CN112614804A - Heating sucker assembly and chip splicing device - Google Patents
Heating sucker assembly and chip splicing device Download PDFInfo
- Publication number
- CN112614804A CN112614804A CN202011381251.0A CN202011381251A CN112614804A CN 112614804 A CN112614804 A CN 112614804A CN 202011381251 A CN202011381251 A CN 202011381251A CN 112614804 A CN112614804 A CN 112614804A
- Authority
- CN
- China
- Prior art keywords
- assembly
- guide rail
- driving
- heating
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010438 heat treatment Methods 0.000 title claims abstract description 130
- 238000001179 sorption measurement Methods 0.000 claims abstract description 43
- 238000009434 installation Methods 0.000 claims abstract description 14
- 238000009413 insulation Methods 0.000 claims description 16
- 239000000853 adhesive Substances 0.000 claims description 14
- 230000001070 adhesive effect Effects 0.000 claims description 14
- 239000000758 substrate Substances 0.000 claims description 6
- 239000011230 binding agent Substances 0.000 abstract description 7
- ORQBXQOJMQIAOY-UHFFFAOYSA-N nobelium Chemical compound [No] ORQBXQOJMQIAOY-UHFFFAOYSA-N 0.000 description 14
- 230000033001 locomotion Effects 0.000 description 11
- 238000000034 method Methods 0.000 description 7
- 239000007767 bonding agent Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 230000000149 penetrating effect Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The application relates to the technical field of chip processing devices, in particular to a heating sucker assembly and a chip splicing device. The heating sucker component comprises a base plate, a heating element and an adsorption platform; an installation space is formed on the base plate and used for installing a heating element, and the adsorption platform is arranged above the heating element; the adsorption platform is used for adsorbing the workpiece to be machined, and the heating element penetrates through the adsorption platform and is used for transferring heat to the workpiece to be machined. This application is provided with heating member and adsorbs the platform, at first utilize adsorb the platform will treat the machined part adsorb in adsorb the bench, realize treating the fixed action of machined part, then give heating member circular telegram, make its inside resistance wire generate heat, the heat passes through adsorb the platform and transmit for treating the binder that machined part and other parts are connected, and then shorten the curing time of binder, improved work efficiency.
Description
Technical Field
The application relates to the technical field of chip processing devices, in particular to a heating sucker assembly and a chip splicing device.
Background
The existing splicing of the chip base plate is mostly finished manually by using a bonding agent, but the existing splicing mode is complex and inconvenient on one hand; on the other hand, the adopted adhesive needs longer curing time, and the working efficiency is reduced.
Therefore, a heating chuck assembly and a die bonder are needed to solve the above technical problems.
Disclosure of Invention
The utility model provides a first aim at provides a heating sucking disc subassembly, in order to solve to a certain extent when adopting the binder, curing time is longer, technical problem that work efficiency is low.
The second aim at of this application provides a chip splicing apparatus, in order to solve the manual concatenation of current adoption, operates complicated technical problem to a certain extent.
The application provides a heating sucker assembly, which comprises a chassis, a heating element and an adsorption platform;
an installation space is formed on the base plate, the heating element is installed in the base plate, and the adsorption platform is arranged above the heating element;
the adsorption platform is used for adsorbing a workpiece to be processed, and the heating element is used for transferring heat to the workpiece to be processed.
In the above technical solution, further, the heating device further includes a first heat insulation member, and the first heat insulation member is disposed between the bottom wall of the chassis and the heating element;
the side wall of the chassis is provided with a limiting hole, the edge of the first heat insulation piece extends outwards to form a limiting block, and the limiting block is matched with the limiting hole so that the first heat insulation piece is embedded in the installation space.
In the above technical solution, further, still include the second heat insulating part, the second heat insulating part is the loop-type, and it sets up in heating member with adsorb between the platform.
The application also provides a chip splicing device which is used for splicing a chip onto a base plate and comprises the heating sucker assembly, a first driving assembly and a second driving assembly;
the second driving component is arranged on the first driving component, and the heating sucker component is arranged on the second driving component;
the first driving assembly can drive the second driving assembly and the heating sucker assembly to reciprocate along a first direction and/or a second direction; the second driving assembly can drive the heating sucker assembly to reciprocate along the first direction and/or the second direction;
the base plate is erected above the heating sucker component, the second driving component can also drive the heating sucker component to reciprocate along a third direction, so that the heating sucker component can move towards the base plate and penetrate through the base plate, the heating sucker component penetrating through the base plate is used for placing the chip, and the chip and the base plate are connected by using an adhesive;
the heating sucker assembly is used for heating the adhesive so as to enable the chip to be adhered to the base plate.
In the above technical solution, further, the first driving assembly includes a first guide rail, a first slider, a second guide rail, a second slider, and a first driving motor;
the first guide rail extends along the first direction, and the second guide rail is arranged on the first sliding block and extends along the second direction; the first sliding block is arranged on the first guide rail in a sliding mode, and the second sliding block is arranged on the second guide rail in a sliding mode; the second driving assembly is arranged on the second sliding block;
the driving end of the first driving motor is connected with the first sliding block and the second sliding block respectively, so that the second driving assembly and the heating sucker assembly can reciprocate along the first direction and/or the second direction.
