CN113224626A - Plate-fin combined radiator - Google Patents

Abstract

The invention provides a plate-fin combined radiator, comprising: the heat superconducting plate comprises a heat superconducting plate, a heat radiating fin, a bottom substrate parting bead, a top substrate parting bead and a bottom cavity, wherein the bottom cavity comprises a bottom cavity main body, a containing groove and a working medium filling port, a power device is arranged at the bottom of the bottom cavity main body, the containing groove is located in the bottom cavity main body, and the working medium filling port is located in one side face of the bottom cavity main body, penetrates through the side face of the bottom cavity main body, is communicated with the containing groove and is used for filling heat transfer working medium in the containing groove. The plate-fin combined radiator inhibits heat transfer by means of phase change of a heat transfer working medium, improves heat transfer efficiency, forms a heat superconducting characteristic of rapid heat conduction, rapidly diffuses high-density heat generated by a power device at the bottom of a bottom cavity to the whole radiator, and finally diffuses the heat into air through the radiating fins.

Description

Plate-fin combined radiator

Technical Field

The invention belongs to the technical field of heat transfer, and particularly relates to a plate-fin combined radiator.

Background

Along with the rapid development of laser technology, the integration level of high-power components is higher and higher, the power density is higher and higher, the heat generated during working is larger and larger, if the heat generated by the power device cannot be dissipated quickly in time, the temperature of a chip in the power device is increased, the working efficiency is reduced, the service life is shortened, and the device is damaged and fails. Therefore, a heat sink capable of dissipating heat efficiently is needed to solve the heat dissipation problem of the high power device.

The heat dissipation mode of the laser module has two types: air cooling and water cooling. Because the fin efficiency of the traditional air cooling radiating fin is low, the heat diffusion performance is poor, and the radiating requirement of a high-heat-flow-density high-power module cannot be met. Therefore, the water cooling heat dissipation is basically selected for the high-power laser module at present, and the water cooling noise is smaller than the air cooling, and the water cooling temperature control is more accurate than the air cooling, so that the requirements of different power optical fiber lasers, ultraviolet lasers and CO can be met₂The cooling of radio frequency ware module, nevertheless adopt the water-cooling heat dissipation to need supporting bulky, the heavy cooling water set of weight, consequently, the water-cooling radiator has the system complicacy, with high costs and occupy great space scheduling problem to have a plurality of connectors in the system, easy weeping causes the system safety problem.

Disclosure of Invention

In view of the above disadvantages of the prior art, the present invention aims to provide a plate-fin combined heat sink, which is used to solve the problems that the laser heat sink in the prior art has low heat dissipation efficiency of an air-cooled heat sink and cannot meet the heat dissipation requirement of a high-density heat-concentrating high-power module, and the problems that the heat dissipation system of a water-cooled heat sink is complex, large in size, heavy in weight, high in cost, and easy to leak liquid to damage the system safety.

To achieve the above and other related objects, the present invention provides a plate-fin unit radiator, comprising:

the heat superconducting plate is internally provided with a plurality of heat transfer channels which are communicated with each other;

the heat dissipation fins are in a plate shape with a plurality of bends and are attached to two opposite surfaces of the heat superconducting plate, a plurality of bends of the heat dissipation fins form heat dissipation channels which correspondingly extend horizontally, and the heat dissipation channels are arranged at intervals along the vertical direction;

the bottom substrate parting bead is attached to the bottom of the radiating fin;

the top substrate parting bead is attached to the top of the radiating fin;

the bottom cavity is located a plurality of heat superconducting plates and a plurality of bottoms of bottom base plate parting beads, and the bottom cavity includes bottom cavity main part, holding tank and working medium filling mouth, wherein, power device is equipped with to the bottom of bottom cavity main part, the holding tank is located in the bottom cavity main part, working medium filling mouth is located a bottom cavity main part side, runs through the side of bottom cavity main part, and with the holding tank intercommunication, be used for to the holding tank intussuseption is filled with heat transfer working medium.

Optionally, the plate-fin modular heat sink comprises: the heat superconducting plates and the radiating fins are alternately stacked, and the outermost two sides of the stacked structure are the radiating fins.

Optionally, the plate-fin combined heat sink further includes a reinforcing plate, and the reinforcing plate is attached to the surfaces of the outermost two sides of the heat dissipation fins, which are far away from the heat superconducting plate.

Optionally, the heat dissipation fins extend in a square wave shape, a zigzag shape or a corrugated shape along the vertical direction.

Optionally, the bottom substrate parting bead and the top substrate parting bead are located between adjacent heat superconducting plates, or between the reinforcing plate and the heat superconducting plate adjacent to the reinforcing plate, and are closely attached to the heat superconducting plate or the surface of the reinforcing plate.

