CN107564971A - A kind of electric leading-out structure of alignment splicing detector component - Google Patents
A kind of electric leading-out structure of alignment splicing detector component Download PDFInfo
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- CN107564971A CN107564971A CN201710623118.3A CN201710623118A CN107564971A CN 107564971 A CN107564971 A CN 107564971A CN 201710623118 A CN201710623118 A CN 201710623118A CN 107564971 A CN107564971 A CN 107564971A
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- substrate
- soft band
- out structure
- detector component
- connector
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Abstract
The invention provides a kind of electric leading-out structure of alignment splicing detector component, include the detector chip of several alignments splicing on substrate, in the vacuum cavity surrounded positioned at shell, electric leading-out structure includes ceramic substrate, soft band, low deflation rate connector and the air-tightness connector on shell in vacuum cavity；Wherein, substrate and ceramic substrate are each attached on metal substrate, electricity UNICOM is realized by lead welding, one end of soft band is also secured on metal substrate, electricity UNICOM is realized by lead welding with ceramic substrate in one end of soft band, the other end of soft band is connected with one end of low deflation rate connector, and the other end of low deflation rate connector is connected with air-tightness connector.The electric leading-out structure of alignment splicing detector component provided by the invention, line lead is entered using ceramic substrate and merged, number of leads is reduced, by the soft band UNICOM of low heat conductivity, solves normal temperature to 60K leakage heat problem.
Description
Technical field
The present invention relates to technical field of photoelectric detection, the electricity of more particularly to a kind of alignment splicing detector component draws knot
Structure.
Background technology
Compared with the micro- Dewar component of infrared detector of routine, alignment splicing detector can preferably be applied to space flight and lead
Domain.As application is to the demand of high-performance, long alignment infrared technique, progressively developed into 100,000 pixels from the unit component of early stage
Etc. two generation devices of scale, to three generations's device of mega pixel.Detector array specification is increasing, alignment splicing detector group
Part structure is different from Conventional monolithic and declined the structure of Dewar component, and its electric leading-out structure is also required to redesign.
The content of the invention
In order to adapt to the requirement of alignment splicing detector component, ensure that the highly reliable electrical signal of detector assembly is drawn,
Realize that infrared band detects, the invention provides a kind of electric leading-out structure of alignment splicing detector component.
The electric leading-out structure of alignment splicing detector component provided by the invention, the alignment splicing detector component bag
The detector chip of several alignments splicing on substrate is included, in the vacuum cavity of shell encirclement, the electricity is drawn
The ceramic substrate, soft band (flexible printed circuit board, FPCB), low deflation rate that going out structure includes being located in the vacuum cavity patch
Part and the air-tightness connector on the shell；Wherein, the substrate and the ceramic substrate are each attached to metal substrate
On, electricity UNICOM is realized by lead welding, one end of the soft band is also secured on the metal substrate, and the one of the soft band
Electricity UNICOM, the other end of the soft band and the low deflation rate connector are realized by lead welding with the ceramic substrate in end
One end connection, the other end of the low deflation rate connector is connected with the air-tightness connector on the shell.
Specifically, the electric leading-out structure of alignment splicing detector component of the present invention, in addition to soft band pressing plate and
Soft band housing screw, one end of the soft band is pressed together on the gold with pressing plate by soft described in the soft band compression screw in compression
Belong on substrate.
Specifically, in the electric leading-out structure of alignment splicing detector component of the present invention, the substrate is treasured
Stone lining bottom.
Specifically, in the electric leading-out structure of alignment splicing detector component of the present invention, the ceramic substrate
For LTCC, abbreviation LTCC.
Specifically, in the electric leading-out structure of alignment splicing detector component of the present invention, the chip is tellurium
Cadmium mercury detector chip.
The electric leading-out structure of alignment splicing detector component provided by the invention, line lead is entered using ceramic substrate and closed
And number of leads is reduced, by the soft band UNICOM of low heat conductivity, solve normal temperature to 60K leakage heat problem, employ a variety of reliable
Material and mature technology combination, breakthrough realizes long detector array component, and small volume, pin count are few, in light weight,
It is highly reliable.
