KR102152200B1 - Electronic parts heat resistance performance test system - Google Patents

Abstract

In the device for testing the heat resistance performance of the electronic component 100
A supply unit 1000 for supplying the electronic component, a heating test unit 2000 for heating and testing the supplied electronic component under a condition of a predetermined temperature, and a discharge unit 3000 for discharging the electronic component for which the heating test is completed. The electronic component 100 is a rectangular parallelepiped having a width/length/height, and has a structure in which an electrode 110 is formed on one side and the other side opposite to the one side, and the supply unit 1000 is the electronic component supplied individually. Is accommodated in the tray 200, but the upper portion of the tray includes a space 210 into which an electronic component can be inserted, and a lower portion of the electronic component inserted into the space 210 is provided with a pin for testing. ) Electronic component heat resistance performance test system, characterized in that provided with a pin hole 220 into which it can be inserted.

Description

Electronic parts heat resistance performance test system

The present invention relates to a heat resistance performance test system of an electronic component, and more particularly, after heating an electronic component at a predetermined temperature in order to test the heat resistance of the electronic component, electrical properties are inspected, and damage during heating during a heat resistance test, It relates to a device for testing heat resistance to see if there is a short circuit and whether the electrical characteristics of an electronic component appear.

In general, the electronic components produced Each item is tested for operation function, reliability, and appearance before shipment.

One of them is heat resistance, that is, heat resistance test. In order to test small electronic components, they are loaded on a tray, and in order to heat the tray in which the electronic components are loaded to a predetermined temperature, a first chamber is provided to control (preheat) the temperature in advance according to the test temperature condition.

After preheating in the first chamber, the electronic components in the tray transferred to the test position in the second chamber, which is the test chamber, are heated to a predetermined temperature. Test pins, etc. should be provided.

In this way, since the tray with the electrical circuit must be moved and heated, damage to the connection components that come into contact with the electronic component may occur in this process.

In addition, in order to cool the electronic components after the heating process and the electrical test in the second chamber, the test tray and the electrical circuit components connected to the tray are returned to a certain temperature, and they are classified into defective products and good products according to the test results and moved. .

In such a heat resistance test, the electronic components supplied by the conveyor line are put in a test tray, preheated in a thermostat, and then heated again in the test thermostat to the heat resistance temperature, that is, the temperature specified by the test, so that the tray is inserted into the thermostat and taken out At, the inside of the thermostat is cooled, the time required to reach the specified temperature by heating both the inside of the thermostat and the electronic components is lengthened, and the electronic components contained in the tray are electrically tested in the thermostat. There were problems such as having to be attached.

Prior Document 1: Korean Patent Application Publication No. 10-2018-0028882 Prior Document 2: Korean Patent Application Publication No. 10- 1998-027504 Prior Document 3: Korean Patent Application Publication No. 10-2018-0077451 Prior Document 4: Korean Utility Model Publication 20-1999-003747

The present invention was devised to solve the problem of the structure of the heat resistance performance test system of the existing electronic components as described above, and the inside of the thermostat, which is a process of heating at a predetermined temperature to test heat resistance, and testing electrical characteristics at a predetermined temperature. The purpose is to shorten the heating time by receiving the tray to heat the electronic components inserted into the tray, and to directly apply heat to the electronic components accommodated in the test tray to inspect the electrical characteristics.

In addition, the present invention configures an electrical circuit that can test electrical characteristics inside a test apparatus for heating electronic components, and removes a connection pin for electrical connection in the moving tray. Another object is to solve the problem of damage to the electrical circuit connecting device due to vibration applied to seat the part.

In addition, the present invention forms a heating test device that tests the heat resistance by receiving and heating electronic parts accommodated in the tray in multiple rows/multi-layers, so that it can be supplied and discharged through a single electronic component supply and discharge device. The purpose is to shorten the test time.

In addition, in the present invention, electronic components are loaded on a test tray, and the loaded tray is transferred to determine the defective product and the good product through a heat resistance test in the heating test, and the defective product and the good product are separated and collected, and the used tray is inspected. Another purpose is to determine whether to reuse and to automate the process of reusing quality trays with one system.

The problem of the present invention is not limited to those mentioned above, and other problems that are not mentioned will be clearly understood by those engaged in the industry from the following description.

An electronic component heat resistance test system according to the present invention for achieving the above object is a device for testing the heat resistance of an electronic component, by heating a supply unit for supplying the electronic component and the supplied electronic component under conditions of a predetermined temperature. It is characterized by a structure comprising a heating test unit to be tested and a discharge unit for discharging the electronic component on which the heating test is completed, to test the heat resistance performance of the electronic component.

Preferably, the electronic component is a rectangular parallelepiped having a width/length/height, and an electrode is formed on one side and the other side opposite to the one side,

The supply unit accommodates the electronic components supplied individually in a tray, and includes a storage space in which the electronic components can be inserted in an upper portion of the tray, and a test pin is inserted in the lower portion while passing through the space It may be characterized in that the pin hole that can be provided.

In addition, the supply unit is a device that accommodates and inspects electronic components supplied individually in a tray and transfers them to a heating test unit, wherein the electronic component loader accommodates the electronic component in the space of the tray; A brushing device that removes remaining electronic parts that have not been accommodated, a first vision test device that inspects empty spaces in the received tray, and the electronic component loader, brushing device, and a first vision test device are connected. And, it may be characterized in that consisting of a first conveyor device for transporting the tray.

In addition, the electronic component loader is a device for storing electronic components supplied individually by inserting them into the storage space of the tray,

A tray loading part on which the tray is mounted and loaded, an electronic component supplying part supplying individual electronic components to the top of the tray loaded in the tray loading part, and a vibration device provided under the tray loading part to allow the loaded tray to vibrate Consists of,

The tray loaded on the tray loading unit is vibrated by the vibration device, and the supplied electronic components are easily inserted into the storage space.

In addition, the brushing device is a device for removing remaining electronic components not inserted in the storage space of the tray in the electronic component loader from the tray,

A tray loading part on which the tray is seated and loaded,

Consists of a brush for brushing and removing residual electronic components not inserted in the storage space,

The upper surface of the tray is brushed to remove the remaining electronic components that have not been inserted to the outside of the tray, and the first vision inspection device inspects the upper surface of the tray brushed by the brushing device, and the electronic component is not inserted. An empty storage space that has not been removed, and a device for determining the remaining electronic components that have not been removed, and transmitting inspection data to the control unit,

A tray supply unit for providing trays that have been inspected by the first vision inspection device to the heating test unit is provided.

