CN112490155B - Chip packaging system - Google Patents
Chip packaging system Download PDFInfo
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- CN112490155B CN112490155B CN202011361673.1A CN202011361673A CN112490155B CN 112490155 B CN112490155 B CN 112490155B CN 202011361673 A CN202011361673 A CN 202011361673A CN 112490155 B CN112490155 B CN 112490155B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
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Abstract
The invention discloses a chip packaging system which comprises a base, wherein a vertical plate is fixedly connected to the position, close to the rear side, of the top of the base, a first motor is installed on the rear side surface of the vertical plate, an output shaft of the first motor penetrates through the vertical plate and is fixedly connected with an outer cylinder, the top end of the outer cylinder is open, the middle of one side of the outer cylinder is open, and a strip-shaped outlet is formed in the outer cylinder at the bottom of the middle opening; according to the invention, the outer cylinder is in a horizontal state, a worker placing the shell is at one side, a worker placing the chip is in the middle, a worker gluing and taking out the chip is at the other side, the station layout is reasonable, the work of the workers is performed by the workers, the chip and the shell can be placed into the outer cylinder at the same time, then the outer cylinder is rotated to a vertical state, the smearing of glue liquid cannot be influenced after the outer cylinder is vertically placed, the semicircular plate is in an initial heating state in the smearing process, the shell and the chip are enabled to be close to the heating element quickly after the smearing is finished, and the improvement of the packaging efficiency is realized through the mutual matching of the processes.
Description
Technical Field
The invention belongs to the technical field of chip packaging, and particularly relates to a chip packaging system.
Background
The shell for installing semiconductor integrated circuit chip has the functions of placing, fixing, sealing, protecting chip and enhancing electrothermal performance, and is also the bridge for communicating the internal world of chip with external circuit, and the contacts on the chip are connected to the pins of the package shell by wires, and these pins are connected with other devices by wires on the printed board. Therefore, the package plays an important role for both the CPU and other LSI integrated circuits.
When carrying out the chip package, need paint the glue solution between chip and shell and carry out the heat-seal after, when chip and shell assembled and the heat-seal along the horizontal direction, the glue solution was difficult for paining, and when chip and shell assembled and the heat-seal along vertical direction, need paint the glue solution after the chip surface, could place the shell, can't put into both simultaneously, and the part of putting after causing easily is not in time put into, not only influences the efficiency of encapsulation, also can cause losing of part simultaneously.
Therefore, it is necessary to provide a chip packaging system to solve the above problems, which facilitates the application of glue during packaging, and improves the packaging efficiency.
Disclosure of Invention
In view of the above problems, the present invention provides a chip packaging system to solve the above problems in the background art.
In order to achieve the purpose, the invention provides the following technical scheme: a chip packaging system comprises a base, wherein a vertical plate is fixedly connected to the position, close to the rear side, of the top of the base, a first motor is installed on the rear side face of the vertical plate, an output shaft of the first motor penetrates through the vertical plate and is fixedly connected with an outer cylinder, the top end of the outer cylinder is open, the middle of one side of the outer cylinder is open, and a strip-shaped outlet is formed in the outer cylinder at the bottom of the middle opening;
the bottom of the outer barrel is fixedly connected with a second motor, the top end of an output shaft of the second motor is fixedly connected with a semi-rotating table, the top of the semi-rotating table is downwards provided with a strip-shaped groove, and the bottom end of the strip-shaped groove is lower than the bottom end of the strip-shaped outlet; the top of the semi-rotating table is connected with a plurality of connecting springs which are divided into two groups, each group is connected with a semicircular plate, and an annular heating element is arranged in the wall thickness of the outer cylinder at the arc surface of the semicircular plate;
a horizontal groove is formed in the inner wall of the outer barrel at the top of the semicircular plate, an opening of the horizontal groove is located in the inner wall of the outer barrel, a horizontal spring which is horizontally arranged is connected to the wall of the horizontal groove, a ball head rod is fixedly connected to one end of the horizontal spring, and when the horizontal spring is in a free state, the ball head part of the ball head rod is just moved out of the horizontal groove;
the top end of the vertical plate is fixedly connected with a transverse plate, a hydraulic rod is installed at the bottom of the transverse plate, a top disc is installed at the output end of the hydraulic rod, and the center line of the top disc is overlapped with the center line of the outer cylinder.
