CN117810093B - Integrated circuit packaging device and packaging process based on SiP technology - Google Patents
Integrated circuit packaging device and packaging process based on SiP technology Download PDFInfo
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- CN117810093B CN117810093B CN202311690669.3A CN202311690669A CN117810093B CN 117810093 B CN117810093 B CN 117810093B CN 202311690669 A CN202311690669 A CN 202311690669A CN 117810093 B CN117810093 B CN 117810093B
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 44
- 238000005516 engineering process Methods 0.000 title claims abstract description 17
- 238000012858 packaging process Methods 0.000 title claims description 5
- 239000003292 glue Substances 0.000 claims abstract description 90
- 238000003860 storage Methods 0.000 claims description 70
- 238000007789 sealing Methods 0.000 claims description 48
- 238000001125 extrusion Methods 0.000 claims description 43
- 239000000463 material Substances 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 238000007790 scraping Methods 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 abstract description 5
- 238000012536 packaging technology Methods 0.000 abstract description 4
- 238000011982 device technology Methods 0.000 abstract description 2
- 230000035515 penetration Effects 0.000 abstract 2
- 238000005538 encapsulation Methods 0.000 description 8
- 238000005457 optimization Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 239000012466 permeate Substances 0.000 description 4
- 239000004033 plastic Substances 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 2
- 230000008595 infiltration Effects 0.000 description 2
- 238000001764 infiltration Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 230000017105 transposition Effects 0.000 description 2
- FGRBYDKOBBBPOI-UHFFFAOYSA-N 10,10-dioxo-2-[4-(N-phenylanilino)phenyl]thioxanthen-9-one Chemical compound O=C1c2ccccc2S(=O)(=O)c2ccc(cc12)-c1ccc(cc1)N(c1ccccc1)c1ccccc1 FGRBYDKOBBBPOI-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 238000012840 feeding operation Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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Abstract
The invention belongs to the technical field of integrated circuit packaging and dispensing, and particularly discloses an integrated circuit packaging device and packaging technology based on SiP technology. The invention can reduce the penetration time of glue, so that the penetration area of the glue is wider, thereby indirectly reducing the adhesion on the electronic element shell and avoiding influencing the heat dissipation of the electronic element after the glue is dried.
Description
Technical Field
The invention belongs to the technical field of integrated circuit packaging and dispensing, and particularly relates to an integrated circuit packaging device and packaging technology based on SiP technology.
Background
The system in package (System Integration Packaging, siP) is an emerging packaging technology in the field of integrated circuit packaging technology. The chip, the packaged element, the system main board and the like with different functions are integrated into one packaging module, so that a complete electronic system is formed.
Some chips and packaged components are packaged into a packaging box through the technology, pins of the packaging box are welded onto an integrated circuit board through the SiP technology, the integrated circuit board is then conveyed to a dispensing machine in the SiP technology for dispensing, and a certain amount of epoxy resin glue is smeared around the packaging box, has fluidity and is sticky, so that the epoxy resin glue can permeate into gaps between the packaging box and the integrated circuit board after contacting the periphery of the packaging box, and the whole gaps can be filled with the glue.
When the glue permeates, the glue can permeate randomly everywhere, the thickness of the glue attached to the packaging box is different, the glue dries after the glue permeates for a short time, and thicker glue dries on the outer wall of the packaging box, so that the heat conductivity of the part of glue is worse than that of other parts due to thicker glue, and the heat dissipation of electronic elements in the packaging box is affected.
Disclosure of Invention
Aiming at the problems in the prior art, the invention provides the following technical scheme: the integrated circuit packaging device based on the SiP technology comprises an integrated circuit packaging dispenser main body, wherein a fixing frame is fixedly arranged on the inner wall of the integrated circuit packaging dispenser main body, driving belts are fixedly arranged on the inner walls of two sides of the bottom of the fixing frame, and the tops of the driving belts are contacted with an integrated circuit board;
The outer wall of the fixed frame is connected with a moving frame in a sliding manner, the outer wall of the moving frame is connected with a moving beam in a sliding manner, and the moving Liang Waibi is connected with a moving block in a sliding manner;
A servo motor is fixedly arranged on one side, far away from the moving beam, of the moving block, a rotating frame is fixedly arranged at the output end of the servo motor, a first electric telescopic rod is fixedly arranged on the outer wall of one side of the rotating frame, a dispensing pipe is fixedly arranged on the inner wall of the bottom of the rotating frame, a storage bin is fixedly arranged on the outer wall of the rotating frame, the storage bin is fixedly connected with the outer wall of one side of the dispensing pipe through a pipeline and is mutually communicated with the outer wall of one side of the dispensing pipe, a pushing rod is fixedly arranged at the bottom of the first electric telescopic rod, and the outer wall of the pushing rod is fixedly connected with the inner wall of the dispensing pipe;
The electric telescopic device comprises a rotating frame, and is characterized in that a second electric telescopic rod is fixedly arranged on the outer wall of the bottom of the rotating frame, a third electric telescopic rod is slidably connected with the inner wall of the bottom of the rotating frame, the output end of the second electric telescopic rod is fixedly connected with the outer wall of the third electric telescopic rod, a connecting block is fixedly arranged at the output end of the third electric telescopic rod, and a fourth electric telescopic rod is fixedly arranged on the inner wall of the connecting block.
