CN112584612A - Double-layer circuit board manufactured by combining single-layer circuit board to flat cable and manufacturing method - Google Patents
Double-layer circuit board manufactured by combining single-layer circuit board to flat cable and manufacturing method Download PDFInfo
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- CN112584612A CN112584612A CN201910961525.4A CN201910961525A CN112584612A CN 112584612 A CN112584612 A CN 112584612A CN 201910961525 A CN201910961525 A CN 201910961525A CN 112584612 A CN112584612 A CN 112584612A
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- circuit board
- layer
- flat cable
- layer circuit
- double
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- 239000010410 layer Substances 0.000 title claims abstract description 139
- 239000002356 single layer Substances 0.000 title claims abstract description 76
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 34
- 239000000853 adhesive Substances 0.000 claims abstract description 34
- 230000001070 adhesive effect Effects 0.000 claims abstract description 34
- 238000009434 installation Methods 0.000 claims abstract description 12
- 239000002184 metal Substances 0.000 claims abstract description 8
- 229910052751 metal Inorganic materials 0.000 claims abstract description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 9
- 238000005520 cutting process Methods 0.000 claims description 8
- 238000004080 punching Methods 0.000 claims description 7
- 239000003292 glue Substances 0.000 claims description 6
- 239000012790 adhesive layer Substances 0.000 claims description 4
- 238000007639 printing Methods 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims description 4
- 239000011889 copper foil Substances 0.000 claims description 2
- 150000002739 metals Chemical class 0.000 abstract description 3
- 239000010408 film Substances 0.000 description 13
- 229910052802 copper Inorganic materials 0.000 description 10
- 239000010949 copper Substances 0.000 description 10
- 239000003522 acrylic cement Substances 0.000 description 8
- 238000004021 metal welding Methods 0.000 description 6
- 238000007650 screen-printing Methods 0.000 description 6
- 238000001723 curing Methods 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 241001391944 Commicarpus scandens Species 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- 230000003064 anti-oxidating effect Effects 0.000 description 1
- 239000013039 cover film Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S4/00—Lighting devices or systems using a string or strip of light sources
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
Abstract
The invention relates to a double-layer circuit board and a manufacturing method thereof, wherein the double-layer circuit board is manufactured by combining a single-layer circuit board with a flat cable, the single-layer circuit board is a conjoined flexible circuit board containing a plurality of lamp strip circuit boards, adhesive is discontinuously printed on the back surface of the circuit board at a plurality of positions, a plurality of holes are punched by a die, wherein some holes are holes for narrowing the edge of the single lamp strip or holes for hollowing out the middle of the single lamp strip, some holes are standby holes for communicating with the flat cable, then the flat cable is manufactured, parallel wires are adhered by a film with adhesive to form the flat cable, a plurality of conducting wire metals are exposed on the flat cable, then the flat cable is cut into a plurality of gaps, the circuit board and the flat cable are aligned and adhered together to form the conjoined double-layer circuit board containing the plurality of lamp strip circuit boards, the circuit board is layered at a plurality of positions, the single circuit board on the front surface, the narrowing or hollow layering part is convenient for multi-directional turning installation.
Description
Technical Field
The invention relates to the field of LED lamp belts and advertising signboards, in particular to a double-layer circuit board manufactured by combining a single-layer circuit board on a flat cable and a manufacturing method thereof.
Background
The prior art makes the lamp area of turning many times and pasting on a plane, mainly used advertising signboards light-emitting word trade to and the lamp house trade, the prior art is used in the flexible line way board lamp area of this trade, what used is following several schemes:
1. the constrictions of many places on individual layer circuit board both sides, the purpose of constriction is convenient for turn on a plane easily, the industry is called S type lamp area, the biggest problem of this kind of circuit board is because many constrictions, the thread that leads to the long lamp area from beginning to end is also on a layer of circuit, and because the constriction leads to the thread to diminish, in addition the lamp area is whole also can not do too wide, too wide difficult turn, and installation space is limited when doing little word, so, just lead to on narrower circuit, some positions still need to narrow, lead to the thread to be laid very little, lead to the lamp area head and the tail between the pressure drop big, tail end luminance reduces. When the lamp strip is used as an advertising word in the industry, an external wire is added to supplement power, so that the voltage drop is reduced, the workload during installation is high, and the comprehensive cost is high.