In the above technical solution, further, the second driving assembly includes a supporting frame, a sliding part, a supporting part, a second driving motor, a lead screw, a supporting part, a moving part, and a third driving motor, which are disposed on the second slider;
a third guide rail extending along the third direction is arranged on the inner side wall of the supporting frame, the sliding part is arranged on the third guide rail in a sliding manner, the sliding part is fixedly connected with the moving part, the moving part is sleeved on the lead screw, and the second driving motor can drive the lead screw to rotate so as to enable the moving part and the sliding part to reciprocate along the third direction;
the supporting part is arranged at the top of the sliding part, a fourth guide rail is formed on the supporting part and extends along the first direction, and a fourth sliding block is arranged on the fourth guide rail in a sliding manner; a fifth guide rail is formed on the fourth sliding block and extends along the second direction, the supporting part is arranged on the fifth guide rail in a sliding mode, and the heating sucker assembly is arranged on the supporting part;
the driving end of the third driving motor is respectively connected with the fourth slider and the supporting part so that the fourth slider reciprocates along the first direction and the supporting part reciprocates along the second direction.
In the above technical solution, further, the device further comprises an angle adjusting assembly and an angle adjusting assembly, wherein the angle adjusting assembly comprises a rotating table arranged on the supporting portion and a rotating motor connected with the rotating table;
the rotating table is provided with the heating sucker assembly;
an annular track is arranged at the edge of the supporting part, a ninth sliding block is arranged on the rotating table towards the supporting part side, and the ninth sliding block is matched with the annular track;
the rotary motor drives the rotary table to rotate along the annular track, so that the heating sucker assembly rotates along the annular track.
In the above technical solution, further, the calibration device further comprises a base, a calibration assembly and a dial, wherein the calibration assembly and the dial are arranged on the base;
the first driving assembly and the second driving assembly are arranged on the base, and the calibration assembly is erected above the angle adjusting assembly; the dial is arranged on the bearing part through a connecting piece, the dial and the adsorption table are positioned on the same plane, and the dial is used for determining a coordinate system of the first driving assembly;
the calibration assembly comprises a microscope, a seventh guide rail and a seventh slide block;
the seventh guide rail is arranged on two sides of the first guide rail in the length direction and extends along the second direction; the seventh sliding block is arranged on the seventh guide rail in a sliding manner and can extend along the third direction; the tops of the two seventh sliding blocks are connected through an eighth guide rail, and the microscope is arranged on the eighth guide rail in a sliding manner along the first direction through the eighth sliding block;
driving the microscope to move in the first direction and/or the second direction to position the microscope directly above the scale such that the coordinate system of the calibration assembly coincides with the coordinate system of the second drive motor;
when the second driving component drives the heating sucker component to move along the third party and penetrate through the base plate, a chip is manually placed, and the position of the chip is adjusted through a microscope and the angle adjusting component so that the first marking point on the chip is overlapped with the second marking point on the base plate.
In the above technical solution, further, the apparatus further includes an auxiliary driving assembly, and the auxiliary driving assembly is arranged at an interval with the first driving assembly along the second direction;
the auxiliary driving assembly comprises a sixth guide rail and a sixth sliding block arranged on the sixth guide rail; and two ends of the second guide rail are respectively arranged on the first guide rail and the sixth guide rail.
In the above technical solution, further, a protrusion is formed on the adsorption table and extends along the third direction, and a through hole is formed on the base plate;
when the second driving component drives the heating sucker component to move along the third direction, the protrusion can penetrate through the through hole.
Compared with the prior art, the beneficial effect of this application is:
the application provides a heating sucker assembly, which comprises a chassis, a heating element and an adsorption platform; an installation space is formed on the base plate, the heating element is installed in the installation space, and the adsorption platform is arranged above the heating element; the adsorption platform is used for adsorbing a workpiece to be processed, and the heating element is used for transferring heat to the workpiece to be processed.
Specifically, consider often need to utilize the binder will treat that the machined part bonds with other parts together, in order to shorten the curing time of binder, improve work efficiency, this application is provided with heating member and adsorption platform, at first utilize the adsorption platform will treat that the machined part adsorbs in on the adsorption platform, realize treating the fixed action of machined part, then energize for heating member, make its inside resistance wire generate heat, the heat passes through the adsorption platform and transmits for treating the machined part, and then transmits to treating the binder that the machined part is connected with other parts, and then shortens the curing time of binder, has improved the concatenation efficiency of treating machined part and other parts.
The application also provides a chip splicing device which is used for splicing the chip to the base plate; the heating sucker component comprises a heating sucker component, a first driving component and a second driving component;
the second driving component is arranged on the first driving component, and the heating sucker component is arranged on the second driving component;
the first driving assembly can drive the second driving assembly and the heating sucker assembly to reciprocate along a first direction and/or a second direction; the second driving assembly can drive the heating sucker assembly to reciprocate along the first direction and/or the second direction;
the base plate is erected above the heating sucker component, the second driving component can also drive the heating sucker component to reciprocate along a third direction, so that the heating sucker component can move towards the base plate and penetrate through the base plate, the heating sucker component penetrating through the base plate is used for placing the chip, and the chip and the base plate are connected by using an adhesive;
the heating sucker assembly is used for heating the adhesive so as to enable the chip to be adhered to the base plate.