The utility model discloses a glue feeding device, including connecting block bottom, fourth electric telescopic handle, storage device, feed bin inner wall, extrusion device is connected with all to be connected with extrusion device with fourth electric telescopic handle output, extrusion device is used for extruding glue and enters into the gap between circuit board and the electronic component box fast, the storage device is used for carrying glue to the feed bin fast.
As a preferable aspect of the above-described aspect, the pressing device includes:
The connecting bin, connect the bin top with connecting block bottom fixed connection, connecting bin is kept away from one side outer wall fixed mounting who takes the rubber tube and is had the scraper blade, connecting bin is kept away from one side bottom of scraper blade and has been seted up the opening
Go up stripper plate and lower stripper plate, go up stripper plate outer wall and lower stripper plate outer wall all with connect storehouse inner wall sliding connection, go up stripper plate and lower stripper plate edge portion and all set up to the triangle form, go up stripper plate and lower stripper plate and all adopt ceramic to make, the top that lower stripper plate is close to the connection storehouse open position is provided with the lug.
As the optimization of the technical scheme, the top of the upper extrusion plate is fixedly connected with the output end of the fourth electric telescopic rod, and a connecting frame for pushing the lower extrusion plate to move is fixedly arranged on the outer wall of one side of the lower extrusion plate.
As the optimization of the technical scheme, the outer wall of the connecting frame is in sliding connection with the inner wall of the connecting bin, and a cross rod is fixedly arranged on one side, close to the lower extrusion plate, of the connecting frame.
As the optimization of the technical scheme, the volume of the cross rod is the same as the volume of the opening formed by the connecting bin, the cross rod is in sliding connection with the inner wall of the opening formed by the connecting bin, and the top of the cross rod is provided with a bulge.
As a preferable aspect of the above-described technical solution, the storage device includes: storage tank, sliding rod and sealing plate;
The top outer wall and the bottom inner wall of the storage tank are provided with threads, the two threads can be in threaded connection, the top diameter of the inner wall of the storage tank is larger than the bottom diameter of the inner wall, and the top outer wall of the storage tank is in threaded connection with the inner wall of the sealing cover through the threads;
the bottom of the sliding rod is fixedly connected with the sealing plate, the outer wall of the sliding rod is in sliding connection with the inner wall of the top of the sealing cover, and the sliding rod is cylindrical in shape;
the sealing plate is cylindrical, the diameter of the upper half part of the sealing plate is larger than that of the lower half part of the sealing plate, the shape of the sealing plate is the same as that of an opening formed in the bottom of the storage tank, the outer wall of the sealing plate is in sliding connection with the inner wall of the opening formed in the bottom of the storage tank, and a bump is arranged on the outer wall of the lower half part of the sealing plate.
As the optimization of the technical scheme, the top of the inner wall of the storage bin is fixedly provided with the ejector rod for jacking up the sealing plate, the top of the ejector rod is contacted with the bottom of the sealing plate, and the diameter of the top of the ejector rod is smaller than that of the bottom.
As the optimization of the technical scheme, the bottom of the material storage tank is provided with an opening, the diameter of the bottom of the inner wall of the material storage tank is the same as the diameter of the opening arranged at the bottom of the material storage tank, and the bottom of the material storage tank is provided with a rubber ring.
The invention also provides a packaging process of the integrated circuit packaging device based on the SiP technology, which comprises the following steps:
Step one: after each electronic component is assembled into an electronic component box through a SiP production line, the electronic component box is welded to an integrated circuit board, the circuit board is placed on a driving belt, the driving belt drives the circuit board to be sent to the lower part of the glue dispensing pipe, and the glue dispensing pipe is driven to move to the edge part of the electronic component box through driving each motor;
step two, a step two is carried out; after the glue dispensing pipe moves to the edge part of the electronic component box, the numerical control system in the SiP is used for controlling the first electric telescopic rod to drive the pushing rod to move up and down in the glue dispensing pipe, and the pushing rod can push the glue to drop down to the edge part of the electronic component box rapidly;
Step three: after the glue drips to the edge part of the electronic component box, the second electric telescopic rod and the third electric telescopic rod are started to drive the connecting bin to move to a proper position, so that the upper extrusion plate and the lower extrusion plate are contacted with the glue, and then the fourth electric telescopic rod is started to drive the upper extrusion plate to move up and down, so that the glue is extruded to enter a gap between the electronic component box and the circuit board;
Step four: when the glue dispensing pipe rotates around one electronic element box for one circle, the integrated circuit packaging glue dispensing work of one electronic element box is completed, and then the driving system drives the glue dispensing pipe to move towards the next electronic element box, so that the glue dispensing work of the integrated circuit packaging glue dispensing of all the electronic element boxes is completed in a reciprocating mode.