2. The double-layer circuit board is characterized in that the two sides of the double-layer circuit board are narrowed at a plurality of positions, the narrowing aims to facilitate easy turning on a plane, the double-layer circuit board is called an S-shaped lamp strip in the industry, although the main guide line of the circuit board is enlarged after the circuit board is manufactured into two layers, another problem is caused, when the double-layer circuit board lamp strip is turned and bent, the upper layer copper and the lower layer copper mutually prop against each other, the circuit is easy to prop up and break, therefore, the copper thickness is thicker, the circuit is thicker and harder, the circuit is easier to prop up and break when the circuit is turned, meanwhile, the main line of the long lamp strip from head to tail is also reduced due to narrowing at a plurality of positions, the whole lamp strip cannot be too wide, is too wide and is not easy to turn, the installation space is limited when the lamp strip is small, the partial positions are narrowed, the main line is still insufficient, the pressure drop between the head and the tail ends of the lamp strip is large, the brightness, still need external wire to mend the electricity, reduce the pressure drop, work load during the installation moreover, comprehensive cost is very high.
3. The industry also uses the lamp strip with complete straight strips as advertising words, and the lamp strip has small pressure drop, but is difficult to turn and basically eliminates products.
In order to overcome the defects and shortcomings, how to make a long circuit board which is small in pressure drop, convenient to turn, not easy to break when turning, not adding wires for charging when in installation and use, and reducing the comprehensive cost, the invention combines a single-layer circuit board on a flat cable to manufacture a double-layer circuit board, the circuit board is used as the lamp strip, a single-layer connected flexible circuit board containing a plurality of lamp strip circuit boards is manufactured, a plurality of hollowed holes are formed on the circuit board by die cutting, an adhesive is printed at a plurality of positions on the back surface, then the flat cable is manufactured, parallel wires are adhered by a film with the adhesive to manufacture the flat cable, a plurality of positions on the flat cable are exposed with metal wires, then the flat cable is cut into a plurality of gaps, the circuit board and the flat cable are aligned and adhered together to form the connected double-layer circuit board containing a plurality of lamp strips, the double-layer circuit board is a circuit board with a plurality of layers, and the edge of, the single-layer circuit board on the front side is narrowed at multiple positions, a layered structure is formed at the narrowed position (not limited to the narrowed position) and the back side flat cable, a gap is formed at the narrowed position of the back side flat cable, and when the single-layer LED lamp strip made of the circuit board is used by being attached to a plane on the back side, the single-layer circuit board is convenient to turn and install at the narrowed layered position.
Or, a single-layer connected flexible circuit board containing a plurality of lamp strip circuit boards is manufactured, an adhesive is printed at a plurality of positions on the back, then a flat cable is manufactured, parallel wires are pasted by a film with the adhesive to manufacture the flat cable, a plurality of positions on the flat cable are exposed with metal of the wires, the circuit board and the flat cable are pasted together in an aligning way to form a connected double-layer circuit board containing a plurality of lamp strip circuit boards, the double-layer circuit board is a circuit board with a plurality of layers, the circuit board is punched or cut into a plurality of hollow parts by a die or a laser, hollow parts are formed at the layering positions (but not limited to the layering positions), and a plurality of hollow parts are formed in the middle of each single circuit board in the connected circuit board.
The invention solves the problems that the back-side flat cable is layered at the turning part, the positive electrode and the negative electrode are cut and separated, the wires are not extruded and do not jack when the back-side flat cable turns, the wires can be enlarged to meet the load requirement, and the wires used in use and installation are taken and integrated together without increasing the cost of copper wires, but are layered together, so that the installation efficiency is high, the comprehensive cost is greatly reduced, and the advertising words have no wiring of mixed seven and eight lees.
