 3 and 4, it can be clearly seen that the second embodiment of the present invention is different from the first embodiment in that the circuit board 4 has more manufacturing areas 41, so that the printed circuit board 5 covers a plurality of manufacturing areas 41 on the circuit board 4, that is, the mark 6 on the printed circuit board 5 also has area codes including a plurality of manufacturing areas 41, so that the subsequent data collection and analysis can be more specific.
Claims (3)
1. A printed circuit board production marking method for counting and recasting production defects of printed circuit boards is characterized by comprising the following steps:
(A) endowing the circuit main board with a main board code, dividing the circuit main board into a plurality of manufacturing areas, and endowing different area codes to the manufacturing areas;
(B) and marking the printed circuit board produced by the circuit main board, wherein the marking content comprises a main board code of the circuit main board and an area code of the printed circuit board in the manufacturing area.
2. The method as claimed in claim 1, wherein the printed circuit board marking content further includes production information.
3. The method as claimed in claim 1, wherein the mark of the pcb is a one-dimensional code or a two-dimensional code.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911039571.5A CN112752387A (en) | 2019-10-29 | 2019-10-29 | Printed circuit board production marking method for counting and recasting production defects |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911039571.5A CN112752387A (en) | 2019-10-29 | 2019-10-29 | Printed circuit board production marking method for counting and recasting production defects |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112752387A true CN112752387A (en) | 2021-05-04 |
Family
ID=75640183
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911039571.5A Withdrawn CN112752387A (en) | 2019-10-29 | 2019-10-29 | Printed circuit board production marking method for counting and recasting production defects |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112752387A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040000584A1 (en) * | 2002-06-28 | 2004-01-01 | Nokia Corporation | Carriers for printed circuit board marking |
| CN106604553A (en) * | 2016-12-24 | 2017-04-26 | 上海与德信息技术有限公司 | Distinguishing method of printed circuit board |
| CN112702905A (en) * | 2019-10-22 | 2021-04-23 | 联策科技股份有限公司 | Method and system for tracing yield and error rate of printed circuit board |
-
2019
- 2019-10-29 CN CN201911039571.5A patent/CN112752387A/en not_active Withdrawn
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040000584A1 (en) * | 2002-06-28 | 2004-01-01 | Nokia Corporation | Carriers for printed circuit board marking |
| CN106604553A (en) * | 2016-12-24 | 2017-04-26 | 上海与德信息技术有限公司 | Distinguishing method of printed circuit board |
| CN112702905A (en) * | 2019-10-22 | 2021-04-23 | 联策科技股份有限公司 | Method and system for tracing yield and error rate of printed circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20210504 |
|
| WW01 | Invention patent application withdrawn after publication |