Specifically, the first driving component is used for driving the chip to move in a large stroke, the second driving component is used for adjusting the chip to move in a small stroke, the base plate is erected above the heating sucker component, and in the actual using process, the step 100: driving the second driving assembly and the heating sucker assembly to reciprocate along the first direction and/or the second direction by using the first driving assembly, so that the heating sucker assembly is positioned below the through hole of the base plate; step 200: driving the heating sucker assembly to penetrate through the through hole along a third direction by using the second driving assembly; step 300: placing a chip on the adsorption table, coating an adhesive on a base plate, and driving the heating sucker assembly and the chip to move downwards along the third direction by using the second driving assembly again so that the chip is adhered on the base plate; step 400: heating the adhesive by using a heating element to accelerate the curing time of the adhesive; the whole operation process is simple and directional, and the working efficiency is improved.
Drawings
In order to more clearly illustrate the detailed description of the present application or the technical solutions in the prior art, the drawings needed to be used in the detailed description of the present application or the prior art description will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is an exploded view of a heated chuck assembly provided in one embodiment of the present application;
FIG. 2 is a schematic diagram of an overall structure of a heated chuck assembly provided in one embodiment of the present application;
fig. 3 is a schematic overall structure diagram of a chip splicing apparatus provided in the second embodiment of the present application;
fig. 4 is a schematic structural diagram of a first driving assembly and an auxiliary driving assembly in a chip splicing apparatus provided in the second embodiment of the present application;
fig. 5 is a schematic structural diagram of a second driving assembly and an angle adjusting assembly in a chip splicing apparatus provided in the second embodiment of the present application at a first viewing angle;
fig. 6 is a schematic structural diagram of a second driving assembly and an angle adjusting assembly in a chip splicing apparatus provided in the second embodiment of the present application at a second viewing angle;
fig. 7 is an exploded view of a heated chuck assembly in a chip mounter according to a second embodiment of the present application.
In the figure: 100-a chassis; 101-installation space; 102-a heating element; 103-an adsorption stage; 104-a first thermal shield; 105-a limiting hole; 106-a limiting block; 107-base plate; 108-a first drive assembly; 109-a second drive assembly; 110-a first direction; 111-a second direction; 112-a third direction; 113-a first guide rail; 114-a first slider; 115-a second guide rail; 116-a second slider; 117-a support frame; 118-a slide; 119-a support; 120-an angle adjustment assembly; 121-a motion part; 122 — a calibration component; 123-a base; 124-dial scale; 125-microscope; 126-a seventh guide rail; 127-a seventh slider; 128-an eighth rail; 129-auxiliary drive assembly; 130-a sixth guide rail; 131-a sixth slider; 132-a bump; 133-a second thermal shield; 134-eighth slider; 135-a lead screw; 136-a second drive motor; 137-heating the chuck assembly.
Detailed Description
The technical solutions of the present application will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are only some embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.
Example one
Referring to fig. 1 and 2, the present application provides a heated chuck assembly 137 comprising a base 100, a heating element 102, and a suction station 103; the base plate 100 is formed with an installation space 101, and preferably, the base plate 100 is a cylindrical structure; preferably, the installation space 101 is also a cylindrical structure. The installation space 101 is used for installing the heating part 102, preferably, the heating part 102 is a heating plate, a resistance wire is arranged in the heating plate, and the resistance wire is connected with a power supply to be electrified so as to generate heat. The adsorption platform 103 is arranged above the heating element 102, the adsorption platform 103 is used for adsorbing a workpiece to be processed, the adsorption platform 103 has various forms, the adsorption platform 103 can be made of a magnet and used for adsorbing the workpiece to be processed, considering that the workpiece to be processed in the present application is a chip, preferably, the adsorption platform 103 adsorbs the chip in a vacuum adsorption manner, for example, a vacuum chuck is formed on the adsorption platform 103, so that vacuum adsorption on the chip is realized.
Specifically, in consideration of the fact that the workpiece to be machined is often bonded with other parts by using a bonding agent, in order to shorten the curing time of the bonding agent and improve the working efficiency, the heating element 102 and the adsorption table 103 are arranged, the workpiece to be machined is firstly adsorbed on the adsorption table 103 by using the adsorption table 103 to realize the fixing effect of the workpiece to be machined, then the heating element 102 is electrified to heat the resistance wire in the heating element, the heat is transmitted to the bonding agent for connecting the workpiece to be machined with other parts through the adsorption table 103, the curing time of the bonding agent is further shortened, and the working efficiency is improved.
More specifically, the heating element 102 and the adsorption station 103 are detachably connected, that is, when the heating element 102 is not needed to be used, the heating element 102 can be removed from the chassis 100; in addition, the adsorption table 103 can be made into various structures and also can be of an exchangeable structure, namely, when a large workpiece to be processed is adsorbed, a large-size adsorption table 103 can be selected.