Disclosure of Invention
The invention relates to a double-layer circuit board and a manufacturing method thereof, wherein the double-layer circuit board is manufactured by combining a single-layer circuit board with a flat cable, the single-layer circuit board is a conjoined flexible circuit board containing a plurality of lamp strip circuit boards, adhesive is discontinuously printed on the back surface of the circuit board at a plurality of positions, a plurality of holes are punched by a die, wherein some holes are holes for narrowing the edge of the single lamp strip or holes for hollowing out the middle of the single lamp strip, some holes are standby holes for communicating with the flat cable, then the flat cable is manufactured, parallel wires are adhered by a film with adhesive to form the flat cable, a plurality of conducting wire metals are exposed on the flat cable, then the flat cable is cut into a plurality of gaps, the circuit board and the flat cable are aligned and adhered together to form the conjoined double-layer circuit board containing the plurality of lamp strip circuit boards, the circuit board is layered at a plurality of positions, the single circuit board on the front surface, the narrowing or hollow layering part is convenient for multi-directional turning installation.
The invention provides a method for manufacturing a double-layer circuit board by combining a single-layer circuit board with a flat cable, which comprises the steps of manufacturing the single-layer circuit board, wherein the single-layer circuit board is a connected flexible circuit board containing a plurality of circuit boards with light strips, manufacturing the flat cable, adhering parallel wires by using a film with glue to manufacture the flat cable, exposing a plurality of conducting wire metals on the flat cable, cutting the flat cable into a plurality of gaps, applying adhesive on a plurality of positions on the back surface of the circuit board to form an intermittent adhesive layer with the glue at a plurality of positions, punching a plurality of holes, wherein the holes are holes for narrowing the edge of a single light strip or/and hollow holes in the middle of the light strip, the holes are spare holes for conducting with the flat cable, aligning and adhering the circuit board and the flat cable together to form the connected double-layer circuit board containing a plurality of light strips, and the double-layer circuit board is a circuit board with, at the edge of each single-layer circuit board in the double-layer circuit board, the single-layer circuit board on the front side is narrowed at a plurality of positions, or/and a plurality of hollow parts are formed in the middle of the circuit board on the front side, the narrowed positions or the hollow parts (not limited to the narrowed positions and the hollow parts) of the circuit board on the front side and the flat cable on the back side form a layered structure, gaps are formed in the narrowed positions or/and the hollow parts of the flat cable on the back side, and the LED single-layer lamp strip made of the circuit board is convenient for multi-directional turning installation at the narrowed positions or the hollow layered positions during use.
According to the present invention, there is also provided a double-layer circuit board manufactured by combining a single-layer circuit board to a flat cable, comprising: a single-layer circuit board on the upper layer; an adhesive in the intermediate layer; a flat cable on the lower layer; it is characterized in that the circuit board is a conjoined circuit board containing a plurality of single strip circuit boards, the circuit board on the upper layer is a single-layer circuit board, the circuit board on the upper layer and the flat cable on the lower layer are intermittently bonded at a plurality of positions through an intermediate layer adhesive, the formed double-layer circuit board is a circuit board with a plurality of layers, at the edge of each single-layer circuit board in the double-layer circuit board, the single-layer circuit board on the front surface is narrowed at a plurality of positions, or/and the circuit board on the front side is provided with a plurality of hollow structures in the middle of each strip, and a layered structure is formed at the narrowing or/and hollow part (not limited to the narrowing or hollow part) and the back side flat cable, the back side flat cable is provided with a gap at the narrowing or/hollow part, the single LED strip made of the circuit board, the narrowing or/and the hollow-out part is of a layered structure, so that the multidirectional turning installation is convenient during use.