Optionally, the heat superconducting plate comprises: the air conditioner comprises a first cover plate, a second cover plate, a peripheral frame and at least one guide plate; wherein the content of the first and second substances,

the first cover plate is attached to one surface of the peripheral frame, the second cover plate is attached to the surface, away from the first cover plate, of the peripheral frame, and the peripheral frame is composed of three frames, so that a cavity with an opening only at the bottom is formed among the first cover plate, the second cover plate and the peripheral frame;

the baffle is positioned in the cavity; the guide plate comprises a plurality of convex parts which are arranged at intervals in the horizontal direction and extend in the vertical direction, the bottoms of the convex parts which are adjacent to each other in the horizontal direction are integrally connected, and gaps are reserved between the inner sides of the convex parts and the adjacent convex parts, so that the heat transfer channel is formed between the guide plate and the first cover plate and between the guide plate and the second cover plate.

Optionally, a reserved gap of at least 2mm is formed between the top edge of the guide plate and the inner surface of the top of the peripheral frame; the bottom edge of the guide plate is exposed by more than 3mm relative to the lower edge of the bottom substrate parting strip.

Optionally, the length of the deflector in the horizontal direction is the same as the length of the inner side of the peripheral frame in the horizontal direction.

Optionally, the bottom chamber further comprises:

the enhanced heat transfer convex parts are positioned on the bottom surface in the accommodating groove, are arranged in order transversely and longitudinally and are integrally formed with the bottom surface of the accommodating groove;

the lug parts are positioned on the inner side surfaces of two edges of the accommodating groove along the length direction, are regularly arranged at intervals along the length direction, and are integrally formed with the bottom cavity main body;

the bottom supporting blocks are positioned on the bottom surface in the accommodating groove, distributed on two sides of the accommodating groove along the length direction, regularly arranged at intervals along the length direction of the accommodating groove, and provided with gaps with certain intervals with the enhanced heat transfer convex parts and the lug parts; the bottom support block comprises a first step and a second step, and the second step is higher than the first step.

Optionally, the shape of the heat transfer enhancement convex part is a square block shape or a sawtooth shape.

Optionally, a porous capillary structure formed by sintering aluminum powder is arranged between the heat transfer enhancement convex parts.

Optionally, a closed cavity is formed among the plurality of bottom substrate parting beads, the plurality of heat superconducting plates and the bottom cavity, the closed cavity is the accommodating groove and the heat transfer channel which are communicated with each other, and a heat transfer working medium is arranged in the closed cavity.

Optionally, a height difference between the second step and the first step is greater than 3mm, the heat superconducting plates attached to the outermost sides of the heat dissipation fins are located on the same side between the bump portions and the second step, the bump portions and vertical edges of the bottom cavity main body are used for supporting the bottom substrate parting beads and the heat superconducting plates.

As described above, the plate-fin combined heat sink of the present invention has the following beneficial effects:

1. the closed cavity formed by the bottom substrate parting beads, the heat superconducting plates and the bottom cavity is filled with heat transfer working medium, the heat superconducting plates and the bottom cavity inhibit heat transfer by means of phase change or phase change of the heat transfer working medium, heat transfer efficiency is improved, a heat superconducting characteristic of rapid heat conduction is formed, high-density heat generated by a power device at the bottom of the bottom cavity is rapidly diffused to the whole radiator, and the temperature of the whole heat superconducting plate is uniform.

2. Radiating fins are welded on two sides of the heat superconducting plate, and the radiating fins can quickly radiate heat conducted by the heat superconducting plate into the air, so that the heat transfer efficiency of the heat superconducting plate is further improved, and the requirement that the temperature rise of a heat source is within the range of 5 ℃ is met. The radiating fins increase the heat exchange area with air, reduce the thermal resistance of the system and improve the radiating capacity of the system. In addition, the combination of the heat radiating fins and the heat superconducting plate not only can reduce the thickness of the heat superconducting plate, but also saves the cost, so that the combination has lighter weight.

3. The accommodating groove in the bottom cavity can be used as a buffer and storage area of the heat transfer working medium, the distribution of the heat transfer working medium is balanced, and the heat transfer working medium can be communicated with the heat superconducting plate, so that the heat transfer working medium can directly transfer heat between the accommodating groove and the heat superconducting plate.

4. The bottom cavity is provided with a plurality of enhanced heat transfer convex parts, which can increase the heating area of the heat transfer working medium, thereby achieving the effects of enhancing heat transfer, reducing thermal resistance and improving the heat dissipation efficiency of the radiator. In addition, the porous capillary structure formed by sintering the aluminum powder can not only strengthen the boiling heat transfer of the heat transfer working medium, reduce the thermal resistance and increase the heat conduction capability, but also ensure that the heat transfer working medium is uniformly distributed in the holding tank and reduce the occurrence probability of the local dry wall phenomenon under high heat dissipation power.

