CN112595922A

CN112595922A - Sorting machine for testing electronic components

Info

Publication number: CN112595922A
Application number: CN202011106276.XA
Authority: CN
Inventors: 罗闰成; 卢锺基
Original assignee: Techwing Co Ltd
Current assignee: Techwing Co Ltd
Priority date: 2016-09-09
Filing date: 2017-09-08
Publication date: 2021-04-02
Anticipated expiration: 2037-09-08
Also published as: KR20180028882A; CN112595922B; KR20240011209A; TW201818085A; TWI629489B

Abstract

The present invention relates to a handler for testing electronic parts. The handler for testing electronic parts according to the present invention comprises: and a moving chamber capable of accommodating the test tray loaded with the electronic components and moving along a predetermined moving path. And, the moving chamber may include: a first chamber part for adjusting a temperature of the electronic parts stacked on the test tray; and a second chamber part for restoring the temperature of the electronic components stacked on the test tray to normal temperature. According to the present invention, since a plurality of test windows can be arranged in a unit form by configuring a movable chamber, an installation space for a processing capacity can be greatly reduced, and an installation area can be minimized by dividing one chamber into two chambers and additionally installing functions.

Description

Sorting machine for testing electronic components

The present application is a divisional application of a patent application having an application date of 2017, 9/8, application No. 201710805550.4, entitled "handler for testing electronic components".

Technical Field

The present invention relates to a handler for testing electronic parts.

Background

The produced electronic components are classified into good products and defective products after being tested by a tester, and only the good products are shipped.

The electrical connection between the tester and the electronic components is realized by a handler (hereinafter, simply referred to as "handler") for testing the electronic components, and there are various handlers depending on the kinds of the electronic components. The present invention relates to a handler to which a test tray capable of stacking a plurality of electronic components is applied.

The sorting machine using the test tray has various forms including korean laid-open patent No. 10-2013-0105104, etc., and generally, as shown in a conceptual plan view of fig. 1, includes: a loader 110; a first chamber 120; a test chamber 130; a connector 140; a second chamber 150, and an unloader 160.

The loader 110 loads the stack on a Customer-tray (Customer-tray) CT₁The electronic parts to be tested are loaded to the test tray TT located at a LOADING POSITION (LP).

The first chamber 120 is provided for temperature adjustment (preheating or precooling) in advance according to the test temperature condition before testing the electronic components stacked on the accommodated test tray TT.

The TEST chamber 130 is provided for testing the electronic components on the TEST tray TT which is transferred to a TEST POSITION (TP) after the first chamber 120 is preheated/precooled. That is, the test chamber 130 is provided to maintain the temperature of the electronic components stacked on the housed test tray TT at the test temperature condition.

The connector 140 electrically connects the electronic components stacked on the test tray TT at the test position TP to the tester.

The second chamber 150 is provided to cool the electronic components in a heated state on the test tray TT transferred from the test chamber 130 to return to room temperature or a predetermined temperature at which no problem occurs during unloading.

The unloader 160 sorts by test grade and moves to an empty customer tray CT while UNLOADING electronic parts from the test tray TT located at an UNLOADING POSITION (UP)₂。

As described above, the test tray TT circulates in the circulation path CC passing through the loading position LP, the test position TP, and the unloading position UP and returning to the loading position LP, and for this purpose, a plurality of conveyors, not shown, transfer the test tray TT among the sections forming the circulation path CC.

In addition, as shown in fig. 1, since the handler 100 has a structure in which the test chamber 130 is positioned between the first chamber 110 and the second chamber 150 and a structure in which the test tray TT is transferred to the closed circulation path CC, it is difficult to arrange 4 or more test windows TW in consideration of the width and height of the equipment. Here, the test window TW refers to a window where the electronic component is electrically connected to a TESTER (TESTER), and each 1 test window TW corresponds to 1 test tray TT. Of course, the TESTER (TESTER) is coupled to the sorter 100 through the test window TW.

Therefore, the electronic components testable by 1 pass are also limited to the number of test trays TT stacked in at least 1 to at most 3, which makes the sorter 100 incapable of being infinitely enlarged in size to have a limit in processing capacity.

Disclosure of Invention

An object of the present invention is to provide a technique in which one chamber for temperature adjustment can supply test trays to a plurality of test windows or can receive test trays from a plurality of test windows.

A handler for testing electronic parts according to a first aspect of the present invention comprises: a moving chamber capable of accommodating a test tray on which electronic components are stacked and moving along a predetermined moving path; a transfer device that transfers the moving chamber on the moving path; a connector disposed at least one side of the moving path to receive the test tray from the moving chamber or supply the test tray to the moving chamber, and electrically connecting or disconnecting the electronic component to or from the tester combined with the test window to enable an electrical characteristic test of the electronic component stacked on the test tray; and at least one moving device for moving the test tray between the moving chamber and the connector.

The at least one moving means may be provided in the moving chamber to move together with the moving chamber.

The moving chamber includes: a first chamber part for adjusting a temperature of the electronic parts stacked on the test tray; and a second chamber portion disposed side by side with the first chamber portion in an up-and-down direction to restore the temperature of the electronic component stacked on the test tray to a normal temperature, the first chamber portion and the second chamber portion being separated from each other by a partition wall.

The first chamber portion comprises: a door for opening and closing a first moving hole for receiving a test tray at a loading position or transferring the test tray to the connector, the second chamber portion comprising: a second transfer hole for transferring the test tray to the unloading position or receiving the test tray from the connector, the interior of the second chamber section communicating with the outside through the second transfer hole.

The method can also comprise the following steps: an elevator for elevating the movable chamber to a position where the test tray can be transferred from the first chamber portion to the connector or to a position where the second chamber portion can receive the test tray from the connector.

The method can also comprise the following steps: and a lifter configured to lift the test tray carried into the test chamber from the first chamber portion, thereby allowing the test tray containing the tested electronic component to be carried out to the second chamber portion disposed above the first chamber portion.

The test windows are multiple, and the connectors are respectively configured on the multiple test windows.

Further comprising: and a plurality of test chambers for receiving the test trays from the moving chambers and being disposed at the side of each test window to maintain a test temperature condition of the electronic components, wherein the moving chambers and the test chambers have a one-to-many number relationship.

The connectors are respectively configured at two sides of the moving path.

The method can also comprise the following steps: a test chamber for receiving the test tray from the moving chamber and maintaining the temperature of the electronic components stacked on the received test tray at a test temperature; and an isolator for isolating the electronic components of the test tray located on a path moving from the moving chamber to the test chamber from outside air.

The separator further includes: a first buffer chamber which is on standby before a test tray on which electronic components to be tested are stacked moves to the moving chamber; and a second buffer chamber for receiving and waiting the test tray loaded with the tested electronic components from the moving chamber, wherein the first buffer chamber and the second buffer chamber can be configured in a fixed type.

Before the test tray moves from the inside of the first buffer chamber to the inside of the moving chamber, the thermal state inside the first buffer chamber is transferred to the inside of the moving chamber through a closed passage formed between the first buffer chamber and the moving chamber, so that the temperature inside the moving chamber is equalized to the temperature inside the first buffer chamber.

