CN112670805B - Laser crystal direct-punching cooling type micro-channel radiator - Google Patents
Laser crystal direct-punching cooling type micro-channel radiator Download PDFInfo
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- CN112670805B CN112670805B CN202011630386.6A CN202011630386A CN112670805B CN 112670805 B CN112670805 B CN 112670805B CN 202011630386 A CN202011630386 A CN 202011630386A CN 112670805 B CN112670805 B CN 112670805B
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Abstract
The invention discloses a laser crystal direct-impact cooling type micro-channel radiator, which comprises: the laser slab crystal and two groups of micro-channel radiators with the same structure; the microchannel heat sink includes a microchannel layer and a coverboard layer. The fluid working medium enters a concentrated heat dissipation area of the laser slab crystal from the middle part and is directly impacted at high speed and cooled quickly; the microchannel structure of the microchannel layer enhances the heat transfer of the fluid working medium. The fluid working medium flows to both sides after entering the microchannel layer, takes away the heat diffused by the laser slab crystal on the bottom surface, and greatly weakens the temperature distribution difference between the microchannel layer and the laser slab crystal. The whole width of the structure is equivalent to the width of the laser slab crystal in the light transmission direction, and the limitation of a narrow space formed by arranging other components of a laser system in the width direction of the laser slab crystal is met. The two groups of micro-channel radiators work together to realize simultaneous heat absorption at two sides of the laser slab crystal, and the requirement of high-power heat dissipation in the small-size laser slab crystal in a limited space is met.
Description
Technical Field
The invention belongs to the technical field of laser application, and particularly relates to a laser crystal direct-impact cooling type micro-channel radiator.
Background
The long-term stable operation of the solid laser puts high requirements on the heat dissipation of the crystal. Especially for a slab laser, the laser crystal has small volume and high power, and the output heat flux density can reach hundreds of watts on a very small crystal surface. If the heat dissipation capability is poor, the crystal temperature can be obviously increased, and a series of problems of laser beam quality reduction, low conversion efficiency and the like are caused. Therefore, high power lasers must be equipped with a stable and efficient crystal heat removal system.
Meanwhile, the laser system has higher uniformity of the temperature of the crystal surface. Because the pump light hits the crystal, the heat flow distribution in the laser crystal is changed exponentially along the light transmission direction, and a large temperature gradient exists. Non-uniform heat dissipation can cause significant thermal stress effects, often causing crystal breakage and damage to the laser system. Therefore, the heat sink of the laser crystal mainly considers the temperature distribution difference of the crystal surface.
Furthermore, unlike conventional heat sinks, laser crystal heat sinks tend to have special requirements for structural arrangements. For a slab laser, a pumping light source is a semiconductor laser stack array, and is converged and incident on the end face of a crystal after being shaped by a lens. If the size of the heat radiator in the light passing direction is too large and greatly exceeds the width of the crystal, part of the pump light can be directly shielded. Meanwhile, considering the placement of the cavity mirror of the resonant cavity, the space for arranging the crystal radiator between the lenses is very limited, and the space condition is fully considered in the design of the laser crystal radiator.
The existing laser crystal radiator can not meet the requirements at the same time. Therefore, it is necessary to design and develop a laser crystal heat sink with a new structure, simplify the structure in a limited arrangement space, and achieve compactness and miniaturization. The requirement of high-power heat dissipation on the laser crystal is met, the non-uniform heat flow distribution characteristics in the crystal are considered, the temperature distribution difference of the surface of the crystal is reduced, and the service life and the stability of the laser crystal are improved.
Disclosure of Invention
The technical problem of the invention is solved: the defects of the prior art are overcome, the laser crystal direct-flushing cooling type micro-channel radiator is provided, a long channel structure can be better utilized, the integral heat absorption capacity of a fluid working medium is improved, and the uniformity of the temperature on the surface of a laser slab crystal and the surface of the micro-channel radiator can be improved in all directions.