5. The guide plate in the heat superconducting plate is welded with the first cover plate and the second cover plate together to play a role in reinforcement, the strength and the bearing capacity of the whole heat superconducting plate are improved, the cover plates on two sides can be thinned, and therefore the weight of the heat superconducting plate is reduced.

6. The guide plate in the heat superconducting plate is provided with a plurality of convex parts, so that the guide plate has a larger contact area with a heat transfer working medium, the welding area of the guide plate and the cover plates on two sides is increased, on one hand, the heat conduction efficiency of heat superconductivity is improved, on the other hand, the strength of the superconducting plate is further increased, and the superconducting plate has stronger deformation resistance.

7. A gap of at least 2mm is reserved between the top edge of the guide plate and the inner surface of the top of the peripheral frame, so that the upper parts of the heat transfer channels are communicated with each other, heat transfer working media can conveniently circulate mutually, and the heat transfer is more uniform; the edge of the bottom of the guide plate is exposed by more than 3mm relative to the lower edge of the first substrate parting bead, so that heat transfer working media can enter the heat superconducting plate more easily, and the reliability and the heat conduction capability of the radiator are improved.

Drawings

Fig. 1 is an exploded view of a plate-fin modular heat sink according to an embodiment of the present invention.

Fig. 2 is an enlarged schematic view of the area a in fig. 1.

Fig. 3 is a schematic side sectional view illustrating a plate-fin heat sink assembly according to an embodiment of the present invention.

Fig. 4 is a schematic front sectional view illustrating a plate-fin heat sink assembly according to an embodiment of the present invention.

Fig. 5 is a schematic side sectional view of a bottom cavity with square-shaped enhanced heat transfer protrusions in a plate-fin heat spreader according to an embodiment of the present invention.

Fig. 6 is a schematic side sectional view illustrating a bottom cavity of a plate-fin heat spreader having serrated enhanced heat transfer protrusions according to an embodiment of the present invention.

Fig. 7 is a schematic side sectional view of a bottom cavity having square-shaped enhanced heat transfer protrusions and a porous capillary structure in a plate-fin heat spreader according to an embodiment of the present invention.

Fig. 8 is a schematic side sectional view of a bottom cavity having serrated enhanced heat transfer protrusions and provided with a porous capillary structure in a plate-fin heat spreader according to an embodiment of the present invention.

Fig. 9 is a schematic structural diagram of a mounting plate in a plate-fin modular heat sink provided in an embodiment of the present invention.

Description of the element reference numerals

10 heat superconducting plate

101 first cover plate

102 second cover plate

103 peripheral frame

104 guide plate

105 reserved gap

20 radiating fin

31 bottom base plate parting bead

32 Top substrate parting bead

40 reinforcing plate

50 bottom chamber

501 bottom cavity body

502 holding tank

503 enhanced heat transfer protrusions

504 working medium filling opening

505 bump portion

506 bottom support block

5061 first stage

5062 second stage

507 porous capillary structure

60 power device

70 mounting plate

701 installation control module area

Detailed Description

The embodiments of the present invention are described below with reference to specific embodiments, and other advantages and effects of the present invention will be easily understood by those skilled in the art from the disclosure of the present specification. The invention is capable of other and different embodiments and of being practiced or of being carried out in various ways, and its several details are capable of modification in various respects, all without departing from the spirit and scope of the present invention.

It should be noted that the drawings provided in the present embodiment are only for illustrating the basic idea of the present invention, and although the drawings only show the components related to the present invention and are not drawn according to the number, shape and size of the components in actual implementation, the form, quantity, position relationship and proportion of the components in actual implementation can be changed freely on the premise of implementing the technical solution of the present invention, and the layout form of the components may be more complicated.

Referring to fig. 1 and 2, the present invention provides a plate-fin assembly type heat sink, which includes: a heat superconducting plate 10, in which a plurality of heat transfer channels (not shown) are formed in the heat superconducting plate 10 to communicate with each other; the heat dissipation fins 20 are plate-shaped and are provided with a plurality of bends, and are attached to two opposite surfaces of the heat superconducting plate 10, a plurality of bends of the heat dissipation fins 20 form heat dissipation channels extending horizontally correspondingly, and the heat dissipation channels are arranged at intervals along the vertical direction; a bottom substrate division bar 31 attached to the bottom of the heat dissipation fin 20; a top substrate division bar 32 attached to the top of the heat dissipation fins 20; the bottom cavity 50 is located at the bottoms of the plurality of heat superconducting plates 10 and the plurality of bottom substrate parting beads 31, the bottom cavity 50 comprises a bottom cavity main body 501, a containing groove 502 and a working medium filling port 504, wherein a power device 60 (namely a heat source) is installed at the bottom of the bottom cavity main body 501, the containing groove 502 is located in the bottom cavity main body 501, and the working medium filling port 504 is located on one side surface of the bottom cavity main body 501, penetrates through the side surface of the bottom cavity main body 501, is communicated with the containing groove 502 and is used for filling heat transfer working medium in the containing groove 502. The bottom cavity 50 is in direct contact with the power device 60, a heat transfer working medium is filled into the accommodating groove 502 of the bottom cavity 50 through a working medium filling port 504, and the accommodating groove 502 is communicated with the heat superconducting plate 10, so that the heat transfer working medium can generate phase change inhibition between the bottom cavity 50 and the heat superconducting plate 10, and the heat generated by the power device 60 can be rapidly diffused through the radiating fins 20.