The invention also provides a method for manufacturing a double-layer circuit board by combining a single-layer circuit board with a flat cable, in particular to a method for manufacturing a single-layer circuit board which is a conjoined flexible circuit board containing a plurality of circuit boards with lamps, then manufacturing a flat cable, sticking parallel wires by a film with adhesive to manufacture the flat cable, exposing metal of the wires at a plurality of positions on the flat cable, applying adhesive on the back of the circuit board or the flat cable, wherein the adhesive is discontinuously adhered on the board to form a plurality of spaced adhesive layers, and attaching the circuit board and the flat cable together in an aligned manner to form a connected double-layer circuit board with a plurality of lamp strip circuit boards, wherein the double-layer circuit board is a circuit board with a plurality of layers, and then, cutting the layering part to enable the single circuit board to be a plurality of hollows, but not limited to the hollows formed at the layering position.
According to the present invention, there is also provided a double-layer circuit board manufactured by combining a single-layer circuit board to a flat cable, comprising: a single-layer circuit board on the upper layer; an adhesive in the intermediate layer; a flat cable on the lower layer; the LED lamp strip is characterized in that the circuit board is a connected circuit board comprising a plurality of lamp strip circuit boards, the circuit board on the upper layer is a single-layer circuit board, the upper-layer circuit board and the lower-layer flat cable are intermittently bonded at a plurality of positions through an intermediate-layer adhesive, the formed double-layer circuit board is a circuit board with a plurality of layers, hollows are formed at the layers (but not limited to the layers), a plurality of hollows are formed in the middle of each single circuit board in the connected circuit board, and the single LED lamp strip manufactured by the circuit board is convenient to turn in multiple directions at the hollowed layers during use.
According to a preferred embodiment of the present invention, the double-layer circuit board is formed by combining a single-layer circuit board to a flat cable, wherein the flat cable is formed by arranging a plurality of twisted wires or a plurality of single wires in a juxtaposed manner.
According to a preferred embodiment of the present invention, the single-layer circuit board is a circuit board made of conductive wires or a circuit board made of copper foil.
According to a preferred embodiment of the present invention, the double-layer circuit board formed by combining the single-layer circuit board to the flat cable is characterized in that an adhesive is disposed at a position facing an intermediate layer in the board at a pad position (but not limited to a pad position of an LED lamp) for soldering the LED lamp.
According to a preferred embodiment of the present invention, the double-layer circuit board is formed by combining a single-layer circuit board onto a flat cable, wherein the adhesive is applied by printing.
The details of one or more embodiments of the invention are set forth in the accompanying drawings and the description below.
Drawings
The features, objects, and advantages of the present invention will become more apparent from the description set forth below when taken in conjunction with the drawings, a brief description of which follows.
Fig. 1 is a schematic plan view of a single-layer circuit board on an upper layer, a via hole is arranged at a via soldering position, and a front circuit pad of the upper layer circuit board is exposed at the edge of the via hole.
Fig. 2 is a schematic plan view of the upper layer of the integrated single-layer circuit board after a plurality of hollow holes are formed by die cutting.
Fig. 3 is a schematic plan view of a single-layer circuit board having a plurality of holes and an adhesive printed at a plurality of positions on a back surface of the single-layer circuit board.
Fig. 4 is a schematic plan view of a plurality of flat wires juxtaposed on a back adhesive film.
Fig. 5 is a schematic plan view of a cover film with windows covering the front surfaces of the juxtaposed flat wires, and the juxtaposed flat wires are exposed from the windows to form solder joints, so as to form a lower-layer flat cable.
Fig. 6 is a schematic plan view showing a plurality of slits punched in a die between two adjacent flat wires of the lower layer bus.
Fig. 7 is a schematic plan view of a plurality of conjoined double-layer circuit boards with discontinuous adhesion and discontinuous layering formed by attaching an upper layer single-layer circuit board with a plurality of hollowed-out holes to a lower layer flat cable through an adhesive in a middle layer.
