CN216914579U - Chip packaging epoxy molding compound testing mold - Google Patents
Chip packaging epoxy molding compound testing mold Download PDFInfo
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- CN216914579U CN216914579U CN202220744525.6U CN202220744525U CN216914579U CN 216914579 U CN216914579 U CN 216914579U CN 202220744525 U CN202220744525 U CN 202220744525U CN 216914579 U CN216914579 U CN 216914579U
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Abstract
The utility model provides a testing mold for a chip packaging epoxy molding compound. The chip packaging epoxy molding compound testing mold comprises: a base plate; the two supporting plates are fixedly arranged on the top of the bottom plate; the top plate is fixedly arranged at the tops of the two support plates; the threaded sleeve is rotatably arranged on the top plate and penetrates through the top plate; the adjusting screw is installed in the threaded sleeve in a threaded mode and penetrates through the threaded sleeve; and the rotating motor is fixedly arranged at the top of the top plate. The testing mold for the chip packaging epoxy molding compound provided by the utility model has the advantages of convenience in use, capability of detecting a plurality of epoxy molding compounds simultaneously and improvement of working efficiency.
Description
Technical Field
The utility model relates to the technical field of plastics, in particular to a testing mold for a chip packaging epoxy molding compound.
Background
The epoxy resin molding compound is a powdery molding compound formed by mixing epoxy resin serving as matrix resin, high-performance phenolic resin serving as a curing agent, silicon powder and the like serving as fillers and a plurality of additives, and is widely applied to chip packaging due to excellent comprehensive performance and low manufacturing cost, the epoxy resin molding compound is extruded into a die cavity and embedded with a semiconductor chip in the die cavity, and the semiconductor chip is crosslinked, cured and molded to form a semiconductor molding compound with a certain structural shape.
However, the existing testing mold can only detect the hardness of a single epoxy molding compound generally, when the production is in a busy season, the subsequent work efficiency is affected when the hardness of the epoxy molding compound which cannot be detected in time often occurs, and the existing testing mold can detect the hardness of the epoxy molding compound at normal temperature and cannot detect the hardness of the epoxy molding compound at different temperatures, so that people can not detect the hardness of the epoxy molding compound at high temperature, and certain limitation exists.
Therefore, it is necessary to provide a new testing mold for chip packaging epoxy molding compound to solve the above technical problems.
SUMMERY OF THE UTILITY MODEL
The utility model solves the technical problem of providing a chip packaging epoxy molding compound testing mold which is convenient to use, can simultaneously detect a plurality of epoxy molding compounds and improve the working efficiency.
In order to solve the technical problem, the testing mold for the chip packaging epoxy molding compound provided by the utility model comprises: a base plate; the two supporting plates are fixedly arranged on the top of the bottom plate; the top plate is fixedly arranged at the tops of the two support plates; the threaded sleeve is rotatably arranged on the top plate and penetrates through the top plate; the adjusting screw is installed in the threaded sleeve in a threaded mode and penetrates through the threaded sleeve; the rotating motor is fixedly arranged at the top of the top plate; the first conical gear is fixedly sleeved on the threaded sleeve; the second bevel gear is fixedly sleeved on the output shaft of the rotating motor and is meshed with the first bevel gear; the adjusting plate is fixedly arranged at the bottom end of the adjusting screw rod; and the hardness detection mechanisms are arranged on the adjusting plate.
Preferably, any one of the strength detection mechanisms comprises a groove, a fixed block, a mounting plate, a clamping groove, a cavity, a compression spring, a movable plate, a clamping plate and a hardness detector, the groove is formed in the bottom of the adjusting plate, the mounting plate is arranged in the groove, a fixed groove is formed in the outer wall of one side of the mounting plate, the fixed block is fixedly mounted on the outer wall of one side of the groove, one side of the fixed block extends into the fixed groove, the clamping groove is formed in the outer wall of one side, away from the fixed block, of the mounting plate, the cavity is formed in the adjusting plate, the compression spring is fixedly mounted in the cavity, the movable plate is fixedly mounted on the compression spring, the bottom of the movable plate extends out of the cavity and is in sliding connection with the cavity, the clamping plate is fixedly mounted on the outer wall of one side of the movable plate, and one side of the clamping plate extends into the clamping groove, the clamping plate is connected with the adjusting plate in a sliding mode, and the hardness detector is fixedly installed at the bottom of the installing plate.