A handler for testing electronic parts according to a second aspect of the present invention comprises: a receiving chamber capable of receiving a test tray on which electronic components are stacked; a connector configured to receive the test tray from the receiving chamber or transfer the test tray to the receiving chamber, to electrically connect or disconnect the electronic component to or from the tester combined with the test window, to enable an electrical characteristic test of the electronic component stacked on the test tray, and configured at one side of the receiving chamber; and a plurality of moving devices for moving the test tray between the receiving chamber and the connector, the receiving chamber including: a first chamber part for adjusting a temperature of the electronic parts stacked on the test tray; and a second chamber portion integrally coupled to the first chamber portion and arranged side by side, an interior of the second chamber portion being separated from the first chamber portion by a partition wall, for returning a temperature of the electronic components stacked on the test tray to a normal temperature, wherein one of the plurality of moving devices moves the test tray from the first chamber portion to the connector, and the other moves the test tray from the connector to the second chamber portion.

The first chamber portion and the second chamber portion are arranged side by side in the vertical direction.

According to the present invention, the following effects are obtained.

First, by constituting a movable chamber that can access the test windows, a plurality of test windows can be arranged in a unit form, and thus the size of the handler with respect to the processing capacity can be minimized.

Second, one moving chamber may be connected to a plurality of test chambers (or connectors) while moving, and thus the number of movers for passing the test tray through each test chamber may be considerably reduced accordingly, so that the size may be more minimized and the production cost may be reduced.

Third, since the number of cells can be increased or decreased with the same configuration, it is easy to manufacture a sorting machine that meets the requirements of a client company. That is, it is not necessary to design the capacitor separately for the increase and decrease of the capacity.

Fourth, one moving chamber can be accessed to each test chamber (or connector), and thus if the moving chamber is divided into two regions to set its functions differently, it is possible not only to perform tests in various temperature environments but also to further minimize the size of the handler.

Fifth, equipment may be optimized for devices where test times should be longer than the ambient formation time within the mobile chamber.

Drawings

Fig. 1 is a conceptual plan view of a conventional handler for testing electronic components.

Fig. 2 is a conceptual plan view of a sorter according to a first embodiment of the present invention.

Fig. 3 is a schematic front sectional view of a moving chamber corresponding to the sorter of fig. 2.

Fig. 4 is a conceptual perspective view of a lift cam mechanism corresponding to the moving chamber of fig. 3.

Fig. 5 is a diagram for explaining the operation of the lifting cam mechanism of fig. 4.

Fig. 6 is a conceptual front view of an elevating mechanism applied to the sorter of fig. 2.

Fig. 7 is a reference diagram for explaining the operation of the elevator of fig. 6.

Fig. 8 is a conceptual plan view of a transporter corresponding to the sorter of fig. 2.

Fig. 9 is a conceptual front sectional view of a test chamber corresponding to the handler of fig. 2.

Fig. 10 is a conceptual side sectional view of a connector corresponding to the sorter of fig. 2.

Fig. 11 is a diagram for explaining the operation of the connector of fig. 10.

Fig. 12 is a conceptual perspective view of a moving device applied to the sorting machine of fig. 2.

Fig. 13 is a diagram for explaining the operation of the mobile device of fig. 12.

Fig. 14 is a conceptual front sectional view of an isolator corresponding to the sorter of fig. 2.

Fig. 15 is a diagram for explaining the operation and function of the isolator of fig. 12.

Fig. 16 is a conceptual plan view of a sorter according to a second embodiment of the invention.

Fig. 17 is a conceptual plan view of a sorter according to a modification of the second embodiment of the present invention.

Fig. 18 is a conceptual plan view of a sorter according to embodiment 3 of the invention.

Fig. 19 is a view showing a case where a plurality of the sorting machines of fig. 18 are used in parallel.

Fig. 20 is a conceptual plan view of a sorter according to embodiment 4 of the invention.

Fig. 21 is a schematic view of an elevator of an additional example for implementing the movement of test trays between the moving chamber and the test chambers in the present invention.

Description of the symbols

200: the sorter 210: moving chamber

211: first chamber portion 212: second chamber section

220: the elevator 230: transfer device

241-248: test chambers 251 to 258: connector with a locking member

261a, 261 b: first moving device 262a, 262 b: second moving device

271: the loader 272: unloading machine

291. 292: isolator

Detailed Description

Preferred embodiments according to the present invention will be described with reference to the accompanying drawings, but descriptions of overlapping or identical structures will be omitted or compressed as much as possible for the sake of simplicity of description.

< first embodiment >

1. General description of the constitution

Fig. 2 is a conceptual plan view of a sorter 200 according to the first embodiment of the present invention.

The sorter 200 according to the present embodiment includes: a moving chamber 210; an elevator 220; a shifter 230; 8 test chambers 241-248; 8 connectors 251-258; 2 first moving

devices

261a, 261 b; 2 second mobile devices 262a, 262 b; a loader 271; an unloader 272; a first player 281; a second player 282; driving the tester DT; 2

isolators

291, 292.

The moving chamber 210 moves back and forth in the front and rear directions by a predetermined moving path MC. Such a moving chamber 210 may house a Test Tray (TT).

The elevator 220 elevates the moving chamber 210. This is to enable the moving chamber 210 to provide the test tray TT to the test chambers 241-248 or the unloading position UP or receive the test tray TT from the test chambers 241-248 or the loading position LP in a proper position.

The mover 230 moves the moving chamber 210 on the moving path MC.

The 8 test chambers 241-248 are disposed on the left and right sides of the moving path MC for 4, respectively, and are disposed to maintain the test temperature condition of the electronic components of the test tray TT.

The 8 connectors 251-258 electrically connect the electronic components of the test tray TT received in the test chambers 241-248 to the tester (not shown). Also, each of the connectors 251-258 is configured to receive a test tray TT from the moving chamber 210 or provide a test tray TT to the moving chamber 210. Therefore, 4 connectors 251 to 258 are also arranged on the left and right sides of the moving path MC.

The 2 first moving

devices

261a and 261b and the 2 second moving devices 262a and 262b are disposed in the moving chamber 210 and move together with the moving chamber 210. Here, the

first transfer devices

261a and 261b perform a function of transferring the test tray TT loaded with the electronic components from the loading position LP to the transfer chamber 210 or transferring the test tray TT accommodated in the transfer chamber 210 to the respective test chambers 241 to 248. The second transfer devices 262a and 262b perform a function of transferring the test trays TT located in the test chambers 241 to 248 to the transfer chamber 210 or to the unloading position UP.

Loader 271 makes and locates at customer's tray CT₁To the test tray TT located at the loading position LP.

The unloader 272 moves the electronic parts from the test tray TT located at the unloading position UP to the empty customer tray CT₂、CT₃。

The first opening machine 281 enables the electronic components to be properly stacked on the test tray TT by opening the test tray TT located at the loading position LP.

The second opener 282 enables the electronic components to be appropriately removed from the corresponding test tray TT by opening the test tray TT located at the unloading position UP.

The drive tester DT is provided for simply testing whether the electronic component is electrically driven or not.

The 2

isolators

291 and 292 are provided in the moving chamber 210 and perform a function of isolating the test tray TT moving from the moving chamber 210 to the test chambers 241 to 248 from the outside air.