In order to solve the technical problem, the invention discloses a laser crystal direct-punching cooling type micro-channel radiator, which comprises: the device comprises a laser lath crystal, an upper micro-channel radiator and a lower micro-channel radiator;
the upper micro-channel radiator and the lower micro-channel radiator are micro-channel radiators with the same structure; the upper and lower radiating surfaces of the laser slab crystal are respectively combined with the bottom heat absorbing surfaces of the upper micro-channel radiator and the lower micro-channel radiator.
In the above-mentioned laser crystal direct-impact cooling type microchannel radiator, the microchannel radiator is a two-layer structure, including: a microchannel layer and a coverboard layer;
the bottom surface of the microchannel layer is a heat absorption surface and is combined with the laser slab crystal;
a microchannel structure is arranged in the microchannel layer;
the cover plate layer is tightly matched with the microchannel layer and provides an inlet and outlet channel of fluid working medium for the microchannel layer.
In the laser crystal direct-punching cooling type micro-channel radiator, the middle part of a cover plate layer is provided with a fluid working medium inlet and an inlet header; the two sides of the cover plate layer are symmetrically provided with a fluid working medium outlet A, a fluid working medium outlet B, an outlet header A and an outlet header B;
the fluid working medium inlet is communicated with the micro-channel structure through the inlet header;
the fluid working medium outlet A is communicated with the micro-channel structure through an outlet header A;
and the fluid working medium outlet B is communicated with the micro-channel structure through an outlet header B.
In the laser crystal direct-flushing cooling type micro-channel radiator, fluid collecting grooves are arranged at two ends of a micro-channel structure; the fluid working medium outlet A and the fluid working medium outlet B are respectively and directly communicated with the fluid collecting grooves at the two ends of the micro-channel structure.
In the above laser crystal direct-impact cooling type microchannel heat sink, the aspect ratio of the cross section of the microchannel structure is: 1:1 to 1: 20.
In the laser crystal direct-punching cooling type micro-channel radiator, the length of the micro-channel structure is 1-10 times of the width of the laser slab crystal in the same direction.
In the laser crystal direct-punching cooling type microchannel radiator, the fluid working medium inlet, the fluid working medium outlet A and the fluid working medium outlet B are respectively arranged on the flange of the cover plate layer so as to reduce the whole weight of the cover plate layer.
In the laser crystal direct-punching cooling type microchannel radiator, the matching contact surface between the microchannel layer and the cover plate layer is a flat surface, and a material spreading welding sealing mode or a bonding sealing mode is adopted between the layers to form an integrated structure.
In the laser crystal direct-punching cooling type microchannel radiator, a primary-secondary groove is arranged on a matching contact surface between a microchannel layer and a cover plate layer and is used for positioning, welding and sealing the two layers; the secondary groove is arranged on the microchannel layer, and the primary groove is arranged on the cover plate layer; or the mother groove is arranged on the microchannel layer, and the son groove is arranged on the cover plate layer.
In the laser crystal direct-punching cooling type microchannel radiator, the side extension section of the microchannel layer forms a side lug structure, and the side lug structure is provided with bolt holes for integrally reinforcing the upper and lower groups of microchannel radiators after being bonded with the laser lath crystal.
The invention has the following advantages:
(1) the invention discloses a direct-impact cooling type micro-channel radiator for a laser crystal, which adopts an upper micro-channel radiator and a lower micro-channel radiator with the same structure to radiate heat of the upper side and the lower side of the laser slab crystal. The fluid working medium inlet on the cover plate layer is arranged in the middle, the fluid working medium directly and vertically scours the position of the laser slab crystal after entering the microchannel radiator, a cold fluid has strong heat carrying capacity at the position, the laser slab crystal is rapidly cooled in a centralized heat dissipation area, the fluid working medium flows to the two sides of the microchannel structure after being vertically scoured, and the flowing turns can cause local turbulence disturbance, so that the direct impact area has a high local heat transfer coefficient. Meanwhile, the micro-channel structure greatly enhances the heat transfer capacity, and the attribute and the flow working parameter of the fluid working medium can be selected according to the integral heat dissipation capacity and the space environment, so that the single-phase flow or the two-phase flow of the fluid working medium in the micro-channel structure is realized. After the lower part of the lower micro-channel layer is contacted with the laser slab crystal, the heat is in the horizontal range at the same time, so that the invention can better utilize the long-channel structure and improve the integral heat absorption capacity of the fluid working medium.