Preferably, the top inner wall of the cavity is provided with a first limiting groove, and the top of the moving plate extends into the corresponding first limiting groove and is in sliding connection with the corresponding inner wall of the first limiting groove.
Preferably, the top fixed mounting of bottom plate has a frame-shaped plate, the top fixed mounting of bottom plate has places the platform, just place the platform and be located in the frame-shaped plate, fixed mounting has fixed pipe on the inner wall of frame-shaped plate, fixed mounting has a plurality of steam nozzle on the fixed pipe, the top fixed mounting of bottom plate has the air heater, the air outlet department fixed mounting of air heater has the connection pipe, just the one end of connection pipe extends to with fixed pipe fixed connection in the frame-shaped plate.
Preferably, a plurality of high-temperature-resistant friction plates are fixedly mounted at the top of the placing table.
Preferably, the outer wall of one side of each of the two support plates, which is close to each other, is provided with a second limit groove, and two sides of the adjusting plate extend into the corresponding second limit grooves and are in sliding connection with the corresponding inner walls of the second limit grooves.
Preferably, a protective cover is fixedly mounted at the top of the top plate, and the threaded sleeve, the first bevel gear, the rotating motor and the second bevel gear are all located in the protective cover.
Compared with the related art, the chip packaging epoxy molding compound testing mold provided by the utility model has the following beneficial effects:
the utility model provides a testing mold for chip packaging epoxy molding compound, which is characterized in that the epoxy molding compound is placed on a high-temperature-resistant friction plate, the hardness detector is driven to move downwards by rotating the rotating motor to be contacted with the epoxy molding compound, the hardness of the epoxy molding compound is detected by the hardness detector, the air heater is started, the hot air generated by the hot air blower is sprayed out from the hot air nozzle to the epoxy molding compound through the connecting pipe and the fixing pipe, the epoxy molding compound is heated to increase the temperature of the epoxy molding compound, and the hardness of the epoxy molding compound in a high-temperature state can be detected through the operation, so that the applicability of the device is further improved, the clamping plate is driven to leave the clamping groove through the movable plate, when the cardboard leaves the draw-in groove completely, move the mounting panel in the right direction again and make mounting panel and fixed block separation, when mounting panel and fixed block separated completely, move downwards again can dismantle the process that gets off from the regulating plate with the hardness testing appearance simple fast.
Drawings
FIG. 1 is a schematic structural diagram of a preferred embodiment of a testing mold for a chip package epoxy molding compound according to the present invention;
FIG. 2 is an enlarged view of portion A of FIG. 1;
fig. 3 is a top view of the frame-shaped plate shown in fig. 1.
Reference numbers in the figures: 1. a base plate; 2. a support plate; 3. a top plate; 4. a threaded sleeve; 5. adjusting the screw rod; 6. a first bevel gear; 7. rotating the motor; 8. a second bevel gear; 9. an adjusting plate; 10. a groove; 11. a fixed block; 12. mounting a plate; 13. a card slot; 14. a cavity; 15. a compression spring; 16. moving the plate; 17. clamping a plate; 18. a hardness detector; 19. a frame-shaped plate; 20. a placing table; 21. a high temperature resistant friction plate; 22. a hot air blower; 23. connecting the pipe; 24. a hot gas nozzle; 25. and fixing the tube.
Detailed Description
The utility model is further described with reference to the following figures and embodiments.