Preferably, a plurality of object placing grooves are formed in the tops of the semicircular plates, the object placing grooves in the two semicircular plates are uniformly distributed in the circumferential direction, heat-resistant films are arranged in the object placing grooves, a connecting rod is fixedly connected to the center of the upper surface of each heat-resistant film, the top end of each connecting rod is connected with a contact disc, a plurality of rubber bulges are uniformly distributed in the circumferential direction on the top of each contact disc, the rubber bulges are arranged in a hollow mode, and a plurality of air injection holes are formed in the circumferential direction of the rubber bulges at positions close to the tops; the connecting rod outer face of cylinder department fixedly connected with cardboard puts thing groove department the inside draw-in groove of having seted up of semicircle board, cardboard one end is located the inboard top of draw-in groove.
Preferably, the diameter of the contact tray is gradually reduced towards the bottom, and the diameter of the top of the contact tray is smaller than that of the storage groove.
As a specific embodiment of the present invention, a plurality of gravity balls are fixedly connected to the top edge of the heat-resistant film, and are circumferentially and uniformly distributed.
Preferably, the edge of the gas injection hole is serrated, and the diameter of the bottom end of the gas injection hole is larger than that of the top end of the gas injection hole.
Preferably, the position of the top of the base, which is close to the rear side, is fixedly connected with a portal frame, and the vertical plate penetrates through the horizontal section of the portal frame.
Preferably, the surface of the ball head rod is subjected to polishing treatment, and the ball head rod is arranged in a hollow mode.
The invention has the technical effects and advantages that:
1. according to the invention, the outer cylinder is in a horizontal state, a worker placing the shell is at one side, a worker placing the chip is in the middle, a worker coating glue and taking out the chip is at the other side, the station layout is reasonable, the workers are responsible for the work, the working efficiency is greatly improved, the chip and the shell can be placed into the outer cylinder at the same time, then the outer cylinder is rotated to a vertical state, the smearing of glue liquid cannot be influenced after the chip and the shell are placed vertically, the semicircular plate is in an initial heating state in the smearing process, the shell and the chip can be quickly close to a heating element after the smearing is finished, the forming efficiency is improved, and the packaging efficiency is improved through the mutual matching of the processes;
2. according to the invention, the semicircular plate is heated by the heating element, and the chip is prevented from directly impacting the semicircular plate after the middle part of the heat-resistant film is raised; when the chip impacts the rubber bulge at the top of the contact disc, the rubber bulge is compressed, gas in the rubber bulge can be sprayed out through the air hole at the edge of the top of the rubber bulge, upward blowing force is applied to the chip, and the impact force between the chip and the contact disc is prevented from being too large; meanwhile, due to the supporting effect of the rubber bulges and the contact disc, the chip is not contacted with the semicircular plate, so that when the chip is taken out, a gap can be formed between the chip and the semicircular plate, the chip is convenient to take out, and when the chip is driven to rotate, the friction force between the chip and the rubber bulges can be increased, so that the chip can always rotate when glue is coated;
3. according to the invention, the gravity ball bonded at the edge of the top of the heat-resistant film plays a certain heat absorption role, so that heat in the storage groove at the top of the heat-resistant film can be absorbed, further more heat in the storage groove at the bottom of the heat-resistant film can be caused, air at the bottom of the heat-resistant film can expand more quickly, the heat-resistant film is pushed to rise smoothly, meanwhile, when the heat-resistant film stops working, heat on the surface of the gravity ball can provide certain heat for the air in the storage groove, the phenomenon that the heat in the storage groove is dissipated too fast is prevented, the speed of contraction of the heat-resistant film is slowed, further, the speed of returning the clamping plate on the connecting rod is slowed, and the noise of downward impact of the clamping plate is reduced.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and those skilled in the art can also obtain other drawings according to the drawings without creative efforts.
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a side view of the present invention;
FIG. 3 is a top view of two semicircular plates in the present invention;
FIG. 4 is a side cross-sectional view of a semicircular plate of the present invention;
FIG. 5 is a plan view of a rubber protrusion in the present invention.