The beneficial effects of the invention are as follows:
(1) Through setting up extrusion device, when carrying out integrated circuit encapsulation point gum work, start second electric telescopic handle and third electric telescopic handle drive and go up stripper plate and lower stripper plate contact glue, it reciprocates to drive at the fourth electric telescopic handle and to extrude the gap department between electronic component box and the integrated circuit board to remove to the glue, the glue accelerates under the tension effect to the gap department flow, just so can reduce the infiltration time of glue for glue infiltration's area is wider, thereby indirectly reduced and attached at the electronic component shell, avoided influencing the heat dissipation of electronic component after glue dries out.
(2) Meanwhile, through the arrangement of the scraping plate, when the connecting bin moves, redundant glue is smoothed on the electronic component shell, so that the thickness of the glue on the electronic component shell is reduced, and the influence of the thickness of the glue on the heat dissipation of the electronic component is reduced.
Drawings
FIG. 1 is a three-dimensional perspective view of an integrated circuit board package dispenser;
FIG. 2 shows a schematic diagram of the internal structure of FIG. 1;
FIG. 3 shows a second internal schematic diagram of FIG. 1;
FIG. 4 shows a third internal schematic diagram of FIG. 1;
FIG. 5 illustrates a side view of FIG. 4;
FIG. 6 is a schematic view showing the internal structure of FIG. 4;
FIG. 7 is a diagram showing the connection of the second electric telescopic link to the third electric telescopic link;
FIG. 8 is a three-dimensional perspective view of the extrusion device;
FIG. 9 shows an exploded view of the extrusion device;
FIG. 10 shows a three-dimensional cross-sectional view of a silo;
FIG. 11 illustrates a first explosive schematic of a storage device;
FIG. 12 illustrates a second storage device explosion schematic;
Fig. 13 shows an enlarged view of region a of fig. 9;
Fig. 14 shows an enlarged view of region B of fig. 12;
Fig. 15 shows an enlarged view of region C of fig. 11.
In the figure: the integrated circuit packaging dispenser body 1, a fixed frame 2, a driving belt 3, an integrated circuit board 4, a movable frame 5, a movable beam 6, a movable block 7, a servo motor 8, a rotary frame 9, a first electric telescopic rod 10, a dispensing tube 11, a storage bin 12, a push rod 13, a second electric telescopic rod 14, a third electric telescopic rod 15, a connecting block 16, a fourth electric telescopic rod 17, a connecting bin 18, a scraping plate 19, an upper extrusion plate 20, a lower extrusion plate 21, a connecting frame 22, a cross rod 23, a push rod 24, a storage tank 25, a sliding rod 26, a sealing plate 27 and a sealing cover 28.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the present invention will be clearly and completely described below with reference to the embodiments.
Embodiment one: the invention provides an integrated circuit packaging device based on SiP technology, as shown in fig. 1-15, wherein the integrated circuit packaging dispensing machine comprises an integrated circuit packaging dispensing machine main body 1, a fixing frame 2 is fixedly arranged on the inner wall of the integrated circuit packaging dispensing machine main body 1, the bottom position of the fixing frame 2 is composed of two fixing plates, a gap is reserved between the two fixing plates, two fixing rods are arranged at the tops of the two fixing plates at the same time, four corners of a movable frame 5 are in sliding connection with the fixing rods, a driving belt 3 is fixedly arranged on the inner walls of two sides of the bottom of the fixing frame 2, the top of the driving belt 3 is contacted with an integrated circuit board 4, the driving belt 3 is driven by a motor, and the motor can be arranged at a proper position according to requirements;
The outer wall sliding connection of mount 2 has movable frame 5, movable frame 5 outer wall sliding connection has movable beam 6, movable beam 6 outer wall sliding connection has movable block 7, as shown in fig. 2 through 4, all be provided with corresponding current drive structure on integrated circuit encapsulation point gum machine main part 1, movable frame 5 and movable beam 6, movable block 7 through these structures, the servo motor of installation like in circuit encapsulation point gum machine main part 1 top can drive movable frame 5 through the rotatory mode of drive lead screw and reciprocate, and both sides at movable beam 6 all are provided with the motor, the motor bottom is provided with the gyro wheel, both sides at movable beam 6 all are provided with recess and gyro wheel contact, can drive the gyro wheel through the motor and rotate, thereby make movable beam 6 slide on movable frame 5, and be provided with the motor on movable block 7, the bottom of motor is provided with the gear, be provided with the dead lever that drives simultaneously between movable beam 6, the gear meshes with the dead lever, just can drive movable block 7 through motor drive gear rotation and remove.