The working process of the plate-fin combined radiator comprises the following steps: the power device 60 generates heat when working, because the power device 60 is in direct contact with the bottom cavity 50, the heat can be rapidly transmitted to the heat transfer working medium in the accommodating groove 502 through the bottom cavity 50, the heat transfer working medium in the accommodating groove 502 is heated and evaporated and enters the heat transfer channel in the heat superconducting plate 10 for heat transfer, the gaseous heat transfer working medium is condensed in the heat transfer process, the heat is rapidly transmitted to the whole surface of the heat superconducting plate 10 through the heat transfer working medium, and finally the heat is dissipated to the outside air through the heat dissipation channel of the heat dissipation fin 20. On the other hand, the condensed heat transfer working medium liquid flows back to the bottom cavity 50 by gravity, and the next evaporation-condensation heat transfer cycle is started.

As an example, as shown in fig. 1 and 2, the heat superconducting plate 10 includes: a first cover plate 101, a second cover plate 102, a peripheral frame 103 and at least one guide plate 104; the first cover plate 101 is attached to a surface of the peripheral frame 103, the second cover plate 102 is attached to a surface of the peripheral frame 103 away from the first cover plate 101, and the peripheral frame 103 is a three-sided frame, so that a cavity with only a bottom opening is formed among the first cover plate 101, the second cover plate 102 and the peripheral frame 103; the baffle 104 is located within the cavity; the flow guiding plate 104 comprises a plurality of protrusions (not shown) which are arranged at intervals along the horizontal direction and extend along the vertical direction, the bottoms of the adjacent protrusions in the horizontal direction are integrally connected, and gaps are arranged between the inner sides of the protrusions and the adjacent protrusions, so that the heat transfer channel is formed between the flow guiding plate 104 and the first cover plate 101 and the second cover plate 102; the heat transfer channel realizes the high-efficiency heat transfer of heat superconductivity through the evaporation and condensation phase change of the heat transfer working medium. It should be noted that the horizontal direction may be a length direction of the guide plate 104, and then the vertical direction is a width direction of the guide plate 104; the horizontal direction may be a width direction of the baffle 104, and then the vertical direction is a length direction of the baffle 104.

Specifically, the first cover plate 101, the second cover plate 102, the peripheral frame 103, and at least one of the guide plates 104 are welded together by a welding process, and the heat superconducting plate 10 is open only at the bottom and the rest is hermetically welded. Optionally, the number of the flow guide plates 104 is multiple, a plurality of the flow guide plates 104 may be arranged in the vertical direction, and a gap is formed between adjacent flow guide plates 104, so that the fluidity of the heat transfer working medium is enhanced, and the heat transfer efficiency is improved.

As an example, as shown in fig. 3 and 4, a reserved gap 105 of at least 2mm is formed between the top edge of the flow guide plate 104 and the inner surface of the top of the peripheral frame 103, so that the tops of the heat transfer channels are communicated with each other, thereby facilitating the mutual circulation of heat transfer working mediums and making the heat transfer more uniform; the bottom edge of the guide plate 104 is exposed by more than 3mm relative to the lower edge of the bottom substrate parting bead 31, so that heat transfer working media can enter the heat superconducting plate 10 more easily, and the reliability and the heat conduction capability of the radiator are improved. The length of the guide plate 104 in the horizontal direction is the same as the length of the inner side of the peripheral frame 103 in the horizontal direction, and the width of the guide plate 104 in the horizontal direction is the same as the width of the inner side of the peripheral frame 103 in the horizontal direction.

As an example, a plurality of heat superconducting plates 10 and a plurality of heat dissipating fins 20 are alternately stacked in multiple layers, and the outermost sides of the stacked structure are both the heat dissipating fins 20, so that the heat superconducting plates 10 are provided with the heat dissipating fins 20 on both sides, which can make the system heat dissipation more efficient. A plurality of the heat superconducting plates 10 and a plurality of the heat radiating fins 20 are combined together by a welding process. In addition, a plurality of bottom substrate division bars 31 and a plurality of top substrate division bars 32 which are arranged corresponding to the bottom substrate division bars vertically are also welded and fixed to the heat superconducting plate 10.

