CN112582315A - 一种防氧化硅片清洗装置 - Google Patents
一种防氧化硅片清洗装置 Download PDFInfo
- Publication number
- CN112582315A CN112582315A CN202110224962.5A CN202110224962A CN112582315A CN 112582315 A CN112582315 A CN 112582315A CN 202110224962 A CN202110224962 A CN 202110224962A CN 112582315 A CN112582315 A CN 112582315A
- Authority
- CN
- China
- Prior art keywords
- silicon wafer
- cleaning device
- ring
- wafer cleaning
- clasping
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 72
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 69
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 66
- 239000010703 silicon Substances 0.000 title claims abstract description 66
- 230000003064 anti-oxidating effect Effects 0.000 title claims abstract description 29
- 230000003647 oxidation Effects 0.000 claims description 12
- 238000007254 oxidation reaction Methods 0.000 claims description 12
- 238000003780 insertion Methods 0.000 claims description 5
- 230000037431 insertion Effects 0.000 claims description 5
- 239000007788 liquid Substances 0.000 abstract description 7
- 239000003814 drug Substances 0.000 abstract description 6
- 238000003860 storage Methods 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 49
- 238000003825 pressing Methods 0.000 description 10
- 238000000034 method Methods 0.000 description 6
- 238000012986 modification Methods 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- 241000446313 Lamella Species 0.000 description 2
- 239000013043 chemical agent Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000012459 cleaning agent Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- 239000011863 silicon-based powder Substances 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202110224962.5A CN112582315B (zh) | 2021-03-01 | 2021-03-01 | 一种防氧化硅片清洗装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202110224962.5A CN112582315B (zh) | 2021-03-01 | 2021-03-01 | 一种防氧化硅片清洗装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN112582315A true CN112582315A (zh) | 2021-03-30 |
CN112582315B CN112582315B (zh) | 2021-05-07 |
Family
ID=75113987
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202110224962.5A Active CN112582315B (zh) | 2021-03-01 | 2021-03-01 | 一种防氧化硅片清洗装置 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN112582315B (zh) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0520105A1 (en) * | 1991-06-28 | 1992-12-30 | Shin-Etsu Handotai Company Limited | A wafer basket |
CN210963140U (zh) * | 2019-08-13 | 2020-07-10 | 北京九溪堂国际商贸有限公司 | 一种多层多用膏药贴 |
CN211788931U (zh) * | 2020-04-09 | 2020-10-27 | 金寨嘉悦新能源科技有限公司 | 一种用于太阳能电池硅片清洗机 |
CN112309942A (zh) * | 2020-10-30 | 2021-02-02 | 四川上特科技有限公司 | 一种硅片清洗系统 |
-
2021
- 2021-03-01 CN CN202110224962.5A patent/CN112582315B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0520105A1 (en) * | 1991-06-28 | 1992-12-30 | Shin-Etsu Handotai Company Limited | A wafer basket |
CN210963140U (zh) * | 2019-08-13 | 2020-07-10 | 北京九溪堂国际商贸有限公司 | 一种多层多用膏药贴 |
CN211788931U (zh) * | 2020-04-09 | 2020-10-27 | 金寨嘉悦新能源科技有限公司 | 一种用于太阳能电池硅片清洗机 |
CN112309942A (zh) * | 2020-10-30 | 2021-02-02 | 四川上特科技有限公司 | 一种硅片清洗系统 |
Also Published As
Publication number | Publication date |
---|---|
CN112582315B (zh) | 2021-05-07 |
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Legal Events
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PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20220627 Address after: No. 151, Keji Avenue, Sanshui street, Jiangyan District, Taizhou City, Jiangsu Province, 225300 Patentee after: Jiangsu Yadian Technology Co.,Ltd. Address before: 8 / F, block B, Tianrun science and technology building, 801 Changwu Middle Road, Wujin District, Changzhou City, Jiangsu Province, 213000 Patentee before: CHANGZHOU JIANGSU UNIVERSITY ENGINEERING TECHNOLOGY Research Institute Patentee before: Jiangsu Yadian Technology Co.,Ltd. |
|
TR01 | Transfer of patent right | ||
CP03 | Change of name, title or address |
Address after: 225500 No. 151, Keji Avenue, Sanshui street, Jiangyan District, Taizhou City, Jiangsu Province Patentee after: Jiangsu Yadian Technology Co.,Ltd. Address before: No. 151, Keji Avenue, Sanshui street, Jiangyan District, Taizhou City, Jiangsu Province, 225300 Patentee before: Jiangsu Yadian Technology Co.,Ltd. |
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CP03 | Change of name, title or address |