(2) The invention discloses a laser crystal direct-impact cooling type microchannel radiator, which has the direct-impact rapid heat exchange characteristic of a high heat flow density area, so that the temperature difference of the surface of a laser slab crystal in contact with the bottom surface of a microchannel layer is reduced. And in the length direction of the microchannel layer, the transverse heat expansion is obvious, and fluid working media in the microchannel layer absorb heat downstream, so that the integral temperature difference of the bottom surface of the microchannel radiator is smaller. Therefore, the present invention can improve the temperature uniformity on the surface of the laser slab crystal and the surface of the microchannel heat sink in all directions.
(3) The invention discloses a laser crystal direct-impact cooling type micro-channel radiator, and the whole width of the structure is equivalent to the width of a laser slab crystal. The invention has the advantages that the strip-shaped design is adopted, the integral structure is compact, and in addition, the working medium inlet and outlet in the middle of the cover plate layer are designed by adopting the flanges, so that the integral weight is effectively reduced. After the upper and lower groups of micro-channel radiators are bonded with the laser slab crystal, the laser slab crystal is further reinforced through the side lugs and the bolts, so that the risks of structural looseness, fluid working medium leakage and the like caused by long-term thermal expansion and external vibration under the conditions of ground, space load and the like are eliminated.
Drawings
FIG. 1 is a front view of a laser crystal direct-cooled microchannel heat sink in an embodiment of the invention;
FIG. 2 is a side view of a laser crystal direct-cooled microchannel heat sink in an embodiment of the invention;
FIG. 3 is a front and top view of a microchannel layer in an embodiment of the invention;
fig. 4 is a front and top view of a cover sheet layer construction according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the embodiments of the present invention will be described in detail with reference to the accompanying drawings.
One of the verification ideas of the present invention is: the utility model provides a laser crystal direct-flushing cooling type microchannel radiator, includes: the laser slab crystal and the upper and lower groups of micro-channel radiators with the same structure; the single-side microchannel radiator is of a two-layer structure and comprises a microchannel layer and a cover plate layer; the microchannel layer is internally provided with a microchannel structure, and the cover plate layer provides an inlet and outlet channel for fluid working media for the microchannel layer. Fluid working medium enters the microchannel radiator from the middle part of the cover plate layer, and directly impacts and quickly cools the concentrated heat dissipation area of the laser lath crystal at the bottom surface of the microchannel layer at a high speed, and meanwhile, the microchannel structure strengthens the heat transfer of the fluid working medium and has higher local heat transfer coefficient. After entering the microchannel layer, the fluid working medium flows to two sides along the microchannel, and takes away the heat diffused by the laser slab crystal on the bottom surface, thereby greatly weakening the temperature distribution difference between the microchannel layer and the surface of the laser slab crystal. The whole width of the structure is equivalent to the width of the laser slab crystal in the light transmission direction, and the limitation of a narrow space formed by arranging other components of a laser system in the width direction of the laser slab crystal is met. The upper and lower groups of micro-channel radiators work together to absorb heat at the upper and lower sides of the laser slab crystal simultaneously, so that the high-power heat dissipation requirement in the small-size laser slab crystal in a limited space is met.