In the present invention, the heating test unit is an apparatus for performing a heat resistance test of the electronic component in a tray into which the electronic component for which the first vision inspection is completed is inserted,

The first vision inspection device receives the inspected tray and transfers the tray to the heating test inspection section, and receives the transferred tray and inserts the transferred tray into the tray and heats the housed electronic component under a condition of a predetermined temperature. It may include a heating test device unit for testing, and an unloader unit (Unload) for transferring the tray on which the heat resistance test has been completed from the heating test device unit to the discharge unit.

In addition, a plurality of the heating test device units are arranged in a row, and a plurality of the heating test units are arranged in a layer above each of the plurality of units. A picker waiting unit for waiting for the tray may be provided.

In addition, the loader unit is provided with a load shuttle for distributing the tray supplied from the tray supply unit to the tray standby zone, and distributes the tray supplied from the tray supply unit to the picker waiting unit,

When the trays are disposed in all of the respective picker waiting units, a tray picker may be included to pick up the trays disposed in the picker waiting units and supply them to the tray seating unit of the heating test apparatus.

In addition, the tray picker has the same number as each of the picker waiting parts, and the tray picker is a lifter column and a lifter arm moving up and down along the lifter column and a lower portion of the lifter arm to be waiting for the picker waiting part. The tray is chucked and consists of a grip part moving left and right along the retter arm.

In addition, the tray picker simultaneously supplies the tray to the tray seating portion of the heating test device disposed on one layer. At this time, when the trays are seated in all the picker waiting portions, the grip portion chucks the tray and the lifter arm After moving along the lifter column according to the height of one layer, the grip unit is moved to the left or right to supply the tray to the tray seating unit of the heating test unit, and a tray is provided to the heating test unit disposed on another layer. In order to supply, the lifter arm may move along the lifter column according to the height of the another layer, and then move the grip part to the left or right to supply the tray to the tray seating part of the heating test apparatus part.

In addition, the heating test unit is a device that directly contacts the electronic components inserted into the tray supplied through the tray picker, heats them under a predetermined temperature condition, and supplies test power to both electrodes of the electronic components to test electrical characteristics. ,

A lower frame, an intermediate frame supported by a plurality of first support frames coupled to an upper side of the lower frame, a plurality of second support frames connected to a first support frame at an upper side of the intermediate frame, the plurality of It characterized in that it comprises a heating test apparatus unit frame including an upper frame coupled to the upper end of the second support frame.

In addition, a heater device driven by an upper driving unit and the upper driving unit is provided on a lower surface of the upper frame, a tray seating unit on the intermediate frame, a lower driving unit on the upper surface of the lower frame, and the lower driving unit to drive electrical characteristics. An electrical inspection device capable of inspecting is provided.

In addition, an air or hydraulic cylinder attached to the lower surface of the upper frame and moving the cylinder axis up and down, and a heater installation board attached to the end of the cylinder axis, and the upper lower surface and the intermediate frame are coupled to the heater installation board. It includes a plurality of guide shafts for moving to,

A heater device is attached to the heater installation board.

In addition, the heater device

It is directly in contact with the upper electrode of the electronic component inserted in the tray and is formed of a copper plate to be used as a common ground (GND COM) for the internal circuit of the electronic component test. Electronic component contact plate

It is bonded to the upper surface of the electronic component contact plate to transfer heat generated by the rod heater, and is bonded to the heater top frame and the heater top frame in which grooves into which the rod heater is inserted are formed on the upper surface. The rod heater is inserted into a heater boat frame having a groove in which a rod heater is inserted in the lower surface, and a groove formed in the upper surface of the heater top frame and the lower surface of the heater boat frame to generate electric heat. Wow

It is generated in the rod heater in a shape that surrounds the outer surface of the electronic component contact plate excluding the bottom surface directly in contact with the upper electrode of the electronic component, the heater top frame including the rod heater, and the heater boat frame. It characterized in that it is provided with an external heat insulator that prevents heat dissipation.

In addition, the intermediate frame is provided with a mounting jig portion including a tray mounting portion on which the tray transferred to the tray picker is mounted, and the tray mounting portion jig portion has upper and lower portions open so that the tray is seated and fixed. The delivered tray is guided to the correct position by inserting one or more core holes formed to be seated in the correct position of the tray seating portion and the tray seating portion in which the tray is seated by inserting a core hole formed in the tray. It is guided by a combination of one or a plurality of hole cores formed so as to be formed and a core hole formed in a tray corresponding to the hole core, and the position is clearly fixed.

In addition, an air or hydraulic cylinder that is attached to the upper surface of the lower frame and moves the cylinder axis up and down, and a pin board (pin B/D) that is attached to the end of the cylinder axis and inserts and fixes test pins. )Wow,

It includes a plurality of guide shafts coupled to the upper side of the lower frame and the intermediate frame to prevent shaking when the pin board (pin B/D) moves up and down,

The pin board (pin B/D) is inserted into a pin hole in the lower portion of the space in which the electronic component formed in the tray fixed to the tray seat can be inserted, and a test power is supplied to the inserted electronic component electrode for testing. Test pins,

It characterized in that it comprises a test board (test B / D) for supplying test power to the pin board (pin B / D).

In addition, the tray is delivered to the tray picker to the tray seating portion of the seating portion jig portion formed in the intermediate frame, and the tray is seated in the correct position by combining the core hole of the delivered tray and the hole core of the tray seating portion, and The air or hydraulic cylinder is operated, and the heater device attached to the end of the cylinder shaft is moved downward,

By the movement, the electronic component contact plate is inserted into the tray and directly contacts the received electronic component electrode to be directly heated to a predetermined temperature by electric heat generated by the rod heater of the heater device,

When the temperature of the electronic component is heated to a predetermined temperature, the air or hydraulic cylinder attached to the upper surface of the lower frame is operated, and the pin B/D attached to the end of the cylinder shaft is moved upward,

Test pins inserted and fixed to the pin board (pin B/D) are inserted into the pin holes in the tray fixed to the tray seat to contact the electronic component electrode inserted and fixed to the tray seat,

The negative power controlled by the control unit of the heating test unit is energized to the contact plate of the electronic component of the upper heater device to the common ground (GND COM), and the positive power is supplied with a pin B/D through the test board (test B/D). ), the test pins inserted and fixed rise and are inserted into the lower pin hole of the tray fixed to the tray seating part, and are in contact with the electrode part of the electronic component to test the electrical characteristics and transmit the test result to the control unit. It features.