Fig. 8 is a schematic cross-sectional view of a double-layer circuit board with discontinuous adhesion and discontinuous lamination formed by attaching an upper-layer single-layer circuit board with a plurality of hollowed-out holes to a lower-layer flat cable through an adhesive in a middle layer.
Fig. 9 is a schematic plan view showing that the single-layer circuit board on the upper layer with a plurality of hollowed-out holes is bonded with the flat cable on the lower layer through the adhesive on the middle layer to form a double-sided circuit board which is intermittently bonded and intermittently layered, and the single-layer circuit board on the front side is narrowed at a plurality of places after being cut into single double-layer circuit boards.
Fig. 10 is a schematic plan view of a plurality of connected double-layer circuit boards, in which an upper single-layer circuit board is attached to a lower flat cable through an adhesive in an intermediate layer to form intermittent adhesion and intermittent layering, and a plurality of hollowed-out holes are formed in the middle of each single circuit board in the connected double-layer circuit boards.
Fig. 11 is a schematic rear plane view of a multi-strip connected double-layer circuit board with an upper layer of single-layer circuit board attached to a lower layer of flat cable through an adhesive in a middle layer to form discontinuous adhesion, discontinuous layering, and multiple hollowed-out holes formed in the middle of each single-strip circuit board in the connected double-layer circuit board and cut into single-strip double-layer circuit boards.
Detailed Description
The present invention will be described in detail below by taking preferred embodiments as examples.
It will be understood by those skilled in the art that the following descriptions are provided for purposes of illustration and description of certain preferred embodiments only and are not intended to limit the scope of the present invention.
Preferably, the first implementation:
the method comprises the steps of manufacturing a front circuit and a positioning hole by adopting a traditional circuit board manufacturing process and carrying out silk-screen printing of circuit anti-corrosion ink, baking and curing, etching and film stripping on a single-sided flexible copper-clad plate, testing, attaching and pressing a covering film with a window on the circuit in an alignment manner, exposing a bonding pad 1.1 from the window, printing characters, baking and curing, punching and cutting a via hole 1.2 by using a die, exposing a front circuit bonding pad 1.3 at the hole edge of the via hole 1.2, and manufacturing the upper-layer single-layer circuit board 1 shown in figure 1.
The single-layer circuit board 1 on the upper layer is hung on the positioning pin of the die by using a pre-designed die on a 60-ton punching machine of a Wobbe finishing machine, and then a plurality of hollowed-out holes 1.4 are punched (as shown in figure 2).
According to the engineering data of the design, at a plurality of positions of the local part of the back surface of the single-layer circuit board 1 on the upper layer with a plurality of hollowed-out holes 1.4, a 36T acrylic adhesive 2 (shown in figure 3) for screen printing a flexible board is used on a screen printing machine, and enters a tunnel furnace at 120 ℃ for 3 minutes to be heated and volatilized to remove the solvent in the acrylic adhesive 2.
The method comprises the steps of placing a plurality of coils of flat copper wires 3.1 on a pay-off rack of a wire covering machine, positioning and arranging through a spacing rod die arranged on the wire covering machine, enabling one side of each flat copper wire 3.1 to be covered and adhered with a PI film 1 with glue (shown in figure 4), enabling the other side of each flat copper wire 3.1 to be covered and adhered with a covering film with a pad window, enabling the flat copper wires 3.1 to be exposed out of the pad window to form a metal welding point 3.1a, enabling the flat copper wires 3.1 to be clamped in the middle to manufacture a flat cable (shown in figure 5), and punching a plurality of gaps 3.2 on a punch press through the flat cable die according to a pre-designed position (shown in figure 6).