The movable block 7 is kept away from one side fixed mounting of walking beam 6 and has servo motor 8, servo motor 8 output fixed mounting has rotation frame 9, rotation frame 9 one side outer wall fixed mounting has first electric telescopic handle 10, rotation frame 9 bottom inner wall fixed mounting has some rubber tubes 11, rotation frame 9 outer wall fixed mounting has feed bin 12, feed bin 12 passes through pipeline and some rubber tubes 11 one side outer wall fixed connection and communicates each other, first electric telescopic handle 10 bottom fixed mounting has catch bar 13, catch bar 13 outer wall and some rubber tubes 11 inner wall fixed connection, when carrying out integrated circuit encapsulation dispensing work, accessible servo motor 8 drives rotation frame 9 and rotates, thereby drive each part on the rotation frame 9 and carry out rotatory transposition, and when needing to carry out integrated circuit encapsulation dispensing work, the pipeline that the glue can thereby feed bin 12 bottom is connected flows in some rubber tubes 11, simultaneously can start first electric telescopic handle 10 and drive catch bar 13 and reciprocate in some rubber tubes 11, thereby promote glue to flow down, glue will contact around the electronic component box.
The outer wall of the bottom of the rotating frame 9 is fixedly provided with a second electric telescopic rod 14, the inner wall of the bottom of the rotating frame 9 is slidably connected with a third electric telescopic rod 15, the output end of the second electric telescopic rod 14 is fixedly connected with the outer wall of the third electric telescopic rod 15, the output end of the third electric telescopic rod 15 is fixedly provided with a connecting block 16, the inner wall of the connecting block 16 is fixedly provided with a fourth electric telescopic rod 17, when the extruding device is required to be driven to move, the second electric telescopic rod can drive the third electric telescopic rod 15 to move on the X axis with the extruding device, and meanwhile, the extruding device can be driven to move up and down on the Y axis through the third electric telescopic rod 15.
The extrusion device includes:
The top of the upper extrusion plate 20 is fixedly connected with the output end of the fourth electric telescopic rod 17, the upper extrusion plate 20 and the lower extrusion plate 21 are both in sliding connection with the inner wall of the connecting bin 18, when the integrated circuit packaging and dispensing work is carried out, the upper extrusion plate 20 and the lower extrusion plate 21 are driven to contact glue through the second electric telescopic rod 14 and the third electric telescopic rod 15, then the fourth electric telescopic rod 17 is started, the upper extrusion plate 20 is driven to move up and down through the fourth electric telescopic rod 17 to extrude the glue to move towards a gap between the electronic component box and the integrated circuit board, and the glue can flow towards the gap under the action of tension;
The edge parts of the upper extrusion plate 20 and the lower extrusion plate 21 are all set to be triangular, the upper extrusion plate 20 and the lower extrusion plate 21 are all made of ceramics, the top part of the lower extrusion plate 21, which is close to the opening position of the connecting bin 18, is provided with a convex block, and because the edge parts of the upper extrusion plate 20 and the lower extrusion plate 21 are all set to be triangular, the edge parts and the glue area are small when the extrusion plate 20 and the lower extrusion plate 21 move, so that excessive glue cannot be carried to move in other directions, and the glue is prevented from flowing around randomly.
The connecting bin 18, connecting bin 18 top and connecting block 16 bottom fixed connection, connecting bin 18 keep away from some rubber tube 11 one side outer wall fixed mounting have scraper blade 19, through setting up scraper blade 19, when connecting bin 18 removes, smooth unnecessary glue on the electronic component casing to reduce the glue thickness on the electronic component casing, thereby reduce the influence of glue thickness to the electronic component heat dissipation.