In addition, when the upper driving unit descends the heater device and the electrode surface of the electronic component and the electronic component contact plate come into contact, the upper surface of the tray and the electronic component contact plate of the heater device can be prevented from thermal deformation during heating. May be characterized by a configuration made such that a certain gap is formed.

In addition, in the present invention, the unloader

As a device for transferring the tray into which the electronic component, which has completed the heat resistance test in the heating test device part, is inserted from the heating test device part to the discharge part,

When the heat test in the heating test device is completed, simultaneously unloading the tray from the tray seating part of the heating test device through the tray picker,

The tray picker unloads the tray at the same time to the tray seating portion 1139 of the heating test device provided on one layer, and unloads the tray at the same time with a time difference between the heating test device part provided on the other floor.

In addition, when the tray is unloaded at the same time as the tray seating portion of the heating test device at the front end of the grip, the heating test device can remove the electronic component adhered to the electronic component contact plate of the heater device during the heat resistance test. A storage box for accommodating and storing the brush and the electronic component removed by the brush may be provided.

In addition, it includes an unloading shuttle unit for transferring the trays unloaded simultaneously by the tray picker to a third conveyor device,

The unloading shuttle unit may sequentially supply the trays unloaded to the tray seating unit at the same time by the tray picker to the third conveyor unit, and the tray supplied to the third conveyor unit of the unloader unit It includes a tray lift conveyed to the fourth conveyor device of the discharge unit.

In the present invention, the discharge unit receives the tray from which the heat resistance test has been completed by the heating test device unit through the unloader unit, inspects the tray, collects electronic parts stored in the tray, and transfers the tray from which the electronic parts are collected. A second vision inspection device that determines whether an electronic component accommodated in the tray is located in a correct position, a defective product removing device that removes a defective product determined in the heating test process from the tray, and a good product from the tray. Determination by the collection device for good quality products to be collected, a third vision inspection device that checks whether there are residual good products in the tray from which the good products are collected and whether the tray itself is defective, and the third vision inspection device A tray circulation device (2500) that carries out the defective tray to the outside and transfers the remaining trays to the supply unit, and the second vision inspection device, the defective product collection device, the good product collection device, the third vision inspection device, and the tray circulation device are connected. And a fourth conveyor device for transferring the tray.

In addition, the second vision inspection device inspects the upper surface of the tray on which the heat resistance test has been completed by the heating test unit, and uses the data received from the control unit to use the electronic components received in the tray inspected by the first vision inspection device. And a device for determining whether there is an electronic component inserted in a previous inspection process in the empty storage space in which the electronic component is not inserted, and transmits the inspection data to the control unit,

The defective electronic component removal device is a device that removes the electronic component whose position has been moved by the second vision inspection device and the defective electronic component determined by the heating test unit from the tray and transfers the defective electronic component to a loading bin,

The good-goods collection device includes a device for collecting good goods that have passed in a heating test from a tray from which bad electronic parts are removed from the bad electronic parts removing device and transferring them to a good electronic parts loading box,

In addition, the third vision inspection device inspects the upper surface of the tray where the electronic parts are collected by the non-defective product collection device to determine whether there are residual good products in the tray from which the good products are collected, and whether the tray itself is defective, and controls the inspection data. In the tray circulation device, the tray in which the remaining good products determined by the third vision inspection device exist and the tray itself carries out the defective and defective tray to the outside, and transfers the remaining trays to the transfer unit for reuse. Consists of a device.

The electronic component heat resistance test system of the present invention having the above characteristics has the advantage of shortening the heating time of the electronic component because the electric heater device is heated to a predetermined temperature by directly contacting the electronic component accommodated in the tray.

There is an advantage in that an electrical connection pin constituting an electrical circuit for testing electrical characteristics is not attached to the tray accommodating the electronic component of the present invention, thereby preventing damage to the connection pin due to movement of the tray. .

In the present invention, a heating test device that receives electronic components accommodated in a tray to test heat resistance performance is formed in multiple rows and multiple layers, and can be continuously supplied and discharged with one connected electronic component supplying and discharging device. It has the advantage of improving the productivity of the test.

In the present invention, electronic components are loaded on a test tray, and the loaded tray is transported to undergo a heat resistance test in a heating test, discriminating as defective products and good products, separately collecting defective products and good products, and inspecting and reusing used trays There is an advantage of establishing an automated system because the process of reusing high-quality trays by determining whether or not is connected to one system.

1 is a schematic configuration diagram of an electronic component heat resistance test system according to an embodiment of the present invention.
2 is a diagram of a tray for accommodating an electronic component according to an embodiment of the present invention.
3 is a front view illustrating an electronic component supply and discharge device according to an embodiment of the present invention.
4 is a front view showing an operation sequence of a heating test device according to an embodiment of the present invention.
5 is a cross-sectional view schematically showing an inner cross-section of a heating test apparatus according to an embodiment of the present invention.
6 is a diagram of a heating device according to an embodiment of the present invention.

As for terms used in the present invention, general terms that are currently widely used are selected, but in certain cases, some terms are arbitrarily selected by the applicant. In this case, the meanings described or used in the specific contents for carrying out the invention are not just the names of terms. The meaning should be grasped in consideration of.

Prior to the detailed description of the present invention, the present invention can be made various modifications and various embodiments, and the examples described below and shown in the drawings are intended to limit the present invention to specific embodiments. It should be understood as including all changes, equivalents, and substitutes included in the spirit and scope of the present invention.

The terms used in the present specification are only used to describe specific embodiments, and are not intended to limit the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise.

Hereinafter, the technical configuration of the present invention will be described in detail with reference to exemplary embodiments illustrated in the accompanying drawings. Here, it should be noted that all expressions related to directions such as up, down, left, right, right, left, and bottom are described based on the presented drawings.

1 shows a schematic structure of a circulation system for an electronic component heat resistance test system included in the present invention.

Hereinafter, an electronic component heat resistance test system according to an exemplary embodiment of the present invention will be described in detail.

Referring to FIG. 1, the present invention is a device for testing the heat resistance of an electronic component 100, in which a supply unit 1000 for supplying the electronic component and the supplied electronic component are heated to a predetermined temperature. It can be seen that it consists of a heating test unit 2000 and a discharge unit 3000 for discharging the electronic component for which the heating test has been completed.