2. Description of the respective configurations

A. Description of the moving Chamber 210

As shown in the schematic front sectional view of fig. 3, the moving chamber 210 is divided into a first chamber portion 211 on a lower side and a second chamber portion 212 on an upper side by a partition wall DW. Here, the partition wall DW is preferably made of a heat insulating material in order to insulate the heat movement.

The first chamber portion 211 is provided for previously adjusting the temperature of the electronic components stacked on the test tray TT so as to be able to correspond to the test temperature environment condition. Such a first chamber portion 211 may selectively have or entirely have a heater HT for forming a high temperature environment and a cooling module CM for forming a low temperature environment according to application conditions of the sorter 200. Here, the heater HT is preferably disposed at a lower portion of the first chamber portion 211 and the cooling module CM is preferably disposed at an upper portion of the first chamber portion 211 in consideration of air movement according to an air temperature state. Here, the cooling module CM may be configured by the evaporator 1, the circulation fan 2, and the case 3, and the inside air of the first chamber portion 211 is circulated in such a manner as to be discharged from the case 3 through the evaporator 1 after flowing into the inside of the case 3 by the circulation fan 2, thereby cooling the electronic components of the test tray TT. Here, in order to prevent the driving motor 2a of the circulation fan 2 from being damaged by heat or frost formation, it is preferably disposed outside the first chamber portion 211.

For reference, according to an implementation, the moving chamber 210 may be embodied such that the first chamber portion 211 functions as a heating chamber and the second chamber portion 212 functions as a cooling chamber. In this case, considering the principle that the cold air is decreased by the increase of the hot gas and the reason of the equipment structure, it is preferable that the lower part is generally filled with many structures and the upper part is opened without other structures, and the first chamber portion 211 for increasing the temperature is disposed on the lower side and the second chamber portion 212 for decreasing the temperature is disposed on the upper side. In the case of the room temperature test, the upper second chamber section 212 may be designed to be opened to the maximum extent, but in order to return to the predetermined temperature or cool to the predetermined temperature, it is also conceivable that the second chamber section 212 is also configured to be closed so as to isolate the outside air.

In order to receive the test tray TT from the loading position LP on the left side of the moving path MC or to selectively transfer the test tray TT to the test chambers 241 to 248 respectively positioned on the left and right sides of the moving path MC, the first chamber portion 211 is formed with a left moving hole LH on the left sidewall₁A right moving hole RH is formed on the right side wall₁. It is apparent that the first chamber portion 211 has a hole LH for opening and closing the left moving hole in order to isolate the inside of the first chamber portion 211 from the outside air₁Left side switch door LD and right side moving hole RH₁The right side of which opens and closes the door RD. Here, each of the opening and closing doors LD, RD may be configured to be lifted and lowered by another driving source such as a cylinder CD to open and close the moving hole LH₁、RH₁. Obviously, the opening and closing door may be configured to be opened and closed by a hinge structure according to an implementation, but it is more preferable to use a lifting structure in order to prevent the width of the equipment from being widened.

Also, the first chamber portion 211 has a pair of support rails 211a and an elevating cam mechanism 211 b.

The pair of support rails 211a support front and rear ends of the test tray TT received in the first chamber portion 211 and guide movement of the test tray TT moving in the left-right direction.

The lifting cam mechanism 211b lifts and lowers the pair of support rails. For this, as shown in fig. 4, the lifting cam mechanism 211b includes: a drive shaft DS; a driven shaft PS; a conveyor belt TB and a rotation motor RM.

A cam protrusion CP having a center O' offset from the center O of each shaft is formed on the driving shaft DS and the driven shaft PS. The pair of support rails 211a are supported in a state of being lifted by the cam protrusion CP.

The conveyor belt TB transmits the rotational force of the drive shaft DS to the driven shaft PS. It is contemplated that the conveyor belt TB may preferably be constructed of a timing belt to achieve accurate linkage of the drive shaft DS and the driven shaft PS.

The rotation motor RM rotates the drive shaft DS. Therefore, if the rotation motor RM is operated, the driving shaft DS and the driven shaft PS are rotated to rotate the cam protrusion CP, and the support rail 211a is lifted up and down by a predetermined height H as shown in fig. 5. Obviously, as the support rail 211a is lifted, the test tray TT placed on the support rail 211a is also lifted together.

The second chamber section 212 is arranged to change the temperature of the electronic component subjected to the test to be close to normal temperature, or to change the temperature to a temperature at least to an extent that the electronic component can be appropriately unloaded without damage to the electronic component or the unloader 272.

The second chamber portion 212 is also configured in a closed structure according to an application condition of the handler 200, and may be configured to selectively have or entirely have a heater for increasing the temperature of the electronic part and a cooling module for reducing the temperature of the electronic part. However, in the present embodiment, the cooling structure is only the simplest cooling structure in which the electronic component is exposed to the outside air in order to change the temperature of the tested electronic component to be close to the normal temperature, and the temperature of the electronic component is lowered by the exhaust fan VP.

The second chamber section 212 also has left side shift holes LH formed in the left and right side walls thereof so that the test tray TT can be received from the test chambers 241 to 248 located on the left and right sides of the shift path MC or transferred to the unloading position UP located on the front of the right side₂With right hand moving hole RH₂. Also, the second chamber portion 212 in this embodiment does not have the left moving hole LH opened and closed to expose the electronic components inside thereof to the outside air₂With right hand moving hole RH₂The other opening and closing door of (2) is also formed with communication holes CH in the front and rear side walls so that the inside thereof is more exposed to the outside air.

Likewise, the second chamber section 212 also includes: a pair of front and rear support rails 212a for supporting the accommodated test tray TT and guiding the movement of the test tray TT moving in the left-right direction; and an elevating cam mechanism 212b for elevating the support rail 212 a.

As described above, the first chamber section 211 functions as a supply chamber for supplying the test tray TT to the test chambers 241 to 248, and the second chamber section 212 functions as a recovery chamber for recovering the test tray TT from the test chambers 241 to 248. Also, the first CHAMBER portion 211 functions as a heat treatment CHAMBER (SOAK CHAMBER) for applying temperature stimulus to the electronic components, and the second CHAMBER portion 212 functions as an annealing treatment CHAMBER (DESOAK CHAMBER) for eliminating the temperature stimulus from the electronic components. Obviously, the upper and lower positions of the two

chamber portions

211, 212 may also be interchanged.

B. Description of the Elevator (220)

The elevator 220 elevates the moving chamber 210. This is to enable the moving chamber 210 to provide or receive the test tray TT in a proper position. As shown in fig. 6, such a lifter 220 may be constituted by a lifting cylinder 221 provided to a moving frame 231 of a conveyor 230.

Therefore, if the elevating cylinder 221 is operated, as shown in fig. 7, the moving hole LH of the first chamber portion 211₁、RH₁At the same height as the opening and closing holes OH of the test chambers 241-248 or the moving hole LH of the second chamber part 212₂、RH₂At the same height as the switch holes of the test chambers 241-248. Therefore, the test tray TT can move from the first chamber part 211 to the test chambers 241 to 248 or from the test chambers 241 to 248 to the second chamber part 212. Obviously, the lifting cylinder 221 may be configured in one or more numbers.

As a means for adjusting the appropriate position, the two

openers

281 and 282 may be moved up and down instead of moving the chamber 210. However, in this case, since it is necessary to provide one or more lifting cylinders for each of the

openers

281 and 282, it is more preferable to form the movable chamber 210 to be lifted and lowered in view of optimizing the production cost and the equipment size, controlling the side surface, and the like.