Referring to fig. 1 to 4, in the present embodiment, the laser crystal direct-cooling type micro-channel heat sink includes: a laser slab crystal 1, an upper micro-channel heat sink 21 and a lower micro-channel heat sink 22. Wherein, the upper microchannel heat sink 21 and the lower microchannel heat sink 22 are microchannel heat sinks with the same structure; the upper and lower radiating surfaces of the laser slab crystal 1 are respectively combined with the bottom heat absorbing surfaces of the upper micro-channel radiator 21 and the lower micro-channel radiator 22.
Preferably, a single-side microchannel heat sink is taken as an example for explanation: the microchannel heat sink has a two-layer structure, and specifically may include: microchannel layer 3 and cover plate layer 4. Wherein, the bottom surface of the micro-channel layer 3 is a heat absorption surface and is combined with the laser slab crystal 1; a micro-channel structure 5 is arranged in the micro-channel layer 3; the cover plate layer 4 is tightly matched with the microchannel layer 3 and provides an inlet and outlet channel of fluid working medium for the microchannel layer 3.
In the embodiment, the middle part of the cover plate layer 4 is provided with a fluid working medium inlet 6 and an inlet header 7, and the fluid working medium inlet 6 is communicated with the microchannel structure 5 through the inlet header 7; that is, the fluid working medium enters the microchannel radiator from the fluid working medium inlet 6, and enters the middle part of the microchannel structure 5 through the inlet header 7, and the middle part is a concentrated heat dissipation area of the laser slab crystal 1.
Furthermore, a fluid working medium outlet A8, a fluid working medium outlet B9, an outlet header A10 and an outlet header B11 are symmetrically arranged on two sides of the cover plate layer 4, the fluid working medium outlet A8 is communicated with the microchannel structure 5 through the outlet header A10, and the fluid working medium outlet B9 is communicated with the microchannel structure 5 through the outlet header B11.
Therefore, in the embodiment, the fluid working medium forms a vertical direct-impact cooling mode for the concentrated heat dissipation area, and has better heat carrying capacity. After the concentrated heat dissipation area is washed by the fluid working medium, the fluid working medium flows to the two ends of the microchannel layer 3 through the microchannel structure 5, is collected to the outlet header A10 and the outlet header B11, and then flows out of the microchannel heat sink through the fluid working medium outlets A8 and the fluid working medium outlets B9 which are symmetrically arranged on the two sides of the cover plate layer 4.
Furthermore, fluid working medium inlet 6, fluid working medium outlet A8 and fluid working medium outlet B9 are respectively arranged on the flange of cover plate layer 4, so that the overall weight of cover plate layer 4 can be reduced.
In this embodiment, the microchannel structure 5 is provided with fluid collection grooves 12 at both ends. Wherein, the fluid working medium outlet A8 and the fluid working medium outlet B9 are respectively and directly communicated with the fluid collecting grooves 12 at the two ends of the micro-channel structure 5. It can be seen that, with the addition of the fluid collection groove 12, the fluid outlet A8 and the fluid outlet B9 on the cover plate layer 4 are in direct communication with the fluid collection groove 12 on the microchannel structure 5. The fluid collection tank 12 also facilitates the fabrication of the microchannel structure 5.
In this embodiment, the microchannel structure 5 may be a rectangular microchannel, and the cross-sectional aspect ratio may be: 1: 1-1: 20; the micro-channel structure 5 can also be a trapezoid, a triangle, an arc and other special-shaped micro-channels, and the equivalent length-width ratio of the cross section can be: 1: 1-1: 20; the micro-channel structures 5 have the same trend (can be in the form of parallel straight lines, curved lines or broken lines), and the spacing can be uniformly or non-uniformly arranged; the length of the micro-channel structure 5 can be 1-10 times of the width of the laser slab crystal 1 in the same direction.
In this embodiment, the matching contact surface between the microchannel layer 3 and the cover plate layer 4 is a flat surface, and an integral structure is formed by adopting a material spreading welding sealing mode or a bonding sealing mode between layers, so that the heat transfer effect between the layers is good, and the overall heat dissipation power is high.