In the figure: the device comprises a base 1, a vertical plate 2, a first motor 3, an outer cylinder 4, a strip-shaped outlet 5, a second motor 6, a half-rotating table 7, a connecting spring 8, a semicircular plate 9, a heating element 10, a horizontal spring 11, a ball head rod 12, a hydraulic rod 13, a top disc 14, a heat-resistant film 15, a connecting rod 16, a contact disc 17, a rubber bulge 18, an air vent 19, a clamping plate 20, a clamping groove 21, a gravity ball 22 and a door-shaped frame 23.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The invention provides a chip packaging system as shown in figures 1-5, which comprises a base 1, wherein a vertical plate 2 is fixedly connected to the position, close to the rear side, of the top of the base 1, a first motor 3 is installed on the rear side surface of the vertical plate 2, an output shaft of the first motor 3 penetrates through the vertical plate 2 and is fixedly connected with an outer cylinder 4, the top end of the outer cylinder 4 is opened, the middle part of one side of the outer cylinder 4 is opened, and a strip-shaped outlet 5 is formed in the outer cylinder 4 at the bottom of the middle opening;
the bottom of the outer barrel 4 is fixedly connected with a second motor 6, the top end of an output shaft of the second motor 6 is fixedly connected with a semi-rotating table 7, the top of the semi-rotating table 7 is downwards provided with a strip-shaped groove, and the bottom end of the strip-shaped groove is lower than the bottom end of the strip-shaped outlet 5; the top of the semi-rotating table 7 is connected with a plurality of connecting springs 8, the connecting springs 8 are divided into two groups, each group is connected with a semicircular plate 9, and an annular heating element 10 is arranged in the wall thickness of the outer cylinder 4 at the arc surface of the semicircular plate 9;
a horizontal groove is formed in the inner wall of the outer barrel 4 at the top of the semicircular plate 9, the opening of the horizontal groove is positioned on the inner wall of the outer barrel 4, a horizontal spring 11 which is horizontally arranged is connected to the wall of the horizontal groove, one end of the horizontal spring 11 is fixedly connected with a ball head rod 12, and when the horizontal spring 11 is in a free state, the ball head part of the ball head rod 12 is just moved out of the horizontal groove;
the top end of the vertical plate 2 is fixedly connected with a transverse plate, a hydraulic rod 13 is installed at the bottom of the transverse plate, a top disc 14 is installed at the output end of the hydraulic rod 13, and the central line of the top disc 14 is overlapped with the central line of the outer cylinder 4.
As a specific embodiment of the invention, a plurality of object placing grooves are formed in the tops of the semicircular plates 9, the object placing grooves on the two semicircular plates 9 are uniformly distributed in the circumferential direction, heat-resistant films 15 are arranged in the object placing grooves, a connecting rod 16 is fixedly connected to the center of the upper surfaces of the heat-resistant films 15, the top end of the connecting rod 16 is connected with a contact disc 17, a plurality of rubber bulges 18 are uniformly distributed in the circumferential direction on the top of the contact disc 17, the rubber bulges 18 are arranged in a hollow manner, and a plurality of air injection holes 19 are formed in the circumferential direction at positions, close to the tops, of the rubber bulges 18; a clamping plate 20 is fixedly connected to the outer cylindrical surface of the connecting rod 16, a clamping groove 21 is formed in the semicircular plate 9 at the storage groove, and one end of the clamping plate 20 is located at the top of the inner side of the clamping groove 21; when the heating element 10 is used for heating, the heating element 10 heats the semicircular plate 9, the temperature in the object placing groove at the edge of the semicircular plate 9 can rise, and further the heat-resistant film 15 in the semicircular plate can be pushed to rise through thermal expansion, after the middle part of the heat-resistant film 15 protrudes, the connecting rod 16 can be pushed to rise, the connecting rod 16 pushes the contact disc 17 to rise and move out of the object placing groove, and further when the outer cylinder 4 deflects to a vertical state, when a chip impacts the semicircular plate 9, the contact disc 17 after rising can be firstly contacted with the chip, the chip presses down the protruding heat-resistant film 15, and the chip is prevented from directly impacting the semicircular plate 9; when the chip impacts the rubber bumps 18 on the top of the contact plate 17, the rubber bumps 18 are compressed, gas in the rubber bumps can be sprayed out through the air holes in the edge of the top of the rubber bumps, upward blowing force is applied to the chip, and the phenomenon that the impact force between the chip and the contact plate 17 is too large is prevented; simultaneously because the supporting role of rubber bulge 18 and contact disc 17 makes the chip not contact with semicircle board 9, and then when taking out the chip, can make gapped between chip and semicircle board 9, makes things convenient for taking out of chip to when driving the chip and rotating, a plurality of rubber bulge 18 can increase with the frictional force between the chip, guarantee when paining the glue solution, the chip can rotate all the time.