As an example, referring to fig. 1 and 4, the plate-fin combination heat sink further includes a reinforcing plate 40, where the reinforcing plate 40 is welded to the surface of the heat dissipation fins 20 away from the heat superconducting plate 10 on the outermost sides, that is, a plurality of heat superconducting plates 10 and a plurality of heat dissipation fins 20 are alternately stacked between the reinforcing plates 40. The height of the reinforcing plate 40 is not less than the height difference between the bottom substrate partitions 31 and the top substrate partitions 32 corresponding to the bottom substrate partitions, and the thickness of the reinforcing plate 40 may be greater than the thickness of the heat superconducting plate 10. The reinforcing plate 40 is used for increasing the strength of the radiator, so that the radiator has stronger deformation resistance.

As an example, the heat dissipation fin 20 has a plurality of bending portions, which may extend in a square wave shape, a zigzag shape or a corrugated shape along the vertical direction, and form a corresponding heat dissipation channel extending along the horizontal direction. The heat dissipating fin 20 extends in a square wave shape, a zigzag shape, or a wave shape in a vertical direction, so that the surface area of the heat dissipating fin 20 can be further increased in a limited spatial range, thereby enhancing the heat dissipating effect.

As an example, referring to fig. 1 and fig. 4, the heat dissipation fins 20 are located between the upper and lower bottom substrate partitions 31 and the top substrate partitions 32, the upper surfaces of the bottom substrate partitions 31 are closely attached to the bottoms of the heat dissipation fins 20, and the lower surfaces of the top substrate partitions 32 are closely attached to the tops of the heat dissipation fins 20. Specifically, the heat dissipation fins 20 are combined with the bottom substrate division bars 31 and the top substrate division bars 32 by welding. The bottom substrate parting beads 31 and the top substrate parting beads 32 are arranged in a one-to-one up-down correspondence, and the bottom substrate parting beads 31 are parallel to the top substrate parting beads 32. The length of the bottom substrate parting strip 31 is equal to the length of the top substrate parting strip 32, and can also be equal to the length of the heat dissipation fin 20 along the horizontal direction; the width of the bottom substrate division bar 31 is equal to the width of the top substrate division bar 32, and may also be equal to the width of the heat dissipation fin 20 in the horizontal direction.

As an example, the heat radiation fin 20 may be located between the left and right adjacent heat superconducting plates 10, and welded and fixed to the surfaces of the adjacent heat superconducting plates 10. The width of the heat dissipation fins 20 in the horizontal direction is equal to the distance between the adjacent heat superconducting plates 10; the heat radiation fin 20 may be further located between the reinforcing plate 40 and the heat superconducting plate 10 adjacent thereto, and welded and fixed to the surface of the reinforcing plate 40 and the surface of the heat superconducting plate 10 adjacent thereto. The width of the heat radiation fin 20 in the horizontal direction is equal to the distance between the reinforcing plate 40 and the heat superconducting plate 10 adjacent thereto.

As an example, the bottom substrate spacing bars 31 and the top substrate spacing bars 32 may be located between adjacent heat superconducting plates 10 and welded and fixed to the surface of the superconducting plates 10. The widths of the bottom substrate parting beads 31 and the top substrate parting beads 32 are equal to the spacing between adjacent heat superconducting plates 10, so that the bottom substrate parting beads 31 and the top substrate parting beads 32 can be closely attached to the surfaces of the adjacent heat superconducting plates 10; the bottom substrate spacers 31 and the top substrate spacers 32 may be further located between the reinforcing plate 40 and the heat superconducting plate 10 adjacent thereto, and are welded and fixed to the surface of the reinforcing plate 40 and the surface of the heat superconducting plate 10 adjacent thereto. The widths of the bottom substrate spacers 31 and the top substrate spacers 32 are equal to the spacing between the stiffener 40 and the heat superconducting plate 10 adjacent thereto, so that the bottom substrate spacers 31 and the top substrate spacers 32 can be closely attached to the surface of the stiffener 40 and the surface of the heat superconducting plate 10.

As an example, referring to fig. 1, the bottom cavity 50 is welded to the bottoms of the heat superconducting plates 10, the bottom substrate spacers 31, and the reinforcing plate 40, and the bottom cavity 50 further includes: a plurality of heat transfer enhancing protrusions 503 which are disposed on the bottom surface of the accommodating groove 502, aligned in the horizontal and vertical directions, and formed integrally with the bottom surface of the accommodating groove; the bump parts 505 are positioned on the inner side surfaces of the two edges of the accommodating groove 502 in the length direction, are regularly arranged at intervals in the length direction, and are integrally formed with the bottom cavity main body 501; the bottom supporting blocks 506 are located on the bottom surface of the accommodating groove 502, distributed on two sides of the accommodating groove 502 in the length direction, regularly arranged at intervals in the length direction of the accommodating groove 502, and spaced from the enhanced heat transfer convex part 503 and the bump part 505; the bottom support block 506 includes a first stage 5061 and a second stage 5062, the second stage 5062 being higher than the first stage 5061.