In this embodiment, when the heating element 102 is energized to generate heat, in order to prevent the chassis 100 from being deformed due to excessive heat or a structure for supporting the chassis 100 from being thermally deformed, the heating cup assembly 137 further includes a first thermal insulation element 104, the first thermal insulation element 104 is disposed in the installation space 101 and between the bottom wall of the chassis 100 and the heating element 102, that is, the first thermal insulation element 104 is used to prevent heat from being transmitted toward the chassis 100 side, thereby preventing the chassis 100 from being thermally deformed.
Specifically, considering that the heat insulation member may be displaced due to vibration and the like, in order to prevent the heat insulation member from being displaced and losing the heat insulation effect, in this embodiment, a limiting hole 105 is formed on the side wall of the chassis 100, an edge of the first heat insulation member 104 extends outward to form a limiting block 106, and the limiting block 106 is adapted to the limiting hole 105, so that the first heat insulation member 104 is embedded in the installation space 101, thereby achieving a fixing effect on the first heat insulation member 104 and preventing the first heat insulation member 104 from being displaced.
In this embodiment, during the work process of generating heat by electrifying the heating element 102 and transferring the heat to the workpiece to be processed, if the suction table 103 is to be replaced, since the suction table 103 is also heated at this time, a safety accident may occur when the workpiece is directly replaced, in order to prevent the safety accident, in this embodiment, the heating chuck assembly 137 further includes a second heat insulating element 133, the second heat insulating element 133 is in a ring shape and is disposed between the heating element 102 and the suction table 103, that is, on one hand, the second heating element 102 does not affect the heating of the heating element 102 to the workpiece to be processed, on the other hand, the position of the suction table 103 corresponding to the second heat insulating element 133 is not heated, that is, if the suction table 103 is to be replaced, the position of the suction table 103 corresponding to the second heat insulating element 133 can be touched to realize the replacement of the suction table 103, thereby avoiding the safety accident, and is safer.
Example two
The second embodiment is an improvement on the basis of the first embodiment, technical contents disclosed in the first embodiment are not described repeatedly, and contents disclosed in the second embodiment also belong to contents disclosed in the first embodiment.
Referring to fig. 2 to 7, in order to solve the problem that the operation is complicated due to manual splicing of chips onto the substrate 107 in the prior art, the present application provides a chip splicing apparatus in this embodiment, which is used for splicing the chips onto the substrate 107; the chip splicing device comprises the heating sucker component 137, the first driving component 108 and the second driving component 109; the second driving assembly 109 is arranged on the first driving assembly 108, and the heating sucker assembly 137 is arranged on the second driving assembly 109;
the first driving assembly 108 can drive the second driving assembly 109 and the heating chuck assembly 137 to reciprocate along a first direction 110 and/or a second direction 111; the second driving assembly 109 can drive the heating chuck assembly 137 to reciprocate along the first direction 110 and/or the second direction 111; the second driving assembly 109 can also drive the heating sucker assembly 137 to reciprocate along a third direction 112, so that the heating sucker assembly 137 can move towards the base plate 107 and penetrate through the base plate 107, the heating sucker assembly 137 penetrating through the base plate 107 is used for placing the chip, and the chip is connected with the base plate 107 by using an adhesive; the heating chuck assembly 137 is used for heating the adhesive to adhere the chip on the substrate 107.
Preferably, a protrusion 132 is formed on the adsorption stage 103 and extends along the third direction 112, and a through hole is formed on the base plate 107; when the second driving assembly 109 drives the heating chuck assembly 137 to move along the third direction 112, the protrusion 132 can pass through the through hole.
Specifically, the first driving assembly 108 is used for driving the chip to perform a large-stroke movement, the second driving assembly 109 is used for adjusting the chip to perform a small-stroke movement, the base plate 107 is erected above the heating chuck assembly 137, and in an actual using process, the step 100: driving the second driving assembly 109 and the heating chuck assembly 137 to reciprocate along the first direction 110 and/or the second direction 111 by using the first driving assembly 108, so that the heating chuck assembly 137 is positioned below the through hole; step 200: driving the heated chuck assembly 137 through the through hole in a third direction 112 using the second drive assembly 109; step 300: placing a chip on the adsorption table 103, applying an adhesive on the base plate 107, and driving the heating sucker assembly 137 and the chip to move downwards along the third direction 112 by using the second driving assembly 109 again so that the chip is adhered on the base plate 107; step 400: heating the adhesive by using a heating element 102 to accelerate the curing time of the adhesive; the whole operation process is simple and convenient, and the working efficiency is improved.
In this embodiment, the first driving assembly 108 includes a first guide rail 113, a first slider 114, a second guide rail 115, a second slider 116, and a first driving motor;
the first guide rail 113 extends along the first direction 110, and the second guide rail 115 is disposed on the first slider 114 and extends along the second direction 111; the first sliding block 114 is sleeved on the first guide rail 113, and the second sliding block 116 is sleeved on the second guide rail 115; the second driving assembly 109 is disposed on the second sliding block 116;
the driving end of the first driving motor is connected to the first slider 114 and the second slider 116, respectively, so that the second driving assembly 109 and the heating chuck assembly 137 reciprocate along the first direction 110 and/or the second direction 111.