Referring to fig. 1-3, fig. 1 is a schematic structural diagram of a testing mold for a chip package epoxy molding compound according to a preferred embodiment of the present invention; FIG. 2 is an enlarged view of portion A of FIG. 1; fig. 3 is a top view of the frame-shaped plate shown in fig. 1. The chip packaging epoxy molding compound testing mold comprises: a base plate 1; the two supporting plates 2 are fixedly arranged at the top of the bottom plate 1; the top plate 3 is fixedly arranged on the tops of the two support plates 2; the threaded sleeve 4 is rotatably mounted on the top plate 3, the threaded sleeve 4 penetrates through the top plate 3, a through hole is formed in the top plate 3, the threaded sleeve 4 penetrates through the through hole and is fixedly sleeved with a rotating bearing, and the outer ring of the rotating bearing is fixedly connected with the inner wall of the through hole; the adjusting screw rod 5 is installed in the threaded sleeve 4 in a threaded mode, and the adjusting screw rod 5 penetrates through the threaded sleeve 4; the rotating motor 7 is fixedly arranged on the top of the top plate 3; the first bevel gear 6 is fixedly sleeved on the threaded sleeve 4; the second bevel gear 8 is fixedly sleeved on the output shaft of the rotating motor 7, and the second bevel gear 8 is meshed with the first bevel gear 6; the adjusting plate 9 is fixedly installed at the bottom end of the adjusting screw 5, the rotating motor 7 rotates to drive the second bevel gear 8 to rotate, the second bevel gear 8 rotates to drive the first bevel gear 6 to rotate, the first bevel gear 6 rotates to drive the threaded sleeve 4 to rotate, the threaded sleeve 4 rotates to drive the adjusting screw 5 to move downwards, the adjusting screw 5 moves downwards to drive the adjusting plate 9 to move downwards, and the adjusting plate 9 moves downwards to drive the hardness detector 18 to move downwards to be in contact with the epoxy molding compound; and the hardness detection mechanisms are arranged on the adjusting plate 9.
In order to detect the hardness of a plurality of epoxy molding compounds simultaneously, any one of the strength detection mechanisms comprises a groove 10, a fixed block 11, an installation plate 12, a clamping groove 13, a cavity 14, a compression spring 15, a moving plate 16, a clamping plate 17 and a hardness detector 18, wherein the groove 10 is formed in the bottom of the adjusting plate 9, the installation plate 12 is arranged in the groove 10, a fixed groove is formed in the outer wall of one side of the installation plate 12, the fixed block 11 is fixedly installed on the outer wall of one side of the groove 10, one side of the fixed block 11 extends into the fixed groove, the clamping groove 13 is formed in the outer wall of one side, far away from the fixed block 11, of the installation plate 12, the cavity 14 is formed in the adjusting plate 9, the compression spring 15 is fixedly installed in the cavity 14, and the moving plate 16 is fixedly installed on the compression spring 15, the bottom of the moving plate 16 extends out of the cavity 14 and is in sliding connection with the cavity 14, the clamping plate 17 is fixedly installed on the outer wall of one side of the moving plate 16, one side of the clamping plate 17 extends into the clamping groove 13, the clamping plate 17 is in sliding connection with the adjusting plate 9, one side of the clamping plate 17 is always located in the clamping groove 13 to clamp the mounting plate 12 under the effect of no external force through the compression spring 15, the mounting plate 12 is installed on the adjusting plate 9, the hardness detector 18 is fixedly installed on the adjusting plate 9, and the hardness detector 18 is fixedly installed at the bottom of the mounting plate 12.
In order to limit the moving plate 16 and further stabilize the moving plate 16, a first limiting groove is formed on an inner wall of the top of the cavity 14, and the top of the moving plate 16 extends into the corresponding first limiting groove and is slidably connected with the inner wall of the corresponding first limiting groove.
In order to detect the hardness of the epoxy molding compound at a high temperature, a frame plate 19 is fixedly mounted at the top of the base plate 1, a placing table 20 is fixedly mounted at the top of the base plate 1, the placing table 20 is located in the frame plate 19, a fixing pipe 25 is fixedly mounted on the inner wall of the frame plate 19, a plurality of hot air nozzles 24 are fixedly mounted on the fixing pipe 25, a hot air blower 22 is fixedly mounted at the top of the base plate 1, an engaging pipe 23 is fixedly mounted at an air outlet of the hot air blower 22, one end of the engaging pipe 23 extends into the frame plate 19 and is fixedly connected with the fixing pipe 25, the hot air blower 22 is started, hot air generated by the hot air blower 22 is ejected from the hot air nozzles 24 through the engaging pipe 23 and the fixing pipe 25 onto the epoxy molding compound to heat the epoxy molding compound, so that the temperature of the epoxy molding compound is raised, and then the hardness of the epoxy molding compound is detected by a hardness detector 18, further improving the applicability of the device.