Brief description of the drawings
Fig. 1 is the side view of alignment splicing detector component electric leading-out structure of the present invention；
Fig. 2 is the front view of alignment splicing detector component electric leading-out structure of the present invention；
Wherein, 1, detector chip；2nd, ceramic substrate；3rd, soft band housing screw；4th, soft band；5th, low deflation rate connector；
6th, air-tightness connector；7th, metal substrate；8th, substrate；9. soft band pressing plate.
Embodiment
The exemplary embodiment of the disclosure is more fully described below with reference to accompanying drawings.Although the disclosure is shown in accompanying drawing
Exemplary embodiment, it being understood, however, that may be realized in various forms the disclosure without should be by embodiments set forth here
Limited.On the contrary, these embodiments are provided to facilitate a more thoroughly understanding of the present invention, and can be by the scope of the present disclosure
Completely it is communicated to those skilled in the art.
In order to adapt to the requirement of alignment splicing detector component, ensure that the highly reliable electrical signal of detector assembly is drawn,
Realize that infrared band detects, the invention provides a kind of electric leading-out structure of alignment splicing detector component, below in conjunction with Fig. 1
The present invention will be described in further detail with Fig. 2.It should be appreciated that specific embodiment described herein is only explaining this
Invention, do not limit the present invention.
Fig. 1 is the side view of alignment splicing detector component electric leading-out structure of the present invention, and Fig. 2 splices for alignment of the present invention
The front view of detector assembly electric leading-out structure.As illustrated in figs. 1 and 2, the alignment splicing detector component includes being located at
The detector chip of several alignments splicing on substrate 8, (is not marked in fig. 1 and 2 positioned at the vacuum cavity surrounded by shell
Go out) in, the electric leading-out structure includes ceramic substrate 2, soft band 4, low deflation rate connector in the vacuum cavity
5 and the air-tightness connector 6 on the shell；Wherein, the substrate 8 and the ceramic substrate 2 are each attached to Metal Substrate
On plate 7, electricity UNICOM is realized by lead welding, one end of the soft band 4 is also secured on the metal substrate 7, described soft
Electricity UNICOM (lead pad and the ceramics on i.e. soft band 4 are realized by lead welding with the ceramic substrate in one end of band
The lead pad of substrate 2 corresponds), the other end of the soft band 4 is connected with one end of the low deflation rate connector 5, institute
The other end for stating low deflation rate connector 5 is connected with the air-tightness connector 6 on the shell.
Specifically, the electric leading-out structure of alignment splicing detector component of the present invention, in addition to the soft He of band pressing plate 9
Soft band housing screw 3, one end of the soft band 4 described soft is pressed together on by institute with pressing plate 9 by soft compressed with housing screw 3
State on metal substrate 7.
Specifically, in the electric leading-out structure of alignment splicing detector component of the present invention, the substrate is treasured
Stone lining bottom.
Specifically, in the electric leading-out structure of alignment splicing detector component of the present invention, the ceramic substrate
For LTCC, abbreviation LTCC.
Specifically, in the electric leading-out structure of alignment splicing detector component of the present invention, the chip is tellurium
Cadmium mercury detector chip.
The present invention on a piece of substrate, resolution ratio can spatially need multi-disc cadmium-telluride-mercury infrared detector integrated chip
The different types of detector chip of splicing is sought, the detector chip of super long alignment specification is obtained, solves mercury-cadmium-tellurium detector chips
Array specification is difficult to do the problem of big.The characteristics of due to detector chip material, its operating point need to be arranged on a low temperature 60K left sides
It is right.A vacuum cavity is thus needed, necessary low temperature environment is provided for detector chip.Therefore, it is necessary to resolve two
Problem realizes such a detector assembly structure.First, solve the high coplane degree of detector chip photosurface and picture under low temperature 60K
The problem of plain level high aligning accuracy.Second, complete the realization that 60K draws path to hot, the highly reliable electricity of normal temperature 300K low drains.
First, using with the closer jewel of the coefficient of expansion is as backing material under detector chip low temperature 60K, in jewel
Need to need the accurate MARK mark points aligned according to the position mark MARK designs on detector chip on substrate.By detector
Chip uses high-accuracy mounting means, is placed in on a piece of jewel substrate and putting adhesive curing.