Specifically, in order to ensure that the second driving assembly 109 can move stably, the chip splicing apparatus further includes an auxiliary driving assembly 129, and the auxiliary driving assembly 129 is arranged at an interval with the first driving assembly 108 along the second direction 111, that is, the first driving assembly 108 and the auxiliary driving assembly 129 are arranged in parallel; specifically, the auxiliary drive assembly 129 comprises a sixth guide rail 130 and a sixth slider 131 disposed on the sixth guide rail 130; in summary, both ends of the second guide rail 115 are respectively disposed on the first slider 114 and the sixth slider 131, and in the second guide rail 115, the first guide rail 113 and the sixth guide rail 130 can move along the first direction 110, and the sixth guide rail 130 plays a role of assisting the first guide rail 113.
In this embodiment, after the first driving assembly 108 is used to realize the large stroke movement of the second driving assembly 109, it is necessary to realize the small stroke movement by using the second driving assembly 109, specifically, it is necessary to first pass the heating chuck assembly 137 through the through hole, specifically, the second driving assembly 109 includes the supporting frame 117, the sliding part 118, the bearing part, the second driving motor 136, the lead screw 135, the supporting part 119 and the third driving motor which are arranged on the second sliding block 116;
be provided with on the inside wall of braced frame 117 along the third guide rail that third direction 112 extends, sliding part 118 set up in on the third guide rail, sliding part 118 with motion portion 121 fixed connection, motion portion 121 cover is established on lead screw 135, the drive end of second driving motor 136 pass through the belt with lead screw 135's one end is connected, second driving motor 136 can drive lead screw 135 is rotatory, so that motion portion 121 with sliding part 118 is along third direction 112 reciprocating motion, can make heating sucking disc subassembly 137 along third direction 112 upward movement this moment promptly, and make heating sucking disc subassembly 137 pass on the base plate 107 the through-hole passes the through-hole the chip is placed to the manual on the heating sucking disc subassembly 137 of through-hole.
In order to reduce the error, in the embodiment, the bearing portion is disposed on the top of the sliding portion 118, a fourth guide rail is formed on the bearing portion and extends along the first direction 110, and a fourth slider is sleeved on the fourth guide rail; a fifth guide rail is formed on the fourth slider and extends along the second direction 111, the support part 119 is arranged on the fifth guide rail, and the heating sucker assembly 137 is arranged on the support part 119; the driving end of the third driving motor is respectively connected with the fourth slider and the supporting portion 119, so that the fourth slider reciprocates along the first direction 110 and the supporting portion 119 reciprocates along the second direction 111, that is, the third driving motor can be used for enabling the chip to move along the first direction 110 and/or the second direction 111, so that the first mark point and the second mark point on the base plate 107 coincide to a certain extent, the splicing requirement of the chip is met, the splicing is more accurate, and the working efficiency is improved.
In this embodiment, in order to further improve the splicing precision of the chips, thereby improving the working efficiency, the chip splicing apparatus further includes an angle adjusting assembly 120, where the angle adjusting assembly 120 includes a rotating table disposed on the supporting portion 119 and a rotating motor connected to the rotating table; the heating sucker assembly 137 is arranged on the rotating table.
An annular track is arranged at the edge of the supporting part 119, a ninth sliding block is arranged on the side, facing the supporting part 119, of the rotating table, and the ninth sliding block is matched with the annular track;
the rotary motor drives the rotary table to rotate along the annular track to rotate so that the heating sucker component 137 can rotate along the annular track, and in conclusion, the rotary motor can drive the chip above the base plate 107 to rotate, the movement direction of the chip is further increased, and the first mark point of the chip is enabled to be overlapped with the second mark point of the base plate 107 more accurately.
In this embodiment, in order to further improve the reliability and intelligence of the chip splicing apparatus, so that the chip is spliced with the substrate 107 more accurately, the chip splicing apparatus further includes a base 123, an alignment assembly 122 disposed on the base 123, and a dial 124;
the first driving assembly 108 and the second driving assembly 109 are disposed on the base 123, and the calibration assembly 122 is erected above the angle adjusting assembly 120; the dial 124 is arranged on the supporting part through a connecting piece, the dial 124 and the adsorption platform 103 are positioned on the same plane, and the dial 124 is used for determining a coordinate system of the first driving assembly 108;
the calibration assembly 122 includes a microscope 125, a seventh guide rail 126, and a seventh slide 127;
the seventh guide rail 126 is disposed at two sides of the first guide rail 113 in the length direction and extends along the second direction 111; the seventh sliding block 127 is slidably disposed on the seventh guide rail 126 and can extend along the third direction 112; the two seventh sliding blocks 127 are connected by an eighth guide rail 128, and the microscope 125 is slidably disposed on the eighth guide rail 128 along the first direction 110 by an eighth sliding block 134;
the microscope 125 is driven to move in the first direction 110 and/or the second direction 111 such that the microscope 125 is positioned directly above the scale 124 such that the coordinate system of the calibration assembly 122 coincides with the coordinate system of the second drive motor 136 (the dots of both coordinate systems coincide).