It is obvious that, when the vertical height of the test chambers 241 to 248 is higher than that of the moving chamber 210 and the electronic components are elevated in the test chamber, it is not necessary to separately construct an elevator for elevating the moving chamber 210 or the

openers

281 and 282. That is, in the case where the connector described below is implemented to allow the test tray TT to be selectively positioned at the height of the first chamber section 211 or the second chamber section 212, there is no need to separately provide an elevator for elevating the transfer chamber 210 or the

openers

281 and 282.

C. Description of the mover 230

The mover 230 moves the moving chamber 210 on the moving path MC. The moving path MC is a long path in the front-back direction capable of reciprocating between the loading position LP or unloading position UP on the left and right sides and the test chambers 241-248. As shown in fig. 8, the transfer 230 includes a moving frame 231, a rotating shaft 232, a transfer motor 233, and a pair of guide rails 234.

Since the moving frame 231 is coupled to the rotating shaft 232 by bolts, it can move in the front-rear direction according to the rotation of the rotating shaft 232. The elevator 220 is provided on the moving frame 231, and the moving chamber 210 is coupled to the elevator 220, so that the moving chamber 210 and the elevator 220 move together according to the movement of the moving frame 231.

In order to provide the moving path MC, the rotation shaft 232 is formed in a shape that is long in the front-rear direction.

The transfer motor 233 rotates the forward and reverse rotation shaft 232.

The pair of guide rails 234 guide the forward and backward movement of the moving frame 231.

D. Description of the test chambers 241-248

The 8 test chambers 241-248 are respectively arranged at the left and right sides of the moving path MC for 4.

As shown in the schematic front sectional view of fig. 9, in order to transfer the test tray TT from the transfer chamber 210 or to the transfer chamber 210, an opening hole OH is formed in the transfer path MC of the test chamber 241. It is a matter of course that a control door CG for controlling the opening and closing hole OH is disposed for heat insulation.

In addition, a test window TW is formed at a lower side of the test chamber 241, and a TESTER (TESTER) is coupled at the test window TW side. Generally, one test chamber 241-248 is configured with one test window TW, so that a total of 8 test windows TW are configured in the handler 200 according to the present embodiment. The test window TW is a test site (test area), i.e., an area where the test chamber meets the tester.

It is apparent that the test chamber 241 may selectively have or entirely have the heater HT forming a high temperature environment and the cooling module CM forming a low temperature environment according to the application condition of the handler 200. Obviously, for the uniform distribution of hot or cold air, it is preferable to dispose a fan for air circulation (PAN).

The test chamber 241 is provided with an electromagnet EM on the side of the switch hole OH. If power is supplied to such an electromagnet EM, the isolator 291 operates.

The test chambers denoted by symbols 242 to 248 are identical to the test chamber denoted by symbol 241 or symmetrical to each other with reference to the movement path MC, and therefore, the description thereof is omitted.

Since the test chambers 241 to 248 of the handler 200 according to the present invention are divided into left and right parts and arranged in a chamber, even in the case of a handler requiring an increased processing capacity, the transfer unit 230 described below can be configured to be longer and the test chambers can be additionally arranged, thereby simplifying the design.

Obviously, in the case of equipment for performing an ordinary temperature test configured so that the electronic component does not need to be maintained at a predetermined temperature when the test is performed, the test chamber does not need to be equipped. That is, the test chamber 241 may be disposed only in a device that needs to test the electronic component within a predetermined temperature range. Obviously, in the case of the room temperature test equipment, the test chamber may be configured in an open form.

E. Description of connectors 251-258

The 8 connectors 251 to 258 electrically connect the electronic components to the TESTER (TESTER) by pressing the electronic components of the test tray TT stacked in the test chambers 241 to 248 to the TESTER (TESTER) side (to be precise, the test slot side of the TESTER). For this, as shown in fig. 10, the connector 251 includes a gripping member GE and a pressurizing source PS.

The grip member GE is disposed inside the test chamber 241 and includes grip grooves GH for gripping both ends of the test tray TT. Here, since the grip groove GH is formed long in the left-right direction, the movement of the test tray TT moving in the left-right direction can be guided.

The pressurizing source PS may be configured as a motor to lower or raise the test tray TT gripped by the gripping member GE by lifting the gripping member GE. At this time, as shown in fig. 11a, if the connector 251 lowers the test tray TT, the electronic component is pressed toward the TESTER (TESTER) coupled therebelow, and the TESTER (TESTER) and the electronic component are electrically connected. As shown in fig. 11b, if the connector 251 lifts the test tray TT, the electrical connection between the TESTER (TESTER) and the electronic component is released.

Obviously, the movement of the test tray TT is effected in the state as shown in fig. 11 b.

For reference, in order to protect the pressurization source PS from the internal temperature environment of the test chamber 241, the pressurization source PS is preferably disposed outside the test chamber 241 (on the upper side of the test chamber in the present embodiment).

The connectors 252 to 258 are the same as the connector 251 or symmetrical to each other with reference to the movement path C, and therefore, the description thereof will be omitted.

F. Description of the moving

devices

261a, 261b, 262a, 262b

First moving

devices

261a, 261b are provided to the first chamber portion 211, the first moving device of symbol 261a being responsible for movement of the test tray TT in the left direction of the moving path C, and the first moving device of symbol 261b being responsible for movement of the test tray TT in the right direction of the moving path C.

The second transfer devices 262a, 262b are provided to the second chamber section 212, and the second transfer device of reference numeral 262a is responsible for the movement of the test tray TT in the left direction of the moving path C, and the second transfer device of reference numeral 262b is responsible for the movement of the test tray TT in the right direction of the moving path C.

As shown in fig. 12, the first moving device 261a includes a gripping push rod GS and a moving source MS.

The grip push rod GS has a grip pin GP for gripping the test tray TT at a left end thereof, and is formed with a rack gear RG in the left-right direction. As shown in fig. 13a and 13b, the grip pin GP is inserted into the grip hole GH of the test tray TT to grip the test tray TT when the test tray TT is raised by the operation of the lift cam mechanism 211b, and is disengaged from the grip hole GH when the test tray TT is lowered.

The movement source MS moves the grip push rod GS in the left-right direction, and moves the test tray TT gripped by the grip push rod GS in the left-right direction. To this end, the moving source MS includes a pinion gear PG gear-engaged with a rack gear RG that grips the push rod GS. Such a moving source MS is preferably considered to be arranged outside the moving chamber 210 to prevent thermal damage. Further, if the movement source MS is operated in the state of fig. 13a, as shown in fig. 13c, the test tray TT is also moved leftward as the grip push rod GS is moved leftward.

The first and

second movers

261b, 262a, 262b are configured to have substantially the same configuration, and therefore, the description thereof is omitted.

G. Description of the loader 271 and the unloader 272

The loader 271 and the unloader 272 may have a structure for moving the electronic component. The loader 271 and the unloader 272 are tools for grasping and moving the electronic parts and then placing the electronic parts at desired places, and may have various grasping structures according to kinds of the electronic parts. The technology regarding such various grip structures according to the kinds of electronic components is well known through korean patent laid-open publication nos. 10-2002-0049848, 10-2003-0016060, etc., and thus detailed description thereof is omitted. According to the implementation, an example in which the electronic components are supplied to the handler in a state of being stacked on the test tray may be exemplified, and in this case, the loader 271 may be omitted. In addition, when the test tray on which the tested electronic components are mounted is configured to be taken out from the handler and sorted by another device, the unloader 272 may be omitted.

