CN115346928B - Circuit packaging device and packaging method - Google Patents
Circuit packaging device and packaging method Download PDFInfo
- Publication number
- CN115346928B CN115346928B CN202211007356.9A CN202211007356A CN115346928B CN 115346928 B CN115346928 B CN 115346928B CN 202211007356 A CN202211007356 A CN 202211007356A CN 115346928 B CN115346928 B CN 115346928B
- Authority
- CN
- China
- Prior art keywords
- shell
- bottom shell
- clamping
- ultraviolet light
- curing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
Abstract
The invention belongs to the technical field of circuit packaging, and particularly relates to a circuit packaging device and a circuit packaging process. The circuit packaging device comprises a shell and a bottom shell which is positioned at the bottom of the shell and matched with the shell, wherein the edge of the top of the bottom shell is upwards protruded to form two side frames, the distance between the two side frames is the same as the wall thickness of the bottom shell, so that the bottom surface of the bottom shell is inserted between the two bottom shells, the surface of the bottom shell is provided with clamping claws, and the position of the surface of the shell corresponding to the clamping claws is provided with clamping claws; according to the invention, the clamping claw is clamped into the bayonet to fix the shell and the bottom shell, and ultraviolet light is reflected by the reflecting plate at the right angle bar to become light in the horizontal direction, so that the ultraviolet light acts together with light transmitted by the opaque bottom shell at the bottom to accelerate the curing effect at the position, the efficiency of curing glue reaching the curing standard is improved, dislocation between the ultraviolet light and the bottom shell during subsequent shell movement is prevented, the contact area between the ultraviolet light and the curing glue can be increased by the right angle bar, and the bonding effect is improved.
Description
Technical Field
The invention belongs to the technical field of circuit packaging, and particularly relates to a circuit packaging device and a circuit packaging method.
Background
Packaging is the process of assembling integrated circuits into chip end products, simply by placing the integrated circuit die produced by the foundry on a substrate that serves as a carrier, bringing the die out, and then fixedly packaging the die as a unit. When packaging, the curing glue needs to be shaped by ultraviolet light, but the plastic material shell has poor light transmittance, so that the shell has long curing time, and if the shell is moved in the curing process, the overall dislocation can be caused, thereby influencing the packaging effect.
Disclosure of Invention
In view of the above, the present invention provides a circuit packaging device and a packaging method, so as to solve the above-mentioned problems in the background art.
In order to achieve the above purpose, the present invention provides the following technical solutions: the utility model provides a circuit packaging device, includes the shell and is located its bottom and rather than assorted drain pan, drain pan top edge upwards protrudes and forms two frames, and the interval of two frames is the same with the wall thickness of drain pan to make the drain pan bottom surface insert between two drain pans, the drain pan surface is provided with the jack catch, the bayonet socket has been seted up to the position department that the shell surface corresponds the jack catch, and the pin groove that is used for the pin to pass has been seted up to the shell bottom, and the position undercut between two frames forms the slot corresponding with the position between two adjacent pin grooves, and the upper surface between two frames outside the slot is provided with the curing glue, and the middle part department of two adjacent pin grooves is protruding downwards and is formed right angle strip, all is provided with the reflector panel on two faces of constitution right angle, the drain pan under the slot bottom is transparent material.
Preferably, the top of the reflecting plate is hinged with the right-angle bar, a thermal straight bar is connected between the bottom of the reflecting pipe and the right-angle bar, the thermal straight bar is made of temperature memory alloy, and the thermal straight bar is in a bending state at low temperature, so that the reflecting plate is attached to the right-angle bar.
Preferably, the draw-in groove has been seted up on the reflector panel surface, slot both sides wall all is provided with the cardboard that extends to its center department, and when the reflector panel was vertical state, draw-in groove slope was towards slot bottom positive, and cardboard and draw-in groove grafting match.