In order to increase the friction force between the epoxy molding compound and the placing table 20 and prevent the sliding phenomenon of the epoxy molding compound on the placing table 20, a plurality of high temperature resistant friction plates 21 are fixedly mounted on the top of the placing table 20.
In order to carry out spacingly to regulating plate 9, make adjusting screw 5 rotate and drive regulating plate 9 and remove, two the second spacing groove has been seted up on the one side outer wall that backup pad 2 is close to each other respectively, regulating plate 9's both sides extend to corresponding respectively the second spacing inslot and with corresponding the inner wall sliding connection of second spacing groove.
In order to prevent the threaded sleeve 4, the rotating motor 6, the first bevel gear 7 and the second bevel gear 8 from colliding with external objects to cause damage, a protective cover is fixedly mounted on the top of the top plate 3, and the threaded sleeve 4, the first bevel gear 6, the rotating motor 7 and the second bevel gear 8 are all located in the protective cover.
The working principle of the chip packaging epoxy molding compound testing mold provided by the utility model is as follows: when the hardness of the epoxy molding compound is required to be detected, the device is placed on a workbench, the epoxy molding compound is placed on a high-temperature-resistant friction plate 21, a rotating motor 7 is started, the rotating motor 7 rotates to drive a second bevel gear 8 to rotate, the second bevel gear 8 rotates to drive a first bevel gear 6 to rotate, the first bevel gear 6 rotates to drive a threaded sleeve 4 to rotate, the threaded sleeve 4 rotates to drive an adjusting screw 5 to move downwards, the adjusting screw 5 moves downwards to drive an adjusting plate 9 to move downwards, the adjusting plate 9 moves downwards to drive a hardness detector 18 to move downwards to be in contact with the epoxy molding compound, the hardness of the epoxy molding compound is detected by a hardness detector 18, when the hardness of the epoxy molding compound needs to be detected at a high temperature, an air heater 22 is started, the hot air generated by the hot air blower 22 is sprayed to the epoxy molding compound from the hot air nozzle 24 through the connecting pipe 23 and the fixing pipe 25, the epoxy molding compound is heated to increase the temperature of the epoxy molding compound, and the hardness of the epoxy molding compound in a high-temperature state can be detected through the operation, so that the applicability of the device is further improved, when the hardness detector 18 needs to be disassembled and overhauled, the movable plate 16 is moved to drive the clamping plate 17 to leave the clamping groove 13, when the clamping plate 17 completely leaves the clamping groove 13, the mounting plate 12 is moved rightwards again to separate the mounting plate 12 from the fixed block 11, when the mounting plate 12 is completely separated from the fixing block 11, the hardness tester 18 can be detached from the adjusting plate 9 by moving downward.
Compared with the related art, the chip packaging epoxy molding compound testing mold provided by the utility model has the following beneficial effects:
the utility model provides a testing mold for chip packaging epoxy molding compound, which is characterized in that the epoxy molding compound is placed on a high-temperature-resistant friction plate 21, a rotating motor 7 rotates to drive a hardness detector 18 to move downwards to be in contact with the epoxy molding compound, the hardness of the epoxy molding compound is detected by the hardness detector 18, a hot air fan 22 is started, hot air generated by the hot air fan 22 is sprayed out of a hot air nozzle 24 onto the epoxy molding compound through an adapter tube 23 and a fixed tube 25 to heat the epoxy molding compound, the epoxy temperature is increased, the hardness of the epoxy molding compound in a high-temperature state can be detected by the operation, the applicability of the device is further improved, a clamping plate 17 is driven by a moving plate 16 to leave a clamping groove 13, when the clamping plate 17 completely leaves the clamping groove 13, the mounting plate 12 is moved rightwards to separate the mounting plate 12 from a fixed block 11, when the mounting plate 12 is completely separated from the fixed block 11, the hardness tester 18 can be detached from the adjusting plate 9 by moving downwards.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes, which are made by using the contents of the present specification and the accompanying drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (7)
1. A chip package epoxy molding compound testing mold is characterized by comprising:
a base plate;
the two supporting plates are fixedly arranged on the top of the bottom plate;
the top plate is fixedly arranged at the tops of the two support plates;
the threaded sleeve is rotatably arranged on the top plate and penetrates through the top plate;
the adjusting screw is installed in the threaded sleeve in a threaded mode and penetrates through the threaded sleeve;
the rotating motor is fixedly arranged at the top of the top plate;
the first conical gear is fixedly sleeved on the threaded sleeve;
the second bevel gear is fixedly sleeved on the output shaft of the rotating motor and is meshed with the first bevel gear;
the adjusting plate is fixedly arranged at the bottom end of the adjusting screw rod;
and the hardness detection mechanisms are arranged on the adjusting plate.