In this embodiment, a snap groove may be provided on the mating interface between the microchannel layer 3 and the cover sheet layer 4 for positioning, welding and sealing between the two layers. Wherein, the sub-groove 13 is arranged on the microchannel layer 3, and the mother groove 14 is arranged on the cover plate layer 4; or the mother groove 14 is provided on the microchannel layer 3 and the daughter groove 13 is provided on the cover plate layer 4.
In the embodiment, the side extension section of the microchannel layer 3 forms a side lug structure 15, and a bolt hole is formed on the side lug structure 15, so that the upper and lower microchannel radiators and the laser slab crystal 1 are integrally reinforced after being bonded.
In summary, the invention discloses a direct-punching cooling type micro-channel radiator for a laser crystal, which adopts an upper micro-channel radiator and a lower micro-channel radiator with the same structure to radiate heat at the upper side and the lower side of the laser slab crystal. The fluid working medium inlet on the cover plate layer is arranged in the middle, the fluid working medium enters the microchannel radiator and then vertically washes the position of the laser slab crystal at a high speed, the laser slab crystal is rapidly cooled in the concentrated heat dissipation area, the fluid working medium vertically washes the liquid and then flows to the two sides of the microchannel structure, and the flowing turning has good turbulence disturbance, so that the direct washing area has a high local heat transfer coefficient. Meanwhile, due to the rapid heat exchange characteristic of direct-flushing cooling, the temperature difference of the surface of the laser slab crystal in contact with the bottom surface of the microchannel layer is reduced, and the bottom surface of the microchannel radiator and the surface of the laser slab crystal have better temperature uniformity.
Although the present invention has been described with reference to the preferred embodiments, it is not intended to limit the present invention, and those skilled in the art can make variations and modifications of the present invention without departing from the spirit and scope of the present invention by using the methods and technical contents disclosed above.
Those skilled in the art will appreciate that the invention may be practiced without these specific details.
Claims (7)
1. The utility model provides a laser crystal direct-flushing cooled microchannel radiator which characterized in that includes: the device comprises a laser slab crystal (1), an upper micro-channel radiator (21) and a lower micro-channel radiator (22);
the upper micro-channel radiator (21) and the lower micro-channel radiator (22) are micro-channel radiators with the same structure; the upper and lower radiating surfaces of the laser slab crystal (1) are respectively combined with the bottom heat absorbing surfaces of an upper micro-channel radiator (21) and a lower micro-channel radiator (22);
the unilateral microchannel radiator is a two-layer structure, including: a microchannel layer (3) and a cover plate layer (4); wherein the bottom surface of the micro-channel layer (3) is a heat absorption surface and is combined with the laser slab crystal (1); a micro-channel structure (5) is arranged in the micro-channel layer (3); the cover plate layer (4) is tightly matched with the microchannel layer (3) and provides an inlet and outlet channel of fluid working medium for the microchannel layer (3); the middle part of the cover plate layer (4) is provided with a fluid working medium inlet (6) and an inlet header (7); a fluid working medium outlet A (8), a fluid working medium outlet B (9), an outlet header A (10) and an outlet header B (11) are symmetrically arranged on two sides of the cover plate layer (4); the fluid working medium inlet (6) is communicated with the micro-channel structure (5) through an inlet header (7); the fluid working medium outlet A (8) is communicated with the micro-channel structure (5) through an outlet header A (10); the fluid working medium outlet B (9) is communicated with the micro-channel structure (5) through an outlet header B (11); fluid collecting grooves (12) are arranged at two ends of the micro-channel structure (5); the fluid working medium outlet A (8) and the fluid working medium outlet B (9) are respectively and directly communicated with the fluid collecting grooves (12) at the two ends of the micro-channel structure (5);
fluid working medium enters the microchannel radiator from the middle part of the cover plate layer, and directly impacts and quickly cools the laser lath crystal concentrated heat dissipation area on the bottom surface of the microchannel layer at a high speed, and meanwhile, the microchannel structure strengthens the heat transfer of the fluid working medium; after entering the microchannel layer, the fluid working medium flows to two sides along the microchannel, and takes away the heat diffused by the laser slab crystal on the bottom surface to weaken the temperature distribution difference between the microchannel layer and the surface of the laser slab crystal; the upper and lower micro-channel radiators work together to absorb heat at the upper and lower sides of the laser slab crystal.