In one embodiment of the present invention, the diameter of the contact tray 17 is gradually reduced toward the bottom, and the diameter of the top of the contact tray 17 is smaller than the diameter of the storage slot; the hot air between the contact tray 17 and the heat-resistant film 15 can be quickly overflowed to the storage groove.
As a specific embodiment of the present invention, a plurality of gravity balls 22 are fixedly connected to the top edge of the heat-resistant film 15, and the gravity balls 22 are circumferentially and uniformly distributed; the gravity ball 22 that the edge of heat-resistant film 15 top bonded plays certain endothermic effect, can absorb the heat at the thing inslot at heat-resistant film 15 top, and then can make the heat of the thing inslot of putting of heat-resistant film 15 bottom more, make the air of its bottom can faster inflation, promote heat-resistant film 15 and rise smoothly, simultaneously at the during operation that stops, the heat on gravity ball 22 surface can provide certain heat to the air of putting the thing inslot, prevent to put the heat in the thing inslot and scatter and disappear too fast, make the speed of heat-resistant film 15 shrink slow, and then can make the speed of cardboard 20 return on the connecting rod 16 slow, reduce the noise of cardboard 20 downward striking.
In one embodiment of the present invention, the edges of the gas injection holes 19 are saw-toothed, and the diameter of the bottom ends of the gas injection holes 19 is larger than that of the top ends; 19 edges of fumarole are the cockscomb structure, and when the protruding 18 pressurized of rubber, 19 departments of its fumarole can be out of shape, because 19 edges of fumarole are the cockscomb structure, consequently its edge receives the impact force of the gas of extrusion, and its edge is convenient to be out of shape, prevents that its edge from tearing and causing the damage of protruding 18 of rubber to the diameter ratio top of 19 bottoms of fumarole is big, makes the intensity of spun gas higher, and is better to the ascending impact effect of chip.
As a specific embodiment of the invention, a portal frame 23 is fixedly connected to the position of the top of the base 1 close to the rear side, and the vertical plate 2 penetrates through the horizontal section of the portal frame 23; the intensity that door type frame 23 can increase riser 2 makes a motor 3 and hydraulic stem 13 during operation, and riser 2's stability is better.
As a specific embodiment of the present invention, the surface of the ball head rod 12 is polished, and the ball head rod 12 is hollow; the surface of the ball head rod 12 is polished, so that the friction between the shell and the ball head rod 12 can be reduced, the ball head rod 12 is arranged in a hollow mode, the gravity of the ball head rod 12 can be reduced, and the resistance in moving is small.
The working principle of the invention is as follows:
referring to the attached drawings 1-5 of the specification, when a chip is packaged, glue is required to be smeared between the chip and a shell and then is subjected to heat sealing, when the chip and the shell are assembled and heat-sealed along the horizontal direction, the glue is not easy to smear, when the chip and the shell are assembled and heat-sealed along the vertical direction, the shell can be placed only after the glue is required to be smeared on the surface of the chip, the chip and the shell cannot be placed at the same time, and parts placed after the chip and the shell are not placed in time easily, so that the packaging efficiency is influenced, and the parts are lost at the same time, therefore, the invention mainly solves the problems that the glue is convenient to smear when the chip is packaged, and the packaging efficiency is improved; the specific measures and the using process are as follows: starting a first motor 3, rotating an outer barrel 4 to enable the outer barrel 4 to rotate from a vertical state to a horizontal state, then putting the side wall of a chip outer barrel 4 into the interior from top to bottom, putting a shell into the outer barrel 4 from an end opening of the outer barrel, enabling the first motor 3 to rotate reversely after the first motor 3 and the shell are completely put into the outer barrel 4, enabling the first motor 3 to drive the outer barrel 4 to rotate reversely to be in the vertical state again, stopping the shell by a ball head rod 12 after moving downwards, limiting the top end of the shell by the inner wall of the outer barrel 4, enabling a certain distance to exist between the shell and a chip, meanwhile, enabling the chip to press down two semicircular plates 9, enabling a connecting spring 8 to deform and playing a buffering role for the chip; then a second motor 6 is started, the second motor 6 drives a semi-rotating table 7, a connecting spring 8 and two semi-circular plates 9 to rotate, glue can be coated on the top edge of a chip in the rotating process, a heating element 10 can heat the two semi-circular plates 9 in the glue coating process, the semi-circular plates 9 transmit heat to the chip to initially heat the glue, after the glue coating is completed, a first motor 3 stops working, then a hydraulic rod 13 is started, the hydraulic rod 13 pushes a top disc 14 to move downwards, the top disc 14 enters an outer barrel 4 and pushes a shell to move downwards, the shell pushes a ball head rod 12 into a horizontal groove, a horizontal spring 11 is compressed, the shell moves downwards to be in complete contact with the edge of the chip, and when the shell continues to move downwards, the chip pushes the two semi-circular plates 9 to move downwards, the connecting spring 8 is compressed by the semi-circular plates 9, the semi-circular plates 9 move to the bottom of the heating element 10, the joint of the chip and the shell is aligned with the heating element 10, the glue solution is quickly solidified and shaped, the hydraulic rod 13 is finally controlled, the hydraulic rod 13 drives the top disc 14 to return to the original position, at the moment, the connecting spring 8 restores to push the semi-circular plate 9 to rise, the packaged chip can automatically rise, and the chip is pulled out of the outer cylinder 4 from one side; in the whole process, a worker placing the shell is on one side, a worker placing the chip is in the middle, a worker gluing and taking out the chip is on the other side, the station layout is reasonable, the worker is responsible for each work, the working efficiency is greatly improved, the chip and the shell can be placed into the outer barrel 4 at the same time, then the outer barrel 4 is rotated to be in a vertical state, the smearing of glue liquid cannot be influenced after the chip and the shell are placed vertically, the semicircular plate 9 is in an initial heating state in the smearing process, after the smearing is finished, the shell and the chip can be enabled to be close to the heating element 10 quickly, the forming efficiency is improved, and the packaging efficiency is improved through the mutual matching of the processes; wherein, the height ratio urceolus 4 middle part of shell open-ended highly little, and the height ratio bar open-ended height of pin is little, and the finished product after guaranteeing to accomplish can be taken out.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (7)
1. A chip packaging system, comprising a base (1), characterized in that: a vertical plate (2) is fixedly connected to one side of the top of the base (1), a first motor (3) is installed on one side, away from the base (1), of the vertical plate (2), an output shaft of the first motor (3) penetrates through the vertical plate (2) and is fixedly connected with an outer barrel (4), the top end of the outer barrel (4) is open, the middle of one side of the outer barrel (4) is open, and a strip-shaped outlet (5) is formed in the outer barrel (4) at the bottom of the middle opening;
the bottom of the outer barrel (4) is fixedly connected with a second motor (6), the top end of an output shaft of the second motor (6) is fixedly connected with a semi-rotating table (7), the top of the semi-rotating table (7) is downwards provided with a strip-shaped groove, and the bottom end of the strip-shaped groove is lower than the bottom end of the strip-shaped outlet (5); the top of the semi-rotating table (7) is connected with a plurality of connecting springs (8), the connecting springs (8) are divided into two groups, each group is connected with a semicircular plate (9), and an annular heating element (10) is arranged in the wall thickness of the outer cylinder (4) at the arc surface of the semicircular plate (9);
a horizontal groove is formed in the inner wall of the outer barrel (4) at the top of the semicircular plate (9), an opening of the horizontal groove is located in the inner wall of the outer barrel (4), a horizontal spring (11) which is horizontally arranged is connected to the wall of the horizontal groove, one end of the horizontal spring (11) is fixedly connected with a ball head rod (12), and when the horizontal spring (11) is in a free state, the ball head part of the ball head rod (12) is just moved out of the horizontal groove;
the top end of the vertical plate (2) is fixedly connected with a transverse plate, a hydraulic rod (13) is installed at the bottom of the transverse plate, a top disc (14) is installed at the output end of the hydraulic rod (13), and the central line of the top disc (14) is overlapped with the central line of the outer cylinder (4).
2. The system for packaging a chip according to claim 1, wherein: the top of each semicircular plate (9) is provided with a plurality of storage grooves, the storage grooves on the two semicircular plates (9) are uniformly distributed in the circumferential direction, a heat-resistant film (15) is arranged in each storage groove, the center of the upper surface of each heat-resistant film (15) is fixedly connected with a connecting rod (16), the top end of each connecting rod (16) is connected with a contact disc (17), a plurality of rubber bulges (18) are uniformly distributed in the circumferential direction on the top of each contact disc (17), each rubber bulge (18) is arranged in a hollow mode, and a plurality of air injection holes (19) are formed in the circumferential direction at positions, close to the top, of the rubber bulges (18); the connecting rod (16) outer cylindrical surface department fixedly connected with cardboard (20), put thing groove department semicircle board (9) are inside to be seted up draw-in groove (21), and cardboard (20) one end is located draw-in groove (21) inboard top.
3. The system for packaging a chip according to claim 2, wherein: the diameter of the contact tray (17) is gradually reduced to the bottom, and the diameter of the top of the contact tray (17) is smaller than that of the object placing groove.
4. The chip packaging system according to claim 3, wherein: edge fixedly connected with a plurality of gravity balls (22) in heat-resistant membrane (15) top, a plurality of gravity balls (22) are circumference equipartition.
5. The chip packaging system according to claim 4, wherein: the edge of the gas injection hole (19) is in a sawtooth shape, and the diameter of the bottom end of the gas injection hole (19) is larger than that of the top end.
6. The system for packaging a chip according to claim 5, wherein: the position department fixedly connected with door type frame (23) of base (1) top near the rear side, riser (2) run through the horizontal segment of door type frame (23).
7. The system for packaging a chip according to claim 6, wherein: the surface of the ball head rod (12) is polished, and the ball head rod (12) is arranged in a hollow mode.
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| CN202011361673.1A CN112490155B (en) | 2020-11-27 | 2020-11-27 | Chip packaging system |
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| CN202011361673.1A CN112490155B (en) | 2020-11-27 | 2020-11-27 | Chip packaging system |
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| CN112490155A CN112490155A (en) | 2021-03-12 |
| CN112490155B true CN112490155B (en) | 2021-09-07 |
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| CN113654694B (en) * | 2021-10-20 | 2022-01-18 | 山东汉芯科技有限公司 | Pressure sensor chip packaging system and packaging method thereof |
| CN115346928B (en) * | 2022-08-22 | 2023-06-20 | 四川华尔科技有限公司 | Circuit packaging device and packaging method |
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| CN110277351A (en) * | 2019-06-22 | 2019-09-24 | 吴彬 | A kind of semiconductor chip packaging |
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| CN111933554A (en) * | 2020-09-15 | 2020-11-13 | 西安贝伦环保科技有限公司 | Chip packaging manufacturing equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102119967B1 (en) * | 2018-11-05 | 2020-06-05 | 피앤에이티 주식회사 | Cleaning apparatus for semiconductor chip package molding apparatus |
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|---|---|---|---|---|
| US20190080943A1 (en) * | 2017-09-12 | 2019-03-14 | Samsung Electronics Co., Ltd. | Measurement device and semiconductor manufacturing system including the same |
| CN110277351A (en) * | 2019-06-22 | 2019-09-24 | 吴彬 | A kind of semiconductor chip packaging |
| CN111508860A (en) * | 2019-09-12 | 2020-08-07 | 大连佳峰自动化股份有限公司 | Compound loading attachment of semiconductor package chip mounter |
| CN110931381A (en) * | 2019-12-11 | 2020-03-27 | 杭州易正科技有限公司 | Integrated circuit packaging testing device for continuous testing |
| CN111933554A (en) * | 2020-09-15 | 2020-11-13 | 西安贝伦环保科技有限公司 | Chip packaging manufacturing equipment |
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Effective date of registration: 20210825 Address after: 410000 second floor, building 10, construction machinery industrial park, No. 78, south section of East 11th Road, Langli street, Changsha area, China (Hunan) pilot Free Trade Zone, Changsha City, Hunan Province Applicant after: Hunan changban Technology Co.,Ltd. Address before: 521 Mintai building, Minkang Road, Minkang Road, Longhua New District, Shenzhen, Guangdong Province Applicant before: Shenzhen mingshitang Trading Co.,Ltd. |