H. Description of the

players

281, 282

The opening

devices

281 and 282 may perform a function of opening the test tray TT in order to load the electronic components on the test tray TT or take the electronic components out of the test tray TT. Obviously, the

openers

281 and 282 may have various opening structures according to the fixing structure of the electronic component type. The technology of such various open structures according to the kind of electronic components has also been known by korean patent laid-open publication nos. 10-2009-0008062, 10-2011-0136312, and the like, and thus detailed description thereof is omitted.

For reference, in a horizontal handler for performing a test in a state where a test tray is horizontal, a placement machine may be disposed or not disposed according to the kind of electronic components.

I. Description of the drive tester DT

The drive tester DT is used to test whether the electronic component is properly driven when power is supplied to the electronic component, and it is sufficient that the drive tester DT is configured such that the loader 271 can electrically connect the electronic component in a state of being gripped by the loader 271 to a position of the drive tester DT. The drive tester DT in this embodiment is disposed in front of the loading position LP to minimize the working radius of the loader 271.

J. Description of the

isolators

291, 292

The

isolators

291 and 292 may be arranged in any form as long as they can isolate the test tray TT moving from the moving chamber 210 to the test chambers 241 to 248 from the outside air (more specifically, isolate the electronic components moving together with the test tray from the outside air).

In the present embodiment, the

spacers

291 and 292 may surround the moving hole LH in the first chamber portion 211 of the moving chamber 210₁、RH₁Is disposed in the moving chamber 210. Obviously, according to the implementation, it is also preferably considered to provide 8 isolators in the test chambers 241-248.

As shown in fig. 14, in the present embodiment, the isolator 291 may be composed of a bellows WT and a coupling ring CR.

One side of the bellows WT is coupled to the moving chamber 210, and is disposed in a state capable of contracting and expanding in the left-right direction, and a passage through which the test tray TT can pass is formed inside.

The coupling ring CR is made of a magnetic material and is disposed at the left end of the bellows WT. As shown in fig. 15, such a coupling ring 291b is magnetically coupled to the right side wall surface of the test chamber 241 when the electromagnet EM located at the test chamber 241 is magnetized. Accordingly, the opening and closing hole (OH) of the test chamber 241 and the moving hole LH of the moving chamber 210₁A moving path MW of the test tray TT is formed which is closed from the outside air by the bellows WT. Such a separator 291 plays a role of preventing heat or cold loss to the maximum. In particular, in the low temperature test, dew condensation caused by the test tray (TT, including the electronic components stacked thereon) which is kept at a low temperature during the movement from the first chamber portion 211 to the test chambers 241 to 248 can be prevented, thereby preventing damage of the electronic components due to the dew condensation.

The separator denoted by reference numeral 292 is different from the separator denoted by reference numeral 291 only in direction, and the other structures are completely the same, and therefore, the description thereof is omitted.

For reference, in an example in which the first chamber section 211 functions as a heating chamber and the second chamber section 212 functions as a cooling chamber in a closed structure, 1 separator is disposed on each of the left and right sides of the first chamber section 211 and the left and right sides of the second chamber section 212, and 4 separators are disposed in total. That is, the isolator including the bellows may not be required when only the room temperature test is performed, but may be required when the test is performed at a predetermined temperature. This is because the principle of the frost formation phenomenon occurring when the object to be cooled meets air at normal temperature may cause damage to electronic components including semiconductor elements, and therefore, it is possible to provide an isolator in each of the two

chamber portions

211 and 212 or an isolator in each of the two

chamber portions

211 and 212 as necessary. For example, in the case of performing the room temperature test, the separator is not required, the moving chamber is not required to be divided into two chamber portions, and both the chamber portions may be formed in an open type. In this case, the moving chamber does not have a temperature adjusting function, and thus functions only as a relay test tray. Further, in the case of the low temperature test, both chamber portions need to have a closed structure, and in order to prevent the dewing phenomenon, both chamber portions need to be provided with a separator.

3. Reference item

A. Symbol a is a loading cart and symbol B is an unloading cart.

The loading cart a can stack a plurality of customer trays and is detachably attached to the sorter 200. Obviously, the customer tray CT stacked on the loading cart A₁On which the electronic components to be tested are loaded. In this case, the technique of mounting the loading cart a to the sorter 200 and the technique of placing the customer tray CT in the loading cart a₁The cyclic technique, which the present applicant has provided through korean patent application No. 10-2016-.

The unloading vehicle B can also stack a plurality of client trays CT₂And is detachably attached to the separator 100. The unloading vehicle B is used for stacking and loading a customer tray CT loaded with electronic components completing the test₂。

Obviously, it is also possible to consider configuring a loading stacker or unloading stacker basically mounted on a sorter instead of the loading cart a or the unloading cart B, and it is also possible to configure other supply or recovery devices in various manners.

B. In the unloading Box (C, Unloader Bin Box), a customer tray CT for stacking electronic components determined as defective is arranged₃。

C. The handler 200 may also include a buffer BT for temporarily stacking electronic components according to the selection, a recognizer (BR, for example, a barcode reader) for recognizing the electronic components, and the like.

D. As described above, the test tray TT has the grip hole GH into which the grip pin GP can be inserted, and may have various stacking structures according to the kind of the electronic components. Such various forms of test trays TT have been provided by prior patent documents such as korean laid-open patent nos. 10-2011 + 0136312 and 10-2008 + 0040654, and thus the description thereof is omitted.

E. In addition, in the present embodiment, the first Chamber section 211 is used as a heat treatment Chamber (Soak Chamber) to which thermal stress is applied, and the second Chamber section 212 is used as a heat release treatment Chamber (Desoak Chamber) to release the applied thermal stress. Also, a heater HT and a cooling module CM are disposed at the first chamber portion 211.

However, according to the embodiment, both the first chamber section and the second chamber section may be configured to be capable of sealing the inside thereof, and in this case, for example, the heater may be disposed in the first chamber section and the cooling module may be disposed in the second chamber section. Using this example, the first chamber section functions as a thermal processing chamber and the second chamber section functions as an annealing processing chamber during high temperature testing, and the second chamber section functions as a thermal processing chamber and the first chamber section functions as an annealing processing chamber during low temperature testing.

4. Description of the invention

The loader 271 moves the electronic components from the customer tray CT positioned at the uppermost side of the loading cart A₁To the test tray TT located at the loading position LP. At this time, the first opener 281 maintains the test tray TT in an opened state. In the process of moving the electronic component, the loader 271 electrically connects the gripped electronic component to the drive tester DT, thereby testing whether the electronic component is electrically driven. In this process, the electronic components judged to have a problem in the electric drive are stacked on the buffer BT, and the good electronic components are moved to the test tray TT. Obviously, since the electronic components are also recognized by the recognizer DA during the movement of the electronic components by the loader 271, individual history management can be performed on the electronic components.

Further, after the electronic components are loaded on the test tray TT at the loading position LP, the first moving device of reference numeral 261a operates to move the test tray TT at the loading position LP to the inside of the first chamber portion 211. Accordingly, the electronic components stacked on the test tray TT start assimilating into the internal temperature environment of the first chamber portion 211. At the same time, the transfer chamber 210 is moved to the side of the

test chambers

241, 242, 243, 244, 245, 246, 247, 248 which are currently empty, and the

first transfer device

261a or 261b operates to transfer the test tray TT from the first chamber portion 211 to the

test chambers

241, 242, 243, 244, 245, 246, 247, 248. At this time, the

isolators

291, 292 form a closed moving path MW that can move the test tray TT between the moving chamber 210 and the test chambers 241 to 248 (particularly, between the first test part and the test chambers). The test trays TT accommodated in the test chambers 241 to 248 are held by the holding member GE, and the pressurizing source PS operates to lower the test trays TT toward a TESTER (TESTER). When the lowering of the test tray TT is completed, the electronic components loaded on the test tray TT are electrically connected to a TESTER (TESTER), and the electronic components are tested in this state.

In addition, if the test of the electronic components is finished, the

connectors

251, 252, 253, 254, 255, 256, 257, 258 raise the test tray TT, and the second moving device 262a or 262b operates to move the test tray TT toward the second chamber portion 212. At this time, the moving chamber 210 is in a state of being lowered by the lifter 220, and thus the moving hole LH of the second chamber portion 212₂、RH₂At positions corresponding to the switch holes OH of the

test chambers

241, 242, 243, 244, 245, 246, 247. Next, if the test tray TT finishes moving into the second chamber section 212, the transfer chamber 210 moves forward to be located at the left side of the unloading position UP, and in this state, the second transfer device denoted by reference numeral 262b operates to move the test tray TT to the unloading position UP. Next, the unloader 272 operates to move the electronic components from the test tray TT located at the unloading position UP to the empty customer tray CT located on the upper side of the unloading vehicle B₂And (4) moving. At this time, the electronic components determined to be defective are stacked on the customer tray CT located in the unloading box C₃。

Fig. 16 is a conceptual plan view of the sorter 300 according to the second embodiment of the present invention.

The sorter 300 according to the present embodiment includes: a moving chamber 310; an elevator 320; a transporter 330; 8 test chambers 341-348; 8 connectors 351-358; 2 first moving

devices

361a, 361 b; 2 second

mobile devices

362a, 362 b; a loading/unloading machine 370; a first player 381; a second player 382; driving the tester DT; 2

isolators

391, 392. The structure and function of the moving chamber 310, the elevator 320, the transfer 330, the 8 testing chambers 341 to 348, the 8 connectors 351 to 358, the 2 first moving

devices

361a and 361b, the 2 second moving

devices

362a and 362b, the first opener 381, the second opener 382, the driving tester DT, and the 2

isolators

391 and 392 are respectively the same as the moving chamber 210, the elevator 220, the transfer 230, the 8 testing chambers 241 to 248, the 8 connectors 251 to 258, the 2 first moving

devices

261a and 261b, the 2 second moving devices 262a and 262b, the first opener 281, the second opener 282, the driving tester DT, and the 2

isolators

291 and 292 of the sorter 200 according to the first embodiment, and thus the description thereof is omitted.

However, in the sorter 300 according to the present embodiment, the loading position LP and the unloading position UP are not distinguished and are divided into the first position 1P and the second position 2P. Also, the first position 1P and the second position 2P may be converted into the loading position or the unloading position according to the operation state of the loading/unloading machine 370. That is, the loading/unloading machine 370 loads the electronic parts to be tested to the empty test tray TT located at the first position 1P or the second position 2P, or unloads the electronic parts from the test tray TT located at the first position 1P or the second position 2P on which the electronic parts subjected to the test are stacked.

In the handler 300 according to the present embodiment, in order to minimize the moving path of the loading/unloading machine 370, it is preferable that the drive tester DT is disposed in front of the moving chamber 310. Obviously, more than two drive testers may be provided.

In addition, depending on the implementation, it is also conceivable to dispose the loading/unloading machine as a first Picking machine (Picking machine) and a second Picking machine (Picking machine), and in this case, it is necessary to perform a control method for preventing operational interference between the first Picking machine and the second Picking machine or a separation design of the work area.

Fig. 17 is a conceptual plan view of a sorter 400 according to a modification of the second embodiment of the present invention.

In the modification of fig. 17, 3 unloading boxes C are provided without separately providing unloading vehicles₁、C₂、C₃The electronic components are arranged in a row in the left-right direction on the plane, so that good products and defective products can be sorted out from the electronic components unloaded from the test tray TT. Further, good products can be further classified into various grades.

< third embodiment >

Fig. 18 is a conceptual plan view of the sorter 500 according to embodiment 3 of the invention.

The sorter 500 according to the present embodiment includes: a housing chamber 510; a lifter 520; a test chamber 540; a connector 550; first

mobile devices

561a, 561 b; second

mobile devices

562a, 562 b; a loader/unloader 570, and a player 580.

In the present embodiment, the receiving chamber 510 is located in front of the testing chamber 540.

However, the housing chamber 510 has a structure in which the first chamber portion and the second chamber portion are vertically arranged side by side with a partition wall therebetween in the vertical direction, as in the first embodiment. That is, the first chamber portion and the second chamber portion are integrated to form one receiving chamber 510. The receiving chamber 510 in this embodiment does not move forward and backward but can be lifted and lowered only by the lifter 520.

The remaining configurations, i.e., the elevator 520, the test chamber 540, the connector 550, the first moving

devices

561a, 561b, the second moving

devices

562a, 562b, the loading/unloading machine 570, and the opening machine 580 are the same as the elevator 320, the test chambers 341 to 348, the connectors 351 to 358, the first moving

devices

361a, 361b, the second moving

devices

362a, 362b, the loading/unloading machine 370, and the opening machine 380 of the handler 300 in the second embodiment, and thus the description thereof is omitted.

For reference, fig. 19 shows a case where a plurality of the sorters 300 of fig. 18 are provided for use.

In the present embodiment, similarly, the lifter 520 may be omitted when the vertical heights of the housing chamber 510 and the test chamber 540, the structure for lifting the test tray TT in the test chamber 540, and the like are applied.

< fourth embodiment >

The present embodiment is an example of making the movement of the test tray TT smooth and enabling the electronic parts to reach the temperature required for the test more quickly.

Fig. 20 is a conceptual plan view of the sorter 600 according to embodiment 4 of the present invention.

The sorter 600 according to the present embodiment includes: a moving chamber 610; a lifter 620; a shifter 630; 8 test chambers 641-648; 8 connectors 651-658; 2 first moving means 661a, 661 b; 2 second

mobile devices

662a, 662 b; a loading and unloading machine 670; a first player 681; a second player 682; driving the tester DT; 2

isolators

691, 692. In the handler 600 according to the present embodiment, a first buffer chamber BC1 is disposed between the first handler 681 and the test chamber denoted by the reference numeral 641, and a second buffer chamber BC2 is disposed between the second handler 682 and the test chamber denoted by the reference numeral 645.

In the above configuration, the moving chamber 610, the elevator 620, the transfer 630, the 8 test chambers 641-648, the 8 connectors 651-658, the 2 first moving

devices

661a, 661b, the 2 second moving

devices

662a, 662b, the first opening machine 681, the second opening machine 682, the driving tester DT, the 2

isolators

691, 692 are substantially the same in configuration and function as the moving chamber 210, the elevator 220, the transfer 230, the 8 test chambers 241-248, the 8 connectors 251-258, the 2 first moving

devices

261a, 261b, the 2 second moving devices 262a, 262b, the first opening machine 281, the second opening machine 282, the driving tester DT, the 2

isolators

291, 292, respectively, in the first embodiment, and thus, description thereof will be omitted.

The loading and unloading machine 670 will be located at the customer tray CT₁To the test tray TT positioned at the loading position LP and to move the electronic components from the test tray TT positioned at the unloading position UP to the empty customer tray CT₂、CT₃. This loading and unloading machine 670 also functions in the same manner as the loading machine 271 and the unloading machine 272 of the first embodiment. That is, depending on whether the specification supports the fast test or the slow test, it is possible to appropriately select whether the loading and unloading are performed by one loading and unloading machine 670 as in the present embodiment or the equipment is designed by dividing the loading machine 271 and the unloading machine 272 as in the first embodiment.

The first buffer chamber BC1 waits after receiving the test tray TT on which the electronic components to be tested at the loading position LP are stacked, before moving to the moving chamber 610. Of course, as disclosed in korean laid-open patent No. 10-2008-0082591, it may be implemented that a plurality of test trays TT are received in the first buffer chamber BC1 and the received test trays TT are moved in parallel.

Also, the first buffer chamber BC1 may be configured to provide a temperature environment according to test conditions. In this case, the inside of the first buffer chamber BC1 is maintained at a high temperature during the high temperature test, and the inside of the first buffer chamber BC1 is maintained at a low temperature during the low temperature test.

In the second buffer chamber BC2, the test tray TT on which the electronic components subjected to the test from the moving chamber 610 are stacked is stored and stands by before moving to the unloading position UP. Such a second buffer chamber BC2 may be configured to eliminate thermal stimulation from the electronic components stacked on the test tray TT from the moving chamber 610. Similarly, the second buffer chamber may be configured to accommodate one or more test trays TT.

If the temperature of the electronic components is controlled by the first buffer chamber BC1 and the second buffer chamber BC2 configured as the fixed chambers, the time for the electronic components to stay in the moving chamber 610 can be saved and the utilization rate of the moving chamber 610 can be improved. Therefore, compared to the first embodiment in which the temperature of the electronic components is controlled only by the moving chamber 210 that can move by also performing the function of loading and transferring the electronic components, the test tray TT can be moved more rapidly, and thus the processing capacity can be increased.

Hereinafter, the description is continued on the operation of the sorter 600 according to the present embodiment as described above.

If the customer tray CT with the stack carrying the electronic components is to be loaded₁When the loading cart a is mounted on the handler 600, the loading and unloading machine 670 moves the electronic components from the customer tray CT positioned at the uppermost side of the loading cart a₁To the test tray TT located at the loading position LP. In this process, the loader/unloader 670 passes through the recognizer BR and the drive tester DT, and accordingly, after the electronic part is recognized by the recognizer BR, 1 test is completed by the drive tester DT, and the electronic part is screened once as defective or not according to the 1 test. At this time, the electronic component determined to be defective is stacked and loaded on the buffer BT

After the electronic components are loaded on the test tray TT located at the loading position LP, the test tray TT is moved to the first buffer chamber BC1, stands by, and then moved to the moving chamber 610. Then, the test tray TT is moved to the empty test chambers 641-648 side together with the moving chamber 610 and then supplied to the test chambers 641-648, and 2 tests of the electronic components stacked on the test tray TT are performed in the test chambers 641-648. If the 2-time testing of the electronic components is finished, the test tray TT is moved to the moving chamber 610 again, then moves to the second buffer chamber BC2 and waits, and then moves to the unloading position UP. Also, if all electronic components are unloaded from the test tray TT located at the unloading position UP by the loader-unloader 670, the test tray TT is moved from the unloading position UP to the loading position LP. It is apparent that the electronic parts unloaded from the test tray TT positioned at the unloading position UP by the loading and unloading machine 670 are moved to the empty customer tray CT positioned at the upper side of the unloading cart B₂Or the electronic parts judged as defective are moved to the customer tray CT located in the unloading box C₃。

For reference, since confirmation of the electronic components and a driving test process are increased at the time of loading and a time of applying the thermal stimulus to the electronic components is longer than a time of removing the thermal stimulus from the electronic components, it may be preferably considered that the first buffer chamber BC1 houses more test trays TT than the second buffer chamber BC 2.

As shown in the present embodiment, if the first buffer chamber BC1 and the second buffer chamber BC2 are disposed, the degree of freedom in designing the moving chamber 610 can be improved according to the control.

For example, as described below, the temperature of the moving chamber 610 may be assimilated by the first buffer chamber BC1 when performing a low temperature test.

When the low temperature test is performed, the inside of the first buffer chamber BC1 is formed at a temperature of-40 degrees. If the moving chamber 610 is located at the side of the first buffer chamber BC1, the isolator 691 operates to open the passage between the first buffer chamber BC1 and the moving chamber 610. At this point, the doors of the moving chamber 610 and the first buffer chamber BC1 are closed.

The temperature of the air in the passage is sensed by the sensing, and the first buffer chamber BC1 and the door of the moving chamber 610 are operated in 2 steps.

First, a process of equalizing the internal temperature of the passage opened by the isolator 691 with the internal temperature of the first buffer chamber BC1 is required. Therefore, a low-temperature gas of a degree that can assimilate the temperature of the passage is additionally injected into the first buffer chamber BC 1. Then, the door of the first buffer chamber BC1 is slightly opened as a first step, and the low-temperature gas additionally injected into the first buffer chamber BC1 functions to equalize the passage opened by the isolator 691 to a desired low temperature (-40 degrees or a temperature slightly lower than-40 degrees in some cases). That is, the passage opened by the isolator 691 is quickly equalized to the internal temperature of the first buffer chamber BC1 by the rapidly moving cold air of a required amount corresponding to the low-temperature gas additionally injected into the first buffer chamber BC1 through the slightly opened opening. Obviously, the door of the first chamber 610 maintains a closed state at this time.

If the passages opened by the isolator 691 due to the sensing are equalized to a desired low temperature, the door of the first buffer chamber BC1 is completely opened to the second step and a low temperature gas sufficient to equalize to the internal temperature of the moving chamber 610 is required, and thus the low temperature gas is additionally supplied to the first buffer chamber BC 1. After a sufficient amount of low-temperature gas is injected, the door of the moving chamber 610 is opened, and the temperature inside the moving chamber 610 also starts to be equalized to the inside of the buffer chamber BC 1. Obviously, the internal temperature of the moving chamber 610 is also sensed at this time. And, the internal temperature of the moving chamber 610 is rapidly lowered to a desired low temperature according to a convection phenomenon caused by the air pressure difference and the temperature difference. Here, the door of the moving chamber 610 may also be opened by 2 steps or more. Here, in a state where the door of the first buffer chamber BC1 is slightly opened, the internal temperature of the moving chamber 610 may be equalized to a desired low temperature, and then the door of the first buffer chamber BC1 may be completely opened. Depending on the implementation, the door of the moving chamber 610 may also be configured to be fully opened at the first step.