The single-layer circuit board 1 on the upper layer is printed with the side of an acrylic adhesive 2 and is aligned and adhered with the side of a flat cable with metal welding spots 3.1a, the metal welding spots 3.1a are exposed from a through hole 1.2 of the single-layer circuit board 1 on the upper layer, then the single-layer circuit board and the flat cable are pressed together on a quick press at the temperature of 150 ℃ and the pressure of 120kg, then the single-layer circuit board and the flat cable are baked for 60 minutes at the temperature of 150 ℃ by an oven, the acrylic adhesive 2 is solidified, and then the OSP surface treatment is carried out, so as to manufacture the integrated double-layer circuit board (shown in figure 7) containing a plurality of oxidation-proof circuit boards, wherein the double-layer circuit board is a multi-layered circuit board (shown in figure 8), the single-layer circuit board on the front side is narrowed at a plurality of positions (shown in figure 9), the narrowed positions (not limited to the narrowed positions) and the flat cable on the back side, when the back of the single LED lamp strip made of the circuit board is attached to a plane for use, the single LED lamp strip is convenient to turn and install at the narrowed layered position.
The second preferred implementation:
the method comprises the steps of manufacturing a front circuit and a positioning hole by adopting a traditional circuit board manufacturing process and carrying out silk-screen printing of circuit anti-corrosion ink, baking and curing, etching and film stripping on a single-sided flexible copper-clad plate, testing, attaching and pressing a covering film with a window on the circuit in an alignment manner, exposing a bonding pad 1.1 from the window, printing characters, baking and curing, punching and cutting a via hole 1.2 by using a die, exposing a front circuit bonding pad 1.3 at the hole edge of the via hole 1.2, and manufacturing the upper-layer single-layer circuit board 1 shown in figure 1.
According to the designed engineering data, at a plurality of positions on the back surface of the single-layer circuit board 1 on the upper layer, an acrylic adhesive 2 for a 36T silk-screen printing flexible board is used on a silk-screen printing machine, and enters a tunnel furnace at 120 ℃ for 3 minutes to be heated and volatilized to remove the solvent in the acrylic adhesive 2.
A plurality of coils of flat copper wires 3.1 are placed on a pay-off rack of a wire covering machine and are positioned and arranged through a spacing rod die arranged on the wire covering machine, one side of each flat copper wire 3.1 is covered and adhered with a PI film 1 with glue (shown in figure 4), the other side of each flat copper wire 3.1 is covered and adhered with a covering film with a pad window, the flat copper wires 3.1 are exposed from the pad window to form metal welding spots 3.1a, and the flat copper wires 3.1 are clamped in the middle to be manufactured into a flat cable (shown in figure 5).
The single-layer circuit board 1 on the upper layer is printed with which side of an acrylic adhesive 2 and is aligned and attached with which side of a flat cable with a metal welding spot 3.1a, the metal welding spot 3.1a is exposed from a through hole 1.2 of the single-layer circuit board 1 on the upper layer, then the single-layer circuit board is pressed on a rapid press by parameters of 150 ℃ and 120kg pressure, then the single-layer circuit board is baked for 60 minutes by an oven at 150 ℃ to solidify the acrylic adhesive 2, after OSP surface anti-oxidation treatment, a plurality of hollowed-out holes 1.5 are punched in the middle of each circuit board in the conjoined circuit board on a 60-ton punching machine of a refined machine to manufacture the conjoined double-layer circuit board (as shown in figure 10) containing a plurality of circuit boards, the double-layer circuit board is a circuit board with a plurality of layers (as shown in figure 8), a plurality of hollowed-out holes 1.5 are punched in the middle of each circuit board in the double-layer circuit board (as shown in figure 11), when the back of the single LED lamp strip made of the circuit board is attached to a plane for use, the single LED lamp strip is convenient to turn and install at the hollowed-out layered position.
The present invention has been described in detail with reference to the accompanying drawings, which illustrate a double-layered circuit board and a method for manufacturing the same, in which the single-layered circuit board is combined with a flat cable. It will be understood by those skilled in the art, however, that the foregoing is merely illustrative and descriptive of some specific embodiments and is not to be construed as limiting the scope of the invention, especially the scope of the claims.
