CN112614794A - 一种晶圆用高温药液清洗设备及其清洗工艺 - Google Patents
一种晶圆用高温药液清洗设备及其清洗工艺 Download PDFInfo
- Publication number
- CN112614794A CN112614794A CN202011448759.8A CN202011448759A CN112614794A CN 112614794 A CN112614794 A CN 112614794A CN 202011448759 A CN202011448759 A CN 202011448759A CN 112614794 A CN112614794 A CN 112614794A
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- China
- Prior art keywords
- wafer
- nozzle
- heating plate
- cleaning
- diw
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 91
- 239000007788 liquid Substances 0.000 title claims abstract description 76
- 239000003814 drug Substances 0.000 title claims abstract description 26
- 238000000034 method Methods 0.000 title claims abstract description 18
- 238000010438 heat treatment Methods 0.000 claims abstract description 95
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims abstract description 38
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims abstract description 19
- 235000012431 wafers Nutrition 0.000 claims description 115
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 26
- 238000005507 spraying Methods 0.000 claims description 21
- 239000007921 spray Substances 0.000 claims description 19
- 239000004254 Ammonium phosphate Substances 0.000 claims description 17
- 229910000148 ammonium phosphate Inorganic materials 0.000 claims description 17
- 235000019289 ammonium phosphates Nutrition 0.000 claims description 17
- MNNHAPBLZZVQHP-UHFFFAOYSA-N diammonium hydrogen phosphate Chemical compound [NH4+].[NH4+].OP([O-])([O-])=O MNNHAPBLZZVQHP-UHFFFAOYSA-N 0.000 claims description 17
- 239000000126 substance Substances 0.000 claims description 17
- 229910021641 deionized water Inorganic materials 0.000 claims description 13
- 229910052757 nitrogen Inorganic materials 0.000 claims description 13
- 238000001035 drying Methods 0.000 claims description 11
- 238000005406 washing Methods 0.000 claims description 6
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 abstract description 11
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 abstract description 8
- 239000002245 particle Substances 0.000 abstract description 7
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 abstract description 3
- 229940079593 drug Drugs 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 6
- 230000007547 defect Effects 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 3
- 239000007789 gas Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000008155 medical solution Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000001117 sulphuric acid Substances 0.000 description 1
- 235000011149 sulphuric acid Nutrition 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
Description
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202011448759.8A CN112614794A (zh) | 2020-12-09 | 2020-12-09 | 一种晶圆用高温药液清洗设备及其清洗工艺 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202011448759.8A CN112614794A (zh) | 2020-12-09 | 2020-12-09 | 一种晶圆用高温药液清洗设备及其清洗工艺 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN112614794A true CN112614794A (zh) | 2021-04-06 |
Family
ID=75232962
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202011448759.8A Pending CN112614794A (zh) | 2020-12-09 | 2020-12-09 | 一种晶圆用高温药液清洗设备及其清洗工艺 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN112614794A (zh) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001015470A (ja) * | 1999-07-02 | 2001-01-19 | Semiconductor Leading Edge Technologies Inc | 枚葉式洗浄装置および枚葉式洗浄方法 |
US6443168B1 (en) * | 1999-05-31 | 2002-09-03 | Hitachi Kokusai Electric Inc. | Plate-like specimen fluid-treating apparatus and plate-like specimen fluid-treating method |
JP2016219773A (ja) * | 2015-05-15 | 2016-12-22 | 東京エレクトロン株式会社 | 基板処理装置、基板処理方法および記憶媒体 |
CN110767571A (zh) * | 2018-07-27 | 2020-02-07 | 长鑫存储技术有限公司 | 一种晶圆湿处理设备及晶圆湿处理方法 |
CN213845234U (zh) * | 2020-12-09 | 2021-07-30 | 若名芯半导体科技(苏州)有限公司 | 一种晶圆用高温药液清洗设备 |
-
2020
- 2020-12-09 CN CN202011448759.8A patent/CN112614794A/zh active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6443168B1 (en) * | 1999-05-31 | 2002-09-03 | Hitachi Kokusai Electric Inc. | Plate-like specimen fluid-treating apparatus and plate-like specimen fluid-treating method |
JP2001015470A (ja) * | 1999-07-02 | 2001-01-19 | Semiconductor Leading Edge Technologies Inc | 枚葉式洗浄装置および枚葉式洗浄方法 |
JP2016219773A (ja) * | 2015-05-15 | 2016-12-22 | 東京エレクトロン株式会社 | 基板処理装置、基板処理方法および記憶媒体 |
CN110767571A (zh) * | 2018-07-27 | 2020-02-07 | 长鑫存储技术有限公司 | 一种晶圆湿处理设备及晶圆湿处理方法 |
CN213845234U (zh) * | 2020-12-09 | 2021-07-30 | 若名芯半导体科技(苏州)有限公司 | 一种晶圆用高温药液清洗设备 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20220822 Address after: Room 101, building 4, northwest Suzhou nano City, 99 Jinjihu Avenue, Suzhou Industrial Park, 215000, Jiangsu Province Applicant after: RUOMINGXIN SEMICONDUCTOR TECHNOLOGY (SUZHOU) Co.,Ltd. Applicant after: Rumingxin equipment (Suzhou) Co.,Ltd. Address before: Room 101, building 4, northwest Suzhou nano City, 99 Jinjihu Avenue, Suzhou Industrial Park, 215000, Jiangsu Province Applicant before: RUOMINGXIN SEMICONDUCTOR TECHNOLOGY (SUZHOU) Co.,Ltd. |