When the second driving assembly 109 drives the heated sucker assembly 137 to move along the third party and pass through the base plate 107, a chip is manually placed, and the position of the chip is adjusted by a microscope 125 by using the angle adjusting assembly 120 so that a first mark point on the chip is coincided with a second mark point on the base plate 107.
The actual use process is as follows: before the step 100, the method further comprises a step 90, wherein the step 90: initializing the chip splicing device, specifically, determining a coordinate system of the first driving assembly 108 by using the dial 124, and coinciding the coordinate system of the calibration assembly 122 with the coordinate system of the second driving motor 136 by using the microscope 125 (more specifically, there is a cross-shaped mark on the dial 124, for example, there is a cross-shaped tracking cursor on the microscope 125, and when the cross-shaped tracking cursor on the microscope 125 coincides with the cross-shaped mark on the dial 124, it indicates that the two coordinates coincide), completing the initialization of the chip splicing device; in addition, the substrate 107 is marked with a second marking point, and the chip is marked with a first marking point (the marking of the first marking point and the second marking point is not described herein too much in a conventional manner in the art).
The step 300 further includes a calibration step, which specifically includes: the chip is manually placed on the adsorption table 103, when the first mark point and the second mark point are found to be misaligned, the microscope 125 can observe the first mark point and the second mark point, calculate the deviation of the two mark points, then drive the chip to move along the first direction 110 and/or the second direction 111 by using a third driving motor, drive the chip to rotate by using a rotating motor so as to make the first mark point and the second mark point be aligned, and drive the heating sucker assembly 137 and the chip to move downwards along the third direction 112 by using the second driving assembly 109 after the alignment so as to make the chip be adhered on the base plate 107.
To sum up, realized the chip with the accurate laminating of base plate 107, chip splicing apparatus can move chip concatenation position fast to realize accurate regulation to the position of chip, and then improved the precision, stability and the reliability of concatenation.
Finally, it should be noted that: the above embodiments are only used for illustrating the technical solutions of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present application. Moreover, those skilled in the art will appreciate that while some embodiments herein include some features included in other embodiments, rather than other features, combinations of features of different embodiments are meant to be within the scope of the application and form different embodiments.
Claims (10)
1. A heating sucker component is characterized by comprising a base plate, a heating element and an adsorption platform;
an installation space is formed on the base plate, the heating element is installed in the installation space, and the adsorption platform is arranged above the heating element;
the adsorption platform is used for adsorbing a workpiece to be processed, and the heating element is used for transferring heat to the workpiece to be processed.
2. The heated chuck assembly of claim 1, further comprising a first thermal shield disposed between the bottom wall of the chassis and the heating element;
the side wall of the chassis is provided with a limiting hole, the edge of the first heat insulation piece extends outwards to form a limiting block, and the limiting block is matched with the limiting hole so that the first heat insulation piece is embedded in the installation space.
3. The heated chuck assembly of claim 1 further comprising a second thermal shield in the form of a ring disposed between the heating element and the suction table.
4. A chip splicing device is used for splicing chips to a base plate; characterized in that it comprises a heated chuck assembly according to any one of claims 1 to 3, a first drive assembly and a second drive assembly;
the second driving component is arranged on the first driving component, and the heating sucker component is arranged on the second driving component;
the first driving assembly can drive the second driving assembly and the heating sucker assembly to reciprocate along a first direction and/or a second direction; the second driving assembly can drive the heating sucker assembly to reciprocate along the first direction and/or the second direction;
the base plate is erected above the heating sucker component, the second driving component can also drive the heating sucker component to reciprocate along the third direction, so that the heating sucker component can move towards the base plate and penetrate through the base plate, penetrate through the base plate the heating sucker component is used for placing the chip, and the chip is connected with the base plate by using an adhesive.
5. The chip splicing apparatus according to claim 4, wherein the first driving assembly comprises a first guide rail, a first slider, a second guide rail, a second slider, and a first driving motor;
the first guide rail extends along the first direction, and the second guide rail is arranged on the first sliding block and extends along the second direction; the first sliding block is arranged on the first guide rail in a sliding mode, and the second sliding block is arranged on the second guide rail in a sliding mode; the second driving assembly is arranged on the second sliding block;
the driving end of the first driving motor is connected with the first sliding block and the second sliding block respectively, so that the second driving assembly and the heating sucker assembly can reciprocate along the first direction and/or the second direction.
6. The chip splicing apparatus according to claim 5, wherein the second driving assembly comprises a supporting frame, a sliding part, a supporting part, a second driving motor, a lead screw, a supporting part, a moving part and a third driving motor, which are arranged on the second slider;
a third guide rail extending along the third direction is arranged on the inner side wall of the supporting frame, the sliding part is arranged on the third guide rail in a sliding manner, the sliding part is fixedly connected with the moving part, the moving part is sleeved on the lead screw, and the second driving motor can drive the lead screw to rotate so as to enable the moving part and the sliding part to reciprocate along the third direction;
the supporting part is arranged at the top of the sliding part, a fourth guide rail is formed on the supporting part and extends along the first direction, and a fourth sliding block is arranged on the fourth guide rail in a sliding manner; a fifth guide rail is formed on the fourth sliding block and extends along the second direction, the supporting part is arranged on the fifth guide rail in a sliding mode, and the heating sucker assembly is arranged on the supporting part;
the driving end of the third driving motor is respectively connected with the fourth slider and the supporting part so that the fourth slider reciprocates along the first direction and the supporting part reciprocates along the second direction.