Preferably, the shell top has been seted up the through-hole, and through-hole inboard bottom is provided with the heat pipe, and inside grafting of heat pipe has the connecting rod that the diameter is less than its internal diameter, and connecting rod top integrated into one piece has the post that seals, and bottom integrated into one piece has the same post with sealing the post size, and the connecting rod bottom is provided with the magnetic disc that can adsorb with the one deck magnetic powder layer that the brush of integrated circuit top was covered, is connected with connecting spring between magnetic disc and the shell top inner wall.
Preferably, the heat conducting pipe, the connecting rod, the sealing column and the bottom column are all made of copper, the outer diameters of the sealing column and the heat conducting pipe are the same, and when the sealing column is in contact with the heat conducting pipe, the sealing column and the heat conducting pipe are just flush with the top and the bottom of the through hole respectively.
Preferably, the magnetic powder layer is formed by covering an N-magnet powder brush.
Preferably, a plurality of grooves are formed in two sides of the shell.
Preferably, rubber sleeves are arranged at four vertical edges of the outer surface of the bottom shell, and the bottom ends of the rubber sleeves are lower than the bottom shell.
The invention also provides a method for packaging by using the circuit packaging device, which comprises the following steps:
step one: firstly, placing an integrated circuit on the top of a bottom shell, enabling a shell to approach and attach to the bottom shell from top to bottom, enabling pins of the integrated circuit to be positioned in pin grooves, and enabling clamping claws to be clamped into clamping openings;
step two: when the whole is placed on an ultraviolet machine, ultraviolet light emitted from the bottom upwards makes the curing adhesive subject to light curing through the opaque bottom shell and the bottom shell at the transparent material position;
step three: the reflecting plate at the right-angle bar reflects the ultraviolet light and then changes the ultraviolet light into light in the horizontal direction, so that the ultraviolet light and the light transmitted by the opaque bottom shell at the bottom act together, and the curing adhesive is cured more quickly;
step four: finally, the thermal straight strip is straightened after being heated, the reflector is pushed to be gradually changed into a vertical state from a state of being attached with the right-angle strip, the curing glue plays a role in pushing, tightening and compacting, and the clamping plate is inserted into the clamping groove in an obliquely downward manner, so that the packaging is completed, and a chip is formed.
The invention has the technical effects and advantages that:
1. according to the invention, the clamping claw is clamped into the bayonet to fix the shell and the bottom shell, ultraviolet light emitted upwards from the bottom part enables the curing adhesive to be subjected to light curing through the opaque bottom shell and the bottom shell of the transparent material, and when the ultraviolet light at the transparent material is upwards, the ultraviolet light is reflected by the reflecting plate at the right angle strip and then becomes light in the horizontal direction, so that the ultraviolet light acts together with the light transmitted through the opaque bottom shell at the bottom part, the curing effect at the position is quickened, the efficiency of the curing adhesive reaching the curing standard is improved, dislocation between the curing adhesive and the bottom shell is prevented when the subsequent shell moves, the contact area between the right angle strip and the curing adhesive can be increased, and the bonding effect is improved;
2. according to the invention, the thermal straight strip made of the temperature memory alloy is straightened after being heated, the reflector plate is pushed to gradually change from a state of attaching the right-angle strip to a vertical state, so that the effect of pushing and compacting the curing adhesive at the tops of two adjacent slots is better, when the reflector plate gradually changes to the vertical state, the ultraviolet light reflected by the reflector plate gradually changes from the reflected light in a horizontal state to the upward inclined reflected light, and the angle of the reflected light changes, so that the curing adhesive at the top is subjected to longer-time illumination, and the defect that the illumination is weakened when the light transmitted upwards from the non-transparent bottom reaches the top of the curing adhesive is overcome;