Claims (8)
1. A method for manufacturing a double-layer circuit board by combining a single-layer circuit board with a flat cable comprises manufacturing a single-layer circuit board, wherein the single-layer circuit board is a connected flexible circuit board containing a plurality of circuit boards with light bands, manufacturing a flat cable, adhering parallel wires with films with glue to manufacture the flat cable, exposing metal wires on the flat cable, cutting the flat cable into a plurality of gaps, applying adhesive on a plurality of positions on the back surface of the circuit board to form discontinuous adhesive layers with glue on a plurality of positions, punching a plurality of holes, wherein the holes are holes for narrowing the edge of a single light band or/and holes for hollowing the middle of the single light band, the holes are spare holes for conducting with the flat cable, aligning and adhering the circuit board and the flat cable together to form the connected double-layer circuit board containing the plurality of circuit boards with layered positions, the double-layer circuit board is a circuit board with layered positions, and the edge of each single-layer circuit board in the double-layer, the single LED lamp strip manufactured by the circuit board is convenient to turn in multiple directions at the narrowing or hollowed layering positions when in use.
2. A double-layer circuit board manufactured by combining a single-layer circuit board on a flat cable comprises:
a single-layer circuit board on the upper layer;
an adhesive in the intermediate layer;
a flat cable on the lower layer;
it is characterized in that the circuit board is a conjoined circuit board containing a plurality of single strip circuit boards, the circuit board on the upper layer is a single-layer circuit board, the circuit board on the upper layer and the flat cable on the lower layer are intermittently bonded at a plurality of positions through an intermediate layer adhesive, the formed double-layer circuit board is a circuit board with a plurality of layers, at the edge of each single-layer circuit board in the double-layer circuit board, the single-layer circuit board on the front surface is narrowed at a plurality of positions, or/and the circuit board on the front side is provided with a plurality of hollow structures in the middle of each strip, and a layered structure is formed at the narrowing or/and hollow part (not limited to the narrowing or hollow part) and the back side flat cable, the back side flat cable is provided with a gap at the narrowing or/hollow part, the single LED strip made of the circuit board, the narrowing or/and the hollow-out part is of a layered structure, so that the multidirectional turning installation is convenient during use.
3. A method for manufacturing a double-layer circuit board by combining a single-layer circuit board with a flat cable comprises manufacturing the single-layer circuit board, wherein the single-layer circuit board is a connected flexible circuit board containing a plurality of circuit boards with lamps, manufacturing the flat cable, sticking parallel wires with a film with adhesive to manufacture the flat cable, exposing metal wires at a plurality of positions on the flat cable, applying adhesive on the back of the circuit board or the flat cable, wherein the adhesive is discontinuously adhered on the board to form a plurality of spaced adhesive layers, and attaching the circuit board and the flat cable together in an aligned manner to form a connected double-layer circuit board with a plurality of lamp strip circuit boards, wherein the double-layer circuit board is a circuit board with a plurality of layers, and then, cutting the layering part to enable the single circuit board to be a plurality of hollows, but not limited to the hollows formed at the layering position.
4. A double-layer circuit board manufactured by combining a single-layer circuit board on a flat cable comprises:
a single-layer circuit board on the upper layer;
an adhesive in the intermediate layer;
a flat cable on the lower layer;
the LED lamp strip is characterized in that the circuit board is a connected circuit board comprising a plurality of lamp strip circuit boards, the circuit board on the upper layer is a single-layer circuit board, the upper-layer circuit board and the lower-layer flat cable are intermittently bonded at a plurality of positions through an intermediate-layer adhesive, the formed double-layer circuit board is a circuit board with a plurality of layers, hollows are formed at the layers (but not limited to the layers), a plurality of hollows are formed in the middle of each single circuit board in the connected circuit board, and the single LED lamp strip manufactured by the circuit board is convenient to turn in multiple directions at the hollowed layers during use.