2. The mold for testing the chip encapsulating epoxy molding compound as claimed in claim 1, wherein any one of the hardness detecting mechanisms comprises a groove, a fixed block, a mounting plate, a slot, a cavity, a compression spring, a moving plate, a clamping plate and a hardness detector, the groove is formed at the bottom of the adjusting plate, the mounting plate is disposed in the groove, a fixed slot is formed on an outer wall of one side of the mounting plate, the fixed block is fixedly mounted on an outer wall of one side of the groove, one side of the fixed block extends into the fixed slot, the slot is formed on an outer wall of one side of the mounting plate far away from the fixed block, the cavity is formed in the adjusting plate, the compression spring is fixedly mounted in the cavity, the moving plate is fixedly mounted on the compression spring, and the bottom of the moving plate extends out of the cavity and is slidably connected with the cavity, the clamping plate is fixedly installed on the outer wall of one side of the moving plate, one side of the clamping plate extends into the clamping groove, the clamping plate is connected with the adjusting plate in a sliding mode, and the hardness detector is fixedly installed at the bottom of the installing plate.
3. The mold for testing chip-packaging epoxy molding compound as claimed in claim 2, wherein the top inner wall of the cavity has a first position-limiting groove, and the top of the moving plate extends into the corresponding first position-limiting groove and is slidably connected to the inner wall of the corresponding first position-limiting groove.
4. The mold for testing the chip packaging epoxy molding compound as claimed in claim 1, wherein a frame plate is fixedly mounted on the top of the bottom plate, a placing table is fixedly mounted on the top of the bottom plate, the placing table is located in the frame plate, a fixing pipe is fixedly mounted on the inner wall of the frame plate, a plurality of hot air nozzles are fixedly mounted on the fixing pipe, an air heater is fixedly mounted on the top of the bottom plate, an engaging pipe is fixedly mounted at an air outlet of the air heater, and one end of the engaging pipe extends to the interior of the frame plate and is fixedly connected with the fixing pipe.
5. The mold for testing chip packaging epoxy molding compound as claimed in claim 4, wherein a plurality of high temperature resistant friction plates are fixedly mounted on the top of the placement platform.
6. The mold for testing chip packaging epoxy molding compound as claimed in claim 1, wherein the two supporting plates have second retaining grooves formed on the outer walls thereof, and two sides of the adjusting plate extend into the corresponding second retaining grooves and are slidably connected to the inner walls of the corresponding second retaining grooves.
7. The die for testing chip-packaging epoxy molding compound according to claim 1, wherein a protective cover is fixedly mounted on the top of the top plate, and the threaded sleeve, the first bevel gear, the rotating motor and the second bevel gear are all located in the protective cover.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220744525.6U CN216914579U (en) | 2022-04-01 | 2022-04-01 | Chip packaging epoxy molding compound testing mold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220744525.6U CN216914579U (en) | 2022-04-01 | 2022-04-01 | Chip packaging epoxy molding compound testing mold |
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| Publication Number | Publication Date |
|---|---|
| CN216914579U true CN216914579U (en) | 2022-07-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220744525.6U Active CN216914579U (en) | 2022-04-01 | 2022-04-01 | Chip packaging epoxy molding compound testing mold |
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| CN (1) | CN216914579U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117517135A (en) * | 2024-01-02 | 2024-02-06 | 江苏旭远新材料有限公司 | Fluidity testing device of epoxy molding compound |
-
2022
- 2022-04-01 CN CN202220744525.6U patent/CN216914579U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117517135A (en) * | 2024-01-02 | 2024-02-06 | 江苏旭远新材料有限公司 | Fluidity testing device of epoxy molding compound |
| CN117517135B (en) * | 2024-01-02 | 2024-03-05 | 江苏旭远新材料有限公司 | Fluidity testing device of epoxy molding compound |
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