3. according to the invention, the magnetic powder layer at the top of the integrated circuit is adsorbed by the magnetic disc, so that the pins are tightly attached to the tops of the pin grooves, heat generated during the operation of the chip can be transferred to Feng Zhu through the bottom posts and the connecting rods, or finally transferred to the outside through the sealing posts, so that the internal high temperature is avoided, if the chip is abnormal and the internal high temperature is caused, the magnetic powder layer on the surface of the integrated circuit is heated by high-temperature gas to cause the reduction of magnetism until the magnetic powder layer disappears, the magnetic powder layer is not adsorbed by the magnetic disc, the connecting springs in a stretching state can be restored, the bottom posts, the connecting rods and the sealing posts are driven to rise simultaneously, and when the bottom posts are not contacted with the bottom ends of the heat conducting tubes, the sealing posts are completely moved out of the through holes upwards, and because the diameter of the connecting rods is smaller than the inner diameter of the heat conducting tubes, the internal hot air can overflow through gaps between the connecting rods and the heat conducting tubes, so that the internal hot air is prevented from being excessively exploded.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions of the prior art, the following description will briefly explain the drawings used in the embodiments or the description of the prior art, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic perspective view of a circuit package apparatus of the present invention;
FIG. 2 is an enlarged view of portion A of FIG. 1 in accordance with the present invention;
FIG. 3 is a schematic illustration of a main section of a housing, bottom shell, heat pipe of the present invention;
FIG. 4 is a schematic view of the socket of the present invention after the socket is inserted into the rectangular plate;
FIG. 5 is an enlarged view of portion B of FIG. 4 in accordance with the present invention;
fig. 6 is a flow chart of the encapsulation process in the present invention.
In the figure: the heat-conducting device comprises a shell 1, a bottom shell 2, a frame 3, a clamping jaw 4, a bayonet 5, a pin groove 6, a slot 7, a right-angle bar 8, a reflector 9, a heat straight bar 10, a clamping groove 11, a clamping plate 12, a heat-conducting pipe 13, a connecting rod 14, a sealing column 15, a bottom column 16, a magnetic disc 17, a connecting spring 18, a groove 19 and a rubber sleeve 20.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments of the present invention. All other embodiments, based on the embodiments of the invention, which a person of ordinary skill in the art would obtain without inventive faculty, are within the scope of the invention;
in the description of the present invention, it should be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, merely to facilitate describing the present invention and simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present invention. Furthermore, in the description of the present invention, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
The invention provides a circuit packaging device as shown in fig. 1-5, which comprises a shell 1 and a bottom shell 2 which is positioned at the bottom of the shell and matched with the shell, wherein the top edge of the bottom shell 2 is upwards protruded to form two side frames 3, the distance between the two side frames 3 is the same as the wall thickness of the bottom shell 2, so that the bottom surface of the bottom shell 2 is inserted between the two bottom shells 2, clamping claws 4 are arranged on the surface of the bottom shell 2, a bayonet 5 is arranged at the position of the surface of the shell 1 corresponding to the clamping claws 4, a pin groove 6 for a pin to pass through is arranged at the bottom of the shell 1, a slot 7 corresponding to the position between the two adjacent pin grooves 6 is downwards recessed at the position between the two side frames 3, a curing adhesive is arranged on the upper surface between the two side frames 3 except the slot 7, when the shell 1 is pressed on the bottom shell 2, a part of the curing adhesive is pressed into the slot 7, right-angle strips 8 are downwards protruded at the middle parts of the two adjacent pin grooves 6, reflecting plates 9 are arranged on the two surfaces forming right angles, and the bottom shell 2 right below the slot 7 is made of transparent materials.