5. A two-layer wiring board of claim 1, 2, 3 or 4, wherein the flat cable is formed by arranging a plurality of twisted wires or a plurality of single wires in parallel.
6. The double-layer circuit board formed by combining the single-layer circuit board and the flat cable according to claim 1, 2, 3 or 4, wherein the single-layer circuit board is a circuit board made of conductive wires or a circuit board made of copper foil.
7. The double-layer circuit board formed by combining the single-layer circuit board onto the flat cable according to claim 1, 2, 3 or 4, wherein an adhesive is provided at the positions of the pads for soldering the LED lamp (but not limited to the positions of the pads for soldering the LED lamp) and the positions of the middle layers in the opposite board.
8. A two-layer wiring board formed by combining a single-layer wiring board with a flat cable according to claim 1 or 3, wherein the adhesive is applied by printing.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910961525.4A CN112584612A (en) | 2019-09-27 | 2019-09-27 | Double-layer circuit board manufactured by combining single-layer circuit board to flat cable and manufacturing method |
| PCT/CN2020/108998 WO2021057310A1 (en) | 2019-09-27 | 2020-08-13 | Double-layer circuit board made by combining single-layer circuit board onto flat cable and manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910961525.4A CN112584612A (en) | 2019-09-27 | 2019-09-27 | Double-layer circuit board manufactured by combining single-layer circuit board to flat cable and manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112584612A true CN112584612A (en) | 2021-03-30 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910961525.4A Pending CN112584612A (en) | 2019-09-27 | 2019-09-27 | Double-layer circuit board manufactured by combining single-layer circuit board to flat cable and manufacturing method |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN112584612A (en) |
| WO (1) | WO2021057310A1 (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016021555A (en) * | 2014-05-27 | 2016-02-04 | キヤノン・コンポーネンツ株式会社 | Flexible printed wiring board and flexible circuit board |
| CN206181548U (en) * | 2016-10-19 | 2017-05-17 | 王定锋 | LED stripe shape lamp double layers of circuit boards module |
| CN212381469U (en) * | 2019-09-27 | 2021-01-19 | 王定锋 | Double-layer circuit board manufactured by combining single-layer circuit board on flat cable |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202074316U (en) * | 2010-11-10 | 2011-12-14 | 张�林 | Combined type LED long lamp belt |
| JP2014096260A (en) * | 2012-11-08 | 2014-05-22 | Hitachi Metals Ltd | Flat wiring material and mounting body using it |
| CN204005452U (en) * | 2014-07-28 | 2014-12-10 | 深圳市零奔洋科技有限公司 | Flexible light band |
| CN204153548U (en) * | 2014-09-15 | 2015-02-11 | 王定锋 | A kind of LED be connected |
| CN107990175A (en) * | 2017-12-04 | 2018-05-04 | 惠州科利尔光电有限公司 | A kind of flexible LED rope light |
| CN208154172U (en) * | 2018-04-13 | 2018-11-27 | 深圳市鑫盛源光电有限公司 | A kind of S-shaped LED lens light bar of any bending of energy |
| CN208025174U (en) * | 2018-04-17 | 2018-10-30 | 铜陵国展电子有限公司 | A kind of LED light string with wire producing |
-
2019
- 2019-09-27 CN CN201910961525.4A patent/CN112584612A/en active Pending
-
2020
- 2020-08-13 WO PCT/CN2020/108998 patent/WO2021057310A1/en active Application Filing
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016021555A (en) * | 2014-05-27 | 2016-02-04 | キヤノン・コンポーネンツ株式会社 | Flexible printed wiring board and flexible circuit board |
| CN206181548U (en) * | 2016-10-19 | 2017-05-17 | 王定锋 | LED stripe shape lamp double layers of circuit boards module |
| CN212381469U (en) * | 2019-09-27 | 2021-01-19 | 王定锋 | Double-layer circuit board manufactured by combining single-layer circuit board on flat cable |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2021057310A1 (en) | 2021-04-01 |
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