7. The chip splicing apparatus according to claim 6, further comprising an angle adjustment assembly, wherein the angle adjustment assembly comprises a rotating table disposed on the supporting portion and a rotating motor connected to the rotating table;
the rotating table is provided with the heating sucker assembly;
an annular track is arranged at the edge of the supporting part, a ninth sliding block is arranged on the rotating table towards the supporting part side, and the ninth sliding block is matched with the annular track;
the rotary motor drives the rotary table to rotate along the annular track, so that the heating sucker assembly rotates along the annular track.
8. The chip splicing apparatus according to claim 7, further comprising a base, a calibration assembly disposed on the base, and a dial;
the first driving assembly and the second driving assembly are arranged on the base, and the calibration assembly is erected above the angle adjusting assembly; the dial is arranged on the bearing part through a connecting piece, the dial and the adsorption table are positioned on the same plane, and the dial is used for determining a coordinate system of the first driving assembly;
the calibration assembly comprises a microscope, a seventh guide rail and a seventh slide block;
the seventh guide rail is arranged on two sides of the first guide rail in the length direction and extends along the second direction; the seventh sliding block is arranged on the seventh guide rail in a sliding manner and can extend along the third direction; the tops of the two seventh sliding blocks are connected through an eighth guide rail, and the microscope is arranged on the eighth guide rail in a sliding manner along the first direction through the eighth sliding block;
driving the microscope to move in the first direction and/or the second direction to position the microscope directly above the scale such that the coordinate system of the calibration assembly coincides with the coordinate system of the second drive motor;
when the second driving component drives the heating sucker component to move along the third direction and penetrate through the base plate, a chip is manually placed on the adsorption table, and the position of the chip is adjusted through the microscope and the angle adjusting component so that the first marking point on the chip and the second marking point on the base plate coincide.
9. The chip splicing apparatus according to claim 5, further comprising an auxiliary driving assembly, wherein the auxiliary driving assembly is spaced from the first driving assembly along the second direction;
the auxiliary driving assembly comprises a sixth guide rail and a sixth sliding block arranged on the sixth guide rail in a sliding mode; and two ends of the second guide rail are respectively arranged on the first sliding block and the sixth sliding block.
10. The chip splicing device according to claim 4, wherein a protrusion is formed on the adsorption table and extends along the third direction, and a through hole is formed in the substrate;
when the second driving component drives the heating sucker component to move along the third direction, the protrusion can penetrate through the through hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011381251.0A CN112614804B (en) | 2020-11-30 | 2020-11-30 | Heating sucking disc subassembly and chip splicing apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011381251.0A CN112614804B (en) | 2020-11-30 | 2020-11-30 | Heating sucking disc subassembly and chip splicing apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112614804A true CN112614804A (en) | 2021-04-06 |
| CN112614804B CN112614804B (en) | 2024-06-25 |
Family
ID=75229833
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011381251.0A Active CN112614804B (en) | 2020-11-30 | 2020-11-30 | Heating sucking disc subassembly and chip splicing apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112614804B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116598247A (en) * | 2023-07-18 | 2023-08-15 | 深圳新控半导体技术有限公司 | Self-adjusting pasting platform for chip pasting and control method thereof |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001102477A (en) * | 1999-09-30 | 2001-04-13 | Fujitsu Ltd | Circuit mounting supporting board and manufacturing method thereof, and electronic part |
| CN1660560A (en) * | 2004-02-24 | 2005-08-31 | 三井金属矿业株式会社 | Film splicer and film carrier tape for mounting electronic components |
| CN1821337A (en) * | 2005-02-04 | 2006-08-23 | 株式会社巴川制纸所 | Binder composition for semiconductor device and binder sheet for semiconductor device |
| CN101419922A (en) * | 2008-11-28 | 2009-04-29 | 江苏康众数字医疗设备有限公司 | Multi-module splicing method and device for planar device integration |
| KR101534270B1 (en) * | 2015-02-23 | 2015-07-07 | 주식회사 엠피에스 | Dispensing apparatus for manufacturing camera module |