When packaging, firstly, place integrated circuit at the bottom shell 2 top, then with shell 1 from top to bottom be close to and laminate to cover integrated circuit, the pin of chip is located pin groove 6, the interval of two frames 3 is the same with the wall thickness of bottom shell 2, make bottom shell 2 bottom surface insert between two bottom shells 2, in bayonet socket 5 is gone into to jack catch 4 card, play the fixed action to shell 1 and bottom shell 2, the solidification gum that upper surface set up between two frames 3 outside slot 7 can bond shell 1 and bottom shell 2, when will wholly place on the ultraviolet light machine, the ultraviolet light that sends upwards from the bottom makes solidification gum receive the photo-curing through opaque bottom shell 2 and bottom shell 2 of transparent material department, and when the ultraviolet light of transparent material department upwards can become horizontal direction's light after being reflected by reflector 9 of rectangular 8 department, thereby with the bottom through the light together effect of opaque bottom shell 2 department, the curing effect of accelerating here has been improved, thereby solidification gum reaches the efficiency of curing standard, dislocation with bottom shell 2 when preventing that rectangular 8 from moving, contact with bottom shell 2 is increased, the area of gluing is improved.
Referring to fig. 1 and 4 of the specification, the top of the reflector 9 is hinged to the right-angle bar 8, a thermal straight bar 10 is connected between the bottom of the reflector and the right-angle bar 8, the thermal straight bar 10 is made of a temperature memory alloy, and the thermal straight bar 10 is in a bending state at low temperature, so that the reflector 9 is attached to the right-angle bar 8.
When ultraviolet light cures the curing adhesive, the light emitted by the ultraviolet light has energy to generate a thermal effect, so that the thermal straight strip 10 made of the temperature memory alloy is straightened after being heated, the reflector 9 is pushed to be gradually changed into a vertical state from the state of attaching the right-angle strip 8, thereby playing a role in tightly pushing and compacting the curing adhesive at the tops of the two adjacent slots 7, the contact bonding effect of the curing adhesive with the shell 1 and the bottom shell 2 is better, and when the reflector 9 is gradually changed into the vertical state, the reflected ultraviolet light is gradually changed into upward inclined reflected light from the reflected light in a horizontal state, and the curing adhesive at the top is irradiated for a longer time due to the change of the angle of the reflected light, so as to overcome the defect that the irradiation of the light transmitted upwards from the opaque bottom reaches the top of the curing adhesive is weakened.
Referring to fig. 4 and 5 of the specification, the surface of the reflector 9 is provided with a clamping groove 11, two side walls of the slot 7 are respectively provided with a clamping plate 12 extending towards the center, when the reflector 9 is in a vertical state, the clamping groove 11 is inclined towards the center of the bottom of the slot 7, and the clamping plates 12 are in plug-in matching with the clamping groove 11.
When the reflector 9 is in a vertical state, the clamping plate 12 is inserted into the clamping groove 11 in an inclined downward manner, so that a resistance effect is achieved on the upward separation of the shell 1 from the bottom shell 2, and the stability of the shell 1 and the bottom shell 2 after encapsulation is improved.
Referring to fig. 1 and 3 of the specification, the top of the housing 1 is provided with a through hole, the bottom of the inner side of the through hole is provided with a heat conducting tube 13, the inside of the heat conducting tube 13 is inserted with a connecting rod 14 with a diameter smaller than the inner diameter of the connecting rod, the top end of the connecting rod 14 is integrally formed with a sealing post 15, the bottom end of the connecting rod 14 is integrally formed with a bottom post 16 with the same size as the sealing post 15, the heat conducting tube 13, the connecting rod 14, the sealing post 15 and the bottom post 16 are all made of copper, the heat conducting tube 13, the connecting rod 14, the sealing post 15 and the heat conducting tube 13 have good heat conducting capability, the outer diameter of the sealing post 15 is the same as that of the heat conducting tube 13, when the sealing post 15 is in contact with the heat conducting tube 13, the sealing post 15 is just flush with the top and the bottom of the through hole respectively, the bottom end of the connecting rod 14 is provided with a magnetic disc 17 capable of being adsorbed by a layer of magnetic powder layer brushed on the top of an integrated circuit, the top of the integrated circuit is brushed with a layer of magnetic powder to generate magnetism, the magnetic powder layer is formed by covering the N52 magnetic powder glue brush, the N52 magnet is magnetically changed at 70 ℃, the magnetic force is small in adsorption force with the magnetic disc 17, the top 17 is separated from the top of the integrated circuit 17 from the inner wall of the housing 1 under the effect of the connection spring 18, and the effect is connected with the top 18.