The opening has been seted up to one side bottom that the scraper blade 19 was kept away from to the connection storehouse 18, the link 22 that lower stripper plate 21 one side outer wall fixed mounting was used for promoting lower stripper plate 21 removal, link 22 outer wall and connection storehouse 18 inner wall sliding connection, the link 22 is close to that side fixed mounting of lower stripper plate 21 has horizontal pole 23, the horizontal pole 23 volume is the same with the opening volume that the connection storehouse 18 was seted up, and the opening inner wall sliding connection that horizontal pole 23 and connection storehouse 18 were seted up, the horizontal pole 23 top is provided with the arch, when need clear up the glue that falls to upper stripper plate 20 and lower stripper plate 21 in, start fourth electric telescopic handle 17, make upper stripper plate 20 contact the bellying of lower stripper plate 21, the bellying of lower stripper plate 21 is right triangle-angle triangle in cross-section shape, the mode of accessible promotion link 22, make lower stripper plate 21 remove to the opening part of connection storehouse 18, just so can scrape the glue of upper stripper plate 20 bottom through the bellying, simultaneously also can make lower stripper plate 21 remove out of connection storehouse 18, the convenience of use carries out the clearance work, simultaneously, after lower stripper plate 21 pulling 22, thereby the opening is also pushed out to the opening of the opening is enough to the opening at the side of lower stripper plate 21, the opening is provided with the opening, the opening is realized to the opening is enough to the opening is realized to the opening, the opening is realized to the opening is easy, the opening is realized to the opening, the opening is easy, the opening is realized by the opening, and the opening is easy to the opening is realized.
The storage device includes: a storage tank 25, a sliding rod 26 and a sealing plate 27;
The outer wall of the top of the storage tank 25 and the inner wall of the bottom are provided with threads, the two threads can be in threaded connection, and through the design, different storage tanks 25 can be in threaded connection with each other, so that a sealing plate 27 in the storage tank 25 at the top can be jacked up through a sliding rod 26 arranged in the storage tank 25 at the bottom, and the upper storage tank 25 and the lower storage tank 25 are mutually communicated;
The diameter of the top of the inner wall of the storage tank 25 is larger than the diameter of the bottom of the inner wall, the diameter of the bottom of the inner wall of the storage tank 25 is the same as the diameter of an opening formed in the bottom of the storage tank 25, so that the glue at the top is more than the glue at the bottom, the glue has enough pressure to flow in the direction of the opening of the bottom of the storage tank 25, the outer wall of the top of the storage tank 25 is in threaded connection with the inner wall of the sealing cover 28 through threads, and the bottom of the storage tank 25 is provided with an opening;
The bottom of the sliding rod 26 is fixedly connected with the sealing plate 27, the outer wall of the sliding rod 26 is in sliding connection with the inner wall of the top of the sealing cover 28, the sliding rod 26 is cylindrical in shape, as shown in fig. 10 and 11, two handles are arranged on the inner wall of the top of the sealing cover 28, an elastic arrow-shaped plastic part is arranged on the top of one handle, a connecting groove is arranged on the top of the other handle, an opening is arranged on the top of the connecting groove, baffles are arranged at the bottoms of the two handles, when the two handles are erected, the plastic part enters the connecting groove, and is clamped in the connecting groove, the plastic part can leave the connecting groove only by pressing the plastic part downwards, so that the two baffles are combined together to block the upper part of the sliding rod 26, the sliding rod 26 is prevented from moving upwards randomly, and the sliding rod 26 can move upwards only when the two handles are separated.
The ejector rod 24 used for jacking the sealing plate 27 is fixedly arranged at the top of the inner wall of the storage bin 12, the top of the ejector rod 24 is in contact with the bottom of the sealing plate 27, the top diameter of the ejector rod 24 is smaller than the bottom diameter, the bottom of the storage tank 25 is provided with a rubber ring, when the storage tank 25 is used for feeding, glue can be conveyed into different storage tanks 25 in advance, when the storage tank 25 is used for feeding, the storage tank 25 is directly placed into the storage bin 12, when the storage tank 25 is placed into the feeding bin 12, the sealing plate 27 at the inner bottom of the storage tank 25 is jacked by the ejector rod 24, the top diameter of the ejector rod 24 is smaller than the bottom diameter, so that the glue can flow to the periphery along the ejector rod 24 when the glue flows downwards, the glue can flow to the storage bin 12 from the storage tank 25 quickly, the glue can be fed in advance, the feeding operation can be finished quickly, meanwhile, the bottom of the storage tank 25 is provided with the rubber ring, the diameter is the same as that of the inner ring of the storage bin 12, the air tightness can be improved, and when the glue needs to flow more quickly, the glue can flow to the top of the storage tank 25, the air pressure can be reduced, and the air pressure can flow to the storage tank 25 can flow to the inner wall of the storage tank 25.