As an example, referring to fig. 1, 3 and 4, the length direction of the bottom cavity main body 501 is consistent with the length direction of the bottom substrate parting strip 31 and is also consistent with the horizontal length direction of the heat superconducting plate 10; the width direction of the bottom cavity main body 501 is the direction in which the heat dissipation fins 20 and the heat superconducting plates 10 are alternately arranged.

As an example, referring to fig. 1 to 4, since the accommodating groove 502 is formed in the bottom cavity main body 501, the bottom of the heat superconducting plate 10 is open, and the heat transfer channel is formed inside, so that the bottom cavity main body 501, the bottom substrate spacers 31, and the heat superconducting plates 10 are welded and combined to form a closed chamber, the closed chamber is the accommodating groove 502 and the heat transfer channel which are communicated with each other, a heat transfer working medium is filled in the closed chamber through the working medium filling port 504, the heat transfer working medium circulates between the bottom cavity 50 and the heat superconducting plate 10, and the heat transfer working medium flows through the process and undergoes phase change heat transfer.

The heat superconducting heat transfer technology comprises a heat pipe technology of filling working media in a closed mutually communicated micro-channel system and realizing heat superconducting heat transfer through evaporation and condensation phase change of the working media; and the phase change suppression (PCI) heat transfer technology for realizing high-efficiency heat transfer by controlling the microstructure state of the working medium in a closed system, namely, in the heat transfer process, the boiling of the liquid medium (or the condensation of the gaseous medium) is suppressed, and the consistency of the microstructure of the working medium is achieved on the basis. In this embodiment, the heat superconducting plate 10 may be a phase change suppression heat dissipation plate, and at this time, the heat transfer working medium in the heat superconducting plate 10 is suppressed from boiling or condensing during the heat transfer process, and on this basis, the consistency of the microstructure of the working medium is achieved to realize heat transfer. In this embodiment, the heat superconducting plate 10 may also be a heat pipe heat transfer plate, and at this time, the heat transfer working medium in the heat superconducting plate 10 continuously performs a phase change cycle of evaporation heat absorption and condensation heat release in the heat transfer process to realize rapid heat transfer. Specifically, the heat transfer working medium is a fluid, preferably, the heat transfer working medium may be a gas or a liquid or a mixture of a gas and a liquid, and more preferably, the heat transfer working medium is a mixture of a liquid and a gas.

As an example, referring to fig. 1, 5 and 6, the thermal enhancement protrusions 503 are regularly arranged in a certain area of the accommodating groove 502, and the height of the thermal enhancement protrusions 503 does not exceed the depth of the accommodating groove 502. The shape of the heat transfer enhancement convex part can be a square block shape or a sawtooth shape. It should be noted that, in other embodiments, the heat transfer enhancement protrusion 503 may be adjusted as needed as long as the heat transfer enhancement is satisfied, and the protection scope of the present invention should not be limited too much herein. The enhanced heat transfer convex part 503 can increase the heating area of the bottom cavity main body 501, and can also increase the contact area with the heat transfer working medium, so as to achieve the purposes of enhancing heat transfer, reducing thermal resistance and improving the heat dissipation power of the plate-fin combined radiator.

As an example, referring to fig. 7 and 8, a porous capillary structure 507 formed by sintering aluminum powder may be disposed between the enhanced heat transfer protrusions 503, and the porous capillary structure 507 is filled until the upper surface of the porous capillary structure is flush with the top ends of the enhanced heat transfer protrusions, so that the heat transfer working medium is uniformly distributed in the accommodating groove 502, and the occurrence probability of the local dry wall phenomenon under high heat dissipation power is reduced. In addition, the aluminum powder has good thermal conductivity, and the porous capillary structure 507 formed by sintering the aluminum powder can strengthen the boiling heat transfer of the heat transfer working medium, reduce the thermal resistance and increase the heat conduction capability.

As an example, the first stage 5061 and the second stage 5062 of the bottom support block 506 are integrally formed, a height difference between the second stage 5062 and the first stage 5061 is greater than 3mm, and the height difference is not less than a bottom exposed length of the flow guide plate 104, and the bump portion 505 and the second stage 5062 on the same side of the receiving groove 502 are spaced apart from each other in a width direction of the receiving groove 502 so that the flow guide plate 104 partially disposed in the heat superconducting plate 10 with the heat dissipating fins 20 disposed on the outermost sides thereof is disposed therein. The vertical edges of the second step 5062, the bump portion 505 and the bottom cavity body 501 are equal in height, and are used for supporting the bottom substrate parting strip 31 and the peripheral frame 103 of the heat superconducting plate and are fixed by a welding process. The bottom support block 506 increases the welding contact area of the bottom cavity 50, so that the plate-fin combined heat sink is more stable.