When the shell 1 is downward close to the bottom shell 2, the magnetic disc 17 can quickly adsorb a magnetic powder layer on the top of the integrated circuit, so that pins are tightly attached to the top of the pin groove 6, after packaging is completed, heat generated during chip operation can be transferred to the sealing column 15 through the bottom column 16 and the connecting rod 14 or through the heat conducting tube 13, finally, the heat is transferred to the outside through the sealing column 15, the internal high temperature is avoided, if the chip is abnormal and causes the internal high temperature, the high temperature gas heats the magnetic powder layer on the surface of the integrated circuit to cause the reduction of magnetism until the magnetic powder layer disappears, finally, the magnetic powder layer is not adsorbed with the magnetic disc 17 any more, the connecting spring 18 in a stretched state can be restored, the bottom column 16, the connecting rod 14 and the sealing column 15 are driven to rise at the same time, and Feng Zhu is completely moved out of the through hole upwards when the bottom column 16 is not contacted with the bottom end of the heat conducting tube 13, and therefore, the internal hot air can overflow through a gap between the connecting rod 14 and the heat conducting tube 13 to avoid the explosion caused by the fact that the internal hot air is too much.
Referring to fig. 1 of the specification, a plurality of grooves 19 are formed on two sides of the housing 1.
The grooves 19 on the surface of the housing 1 can play a role in increasing the contact area with air and increasing the heat dissipation effect.
Referring to fig. 1 of the specification, four vertical edges of the outer surface of the bottom shell 2 are respectively provided with a rubber sleeve 20, and the bottom end of the rubber sleeve 20 is lower than the bottom shell 2.
When the rubber sleeve 20 is placed on an ultraviolet tabletop, the rubber sleeve is contacted with the tabletop, so that the movement of the bottom shell 2 can be reduced, and a certain damping effect can be achieved when the rubber sleeve is vibrated.
Referring to fig. 6 of the specification, the invention further provides a method for packaging by using the circuit packaging device, and the process comprises the following steps:
step one: firstly, placing an integrated circuit on the top of a bottom shell 2, approaching and attaching a shell 1 to the bottom shell 2 from top to bottom, enabling pins of the integrated circuit to be positioned in a pin groove 6, and clamping a claw 4 into a bayonet 5;
step two: when the whole is placed on an ultraviolet machine, ultraviolet light emitted from the bottom upwards makes the curing adhesive subject to light curing through the opaque bottom shell 2 and the bottom shell 2 at the transparent material position;
step three: the reflecting plate 9 at the right-angle bar 8 reflects and reflects ultraviolet light to become light in the horizontal direction, so that the ultraviolet light and the light transmitted by the opaque bottom shell 2 at the bottom act together to enable the curing adhesive to be cured more quickly;
step four: finally, the thermal straight strip 10 is straightened after being heated, the reflector 9 is pushed to be gradually changed into a vertical state from the state of being attached to the right-angle strip 8, the solidified glue plays a role in pushing, tightening and compacting, and the clamping plate 12 is just inserted into the clamping groove 11 in an inclined manner, so that the chip is packaged and formed.
Although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.