The sealing plate 27 is cylindrical, the diameter of the upper half part of the sealing plate 27 is larger than that of the lower half part, the shape of the sealing plate 27 is the same as that of an opening formed in the bottom of the storage tank 25, the outer wall of the sealing plate 27 is slidably connected with the inner wall of the opening formed in the bottom of the storage tank 25, the outer wall of the lower half part of the sealing plate 27 is provided with a convex block, when glue exists in the storage tank 25, the gravity of the top of the sealing plate 27 is increased by the glue, the sealing plate 27 extrudes the opening formed in the bottom of the storage tank 25, the diameter of the upper half part of the sealing plate 27 is larger than that of the lower half part, a fault line is formed, so that the air tightness is improved, the convex block formed in the lower half part of the sealing plate 27 is made of rubber, gaps between the sealing plate 27 and the sealing plate 27 can be filled with the gaps when the sealing plate 27 is located in the openings, and the pretightening force between the sealing plate and the sealing plate can be increased.
The bottom of the connecting block 16 and the output end of the fourth electric telescopic rod 17 are both connected with an extruding device, the extruding device is used for extruding glue to rapidly enter into a gap between the circuit board and the electronic component box, the inner wall of the storage bin 12 is connected with a storage device, and the storage device is used for rapidly conveying the glue into the storage bin 12.
Working principle: the SiP production line assembles electronic component into a box, after welding to the integrated circuit board, put the circuit board on drive belt 3, drive circuit board 4 and remove the bottom of some rubber tube 11 by drive structure that corresponds on integrated circuit encapsulation point gum machine main part 1, remove frame 5 and movable beam 6 at this moment, it removes the position that is close to the electronic component box edge to drive some rubber tube 11 through corresponding drive structure on integrated circuit encapsulation point gum machine main part 1, at the fourth electric telescopic handle 17, drive push rod 13 and reciprocate in some rubber tube 11 at the start first electric telescopic handle 10, thereby promote glue to flow downwards, glue can drip on the peripheral edge of electronic component box, simultaneously accessible servo motor 8 drives the rotation frame 9 and rotates, thereby drive each part on the rotation frame 9 and carry out rotatory transposition, and when carrying out integrated circuit encapsulation point gum work, drive the upper squeeze plate 20 and lower squeeze plate 21 through above-mentioned second electric telescopic handle 14 and third electric telescopic handle 15 and contact glue, at the start fourth electric telescopic handle 17 drive upper squeeze plate 20 and reciprocate in some rubber tube 11 and reciprocate the electronic component box and carry out the electronic component box and seal the electronic component box at the position of a round the electronic component box, thereby the electronic component box is cut down when the electronic component is sealed up to the electronic component box is moved down, the electronic component is cut down, the electronic component is sealed up to the electronic component box is then moved down, the electronic component is finished and the electronic component is moved down and the electronic component is sealed and the electronic component is moved down to the electronic component box is moved to the position to the electronic component box is a round a full.
Embodiment two: the invention also provides a packaging process of the integrated circuit packaging device based on the SiP technology, which comprises the following steps:
Step one: after each electronic component is assembled into an electronic component box through a SiP production line, the electronic component box is welded to an integrated circuit board, the circuit board is placed on a driving belt 3, the driving belt 3 drives the circuit board to be sent to the lower part of the dispensing tube 11, and the dispensing tube 11 is moved to the edge part of the electronic component box by driving each motor;
Step two, a step two is carried out; after the glue dispensing pipe 11 moves to the edge part of the electronic component box, the numerical control system in the SiP is used for controlling the first electric telescopic rod 10 to drive the push rod 13 to move up and down in the glue dispensing pipe 11, and the push rod 13 can push glue to drop down to the edge part of the electronic component box rapidly;
Step three: after the glue drips to the edge part of the electronic component box, the second electric telescopic rod 14 and the third electric telescopic rod 15 are started to drive the connecting bin 18 to move to a proper position, so that the upper extrusion plate 20 and the lower extrusion plate 21 are contacted with the glue, and then the fourth electric telescopic rod 17 is started to drive the upper extrusion plate 20 to move up and down, so that the glue is extruded into a gap between the electronic component box and the circuit board;
Step four: when the dispensing tube 11 rotates around one electronic component box for one circle, the integrated circuit packaging dispensing operation of one electronic component box is completed, and then the dispensing tube 11 is driven by the driving system to move towards the next electronic component box, so that the integrated circuit packaging dispensing operation of all electronic component boxes is completed.
The above embodiments are only for illustrating the technical solution of the present invention, and are not limiting.