Looking at the detailed configuration of the present invention

The supply unit 1000 is a device that accommodates and inspects the electronic components 100 individually supplied in the tray 200 and transfers them to the heating test unit 2000. An electronic component that accommodates the electronic components in the space of the tray The loader 400, a brushing device 500 for removing residual electronic components that have not been accommodated during storage in the electronic component loader 400, and a first vision for inspecting empty spaces in the received tray. ) It can be seen that it consists of an inspection device 600, a first conveyor device 300 that connects the electronic component loader, the brushing device and the first vision inspection device, and transfers the tray 200,

The heating test unit 2000 is a device that performs a heat resistance test of the electronic component in the tray 200 into which the electronic component for which the first vision inspection is completed is inserted,

A loader unit (Load: 1100) that receives the tray 200 that has been inspected by the first vision inspection device 600 and transfers it to the heating test inspection unit 1810, and the transferred tray 200 are received and inserted into the tray. A heating test device 1800 for heating the electronic component 100 under a condition of a predetermined temperature and testing electrical characteristics, and a tray 200 for which the heat resistance test is completed are discharged from the heating test device 1800. ), it can be seen that it includes an unloader unit (Unload: 1200),

The discharge unit 3000 receives the tray 200, which has been tested for heat resistance by the heating test unit 1800, through the unloader unit 1200, inspects the tray, and collects electronic components stored in the tray. , A device for transferring the tray from which the electronic parts are collected to the transfer unit 1000, comprising: a second vision inspection device 2100 for determining whether the electronic parts accommodated in the tray 200 are positioned at a proper position; And a defective product removal device that removes the defective product determined in the heating test process from the tray, a quality product collection device that collects good products from the tray, and whether there are residual good products in the tray from which the good products are collected, and the tray itself is defective. A third vision inspection device for checking recognition, and a tray circulation device 2500 for carrying out the defective tray identified by the third vision inspection device to the outside and transferring the remaining trays to the supply unit 1000 And, a fourth conveyor device that connects the second vision inspection device, a defective product collection device, a good product collection device, a third vision inspection device, and a tray circulation device 2500 and transfers the tray.

The electronic component heat resistance performance test system according to the present invention will be described in detail with reference to the accompanying drawings.

1 and 2, the electronic component 100 of the present invention is a rectangular parallelepiped having a width/length/height, and a structure in which an electrode 110 is formed on one side and the other side opposite to the one side.

The supply unit 1000 accommodates the electronic components individually supplied in the tray 200, and includes a storage space 210 in which electronic components can be inserted in an upper portion of the tray, and the space portion ( A pin hole 220 into which a test pin can be inserted is provided while passing through the 210.

Since the tray 200 according to the present invention is not attached with a test pin for electrically connecting to an electronic component inserted into the tray, it is possible to effectively prevent a test pin from being damaged due to movement of the tray.

In addition, the electronic component loader 400 of the supply unit 1000 is a device that inserts and accommodates the electronic components 100 supplied individually into the storage space 210 of the tray 200,

An electronic component supply unit 420 for supplying individual electronic components to the upper tray 200 on which the tray 200 is mounted and loaded, and the tray 200 loaded on the tray loading unit 410 and the loaded The tray 200 is made of a vibration device 430 provided under the tray loading part 410 so that the tray 200 can be vibrated, and the tray 200 loaded on the tray loading part 410 by the vibration device 430 is By vibrating, it can be seen that the supplied electronic component is easily inserted into the storage space part 210.

In addition, the brushing device 500 is a device for removing the remaining electronic components 100 not inserted in the storage space 210 of the tray in the electronic component loader 400 from the tray 200, A tray loading part 510 on which the tray 200 is seated and loaded is provided, and a brush 520 for brushing the upper surface of the tray 200 loaded on the tray loading part 510 in one stroke It is equipped.

That is, the brushing device 500 brushes the upper surface of the seated tray 200 with the tray 200 to brush the remaining electronic components 100 not inserted into the storage space 210 of the tray. It is a device that removes it outside the tray.

The first vision inspection apparatus 600 according to the present invention inspects the upper surface of the tray 200 brushed by the brushing apparatus 500, and the empty storage space portion 610 in which the electronic component is not inserted, As a device that determines the remaining electronic components 620 that have not been removed and transmits the inspection data to the control unit, an empty storage space unit 610 not inserted in the brushed tray 200 and the remaining electronic components 620 that have not been removed ), so it is possible to know the movement of the electronic part according to the movement or the detachment of the inserted electronic part.

A tray supply unit 1110 for providing the tray 200, which has been inspected by the first vision inspection device 600, to the heating test unit 2000, is provided, and the tray supply unit 1110 provides the tray that has been inspected by a loader unit. This is the configuration that transfers to (Load: 1100).

Referring to FIGS. 1 and 3 of the present invention, looking at the heating test unit 2000, a device for performing a heat resistance test of the electronic component in the tray 200 into which the electronic component for which the first vision inspection has been completed is inserted, A loader unit (Load: 1100) that receives the tray 200 that has been inspected by the first vision inspection device 600 and transfers it to the heating test inspection unit 1810, and the transferred tray 200 are received and inserted into the tray. A heating test device 1800 for heating the electronic component 100 under a condition of a predetermined temperature and testing electrical characteristics, and a tray 200 for which the heat resistance test is completed are discharged from the heating test device 1800. It includes an unloader unit (Unload: 1200) transferred to ).

In addition, as shown in FIG. 1, a plurality of heating test apparatus units 1800 may be arranged in a row, and as shown in FIG. 3, as shown in FIG. 3, a plurality of heating test apparatus units are arranged in a layer above each. A number of them may be composed of a double layer.

In this way, a plurality of layers are formed, and a plurality of the heating test apparatus units are arranged in a row at the front end of each of the heating test apparatus units including a picker waiting unit in which a tray for testing is waiting.

The loader unit 1100 is provided with a load shuttle 1120 for distributing the tray supplied from the tray supply unit 1110 to the tray standby zone, and distributes the tray supplied from the tray supply unit to the picker waiting unit 1121 The second conveyor device transports them, and the load shuttle 1120 and the second conveyor device may be configured as one or separately.