As an example, referring to fig. 1 and 9, the bottom of the bottom cavity 50 may be directly fixed in contact with the power device 60 by a fastener or a welding process, or a plate-shaped mounting plate 70 may be disposed at the bottom of the bottom cavity 50. Specifically, the mounting plate 70 is provided with a mounting control module region 701, and the power device 60 is fixed in the mounting control module region 701 through a fastener or a welding process.

The material of the plate-fin combined heat sink is selected from at least one of aluminum, copper alloy and aluminum alloy, and may be selected from other suitable heat conductive materials. The welding process used may be, but is not limited to, brazing, soldering.

In summary, the present invention provides a plate-fin combined heat sink, including: the heat superconducting plate is internally provided with a plurality of heat transfer channels which are communicated with each other; the heat dissipation fins are in a plate shape with a plurality of bends and are attached to two opposite surfaces of the heat superconducting plate, a plurality of bends of the heat dissipation fins form heat dissipation channels which correspondingly extend horizontally, and the heat dissipation channels are arranged at intervals along the vertical direction; the bottom substrate parting bead is attached to the bottom of the radiating fin; the top substrate parting bead is attached to the top of the radiating fin; the bottom cavity is located a plurality of heat superconducting plates and a plurality of bottoms of bottom base plate parting beads, and the bottom cavity includes bottom cavity main part, holding tank and working medium filling mouth, wherein, power device is equipped with to the bottom of bottom cavity main part, the holding tank is located in the bottom cavity main part, working medium filling mouth is located a bottom cavity main part side, runs through the side of bottom cavity main part, and with the holding tank intercommunication, be used for to the holding tank intussuseption is filled with heat transfer working medium. The plate-fin combined radiator has the following beneficial effects: 1. a closed cavity formed by the bottom substrate parting strips, the heat superconducting plates and the bottom cavity is filled with a heat transfer working medium, the heat superconducting plates and the bottom cavity inhibit heat transfer by virtue of phase change or phase change of the heat transfer working medium, the heat transfer efficiency is improved, the heat superconducting characteristic of quick heat conduction is formed, high-density heat generated by a power device at the bottom of the bottom cavity is quickly diffused to the whole radiator, and the temperature of the whole heat superconducting plate is uniform; 2. radiating fins are welded on two sides of the heat superconducting plate, and the radiating fins can quickly radiate heat conducted by the heat superconducting plate into the air, so that the heat transfer efficiency of the heat superconducting plate is further improved, and the requirement that the temperature rise of a heat source is within the range of 5 ℃ is met. The radiating fins increase the heat exchange area with air, reduce the thermal resistance of the system and improve the radiating capacity of the system. In addition, the combination of the heat radiating fins and the heat superconducting plate not only can reduce the thickness of the heat superconducting plate, but also saves the cost, so that the combination has lighter weight; 3. the accommodating groove in the bottom cavity can be used as a buffer and storage area of the heat transfer working medium, balance the distribution of the heat transfer working medium and be communicated with the heat superconducting plate, so that the heat transfer working medium can directly transfer heat between the accommodating groove and the heat superconducting plate; 4. the bottom cavity is provided with a plurality of enhanced heat transfer convex parts, which can increase the heating area of the heat transfer working medium, thereby achieving the effects of enhancing heat transfer, reducing thermal resistance and improving the heat dissipation efficiency of the radiator. In addition, the porous capillary structure formed by sintering the aluminum powder can not only strengthen the boiling heat transfer of the heat transfer working medium, reduce the thermal resistance and increase the heat conduction capability, but also ensure that the heat transfer working medium is uniformly distributed in the holding tank and reduce the occurrence probability of the local dry wall phenomenon under high heat dissipation power; 5. the guide plate in the heat superconducting plate is welded with the first cover plate and the second cover plate together to play a role in reinforcement, so that the strength and the bearing capacity of the whole heat superconducting plate are improved, the cover plates on two sides can be thinned, and the weight of the heat superconducting plate is reduced; 6. the guide plate in the heat superconducting plate is provided with a plurality of convex parts, so that the guide plate has a larger contact area with a heat transfer working medium, the welding area of the guide plate and the cover plates on two sides is increased, the heat conduction efficiency of the heat superconducting is improved on one hand, and the strength of the superconducting plate is further increased on the other hand, so that the superconducting plate has stronger deformation resistance; 7. a gap of at least 2mm is reserved between the top edge of the guide plate and the inner surface of the top of the peripheral frame, so that the upper parts of the heat transfer channels are communicated with each other, heat transfer working media can conveniently circulate mutually, and the heat transfer is more uniform; the edge of the bottom of the guide plate is exposed by more than 3mm relative to the lower edge of the first substrate parting bead, so that heat transfer working media can enter the heat superconducting plate more easily, and the reliability and the heat conduction capability of the radiator are improved.

The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.