Secondly, multilayer low-temperature co-fired ceramic substrate is designed, ceramic substrate can be closed the electrical signal of same nature
And reduce the quantity of pin count.And soft band is designed, as the connecting path of low deflation rate connector, soft band can be realized low
Heat transfer, ensure under the thermograde from low temperature 60K to 300K, reduce the heat consumption of detector assembly.Using low temperature glue sticking
Mode, ceramic substrate and soft band are fixed on metallic substrates, ceramic substrate is welded with jewel substrate and soft band by lead
Mode, realize the UNICOM of highly reliable detector electrical signal.
Finally, welding air-tightness connector is fixed together with detector assembly shell, by the low of soft end of tape
Deflation rate connector docks fastening with the air-tightness connector on shell, realizes from low temperature 60K to normal temperature 300K low drain heat, height
Reliable electricity is drawn.
More specifically, the connected mode of the electric leading-out structure of alignment splicing detector component comprises the following steps：
1. single slice detector chip and the exactitude position mark of detector chip module are designed, and will using film metal technique
Mark is made on jewel substrate；
2. it is using accurate splicing instrument, the alignment mark of detector chip is corresponding with the alignment mark of jewel substrate, and
Detector chip is fixed on jewel substrate using low temperature adhesive.
3. the jewel substrate for fixing detector chip is marked into accurate contraposition with metal substrate according to designed centering
Installation.
4. ceramic substrate is fixed on metallic substrates using low temperature adhesive.
5. after the lead pad of soft band and ceramic substrate lead pad are corresponded, gold is fixed on using low temperature adhesive
Belong on substrate, and pressed soft band on metallic substrates by soft band housing screw and soft band pressing plate.
6. enter line lead welding procedure between jewel substrate and ceramic substrate, ceramic substrate and soft band.
7. weld low deflation rate connector in soft end of tape；
8. the low deflation rate connector of soft end of tape is fixed with air-tightness connector to being plugged together, and by screw.
The present invention can obtain the reality of the long alignment specification cadmium-telluride-mercury infrared detector component electricity output under 60K operating temperatures
It is existing.
Chip of the present invention is the less mercury-cadmium-tellurium detector chips of monolithic array specification, passes through splicing detector
Chip is merged using ceramic substrate lead, reduces number of leads in the mode of jewel substrate, by the soft band UNICOM of low heat conductivity,
Normal temperature is solved to 60K leakage heat problem.
Present invention employs the combination of a variety of reliable materials and mature technology, breakthrough realizes long detector array
Component, small volume, pin count are few, in light weight, highly reliable.
Embodiments of the invention are the foregoing is only, are not intended to limit the invention, for those skilled in the art
For member, the present invention can have various modifications and variations.Any modification within the spirit and principles of the invention, being made,
Equivalent substitution, improvement etc., should be included within scope of the presently claimed invention.
Claims (5)
- A kind of 1. electric leading-out structure of alignment splicing detector component, it is characterised in that the alignment splicing detector component Include the detector chip of several alignments splicing on substrate, in the vacuum cavity of shell encirclement, the electricity Deriving structure includes ceramic substrate in the vacuum cavity, soft band, low deflation rate connector and on the shell Air-tightness connector；Wherein, the substrate and the ceramic substrate are each attached on metal substrate, are welded and realized by lead Electricity UNICOM, one end of the soft band are also secured on the metal substrate, and one end and the ceramic substrate of the soft band lead to Cross lead welding and realize electricity UNICOM, the other end of the soft band is connected with one end of the low deflation rate connector, described low The other end of deflation rate connector is connected with the air-tightness connector on the shell.
- 2. the electric leading-out structure of alignment splicing detector component as claimed in claim 1, it is characterised in that also including soft band Pressing plate and soft band housing screw, one end of the soft band is pressed together on pressing plate by soft described in the soft band compression screw in compression On the metal substrate.
- 3. the electric leading-out structure of alignment splicing detector component as claimed in claim 1, it is characterised in that the substrate is Jewel substrate.
- 4. the electric leading-out structure of alignment splicing detector component as claimed in claim 1, it is characterised in that the ceramic base Plate is LTCC.