Claims (8)
1. A circuit packaging arrangement comprising a housing (1) and a bottom shell (2) at its bottom and matching it, characterized in that: the bottom shell is characterized in that two frames (3) are formed by upward protruding at the edge of the top of the bottom shell (2), the distance between the two frames (3) is the same as the wall thickness of the bottom shell (2), clamping claws (4) are arranged on the surface of the bottom shell (2), bayonets (5) are arranged at positions, corresponding to the clamping claws (4), of the surface of the outer shell (1), pin grooves (6) for allowing pins to pass through are formed in the bottoms of the outer shell (1), inserting grooves (7) corresponding to the positions between the two adjacent pin grooves (6) are formed by downward recessing at the positions between the two frames (3), curing glue is arranged on the upper surfaces between the two frames (3) except for the inserting grooves (7), right-angle strips (8) are formed by downward protruding at the middle parts of the two adjacent pin grooves (6), reflecting plates (9) are arranged on two surfaces forming right angles, and the bottom shell (2) right below the bottoms of the inserting grooves (7) are made of transparent materials;
the top of the reflecting plate (9) is hinged with the right-angle bar (8), a thermal straight bar (10) is connected between the bottom of the reflecting pipe and the right-angle bar (8), the thermal straight bar (10) is made of temperature memory alloy, and the thermal straight bar (10) is in a bending state at low temperature so that the reflecting plate (9) is attached to the right-angle bar (8).
2. The circuit package arrangement of claim 1, wherein: the clamping groove (11) is formed in the surface of the reflecting plate (9), clamping plates (12) extending towards the center of the two side walls of the slot (7) are arranged, when the reflecting plate (9) is in a vertical state, the clamping grooves (11) incline towards the center of the bottom of the slot (7), and the clamping plates (12) are in plug-in matching with the clamping grooves (11).
3. The circuit package arrangement of claim 1, wherein: the shell (1) top has been seted up the through-hole, through-hole inboard bottom is provided with heat pipe (13), inside grafting of heat pipe (13) has connecting rod (14) that the diameter is less than its internal diameter, connecting rod (14) top integrated into one piece has seals post (15), bottom integrated into one piece has bottom post (16) the same with seal post (15) size, connecting rod (14) bottom is provided with one deck magnetic disk (17) that can adsorb with the brush of integrated circuit top one deck magnetic powder layer, be connected with coupling spring (18) between magnetic disk (17) and the shell (1) top inner wall.
4. A circuit package arrangement according to claim 3, wherein: the heat conduction pipe (13), the connecting rod (14), the Feng Zhu (15) and the bottom column (16) are all made of copper, the outer diameters of the sealing column (15) and the heat conduction pipe (13) are the same, and when the sealing column (15) and the heat conduction pipe (13) are in contact, the sealing column and the heat conduction pipe are just flush with the top and the bottom of the through hole respectively.
5. A circuit package arrangement according to claim 3, wherein: the magnetic powder layer is formed by covering an N52 magnet powder glue brush.
6. The circuit package arrangement of claim 1, wherein: a plurality of grooves (19) are formed in two sides of the shell (1).
7. The circuit package arrangement of claim 1, wherein: four vertical edges of the outer surface of the bottom shell (2) are respectively provided with a rubber sleeve (20), and the bottom end of the rubber sleeve (20) is lower than the bottom shell (2).
8. A method of packaging using the circuit packaging apparatus of any one of claims 1-7, characterized in that: the process comprises the following steps:
step one: firstly, placing an integrated circuit on the top of a bottom shell (2), enabling a shell (1) to be close to and attached to the bottom shell (2) from top to bottom, enabling pins of the integrated circuit to be located in a pin groove (6), and enabling a claw (4) to be clamped into a bayonet (5);
step two: when the whole is placed on an ultraviolet machine, ultraviolet light emitted from the bottom upwards makes the curing adhesive subjected to light curing through the opaque bottom shell (2) and the bottom shell (2) made of transparent materials;