2. The laser crystal direct-impingement cooled microchannel heat sink according to claim 1, wherein the cross-sectional aspect ratio of the microchannel structure (5) is: 1:1 to 1: 20.
3. The laser crystal direct-impact cooling type micro-channel heat sink according to claim 1, wherein the length of the micro-channel structure (5) is 1-10 times the width of the laser slab crystal (1) in the same direction.
4. The laser crystal direct-impingement cooling microchannel heat sink of claim 1, wherein the fluid working medium inlet (6), the fluid working medium outlet a (8), and the fluid working medium outlet B (9) are respectively disposed on a flange of the cover plate layer (4) to reduce the overall weight of the cover plate layer (4).
5. The laser crystal direct-punching cooling type microchannel heat sink according to claim 1, wherein the matching contact surface between the microchannel layer (3) and the cover plate layer (4) is a flat surface, and a material spreading welding sealing mode or a bonding sealing mode is adopted between the layers to form an integrated structure.
6. The laser crystal direct-punching cooling type micro-channel radiator according to claim 1, wherein a primary-secondary groove is arranged on the matching contact surface between the micro-channel layer (3) and the cover plate layer (4) and is used for positioning, welding and sealing the two layers; wherein, the sub-groove (13) is arranged on the micro-channel layer (3), and the mother groove (14) is arranged on the cover plate layer (4); or the mother groove (14) is arranged on the micro-channel layer (3), and the son groove (13) is arranged on the cover plate layer (4).
7. The direct-flushing cooling type micro-channel heat sink for the laser crystal according to claim 1, wherein the side extension section of the micro-channel layer (3) forms a side lug structure (15), and bolt holes are formed in the side lug structure (15) for integral reinforcement after the upper and lower micro-channel heat sinks are bonded with the laser slab crystal (1).
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| CN114188803A (en) * | 2021-12-15 | 2022-03-15 | 中国科学院空天信息创新研究院 | Liquid cooling device for large-size slab laser crystal |
| CN114583532B (en) * | 2022-05-05 | 2022-08-05 | 中国工程物理研究院应用电子学研究所 | Thin-sheet laser crystal cooling device and laser |
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| US7472741B2 (en) * | 2005-02-09 | 2009-01-06 | Raytheon Company | Foil slot impingement cooler with effective light-trap cavities |
| CN101640365B (en) * | 2009-08-25 | 2011-05-04 | 武汉工程大学 | Microchannel cooling device at end of high-power optical fiber laser |
| CN104078824B (en) * | 2014-07-22 | 2017-04-26 | 哈尔滨工业大学（威海） | Full-cavity water-cooling solid laser |
| US20170373457A1 (en) * | 2016-06-23 | 2017-12-28 | Lawrence Livermore National Security, Llc | Waveguide for diode-pumped alkali lasers |
| CN110233412A (en) * | 2019-07-04 | 2019-09-13 | 中国电子科技集团公司第十一研究所 | A kind of the slab laser gain module and laser amplifier system of aperture extension |
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| CN102163788A (en) * | 2010-02-24 | 2011-08-24 | 北京中科光睿科技有限责任公司 | Microstructural composite phase-transition cooling integrated system for high-power slab laser |
| CN106785823A (en) * | 2017-03-24 | 2017-05-31 | 武汉大学 | A kind of disturbed flow type microchannel heat sink for high-capacity optical fiber laser |
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