When the trays are arranged in all of the respective picker waiting parts 1121, a tray picker that picks up the trays disposed in the picker waiting part 1121 at once and supplies them to the tray seating part of the heating test device 1800 (Tray Picker; 1130).

In addition, the tray picker 1130 has the same number as each of the picker waiting portions 1121, and the tray picker includes a lifter column 1131, a lifter arm 1132 moving up and down along the lifter column, and the lifter arm. It is disposed at the bottom of and chucks the tray waiting in the picker waiting part 1121, and consists of a grip part 1133 moving left and right along the retter arm, and the tray picker 1130 is disposed on one layer. A tray is simultaneously supplied to the tray seating portion of the heating test device portion 1800. At this time, when the trays are seated in all the picker waiting portions 1121, the grip portion 1133 chuck the tray and then the lifter arm 1132 Moves along the lifter column according to the height of the one layer, and then moves the grip part 1133 to the left or right to supply the tray to the tray seating part of the heating test device, and heating disposed on another layer. In order to supply the tray to the test apparatus unit 1800, the lifter arm 1132 moves along the lifter column according to the height of the another layer, and then moves the grip unit 1133 to the left or right to test the heating. The tray can be supplied to the tray seating unit of the device.

For example, when five heating test units formed in four layers are arranged in one row, the load shuttle 1120 transfers the trays supplied from the tray supply unit to the picker waiting unit 1121, and each of the five heating test units When each tray is seated on the base 1121, the grip unit 1133 chucks each of the five trays, and then the lifter arm 1132 moves along the lifter column according to the height of the one layer. The grip part 1133 is moved to the left or right and supplied to the tray seating part of the five heating test devices, and if necessary in a layer other than the inserted layer, the grip part 1133 chucked each of the five trays. The lifter arm 1132 moves along the lifter column according to the height of the one layer, and then moves the grip part 1133 to the left or right to simultaneously supply it to the tray seating part of the five heating test devices. to be.

Referring to Figures 4 and 5 of the present invention,

The heating test unit 1800 directly contacts the electronic component inserted in the tray 200 supplied to the tray picker 1130 and heats it under a predetermined temperature condition, and supplies test power to both electrodes of the electronic component. It is a device for testing electrical characteristics, and the heating test unit 1800 is supported by a lower frame 1810 and a plurality of first support frames 1820 coupled to an upper side of the lower frame 1810. The intermediate frame 1830 and a plurality of second support frames 1840 connected to the first support frame 1820 on the upper side of the intermediate frame 1830, coupled to the upper end of the plurality of second support frames 1840 It is a heating test device unit frame including the upper frame (1850).

In addition, a heater device 1600 driven by an upper driving unit 1860 and the upper driving unit 1860 is provided on a lower surface of the upper frame 1850, and a tray seating unit 1500, a lower part of the intermediate frame 1830 An upper surface of the frame 1810 is provided with a lower driving unit 1710 and an inspection device 1700 that is driven by the lower driving unit 1710 to test electrical characteristics.

Looking specifically at the heating test device unit 1800,

In addition, an air or hydraulic cylinder 1852 attached to the lower surface 1851 of the upper frame 1850 and moving the cylinder shaft 1853 up and down, and a heater installation board attached to the end of the cylinder shaft 1853 ( 1854) and the lower surface of the upper frame (1850) (1851) and the intermediate frame (1830) is coupled to the heater installation board (1854) includes a plurality of guide shafts (1855) to move up and down, the hydraulic pressure The heater installation board 1854 attached to the end of the cylinder shaft 1853 by the operation of the cylinder is guided and moved by the guide shaft 1855 during movement, thereby preventing shaking.

A heater device 1600 is attached to the heater installation board 1854, and the heater device 1600 directly contacts the upper electrode 110 of the electronic component inserted and received in the tray 200. It can be seen that it is formed of a copper plate to be used as a common ground (GND COM) of the test internal circuit, and is made of an electronic component contact plate 1610 that directly transfers heat generated from the rod heater 1630 to directly heat to a predetermined temperature. .

A heater top frame 1620 that is bonded to the upper surface of the electronic component contact plate 1610 to transfer heat generated by the rod heater 1630 and has a groove on the upper surface into which the rod heater 1630 is inserted. ), and a heater boat frame 1640 that is bonded to the heater top frame 1620 and has a groove on the lower surface into which the rod heater 1630 is inserted.

In addition, a rod heater 1630 that is inserted into a groove formed on an upper surface of the heater top frame 1620 and a lower surface of the heater boat frame 1640 to generate electric heat, and an upper electrode 110 of the electronic component It is a shape that covers the outer surface of the heater top frame 1620 and the heater boat frame 1640 including the electronic component contact plate 1610 and the rod heater 1630 except the bottom surface directly in contact with the An external heat insulator 1650 for preventing heat dissipation of heat generated from the rod heater 1630 is provided.

In the present invention, a silicone rubber may be used as the heat insulating material, and the silicone rubber is very useful because it maintains its electrical insulation, chemical stability and elasticity over a wide temperature range, and the general silicone rubber also has a heat resistance of 350°C and cold resistance. Since is -70°C, it can be safely used at 200°C, which is the typical heat resistance temperature of the invention.

In addition, when the heater device 1600 descends and comes into contact with the top surface of the tray, the insulation material is brought into contact with the top end surface of the tray by the insulation material to form a sealed chamber to a certain degree, thereby increasing the temperature inside the tray. When heating the component directly, the difference between the temperature of the electronic component and the ambient temperature can be reduced, so that it can be heated quickly.

Therefore, since the heater top frame 1620 and the heater boat frame 1640 are combined and the rod heater 1630 is inserted into the space formed therein, the heater tower is in contact with the rod heater. (Heat Top) Heat is transmitted to the frame 1620 and the heater boat frame 1640 and is distributed equally, and the material of the electronic component contact plate 1610 bonded to the lower part is made of a copper plate for quick and uniform contact Heat can be transferred to electronic components.

In addition, the material of the heater top frame 1620 and the heater boat frame 1640 is a stainless steel material 430 having a ferrite structure in consideration of corrosion resistance and heat retention.

In addition, the intermediate frame 1830 has a seating portion jig portion 1400 including a tray seating portion 1500 on which the tray 200 transferred to the tray picker 1130 is seated,

The tray seating portion jig portion 1400 has upper and lower portions open to the tray seating portion 1500 in which the tray 200 is seated and fixed, and the tray seating portion 1500 to be transferred to the correct position of the tray seating portion 1500. The core hole 230 formed in the tray 200 is inserted into one or more core holes 230 formed to be seated and the tray seating portion 1500 on which the tray 200 is seated, and guided to the correct position. One or a plurality of hole cores 1510 are formed so as to be clear.

The hole core 1510 is guided by the coupling of the core hole 230 formed in the tray 200 corresponding to the hole core 1510, and the position is clearly fixed.

In addition, the core hole 230 of the tray 200 routes the inlet side in contact with the hole core 1510 in order to be easily coupled with the hole core 1510, and the hole core 1510 of the tray seat 1500 ) Is formed so that the upper part is curved so that it is easily combined.

In addition, an air or hydraulic cylinder 1813 is attached to the upper surface 1811 of the lower frame 1810 and moves the cylinder shaft 1812 up and down, and is attached to the end of the cylinder shaft 1812, and is tested. A pin board (pin B/D) 1730 for inserting and fixing test pins 1740, and the upper surface 1811 of the lower frame 1810 and the intermediate frame 1830 are coupled to the pin board. B/D; 1730 includes a plurality of guide shafts 2913 to prevent shaking when moving up and down, and the pin B/D 1730 is formed to move without shaking by the cylinder. .

The pin board (pin B/D; 1730) is inserted into the pin hole 220 under the space 210 into which the electronic component formed in the tray 200 fixed to the tray seat 1500 can be inserted. A plurality of test pins 1740 for testing by supplying test power to the inserted electronic component electrode 110, and a test board for supplying test power to the pin B/D 1730 ( test B/D; 1720).

Therefore, when the hydraulic cylinder attached to the upper surface 1811 of the lower frame 1810 is operated, the cylinder shaft 1812 is moved up and down, and it is for testing coupled to a pin board (pin B/D; 1730) coupled to the cylinder axis. The test pins 1740 are moved up and down.

In addition, the supplied test pins 1740, pin B/D 1730, and test B/D 1720 are electrically connected.

In the present invention, the material of the end of which the test pin 1740 and the electrode surface of the electronic component are in contact with each other is made of palladium that suppresses wear resistance and Sn transition, and a stainless spring for high temperature may be used.

Looking at the operation method with the above configuration,

The tray 200 is transferred to the tray mounting part 1500 of the mounting part jig part 1400 formed in the intermediate frame 1830 to the tray picker 1130,

Air or hydraulic pressure mounted on the correct position by the combination of the core hole 230 of the delivered tray 200 and the hole core 1510 of the tray seat 1500, and attached to the lower surface 1851 of the upper frame 1850 The cylinder is operated, and the heater device 1600 attached to the end of the cylinder shaft 1852 is moved downward.

Electric heat generated by the rod heater 1630 of the heater device 1600 by the electronic component contact plate 1610 being inserted into the tray 200 and in direct contact with the received electronic component electrode 110 by the movement It is formed to be heated directly to a temperature determined by.

When the electronic component is heated to a predetermined temperature, an air or hydraulic cylinder attached to the upper surface 1811 of the lower frame 1810 is operated, and a pin B/D attached to the end of the cylinder shaft 1814 (pin B/D) 1730 ) Is moved to the top, and test pins 1740 inserted and fixed to the pin board (pin B/D) 1730 are pinholes in the tray 200 fixed to the tray seat 1500 ( 220 is inserted into the tray seating portion 1500 is inserted and fixed to the electronic component electrode 110,

The cathode power controlled by the control unit of the heating test unit 1800 is energized to the electronic component contact plate 1610 of the upper heater device 1600 to a common ground (GND COM), and the anode power is a test board (test B/D; 2720) through the pin board (pin B/D; 1730) inserted and fixed test pins (test pins 1740) are raised to the tray 200 fixed to the tray seating portion 1500, the lower pin hole 220 It is inserted, and the electrical circuit is completed by contacting the electrode of the electronic component to test the electrical characteristics and transmit the test result to the control unit.

In addition, when the upper driving unit 1860 descends the heater device 1600 so that the electrode surface of the electronic component and the electronic component contact plate 1610 come into contact, the tray 200 can be prevented from thermal deformation during heating. The upper surface of the tray 200 and the electronic component contact plate 1610 of the heater device 1600 are formed such that a predetermined gap is formed.

Since the constant gap as described above has a typical heat resistance test temperature of about 200° C., the upper surface of the tray and the heater can prevent thermal deformation at an interval of 0.3 mm.

By such an operation, the electronic components accommodated in the tray and the electronic component contact plate of the electric heater device are directly in contact with each other, so that the heat generated from the heater uniformly heats the electronic components, thereby reducing the heating time. (1800) The negative power controlled by the controller is energized by the electronic component contact plate 1610 of the upper heater device 1600 to a common ground (GND COM), and the positive power is supplied through a test board (test B/D; 2720). Test pins (1740) inserted and fixed to the pin board (pin B/D; 1730) rise and are inserted into the lower pin hole 220 of the tray 200 fixed to the tray seating part 1500, and Since it is a configuration that tests the electrical characteristics by contacting the electrode part of the component, the electrical connection pin that is electrically connected from the outside is not attached to the tray that accommodates the electronic component. It works.

Looking at the unloader 1200 with reference to FIGS. 1 and 3 of the present invention,

As a device for transferring the tray 200 into which the electronic component, which has completed the heat resistance test in the heating test unit 1800, is inserted from the heating test unit 1800 to the discharge unit 3000,

When the heat resistance test is completed in the heating test unit 1800, the tray 200 can be simultaneously unloaded from the tray seating unit of the heating test unit 1800 through the tray picker 1130, The tray picker 1130 simultaneously unloads the tray to the tray seating part 1139 of the heating test device 1800 provided on one layer, and the heating test device 1800 provided on the other floor has a time difference. You can choose to leave and unload the tray at the same time.

In addition, when the tray is unloaded at the same time as the tray seating portion of the heating test device 1800 at the front end of the grip part 1134, the heater device 1600 is A brush 1134 capable of removing electronic components adhered to the component contact plate 1610 and a storage box 1135 for accommodating and storing the electronic components removed by the brush 1134 may be provided.

Therefore, when the heating test is completed, the heater unit rises from the heating test unit 1800 and the grip unit 1134 of the tray picker 1130 enters the tray seating unit to unload the tray to the outside. The brush 1134 formed on the upper part of the grip part 1134 breaks the electronic part contact plate 1610 of the heater part and enters to remove the electronic part adhered to the electronic part contact plate 1610, and the removed electronic part It is dropped into the storage box 1135 formed in and stored.