step three: the reflecting plate (9) at the right-angle bar (8) reflects ultraviolet light and then changes the ultraviolet light into light in the horizontal direction, so that the ultraviolet light and the light transmitted by the opaque bottom shell (2) at the bottom act together to enable the curing adhesive to be cured more quickly;
step four: finally, the thermal straight strip (10) is straightened after being heated, the reflecting plate (9) is pushed to be gradually changed into a vertical state from the state of being attached with the right-angle strip (8), the solidified glue plays a role in pushing, tightening and compacting, and the clamping plate (12) is just inserted into the clamping groove (11) obliquely downwards, so that packaging is completed to form a chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211007356.9A CN115346928B (en) | 2022-08-22 | 2022-08-22 | Circuit packaging device and packaging method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211007356.9A CN115346928B (en) | 2022-08-22 | 2022-08-22 | Circuit packaging device and packaging method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115346928A CN115346928A (en) | 2022-11-15 |
| CN115346928B true CN115346928B (en) | 2023-06-20 |
Family
ID=83954392
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211007356.9A Active CN115346928B (en) | 2022-08-22 | 2022-08-22 | Circuit packaging device and packaging method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115346928B (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112490155A (en) * | 2020-11-27 | 2021-03-12 | 深圳名仕堂贸易有限公司 | Chip packaging system |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100585819C (en) * | 2006-03-03 | 2010-01-27 | 松下电器产业株式会社 | Wiring member, metal part and semiconductor device, and manufacturing method |
| US20110254030A1 (en) * | 2010-04-15 | 2011-10-20 | Perkinelmer Elcos Gmbh | Liquid reflector |
| CN108766939A (en) * | 2018-08-15 | 2018-11-06 | 江苏盐芯微电子有限公司 | A kind of chip packaging device and packaging method |
| US11398592B2 (en) * | 2019-09-25 | 2022-07-26 | Nichia Corporation | Method for manufacturing light emitting module and light emitting module |
| CN214094330U (en) * | 2020-12-10 | 2021-08-31 | 宁波思宏电器工业有限公司 | Lamp string |
| CN114220773B (en) * | 2022-02-21 | 2022-04-19 | 江苏高格芯微电子有限公司 | High-precision integrated circuit chip packaging device and packaging process thereof |
-
2022
- 2022-08-22 CN CN202211007356.9A patent/CN115346928B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112490155A (en) * | 2020-11-27 | 2021-03-12 | 深圳名仕堂贸易有限公司 | Chip packaging system |
Also Published As
| Publication number | Publication date |
|---|---|
| CN115346928A (en) | 2022-11-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN206943825U (en) | Light emitting diode module and light fixture | |
| CN104334961B (en) | There is the photoconduction of alignment and solid state lamp that integrated perforate heat is led | |
| CN100562068C (en) | The numerical camera mould manufacture method | |
| CN115346928B (en) | Circuit packaging device and packaging method | |
| CN102563577A (en) | Lamp driver and glue filling method of electric shell assembly | |
| CN112845674B (en) | Automatic tab folding flexible shaping device and method for power battery | |
| CN202549250U (en) | High-resolution LED indoor display screen dot matrix module | |
| CZ304521B6 (en) | Electronic control unit and process for producing thereof | |
| CN206786367U (en) | Waterproof LED light engine and LED lamp | |
| CN103779285A (en) | Heat dissipation packaging structure for hybrid integrated power module | |
| CN105066014B (en) | Lamp bar and light guide plate integral structure production method and its mold, backlight module | |
| CN112968105B (en) | Large transfer method for Micro LED chips and display back panel | |
| CN107240636A (en) | A kind of ultra-thin radiator series of buckle-type and chip integrative packaging light-source structure | |
| TWI708989B (en) | Lens module device | |
| CN204948537U (en) | For the bonding tool of side welding LED | |
| WO2021103547A1 (en) | Positioning clamp, and assembly method for led display module | |
| CN102938440A (en) | LED packaging structure and LED lamp using same | |
| CN208284495U (en) | A kind of LED lamp bead of injection molding packaging | |
| CN206846364U (en) | One kind insulation curing type LED | |
| CN207038551U (en) | A kind of radiator and chip integrative packaging light-source structure | |
| CN207140377U (en) | FPC gumming devices | |
| CN207196420U (en) | LED and its arrangements of electric connection | |
| CN204100208U (en) | A kind of radiator and LED lamp | |
| CN205716478U (en) | A kind of LED support luminescence component of band buckle-type reflector | |
| CN204894505U (en) | Hot plate welding set of car car light |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |