CN204153548U - A kind of LED be connected - Google Patents
A kind of LED be connected Download PDFInfo
- Publication number
- CN204153548U CN204153548U CN201420541246.5U CN201420541246U CN204153548U CN 204153548 U CN204153548 U CN 204153548U CN 201420541246 U CN201420541246 U CN 201420541246U CN 204153548 U CN204153548 U CN 204153548U
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- CN
- China
- Prior art keywords
- led
- circuit
- lineback
- circuit board
- connecting line
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model relates to a kind of LED be connected.Specifically, a kind of adopt parallel lineback and circuit board composition to be formed bilayer or the LED of multilayer circuit, sticking with glue the bonding LED lamp bar wiring board of agent is fixed on the lineback circuit of Alignment, conducting between back side wire and front-side circuit is taked to weld a connecting line on front-side circuit solder joint, and then the connecting line other end is soldered on the wire of the back side or front-side circuit is welded to connect line one end, the other one ends wound of connecting line is overleaf on wire, forms bilayer or multilayer circuit light bar that knockdown positive and negative is communicated with.This LED be connected makes simply, structural strength is high, folding, and reliability is high.
Description
Technical field
The utility model belongs to LED circuit board and LED decorations lighting field, is specifically related to a kind of LED be connected.
Background technology
Present LED on the market, the particularly LED of high pressure, usually be all first wire is extruded encapsulating to be fixed in the matrix plastic strip of PVC, again the circuit board unit being welded with LED is seated in the groove of matrix plastic strip, with crochet hook conducting connecting line is wrapped on the wire in plastic strip, and then once extrude encapsulating encapsulate, such production process is numerous and diverse, efficiency is low, and encapsulate needs twice encapsulating just can complete, and causes encapsulating compound thicker, printing opacity rate variance, dispel the heat bad, and cost is high.
In addition, the ultra-long circuit board that can form continuous entire volume made of juxtaposed flat conductor invented before the present inventor, itself contains power lead in its circuit.But, must on the wiring board of this overlength SMT paster LED element, growth light bar could be made.But paster LED element on the wiring board of overlength, technical requirement is high, complex procedures, and operation easier is comparatively large, also higher to the requirement of equipment.
LED circuit board unit is pasted onto on lineback circuit by bonded adhesives by the utility model, connecting line one end is welded in the tie point of circuit board unit, one end is soldered on lineback circuit in addition, forms a kind of LED be connected, and makes simple, encapsulation encapsulate only need once have been encapsulated, such encapsulate can wrap thin, and make the heat radiation of the long light bar of this LED better, glue consumption is low, and LED light emission rate is high, and cost is low.
Utility model content
The utility model can overcome the above shortcoming of prior art, specifically, the bilayer such as adopting parallel lineback and circuit board composition to be formed or the LED of multilayer circuit, sticking with glue the bonding LED lamp bar wiring board of agent is fixed on the lineback circuit of Alignment, conducting between back side wire and front-side circuit is taked to weld a connecting line on front-side circuit solder joint, and then the connecting line other end is soldered on the wire of the back side, or front-side circuit is welded to connect line one end, the other one ends wound of connecting line is overleaf on wire, form bilayer or the multilayer circuit light bar of the connection of knockdown positive and negative.Encapsulation encapsulate only needs once can encapsulate, and such encapsulate can wrap thin, and make the heat radiation of the long light bar of this LED better, glue consumption is low, and LED light emission rate is high, and cost is low.
And the intensity of the LED structure formed therefrom is higher, and more folding, reliability is high.
Structure of the present utility model makes the requirement of manufacturing process low, simple to operate.And the cryogenic material that the insulation supporting substrate making lineback circuit can adopt such as PET etc. cheap, makes material cost reduce.
According to the utility model, provide a kind of LED be connected, comprising: the one side or the double-sided circuit Slab element that are welded with LED; The wire of Alignment is pasted onto on the insulation supporting substrate of band glue, forms lineback circuit; Bonded adhesives; Conducting connecting line; Wherein, LED circuit board unit is pasted onto on lineback circuit by bonded adhesives, connecting line one end is welded in the tie point of circuit board unit, one end is soldered on lineback in addition, or connecting line one end is welded in the connection welding of circuit board unit, one end is wrapped on the lineback of the back side in addition, forms a kind of LED be connected.
According to an embodiment of the present utility model, described a kind of LED be connected, it is characterized in that, described lineback is solid conductor, or the stranded conductor that multiple conducting wires twists together.
According to an embodiment of the present utility model, described a kind of LED be connected, it is characterized in that, described in be welded with the one side of LED or double-sided circuit Slab element be the circuit board that etched circuit board or wire circuit plate or cross cutting form circuit.
Following in the description of the drawings and specific embodiments, one or more embodiments of the detail of the present utility model will be set forth.From these descriptions, accompanying drawing and claim, other features, objects and advantages of the present utility model can be known.
Accompanying drawing explanation
By reading this description in conjunction with the following drawings, feature of the present utility model, object and advantage will become more apparent, in the accompanying drawings:
Fig. 1 is the circuit board unit schematic diagram being welded with LED.
Fig. 2 is that the wire of Alignment is pasted onto on the insulation supporting substrate of band glue, forms the schematic diagram of lineback circuit.
Fig. 3 is that LED circuit board unit is pasted onto the schematic diagram on lineback circuit by bonded adhesives.
Fig. 4 is that LED circuit board unit is pasted onto on lineback circuit by bonded adhesives, and connecting line one end is welded in the tie point of circuit board unit, and one end is soldered on lineback in addition, forms a kind of schematic diagram of the LED be connected.
Fig. 5 is that LED circuit board unit is pasted onto on lineback circuit by bonded adhesives, and connecting line one end is welded in the tie point of circuit board unit, and one ends wound is on lineback in addition, forms a kind of schematic diagram of the LED be connected.
Detailed description of the invention
Below with reference to accompanying drawings the concrete mode of a kind of LED be connected of the utility model is described in more detail.
Those skilled in the art are to be understood that; these embodiments only list some specific embodiment of the utility model; to the utility model and protection domain without any restrictions, some other similar or equivalent embodiment equally also can be used for implementing the utility model.
As shown in Figure 1, by LED circuit board (1), adopt traditional SMT paster mode, print solder paste on the element solder joint of LED circuit board (1), LED (1.1) and resistance (1.2) are mounted on solder joint corresponding to wiring board, weld through Reflow Soldering, LED (1.1) and resistance (1.2) are welded in LED circuit board (1), form the circuit board unit (as shown in Figure 1) being welded with LED.
The wire (2.1) of Alignment is pasted onto on the insulation supporting substrate (2) of band glue, forms lineback circuit (as shown in Figure 2).
As shown in Figure 3, by LED circuit board unit, be pasted onto on the wire (2.1) on lineback circuit by bonded adhesives contraposition one by one, then, respectively connecting line (3) one end is welded on the tie point of circuit board unit, one end is soldered on the wire (2.1) of lineback circuit in addition, form a kind of LED (as shown in Figure 4) be connected, or, respectively connecting line (3) one end is welded on the tie point of circuit board unit, one ends wound is on the wire (2.1) of lineback circuit in addition, form a kind of LED (as shown in Figure 5) be connected.
Below in conjunction with specific embodiments a kind of LED be connected of the utility model is described in detail by reference to the accompanying drawings.But it will be appreciated by those skilled in the art that the above is only illustrate and describe some detailed description of the invention, to scope of the present utility model, the especially scope of claim, does not have any restriction.Scope of the present utility model is limited by claims.
Claims (3)
1. the LED be connected, comprising:
Be welded with one side or the double-sided circuit Slab element of LED;
The wire of Alignment is pasted onto on the insulation supporting substrate of band glue, forms lineback circuit;
Bonded adhesives;
Conducting connecting line;
Wherein, LED circuit board unit is pasted onto on lineback circuit by bonded adhesives, connecting line one end is welded in the tie point of circuit board unit, one end is soldered on lineback in addition, or connecting line one end is welded in the connection welding of circuit board unit, one end is wrapped on the lineback of the back side in addition, forms a kind of LED be connected.
2. a kind of LED be connected according to claim 1, it is characterized in that, described lineback is solid conductor, or the stranded conductor that multiple conducting wires twists together.
3. a kind of LED be connected according to claim 1, is characterized in that, described in be welded with the one side of LED or double-sided circuit Slab element be the circuit board that etched circuit board or wire circuit plate or cross cutting form circuit.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201420541246.5U CN204153548U (en) | 2014-09-15 | 2014-09-15 | A kind of LED be connected |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201420541246.5U CN204153548U (en) | 2014-09-15 | 2014-09-15 | A kind of LED be connected |
Publications (1)
Publication Number | Publication Date |
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CN204153548U true CN204153548U (en) | 2015-02-11 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201420541246.5U Expired - Fee Related CN204153548U (en) | 2014-09-15 | 2014-09-15 | A kind of LED be connected |
Country Status (1)
Country | Link |
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CN (1) | CN204153548U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021057310A1 (en) * | 2019-09-27 | 2021-04-01 | 王定锋 | Double-layer circuit board made by combining single-layer circuit board onto flat cable and manufacturing method |
WO2021093388A1 (en) * | 2019-11-11 | 2021-05-20 | 王定锋 | Long light strip having more uniform brightness overall and fabrication method |
-
2014
- 2014-09-15 CN CN201420541246.5U patent/CN204153548U/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021057310A1 (en) * | 2019-09-27 | 2021-04-01 | 王定锋 | Double-layer circuit board made by combining single-layer circuit board onto flat cable and manufacturing method |
WO2021093388A1 (en) * | 2019-11-11 | 2021-05-20 | 王定锋 | Long light strip having more uniform brightness overall and fabrication method |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20151228 Address after: Chen 51 Road 516029 in Guangdong province Huizhou city Huicheng District Patentee after: Huizhou Guozhan Electronics Co.,Ltd. Address before: 516000 Guangdong city of Huizhou province Chen Chen Jiang Town Industrial Zone (Huizhou Avenue - State Electronics Co. Ltd.) Patentee before: Wang Dingfeng |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150211 |
|
CF01 | Termination of patent right due to non-payment of annual fee |