Claims (9)
1. The integrated circuit packaging device based on the SiP technology is characterized by comprising an integrated circuit packaging dispenser main body (1), wherein a fixing frame (2) is fixedly arranged on the inner wall of the integrated circuit packaging dispenser main body (1), a driving belt (3) is fixedly arranged on the inner walls of two sides of the bottom of the fixing frame (2), and an integrated circuit board (4) is contacted with the top of the driving belt (3); the outer wall of the fixed frame (2) is connected with a movable frame (5) in a sliding manner, the outer wall of the movable frame (5) is connected with a movable beam (6) in a sliding manner, and the outer wall of the movable beam (6) is connected with a movable block (7) in a sliding manner; a servo motor (8) is fixedly arranged on one side, far away from the moving beam (6), of the moving block (7), a rotating frame (9) is fixedly arranged at the output end of the servo motor (8), a first electric telescopic rod (10) is fixedly arranged on the outer wall of one side of the rotating frame (9), a spot rubber pipe (11) is fixedly arranged on the inner wall of the bottom of the rotating frame (9), a storage bin (12) is fixedly arranged on the outer wall of the rotating frame (9), the storage bin (12) is fixedly connected with the outer wall of one side of the spot rubber pipe (11) through a pipeline and is mutually communicated, a pushing rod (13) is fixedly arranged at the bottom of the first electric telescopic rod (10), and the outer wall of the pushing rod (13) is fixedly connected with the inner wall of the spot rubber pipe (11). The utility model discloses a glue feeding device, including rotating frame (9) bottom outer wall fixed mounting has second electric telescopic handle (14), rotating frame (9) bottom inner wall sliding connection third electric telescopic handle (15), second electric telescopic handle (14) output with third electric telescopic handle (15) outer wall fixed connection, third electric telescopic handle (15) output fixed mounting has connecting block (16), connecting block (16) inner wall fixed mounting has fourth electric telescopic handle (17), connecting block (16) bottom and fourth electric telescopic handle (17) output all are connected with extrusion device, extrusion device is arranged in extruding glue to enter into the gap between circuit board and the electronic component box fast, feed bin (12) inner wall connection has storage device, storage device is arranged in carrying glue feed bin (12) fast.
2. The SiP-based integrated circuit packaging apparatus of claim 1, wherein the pressing means comprises:
the connecting bin (18), the top of the connecting bin (18) is fixedly connected with the bottom of the connecting block (16), a scraping plate (19) is fixedly arranged on the outer wall of one side of the connecting bin (18) far away from the spot rubber tube (11), an opening is formed in the bottom of one side of the connecting bin (18) far away from the scraping plate (19),
Go up stripper plate (20) and stripper plate (21), go up stripper plate (20) outer wall and stripper plate (21) outer wall all with connect storehouse (18) inner wall sliding connection, go up stripper plate (20) and stripper plate (21) edge portion and all set up to the triangle form down, go up stripper plate (20) and stripper plate (21) and all adopt ceramic to make down, stripper plate (21) are close to the top of connecting storehouse (18) open position and are provided with the lug.
3. The integrated circuit packaging device based on the SiP technology according to claim 2, wherein the top of the upper extrusion plate (20) is fixedly connected with the output end of the fourth electric telescopic rod (17), and a connecting frame (22) for pushing the lower extrusion plate (21) to move is fixedly installed on the outer wall of one side of the lower extrusion plate (21).
4. A SiP-based integrated circuit packaging apparatus according to claim 3, wherein the outer wall of the connecting frame (22) is slidably connected with the inner wall of the connecting bin (18), and a cross bar (23) is fixedly mounted on one side of the connecting frame (22) close to the lower extrusion plate (21).
5. The SiP technology-based integrated circuit packaging device according to claim 4, wherein the cross bar (23) has the same volume as the opening formed in the connecting bin (18), the cross bar (23) is slidably connected with the inner wall of the opening formed in the connecting bin (18), and a protrusion is disposed at the top of the cross bar (23).
6. The SiP-based integrated circuit packaging apparatus of claim 1, wherein the memory device comprises: a storage tank (25), a sliding rod (26) and a sealing plate (27); the top outer wall and the bottom inner wall of the material storage tank (25) are provided with threads, the two threads can be in threaded connection, the top diameter of the inner wall of the material storage tank (25) is larger than the bottom diameter of the inner wall, and the top outer wall of the material storage tank (25) is in threaded connection with the inner wall of the sealing cover (28) through the threads; the bottom of the sliding rod (26) is fixedly connected with the sealing plate (27), the outer wall of the sliding rod (26) is in sliding connection with the inner wall of the top of the sealing cover (28), the sliding rod (26) is cylindrical in shape, and the height of the sliding rod (26) is higher than that of the material storage tank (25); the sealing plate (27) is cylindrical, the diameter of the upper half part of the sealing plate (27) is larger than that of the lower half part, the shape of the sealing plate (27) is the same as that of an opening formed in the bottom of the storage tank (25), the outer wall of the sealing plate (27) is in sliding connection with the inner wall of the opening formed in the bottom of the storage tank (25), and a protruding block is arranged on the outer wall of the lower half part of the sealing plate (27).
7. The integrated circuit packaging device based on the SiP technology according to claim 6, wherein a push rod (24) for pushing up a sealing plate (27) is fixedly arranged at the top of the inner wall of the storage bin (12), the top of the push rod (24) is contacted with the bottom of the sealing plate (27), and the diameter of the top of the push rod (24) is smaller than that of the bottom.
8. The SiP technology-based integrated circuit packaging device according to claim 6, wherein an opening is provided at the bottom of the stock tank (25), the diameter of the bottom of the inner wall of the stock tank (25) is the same as the diameter of the opening provided at the bottom of the stock tank (25), and a rubber ring is provided at the bottom of the stock tank (25).
9. A packaging process of an integrated circuit packaging device based on SiP technology according to any of claims 1 to 7, comprising the steps of:
Step one: after each electronic component is assembled into an electronic component box through a SiP production line, the electronic component box is welded to an integrated circuit board, the circuit board is placed on a driving belt (3), the driving belt (3) drives the circuit board to be sent to the lower part of a dispensing rubber tube (11), and the dispensing rubber tube (11) is moved to the edge part of the electronic component box by driving each motor;
Step two, a step two is carried out; after the glue dispensing pipe (11) moves to the edge part of the electronic component box, the numerical control system in the SiP is used for controlling the first electric telescopic rod (10) to drive the pushing rod (13) to move up and down in the glue dispensing pipe (11), and the pushing rod (13) can push glue to drop down to the edge part of the electronic component box rapidly;
Step three: after the glue drips to the edge part of the electronic component box, the second electric telescopic rod (14) and the third electric telescopic rod (15) are started to drive the connecting bin (18) to move to a proper position, so that the upper extrusion plate (20) is contacted with the lower extrusion plate (21) to glue, and then the fourth electric telescopic rod (17) is started to drive the upper extrusion plate (20) to move up and down, so that the glue is extruded into a gap between the electronic component box and the circuit board;
Step four: after the glue dispensing pipe (11) rotates around one electronic element box for one circle, the integrated circuit packaging glue dispensing work of one electronic element box is completed, and then the driving system drives the glue dispensing pipe (11) to move towards the next electronic element box, so that the glue dispensing work of the integrated circuit packaging glue dispensing of all the electronic element boxes is completed.
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| CN202311690669.3A CN117810093B (en) | 2023-12-11 | 2023-12-11 | Integrated circuit packaging device and packaging process based on SiP technology |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009195838A (en) * | 2008-02-22 | 2009-09-03 | Seiko Epson Corp | Method and apparatus for treating substrate |
| CN106733450A (en) * | 2016-12-26 | 2017-05-31 | 华侨大学 | A kind of point gum machine |
| CN208014660U (en) * | 2018-03-21 | 2018-10-26 | 浙江汉亚科技有限公司 | A kind of Special multi-head glue dispensing device for integrated circuit package |
| CN110639762A (en) * | 2019-08-14 | 2020-01-03 | 安徽国晶微电子有限公司 | Multi-head glue dispensing device for packaging integrated circuit |
| CN216818280U (en) * | 2021-08-21 | 2022-06-24 | 深圳市安德斯诺科技有限公司 | Adhesive dispensing device for integrated circuit chip packaging |
| CN115346928A (en) * | 2022-08-22 | 2022-11-15 | 四川华尔科技有限公司 | Circuit packaging device and packaging process |
| WO2023151722A2 (en) * | 2023-04-18 | 2023-08-17 | 苏州科易赢信息技术有限公司 | Automatic assembly apparatus |
-
2023
- 2023-12-11 CN CN202311690669.3A patent/CN117810093B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009195838A (en) * | 2008-02-22 | 2009-09-03 | Seiko Epson Corp | Method and apparatus for treating substrate |
| CN106733450A (en) * | 2016-12-26 | 2017-05-31 | 华侨大学 | A kind of point gum machine |
| CN208014660U (en) * | 2018-03-21 | 2018-10-26 | 浙江汉亚科技有限公司 | A kind of Special multi-head glue dispensing device for integrated circuit package |
| CN110639762A (en) * | 2019-08-14 | 2020-01-03 | 安徽国晶微电子有限公司 | Multi-head glue dispensing device for packaging integrated circuit |
| CN216818280U (en) * | 2021-08-21 | 2022-06-24 | 深圳市安德斯诺科技有限公司 | Adhesive dispensing device for integrated circuit chip packaging |
| CN115346928A (en) * | 2022-08-22 | 2022-11-15 | 四川华尔科技有限公司 | Circuit packaging device and packaging process |
| WO2023151722A2 (en) * | 2023-04-18 | 2023-08-17 | 苏州科易赢信息技术有限公司 | Automatic assembly apparatus |
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