In addition, an unloading shuttle unit 1140 for transporting the tray 200 simultaneously unloaded by the tray picker 1130 to a third conveyor device is provided, wherein the unloading shuttle unit 1140 is The tray 200 unloaded to the tray seating portion 1139 at the same time in the tray picker 1130 may be sequentially installed as a third conveyor, and supplied to the third conveyor apparatus of the unloader 1200 And a tray lift for transferring the tray to the fourth conveyor device of the discharge unit 3000.

In addition, the unloading shuttle unit 1140 and the third conveyor device may be configured as one or separately.

In addition, in the present invention, the discharge unit 3000 receives the tray 200 on which the heat resistance test has been completed in the heating test unit 1800 through the unloader unit 1200, inspects the tray, and A second vision inspection device 2100 that collects the stored electronic parts and transfers the tray from which the electronic parts are collected to the transfer unit 1000, and determines whether the electronic parts accommodated in the tray 200 are positioned at the correct position. And a defective product removing device that removes the defective product determined in the heating test process from the tray, a quality product collection device that collects good products from the tray, and whether there are residual good products in the tray from which the good products are collected, and the tray itself A third vision inspection device for inspecting whether it is defective, and a tray circulation device 2500 for carrying out the defective tray determined by the third vision inspection device to the outside and transferring the remaining trays to the supply unit 1000 ), and the second vision inspection device, the defective product collection device, the good product collection device, the third vision inspection device, and a fourth conveyor device that transfers the tray by connecting the tray circulation device 2500, and the second vision The inspection device 2100 inspects the upper surface of the tray 200 on which the heat resistance test has been completed in the heating test unit 1800, and inspects the first vision inspection device 600 using the data received from the control unit. It is a device that determines whether an electronic component accommodated in the tray 200 is positioned in the correct position, an electronic component inserted in the previous inspection process in an empty storage space where the electronic component is not inserted, and transmits the inspection data to the control unit. , The defective electronic component removal device 2200 removes the electronic component whose position is moved by the second vision inspection device 2100 and the defective electronic component determined by the heating test device 1800 from the tray 200 to be defective. It is a device that transfers the electronic parts to the loading box, and the good product collection device 2300 collects the good products that have passed in the heating test from the tray 200 from which the defective electronic parts are removed from the bad electronic parts removal device 2200 It is a device that transports good electronic parts to the storage box.

In addition, the third vision inspection device 2400 inspects the upper surface of the tray 200 from which the electronic parts were collected by the good product collection device 2300 to see if there are residual good products in the tray from which the good products were collected, and the tray itself is defective. It determines whether or not, and transmits the inspection data to the control unit, and the tray circulation device 2500 carries out the tray in which the residual good product determined by the third vision inspection device 2400 exists and the tray itself carries out the defective tray to the outside. , Consists of a device that transfers the rest of the tray 200 to the transfer unit 100 to be reused.

Those of ordinary skill in the art to which the present invention pertains will appreciate that the present invention can be implemented in other specific forms without changing the technical spirit or essential features thereof. Therefore, it should be understood that the embodiments described above are illustrative and non-limiting in all respects. The scope of the present invention is indicated by the scope of the claims to be described later rather than the detailed description, and all changes or modified forms derived from the meaning and scope of the claims and the concept of equality are included in the scope of the present invention. It must be interpreted.

100: electronic component 200: tray
300: first conveyor device 400: electronic component loader
500: brushing device 600: first vision inspection device
1000: supply unit 2000: heating test unit
1100: tray loader unit 1130: tray picker
1200: tray unloader unit 1500: tray seating unit
1600: heater device 1610: electronic component contact plate
1630: rod heater 1700: electrical inspection device
1740: test pin 3000: discharge
2100: second vision inspection device 2200: defective electronic component removal device
2300: good product collection device 2400: third vision inspection device
2500: tray circulation device

Claims (10)

In the device for testing the heat resistance performance of the electronic component 100 in the tray seat
A supply unit 1000 for receiving and inspecting the electronic components 100 individually supplied in the tray 200 and transferring them to the heating test unit 2000;
A loader unit (Load: 1100) that receives the tray 200 into which the electronic component supplied to the supply unit is inserted and transfers it to the heating test inspection unit 1810, and the electronics inserted into the tray by receiving the transferred tray 200 A heating test device 1800 for heating the component 100 under a condition of a predetermined temperature and testing electrical characteristics, and the tray 200 for which the heat resistance test has been completed, from the heating test device 1800 to the discharge part 3000. A heating test unit 2000 including an unloader unit (Unload: 1200) to be transferred,
The heating test unit 1800 receives the tray 200 on which the heat resistance test has been completed through the unloader 1200, inspects the tray, collects electronic parts stored in the tray, and collects the electronic parts. Consists of a discharge unit 3000 for transferring the tray to the transfer unit 1000,
The heating test unit 1800 directly contacts the electronic component inserted in the tray 200 supplied to the tray picker 1130 to heat it under a predetermined temperature condition, and supplies test power to both electrodes of the electronic component. As a device to test electrical properties,
A lower frame 1810 and an intermediate frame 1830 supported by a plurality of first support frames 1820 coupled to an upper side of the lower frame 1810, and a first frame toward the upper side of the intermediate frame 1830. It includes a heating test device unit frame including a plurality of second support frames 1840 connected to the support frame 1820, and an upper frame 1850 coupled to an upper end of the plurality of second support frames 1840,
A lower surface of the upper frame 1850 is provided with an upper driving unit 1860 and a heater device 1600 driven by the upper driving unit 1860, and the intermediate frame 1830 includes a tray seating unit 1500 and a lower frame ( The upper surface of the 1810) is provided with a lower driving unit 1710 and an electrical inspection device 1700 that is driven by the lower driving unit 1710 to test electrical characteristics,
In addition, the tray 200 is transferred to the tray picker 1130 to the tray seat 1500 of the seat jig portion 1400 formed on the intermediate frame 1830,
Air or hydraulic pressure mounted on the correct position by the combination of the core hole 230 of the delivered tray 200 and the hole core 1510 of the tray seat 1500, and attached to the lower surface 1851 of the upper frame 1850 The cylinder is operated, and the heater device 1600 attached to the end of the cylinder shaft 1852 is moved downward,
The heater device 1600 is
A rod heater to directly contact the upper electrode 110 of an electronic component inserted in the tray 200 and formed of a copper plate to be used as a common ground (GND COM) of an electronic component test internal circuit, and to directly heat to a predetermined temperature. The electronic component contact plate 1610 that directly transfers the heat generated from the (1630) is provided,
The electronic component contact plate 1610 is inserted into the tray 200 by the movement of the heater device 1600 to directly contact the received electronic component electrode 110, and the rod heater 1630 of the heater device 1600 It is directly heated to a specified temperature by electric heat generated from
When the temperature of the electronic component is heated to a predetermined temperature, the air or hydraulic cylinder attached to the upper surface 1811 of the lower frame 1810 is operated, and a pin board attached to the end of the cylinder shaft 1814 (pin B/D ; 1730 is moved upward, and test pins 1740 inserted and fixed to the pin board (pin B/D) 1730 are pinned to the tray 200 fixed to the tray seat 1500 It is inserted into the hole 220 and is in contact with the electronic component electrode 110 inserted and fixed in the tray seat 1500,
The cathode power controlled by the control unit of the heating test unit 1800 is energized to the electronic component contact plate 1610 of the upper heater device 1600 to a common ground (GND COM), and the anode power is a test board (test B/D; 2720) through the pin board (pin B/D; 1730) inserted and fixed test pins (test pins 1740) are raised to the tray 200 fixed to the tray seating portion 1500, the lower pin hole 220 It is inserted, and is in contact with the electrode of the electronic component to test the electrical characteristics, and transmits the test result to the control unit,
In addition, when the upper driving unit 1860 descends the heater device 1600 so that the electrode surface of the electronic component and the electronic component contact plate 1610 contact each other, the tray 200 can be prevented from thermal deformation during heating. Electronic component heat resistance performance test system with a loader, characterized in that the upper surface of the tray 200 and the electronic component contact plate (1610) of the heater device (1600) is formed such that a predetermined gap is formed.
According to claim 1
A plurality of the heating test device unit 1800 is arranged in a line
In addition, each of the plurality of the heating test device is configured as a multilayer as the heating test device is arranged in a layer, and a picker waiting part 1121 is provided at the front end of each of the heating test device to wait for a tray for testing,
The loader unit 1100 is
An electronic component, characterized in that a load shuttle 1120 for distributing the tray supplied from the tray supply unit 1110 to the tray waiting zone is provided, and distributing the tray supplied from the tray supply unit to the picker waiting unit 1121 Heat resistance performance test system.
According to claim 2
When the trays are arranged in all of the respective picker waiting units 1121, a tray picker that picks up the trays disposed in the picker waiting unit 1121 and supplies them to the tray seating unit of the heating test unit 1800 ; 1130), characterized in that the electronic component heat resistance test system.
According to claim 3
The tray picker 1130 has the same number as each of the picker waiting portions 1121, and the tray picker includes a lifter column 1131, a lifter arm 1132 moving up and down along the lifter column, and a lower portion of the lifter arm. Electronic component heat resistance performance test system, characterized in that it comprises a grip portion (1133) which is disposed in the picker waiting portion (1121) to chuck the tray waiting, and moves to the left and right along the lifter arm.
According to claim 4
The tray picker 1130 simultaneously supplies a tray to the tray seating portion of the heating test device 1800 disposed on one layer, and at this time, when the trays are seated in all the picker waiting portions 1121, the grip portion 1133 is After chucking the tray, the lifter arm 1132 moves along the lifter column according to the height of the one layer, and then moves the grip part 1133 to the left or right to the tray seating part of the heating test device. Feed the tray,
In order to supply a tray to the heating test unit 1800 disposed on another layer, the lifter arm 1132 moves along the lifter column according to the height of the another layer, and then moves the grip unit 1133 to the left side. Or moving to the right to supply the tray to the tray seating portion of the heating test device.
delete delete The method of claim 5
An air or hydraulic cylinder 1852 that is attached to the lower surface 1851 of the upper frame 1850 and moves the cylinder shaft 1853 up and down,
A heater installation board 1854 attached to the end of the cylinder shaft 1853 and
It includes a plurality of guide shafts 1855 for moving the heater installation board 1854 up and down by being coupled to the lower surface 1851 and the intermediate frame 1830 of the upper frame 1850,
Electronic component heat resistance performance test system, characterized in that a heater device (1600) is attached to the heater installation board (1854).
According to claim 8
The heater device 1600 is
A rod heater to directly contact the upper electrode 110 of an electronic component inserted in the tray 200 and formed of a copper plate to be used as a common ground (GND COM) of an electronic component test internal circuit, and to directly heat to a predetermined temperature The electronic component contact plate 1610 that directly transfers the heat generated from the 1630 and
A heater top frame 1620 that is bonded to the upper surface of the electronic component contact plate 1610 to transfer heat generated by the rod heater 1630, and has a groove on the upper surface into which the rod heater 1630 is inserted. )and
A heater boat frame 1640 that is bonded to the heater top frame 1620 and has a groove on the lower surface into which the rod heater 1630 is inserted.
The rod heater 1630 is inserted into the groove formed in the upper surface of the heater top frame 1620 and the lower surface of the heater boat frame 1640 to generate electric heat;
A heater top frame 1620 and a heater boat frame including an electronic component contact plate 1610 and a rod heater 1630, excluding a bottom surface directly in contact with the upper electrode 110 of the electronic component Electronic component heat resistance performance test system, characterized in that it is provided with an external insulation material (1650) that prevents heat dissipation of heat generated from the rod heater (1630) in a shape surrounding the outer surface of (1640).
The method of claim 5
The intermediate frame 1830 is formed with a seating portion jig portion 1400 including a tray seating portion 1500 on which the tray 200 transferred to the tray picker 1130 is seated,
The tray seating portion jig portion 1400 has the upper and lower portions open to the tray seating portion 1500 to which the tray 200 is seated and fixed.
One or a plurality of core holes 230 formed so as to be seated in the correct position of the tray seating portion 1500 and
One or more hole cores 1510 formed so as to be guided to an accurate position by inserting the core hole 230 formed in the tray 200 into the tray mounting portion 1500 on which the tray 200 is mounted, and
Electronic component heat resistance performance test system, characterized in that guided by the combination of the core hole 230 formed in the tray 200 corresponding to the hole core 1510 and the position is clearly fixed.

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