Claims (13)

1. A plate-fin modular heat sink, comprising:

the heat superconducting plate is internally provided with a plurality of heat transfer channels which are communicated with each other;

the heat dissipation fins are in a plate shape with a plurality of bends and are attached to two opposite surfaces of the heat superconducting plate, a plurality of bends of the heat dissipation fins form heat dissipation channels which correspondingly extend horizontally, and the heat dissipation channels are arranged at intervals along the vertical direction;

the bottom substrate parting bead is attached to the bottom of the radiating fin;

the top substrate parting bead is attached to the top of the radiating fin;

the bottom cavity is located a plurality of heat superconducting plates and a plurality of bottoms of bottom base plate parting beads, and the bottom cavity includes bottom cavity main part, holding tank and working medium filling mouth, wherein, power device is equipped with to the bottom of bottom cavity main part, the holding tank is located in the bottom cavity main part, working medium filling mouth is located a bottom cavity main part side, runs through the side of bottom cavity main part, and with the holding tank intercommunication, be used for to the holding tank intussuseption is filled with heat transfer working medium.

2. The plate-fin unit radiator of claim 1, comprising: the heat superconducting plates and the radiating fins are alternately stacked, and the outermost two sides of the stacked structure are the radiating fins.

3. The plate-fin combination heat sink of claim 2, further comprising a stiffener plate attached to the outermost surface of the heat dissipating fins remote from the heat superconducting plate.

4. The plate-fin modular heat sink of claim 1, wherein the heat dissipating fins extend in a vertical direction in a square wave shape, a zigzag shape, or a corrugated shape.

5. The plate-fin modular heat sink of claim 1, wherein the bottom substrate spacer and the top substrate spacer are positioned between adjacent superconducting plates or between the stiffener and a neighboring superconducting plate and are in close proximity to the superconducting plates or the stiffener surface.

6. The plate-fin modular heat sink of claim 1, wherein the heat superconducting plate comprises: the air conditioner comprises a first cover plate, a second cover plate, a peripheral frame and at least one guide plate; wherein the content of the first and second substances,

the first cover plate is attached to one surface of the peripheral frame, the second cover plate is attached to the surface, away from the first cover plate, of the peripheral frame, and the peripheral frame is composed of three frames, so that a cavity with an opening only at the bottom is formed among the first cover plate, the second cover plate and the peripheral frame;

the baffle is positioned in the cavity; the guide plate comprises a plurality of convex parts which are arranged at intervals in the horizontal direction and extend in the vertical direction, the bottoms of the convex parts which are adjacent to each other in the horizontal direction are integrally connected, and gaps are reserved between the inner sides of the convex parts and the adjacent convex parts, so that the heat transfer channel is formed between the guide plate and the first cover plate and between the guide plate and the second cover plate.

7. The plate-fin modular heat sink of claim 6, wherein there is a clearance of at least 2mm between the top edge of the baffle and the inside surface of the top of the peripheral rim; the bottom edge of the guide plate is exposed by more than 3mm relative to the lower edge of the bottom substrate parting strip.

8. The plate-fin modular heat sink as recited in any one of claims 6 or 7, wherein the length of the air guide plate in the horizontal direction is the same as the length of the inside of the peripheral rim in the horizontal direction.

9. The plate-fin modular heat sink of claim 1, wherein the bottom cavity further comprises:

the enhanced heat transfer convex parts are positioned on the bottom surface in the accommodating groove, are arranged in order transversely and longitudinally and are integrally formed with the bottom surface of the accommodating groove;

the lug parts are positioned on the inner side surfaces of two edges of the accommodating groove along the length direction, are regularly arranged at intervals along the length direction, and are integrally formed with the bottom cavity main body;

the bottom supporting blocks are positioned on the bottom surface in the accommodating groove, distributed on two sides of the accommodating groove along the length direction, regularly arranged at intervals along the length direction of the accommodating groove, and provided with gaps with certain intervals with the enhanced heat transfer convex parts and the lug parts; the bottom support block comprises a first step and a second step, and the second step is higher than the first step.

10. The plate-fin modular heat sink as recited in claim 9, wherein said heat transfer enhancement protrusions are in the shape of a square block or a saw-tooth shape.

11. The plate-fin combined heat sink as recited in claim 10, wherein a porous capillary structure formed by sintering aluminum powder is provided between the heat transfer enhancing protrusions.

12. The plate-fin combined heat sink as claimed in claim 9, wherein a closed cavity is formed among the plurality of bottom substrate spacers, the plurality of heat superconducting plates and the bottom cavity, the closed cavity is formed by the accommodating grooves and the heat transfer channels which are communicated with each other, and a heat transfer working medium is filled in the closed cavity.

13. The plate-fin modular heat sink as claimed in claim 9, wherein the height difference between the second step and the first step is greater than 3mm, the heat superconducting plates attached to the outermost fins are located between the bump portions and the second step on the same side, and the vertical edges of the second step, the bump portions and the bottom cavity main body are used for supporting the bottom substrate spacers and the heat superconducting plates.

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