- 5. the electric leading-out structure of alignment splicing detector component as claimed in claim 1, it is characterised in that the chip is Mercury-cadmium-tellurium detector chips.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710623118.3A CN107564971B (en) | 2017-07-27 | 2017-07-27 | A kind of electric leading-out structure of alignment splicing detector component |
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| CN201710623118.3A CN107564971B (en) | 2017-07-27 | 2017-07-27 | A kind of electric leading-out structure of alignment splicing detector component |
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| CN107564971A true CN107564971A (en) | 2018-01-09 |
| CN107564971B CN107564971B (en) | 2019-11-26 |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109449215A (en) * | 2018-09-20 | 2019-03-08 | 中国电子科技集团公司第十研究所 | A kind of infrared detector electricity ejector |
| CN110797415A (en) * | 2019-10-28 | 2020-02-14 | 中国电子科技集团公司第十一研究所 | Lead wire assembly and infrared detector |
| CN112013886A (en) * | 2020-08-28 | 2020-12-01 | 中国电子科技集团公司第十一研究所 | Infrared detector splicing module and infrared detector integrated assembly |
| CN112540196A (en) * | 2020-11-06 | 2021-03-23 | 中国电子科技集团公司第十一研究所 | Connecting device for testing infrared detector chip |
| CN112614804A (en) * | 2020-11-30 | 2021-04-06 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Heating sucker assembly and chip splicing device |
| CN113655535A (en) * | 2021-07-05 | 2021-11-16 | 中国电子科技集团公司第十一研究所 | Lead-out component and infrared detector |
| CN114242798A (en) * | 2021-12-10 | 2022-03-25 | 湖南科莱特光电有限公司 | Frame structure and infrared detector |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101226925A (en) * | 2008-02-01 | 2008-07-23 | 中国科学院上海技术物理研究所 | Wiring structure of long line series infrared detector dewar assembly and connecting method thereof |
| US20100096703A1 (en) * | 2008-10-16 | 2010-04-22 | Nec Electronics Corporation | Semiconductor device and manufacturing method thereof |
| CN102903783A (en) * | 2012-10-23 | 2013-01-30 | 昆明物理研究所 | Amorphous tellurium-cadmium-mercury/crystalline silicon heterojunction infrared-detector and manufacturing method thereof |
| JP2013157622A (en) * | 2013-03-25 | 2013-08-15 | Nikon Corp | Back side illumination imaging element and imaging apparatus |
-
2017
- 2017-07-27 CN CN201710623118.3A patent/CN107564971B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101226925A (en) * | 2008-02-01 | 2008-07-23 | 中国科学院上海技术物理研究所 | Wiring structure of long line series infrared detector dewar assembly and connecting method thereof |
| US20100096703A1 (en) * | 2008-10-16 | 2010-04-22 | Nec Electronics Corporation | Semiconductor device and manufacturing method thereof |
| CN102903783A (en) * | 2012-10-23 | 2013-01-30 | 昆明物理研究所 | Amorphous tellurium-cadmium-mercury/crystalline silicon heterojunction infrared-detector and manufacturing method thereof |
| JP2013157622A (en) * | 2013-03-25 | 2013-08-15 | Nikon Corp | Back side illumination imaging element and imaging apparatus |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109449215A (en) * | 2018-09-20 | 2019-03-08 | 中国电子科技集团公司第十研究所 | A kind of infrared detector electricity ejector |
| CN109449215B (en) * | 2018-09-20 | 2020-04-24 | 中国电子科技集团公司第十一研究所 | Infrared detector electricity leading-out device |
| CN110797415A (en) * | 2019-10-28 | 2020-02-14 | 中国电子科技集团公司第十一研究所 | Lead wire assembly and infrared detector |
| CN112013886A (en) * | 2020-08-28 | 2020-12-01 | 中国电子科技集团公司第十一研究所 | Infrared detector splicing module and infrared detector integrated assembly |
| CN112013886B (en) * | 2020-08-28 | 2023-03-03 | 中国电子科技集团公司第十一研究所 | Infrared detector splicing module and infrared detector integrated assembly |
| CN112540196A (en) * | 2020-11-06 | 2021-03-23 | 中国电子科技集团公司第十一研究所 | Connecting device for testing infrared detector chip |
| CN112614804A (en) * | 2020-11-30 | 2021-04-06 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Heating sucker assembly and chip splicing device |
| CN113655535A (en) * | 2021-07-05 | 2021-11-16 | 中国电子科技集团公司第十一研究所 | Lead-out component and infrared detector |
| CN114242798A (en) * | 2021-12-10 | 2022-03-25 | 湖南科莱特光电有限公司 | Frame structure and infrared detector |
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| Publication number | Publication date |
|---|---|
| CN107564971B (en) | 2019-11-26 |
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