And, if the inside of the moving chamber 610 is assimilated to a desired low temperature, the test tray TT is moved from the first buffer chamber BC1 to the moving chamber 610.

That is, according to this example, before the test tray TT moves from the inside of the first buffer chamber BC1 to the moving chamber 610, the thermal state of the inside of the first buffer chamber BC1 is rapidly transferred to the inside of the moving chamber 610 through the closed passage formed between the first buffer chamber BC1 and the moving chamber 610 by the isolator 691, so that the temperature of the inside of the moving chamber 610 is equalized to the temperature of the inside of the first buffer chamber BC 1.

As described above, if the internal temperature of the moving chamber 610 is equalized to the internal temperature of the first buffer chamber BC1, it is not necessary to separately provide a cooling machine or a blower fan in the moving chamber 610. In this instance, it may be preferably considered that the same temperature control method as that in the above first buffer chamber BC1 and moving chamber 610 is also applied between the test chambers 641-648 and the moving chamber 610. It is clear that the thermal insulation of the mobile compartment 610 can be even further enhanced in the case according to this example.

For reference, the process of cooling by injecting a low-temperature gas (for example, LN2 gas) is explained in the above example, but it is also possible to sufficiently consider cooling the inside of the first buffer chamber BC1 by supplying cold air by a cooling system using an additional compressor and evaporator.

Further, although the example of the temperature control has been described above using a low temperature test as an example, the present invention can be applied to a high temperature test in the same manner.

< additional example >

1. Elevation of test chamber

In the above-described embodiment, the movement of the test tray TT between the moving chamber and the test chamber is mainly achieved by elevating and lowering the moving

chamber

210, 310, 610. However, depending on the implementation, it is entirely conceivable to move the test chamber up and down without moving the moving chamber up and down.

2. Lifting of test tray in test chamber

In addition, the test tray TT is raised inside the test chamber, so that the test tray TT can be moved between the moving chamber and the test chamber. For example, the test tray carried into the lower region of the test chamber may be lifted up and carried out in the upper region without lifting up and down the transfer chamber. This structure can be realized by configuring the lifter capable of lifting the test tray after the test of the electronic component mounted on the test tray is completed. Fig. 21 shows the simplest example of a lifter for raising the test tray in the test chamber. Referring to fig. 21 (a) and (b), the elevator UA includes a pair of support bases UB and an elevating source UF.

The support table UB supports the test tray TT carried into the lower region. In this case, the support table UB is preferably disposed in the shape of a support rail capable of supporting the test tray TT while guiding the movement thereof. The two support bases UB function as a work window OW that is operated to connect the electronic component loaded on the test tray TT to the tester by a connector for electrically connecting the electronic component to the tester. Obviously, two supports UB can be connected to each other to the other support SB within the range of maintaining the working window OW.

As shown, the ascending source UF may be constituted most simply by a cylinder, but may also be constituted by a motor.

Further, in the case of a conventional general structure in which the electronic component is electrically connected to the tester by pressing the electronic component to the tester side by the elevating operation using the connector, it is preferable to consider that the test tray TT is elevated by the elevating power of the connector rather than disposing another elevating source to the elevator UA. In this case, it is obvious that the two support bases may be provided to the connector and may be lifted and lowered together with the lifting and lowering of the connector. At this time, the elevator UA may be configured as two support bases excluding other elevating sources.

In this example, the present invention can be preferably applied to a case where the lower portion of the transfer chamber is used as a heat equalizing portion for applying thermal stress to the electronic component, and the upper portion is used as a heat releasing equalizing portion for releasing the thermal stress applied to the electronic component. In such an example, the movement of the electronic component between the movement chamber and the test chamber is performed in the following order: after the electronic components having been changed to a high temperature or a low temperature at the lower portion of the moving chamber are carried into the test chamber in a state of being loaded on the test tray TT, the electronic components are lifted up by the elevator and carried out to the moving chamber when the test is completed.

As described above, the present invention has been specifically described by referring to the embodiments of the drawings, but the described embodiments are merely illustrative of the preferred examples of the present invention and it is not to be understood that the present invention is limited to the above embodiments, and the scope of the claims of the present invention is to be understood as the claims and the equivalent scope thereof.

Claims

1. A handler for testing electronic components, comprising:

a moving chamber capable of accommodating a test tray on which electronic components are stacked and moving along a predetermined moving path;

a transfer device that transfers the moving chamber on the moving path;

a connector disposed at least one side of the moving path to receive the test tray from the moving chamber or supply the test tray to the moving chamber, and electrically connecting or disconnecting the electronic component to or from the tester combined with the test window to enable an electrical characteristic test of the electronic component stacked on the test tray; and

at least one moving device to move the test tray between the moving chamber and the connector,

the moving chamber includes:

a first chamber part for adjusting a temperature of the electronic parts stacked on the test tray; and

and a second chamber part arranged side by side with the first chamber part in the vertical direction to restore the temperature of the electronic component stacked on the test tray to normal temperature.

2. The handler for testing electronic parts according to claim 1,

the at least one moving device is disposed in the moving chamber to move together with the moving chamber.

3. The handler for testing electronic parts according to claim 1,

the interiors of the first and second chamber portions are separated from each other by a partition wall.

4. The handler for testing electronic parts according to claim 1,

the first chamber portion comprises: a switch door for opening and closing a first moving hole for receiving the test tray at the loading position or transferring the test tray to the connector,

the second chamber section comprises: a second moving hole for transferring the test tray to an unloading position or receiving the test tray from the connector,

the interior of the second chamber section communicates with the exterior through a second transfer aperture.

5. The handler for testing electronic parts according to claim 1,

further comprising: an elevator for elevating the movable chamber to a position where the test tray can be transferred from the first chamber portion to the connector or to a position where the second chamber portion can receive the test tray from the connector.

6. The handler for testing electronic parts according to claim 1,

further comprising: and a lifter configured to lift the test tray carried into the test chamber from the first chamber portion, thereby allowing the test tray containing the tested electronic component to be carried out to the second chamber portion disposed above the first chamber portion.

7. The handler for testing electronic parts according to claim 1,

the test windows are multiple, and each of the multiple test windows is respectively provided with the connector.

8. The handler for testing electronic parts according to claim 7,

further comprising: a plurality of test chambers for receiving the test trays from the moving chamber and configured at the side of each test window to maintain the test temperature condition of the electronic components,

the moving chamber has a one-to-many quantitative relationship with the testing chamber.

9. The handler for testing electronic parts according to claim 7,

the connectors are respectively configured at two sides of the moving path.

10. The handler for testing electronic parts of claim 1, further comprising:

a test chamber for receiving the test tray from the moving chamber and maintaining the temperature of the electronic components stacked on the received test tray at a test temperature; and

an isolator for isolating the electronic components of the test tray located on a path moving from the moving chamber to the test chamber from outside air.

11. The handler for testing electronic parts of claim 1, further comprising:

a first buffer chamber which is on standby before a test tray on which electronic components to be tested are stacked moves to the moving chamber; and the number of the first and second groups,

a second buffer chamber for receiving the test tray loaded with the tested electronic components from the moving chamber and making the test tray stand by,

the first buffer chamber and the second buffer chamber are configured in a fixed type.

12. The handler for testing electronic parts according to claim 11,