| CN205572330U (en) * | 2016-04-15 | 2016-09-14 | 深圳市固诺泰科技有限公司 | A separator bonds |
| CN107424951A (en) * | 2017-06-02 | 2017-12-01 | 广东瑞谷光网通信股份有限公司 | Chip rotates eutectic welding bench |
| CN107498500A (en) * | 2017-09-14 | 2017-12-22 | 京东方科技集团股份有限公司 | One kind disassembles tool |
| CN107564971A (en) * | 2017-07-27 | 2018-01-09 | 中国电子科技集团公司第十研究所 | A kind of electric leading-out structure of alignment splicing detector component |
| CN208058953U (en) * | 2018-04-18 | 2018-11-06 | 佛山市顺德区美的电热电器制造有限公司 | Heating component and heating utensil |
| US20200258847A1 (en) * | 2019-02-12 | 2020-08-13 | Intel Corporation | Chiplet first architecture for die tiling applications |
| CN211830620U (en) * | 2020-05-11 | 2020-10-30 | 成都骏创科技有限公司 | High-temperature-resistant electrostatic adsorption device for assembling electronic screen |
-
2020
- 2020-11-30 CN CN202011381251.0A patent/CN112614804B/en active Active
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001102477A (en) * | 1999-09-30 | 2001-04-13 | Fujitsu Ltd | Circuit mounting supporting board and manufacturing method thereof, and electronic part |
| CN1660560A (en) * | 2004-02-24 | 2005-08-31 | 三井金属矿业株式会社 | Film splicer and film carrier tape for mounting electronic components |
| CN1821337A (en) * | 2005-02-04 | 2006-08-23 | 株式会社巴川制纸所 | Binder composition for semiconductor device and binder sheet for semiconductor device |
| CN101419922A (en) * | 2008-11-28 | 2009-04-29 | 江苏康众数字医疗设备有限公司 | Multi-module splicing method and device for planar device integration |
| KR101534270B1 (en) * | 2015-02-23 | 2015-07-07 | 주식회사 엠피에스 | Dispensing apparatus for manufacturing camera module |
| CN205572330U (en) * | 2016-04-15 | 2016-09-14 | 深圳市固诺泰科技有限公司 | A separator bonds |
| CN107424951A (en) * | 2017-06-02 | 2017-12-01 | 广东瑞谷光网通信股份有限公司 | Chip rotates eutectic welding bench |
| CN107564971A (en) * | 2017-07-27 | 2018-01-09 | 中国电子科技集团公司第十研究所 | A kind of electric leading-out structure of alignment splicing detector component |
| CN107498500A (en) * | 2017-09-14 | 2017-12-22 | 京东方科技集团股份有限公司 | One kind disassembles tool |
| CN208058953U (en) * | 2018-04-18 | 2018-11-06 | 佛山市顺德区美的电热电器制造有限公司 | Heating component and heating utensil |
| US20200258847A1 (en) * | 2019-02-12 | 2020-08-13 | Intel Corporation | Chiplet first architecture for die tiling applications |
| CN111554671A (en) * | 2019-02-12 | 2020-08-18 | 英特尔公司 | Chiplet priority architecture for die tiling applications |
| CN211830620U (en) * | 2020-05-11 | 2020-10-30 | 成都骏创科技有限公司 | High-temperature-resistant electrostatic adsorption device for assembling electronic screen |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116598247A (en) * | 2023-07-18 | 2023-08-15 | 深圳新控半导体技术有限公司 | Self-adjusting pasting platform for chip pasting and control method thereof |
| CN116598247B (en) * | 2023-07-18 | 2023-09-12 | 深圳新控半导体技术有限公司 | Self-adjusting pasting platform for chip pasting and control method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN112614804B (en) | 2024-06-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103367208B (en) | A kind of back bonding platform for superchip | |
| CN108561389B (en) | Substrate adsorption jig and method for carrying out substrate adsorption by adopting same | |
| CN109739006B (en) | Lens attaching system and method | |
| US10910248B2 (en) | Electronic component mounting apparatus | |
| US10497590B2 (en) | Electronic component handling unit | |
| CN112354795B (en) | Active alignment device for camera | |
| KR20110137602A (en) | Bond head for die bonding machine | |
| CN210223951U (en) | Die bonding mechanism of full-automatic IC plane die bonding machine | |
| CN107999942A (en) | Sealing cap welding equipment | |
| CN112614804A (en) | Heating sucker assembly and chip splicing device | |
| CN217470434U (en) | FOG positioning and pressing device | |
| KR101044622B1 (en) | Apparatus for bonding semiconductor chip | |
| CN103553369A (en) | Glass fitting device | |
| CN113035719B (en) | Chip mounting method and device | |
| KR102379168B1 (en) | Bonding apparatus of semiconductor chip | |
| CN203292816U (en) | High-precision efficient liquid crystal panel installation device | |
| WO2024032053A1 (en) | Nano micro-displacement workbench for laser ultra-precision polishing for highly hard and brittle material | |
| CN107461387B (en) | Dispensing and gluing equipment and dispensing and gluing method | |
| CN206595232U (en) | A kind of wafer stage chip upside-down mounting locating platform | |
| CN209785895U (en) | LED wafer angular position adjustment mechanism and automatic LED die bonder | |
| CN211887724U (en) | Dispensing mechanism and display screen production line | |
| US8016010B2 (en) | Rotary bonding tool which provides a large bond force | |
| CN209793759U (en) | Lens coupling clamping device | |
| CN105789086A (en) | Device for coating scaling powder on both surfaces of chip | |
| CN210377019U (en) | Light shield paster device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant |