CN110277351A - A kind of semiconductor chip packaging - Google Patents
A kind of semiconductor chip packaging Download PDFInfo
- Publication number
- CN110277351A CN110277351A CN201910545633.3A CN201910545633A CN110277351A CN 110277351 A CN110277351 A CN 110277351A CN 201910545633 A CN201910545633 A CN 201910545633A CN 110277351 A CN110277351 A CN 110277351A
- Authority
- CN
- China
- Prior art keywords
- gravitation ball
- pressing plate
- shell
- arc
- semiconductor chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 21
- 239000004065 semiconductor Substances 0.000 title claims abstract description 19
- 230000005484 gravity Effects 0.000 claims abstract description 8
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 20
- 239000012528 membrane Substances 0.000 claims description 16
- 229910052742 iron Inorganic materials 0.000 claims description 10
- 238000007664 blowing Methods 0.000 claims description 3
- 238000011982 device technology Methods 0.000 abstract description 2
- 230000000694 effects Effects 0.000 description 17
- 238000001125 extrusion Methods 0.000 description 5
- 230000035939 shock Effects 0.000 description 4
- 230000006835 compression Effects 0.000 description 3
- 238000007906 compression Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 1
- 238000005485 electric heating Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/562—Protection against mechanical damage
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Packaging Frangible Articles (AREA)
Abstract
The invention belongs to semi-conductor device technology field, specifically a kind of semiconductor chip packaging；Including shell and the capping being fixed by screws at the top of it, the closure base portion is fixed with holddown spring, the holddown spring bottom is provided with pressing plate, the pressing plate bottom is connected with stretch cord, the stretch cord bottom end is connected with gravitation ball, vacuum chamber is offered inside the outer casing bottom wall thickness, gravitation ball is arranged in vacuum chamber；The present invention passes through setting gravitation ball and pressing plate, when shell strikes on other objects, gravitation ball gravity is larger, the inertia being subject to is larger, can be mobile to crash direction, and gravitation ball pulls stretch cord, stretch cord band dynamic pressure plate pushes component, component is fixed, loosening when preventing internal component from being hit improves stability when chip operation.
Description
Technical field
The invention belongs to semi-conductor device technology field, specifically a kind of semiconductor chip packaging.
Background technique
The shell for installing semiconductor integrated circuit chip plays placement, fixation, sealing, protection chip and enhancing electric heating
The effect of performance, but also be link up the chip interior world and external circuit bridge --- the contact on chip is connected with conducting wire
Onto the pin of package casing, these pins establish connection with other devices further through the conducting wire in printed board.Therefore, encapsulation pair
CPU and other LSI integrated circuits all play an important role.
CPU and other LSI integrated antenna packages inside the housing after, top cover is fixed by thin screw, is encountering height
After frequency word is hit, after thin screw loosens, the CPU and other LSI integrated circuits for being fixed therein portion are easy hair after shock
It is raw to loosen, in consideration of it, the present invention provides a kind of semiconductor chip packaging, it can be after top cover loosens, in impact
Its inside is fastened, unstability when work is reduced.
Summary of the invention
In view of the deficiencies of the prior art, the present invention provides a kind of semiconductor chip packagings, mainly pass through gravitation ball and
Pressing plate, gravitation ball are pulled stretch cord by inertia, and component is pushed, component is fixed, with solution by stretch cord band dynamic pressure plate
Certainly the problems mentioned above in the background art.
To achieve the above object, the invention provides the following technical scheme: a kind of semiconductor chip packaging, including shell and logical
The capping that screw is fixed at the top of it is crossed, the closure base portion is fixed with holddown spring, and the holddown spring bottom is provided with pressure
Plate, the pressing plate bottom are connected with stretch cord, and the stretch cord bottom end is connected with gravitation ball, opens inside the outer casing bottom wall thickness
Equipped with vacuum chamber, gravitation ball is arranged in vacuum chamber；When work, when the screw of fixed capping on the shell is due to multiple impact
And after generating loosening, when shell is hit again, capping can not cover tightly its internal component, and cause internal packaging plastic to loosen,
And then making internal component that packaging plastic be followed to shake, the pin for causing component to contact with the external world causes to loosen, and influences normal
Work, at this time due to there is gravitation ball pendant to press plate, when shell strikes on other objects, gravitation ball gravity is larger, is subject to
Inertia is larger, can be mobile to crash direction, and gravitation ball pulls stretch cord, and stretch cord band dynamic pressure plate pushes component, to first device
Part is fixed, and loosening when preventing internal component from being hit improves stability when chip operation.
Preferably, the vacuum chamber is provided with position-limiting tube, and position-limiting tube is internally provided with matched piston, living
Plug side is fixed with pressure ram, and pressure ram one end is arranged on the outside of position-limiting tube, and the interior of shell is provided with bend pipe, bend pipe and true
Cavity connection, bend pipe top are located at pressing plate top and to warped platens；When gravitation ball is to a side impaction, pressure ram can be squeezed,
Pressure ram pushes piston, and by the gas in position-limiting tube by bend pipe top, the gas of extrusion blows on pressing plate, has to pressing plate piston
Suppressing action further enhances the fixed effect to inside chip.
Preferably, one end that the pressure ram is located on the outside of position-limiting tube is fixed with arc-shaped pad, the arc-shaped pad end setting
There is the pole No.1 S, article putting groove is offered on the shell at the arc-shaped pad both ends, the article putting groove is internally provided with No. two S
Pole；When gravitation ball is to when movement at pressure ram, meeting squeezes arc-shaped pad first, when arc-shaped pad is squeezed promotion, arc-shaped pad top
With No. two poles S of the No.1 S of bottom extremely in article putting groove, since polarity is identical, when arc-shaped pad is close to No. two pole S, two
The pole No.1 S can be close to each other under the repulsion effect of No. two pole S, keeps arc-shaped pad end close to each other, plays package to gravitation ball
Effect has certain resistance to gravitation ball when stretch cord pulls gravitation ball return, extends the time of gravitation ball return, makes bullet
The time of power rope deformation is longer, and stretch cord is longer to the fall times of pressing plate, can support the vibration in a period of time after shock
Disappear, guarantees that inside chip is adjacent to shell always, improve fixed effect.
Preferably, it is arranged with gravitation ball opposite face there are two suction block on the arc-shaped pad, two suction blocks are separately positioned on arc
Shape pads both ends, and at the top of the suction block of the top and magnetic patch bottom of lower section is provided with soft iron, and soft iron is for reducing suction block and one
Suction or repulsion number between the pole S or No. two poles S；When No. two poles S push two No.1 S extremely close to each other, arc-shaped pad
Both ends are close to each other, after two suction blocks reach magnetic force range, can mutually adsorb, arc-shaped pad end is driven tightly to be adjacent to gravity
Ball plays better package action to gravitation ball, further enhances the effect hindered gravitation ball, due to the setting of soft iron,
Soft iron shields magnetic, prevents suction block from attracting the pole No.1 S or No. two poles S, ensure that the adsorption effect of two suction blocks.
Preferably, the arc-shaped pad surface near the suction block is provided with wedge, and wedge is towards gravity ball center, and upper and lower two
The opposite one side frosted processing of a wedge；When arc-shaped pad wraps up gravitation ball, wedge is contacted with gravitation ball, close to gravitation ball
The processing of wedge surface frosted, it is larger with the frictional force of gravitation ball, resistance when gravitation ball return can be further increased.
Preferably, it is provided with vibration membrane on the outer casing inner wall at bend pipe apical position, vibration membrane passes through pressing plate
It is close to shell, vibration membrane is used to shake pronunciation when bend pipe is free air-blowing to go out；After capping loosens, gravitation ball is squeezed
When having gas blowout when compression bar, in bend pipe, when gas is blown on vibration membrane, vibration membrane vibration pronunciation can be made, loosened from capping
Gap issues, and staff is allowed to find in time, while when vibration membrane vibration, can slowly fill in downwards among chip and shell
Gap in, the gap position between chip and shell is stoppered when chip is shaken.
Technical effect and advantage of the invention:
1. a kind of semiconductor chip packaging provided by the invention, by setting gravitation ball and pressing plate, when shell strikes it
When on his object, gravitation ball gravity is larger, and the inertia being subject to is larger, can be mobile to crash direction, and gravitation ball pulls stretch cord, bullet
Power rope band dynamic pressure plate pushes component, and component is fixed, and loosening when preventing internal component from being hit improves
Stability when chip operation.
2. a kind of semiconductor chip packaging provided by the invention, by setting bend pipe and piston, when gravitation ball is to a side crash
When hitting, pressure ram can be squeezed, pressure ram pushes piston, and the gas in position-limiting tube is passed through bend pipe top, the gas of extrusion by piston
It blows on pressing plate, has suppressing action to pressing plate, further enhance the fixed effect to inside chip.
Detailed description of the invention
The present invention will be further explained below with reference to the attached drawings.
Fig. 1 is overall structure diagram of the invention；
Fig. 2 is the portion the A enlarged drawing of Fig. 1 in the present invention；
Fig. 3 is working principle diagram when the present invention is hit；
Fig. 4 is the portion the B enlarged drawing of Fig. 3 in the present invention；
In figure: shell 1, capping 2, holddown spring 3, pressing plate 4, stretch cord 5, gravitation ball 6, vacuum chamber 7, position-limiting tube 8, piston
9, pressure ram 10, bend pipe 11, arc-shaped pad 12, the pole No.1 S 13, two pole S 14, suction block 15, wedge 16, vibration membrane 17.
Specific embodiment
In order to be easy to understand the technical means, the creative features, the aims and the efficiencies achieved by the present invention, tie below
Specific embodiment is closed, the present invention is further explained.
As shown in Figs 1-4, a kind of semiconductor chip packaging of the present invention, including shell 1 and be fixed by screws in
Capping 2 at the top of it, 2 bottoms of the capping are fixed with holddown spring 3, and 3 bottom of holddown spring is provided with pressing plate 4, described
4 bottom of pressing plate is connected with stretch cord 5, and 5 bottom end of stretch cord is connected with gravitation ball 6, opens up inside the 1 bottom wall thickness of shell
There is vacuum chamber 7, gravitation ball 6 is arranged inside vacuum chamber 7；When work, when screw of the fixed capping 2 on shell 1 is due to multiple
It hits after generation loosening, when shell 1 is hit again, capping 2 can not cover tightly its internal component, cause internal packaging plastic
It loosens, and then makes internal component that packaging plastic be followed to shake, the pin for causing component to contact with the external world causes to loosen, and influences just
Normal work, at this time due to have gravitation ball 6 pendant press plate 4, when shell 1 strikes on other objects, 6 gravity of gravitation ball compared with
Greatly, the inertia being subject to is larger, can be mobile to crash direction, and gravitation ball 6 pulls stretch cord 5, and stretch cord 5 is with dynamic pressure plate 4 by first device
Part pushes, and component is fixed, loosening when preventing internal component from being hit improves stabilization when chip operation
Property.
The vacuum chamber 7 is internally provided with position-limiting tube 8, and position-limiting tube 8 is internally provided with matched piston 9, piston 9
Side is fixed with pressure ram 10, and for the setting of 10 one end of pressure ram in 8 outside of position-limiting tube, the shell 1 is internally provided with bend pipe 11, curved
Pipe 11 is connected to vacuum chamber 7, and 11 top of bend pipe is located at 4 top of pressing plate and is bent to pressing plate 4；When gravitation ball 6 is to a side impaction,
Pressure ram 10 can be squeezed, pressure ram 10 pushes piston 9, and the gas in position-limiting tube 8 is passed through 11 top of bend pipe by piston 9, extrusion
Gas is blown on pressing plate 4, is had suppressing action to pressing plate 4, is further enhanced the fixed effect to inside chip.
One end that the pressure ram 10 is located at 8 outside of position-limiting tube is fixed with arc-shaped pad 12,12 end of the arc-shaped pad setting
There is the pole No.1 S 13, offers article putting groove on the shell 1 at 12 both ends of arc-shaped pad, the article putting groove is internally provided with
No. two poles S 14；When gravitation ball 6 is to when movement at pressure ram 10, meeting squeezes arc-shaped pad 12 first, pushes when squeezing arc-shaped pad 12
When, No. two S poles 14 of the pole 13 No.1 S of 12 top and bottom of arc-shaped pad in article putting groove, since polarity is identical, in arc-shaped pad
12 close to No. two pole 14 S when, two poles No.1 S 13 can be close to each other under the repulsion effect of No. two pole S 14, makes 12 end of arc-shaped pad
Portion is close to each other, plays package action to gravitation ball 6, when stretch cord 5 pulls 6 return of gravitation ball, has to gravitation ball 6 certain
Resistance extends the time of 6 return of gravitation ball, and the time for deforming stretch cord 5 is longer, stretch cord 5 to the fall times of pressing plate 4 more
It is long, the vibration in a period of time after shock can be offset, guarantee that inside chip is adjacent to shell 1 always, improve fixed
Effect.
With the setting of 6 opposite face of gravitation ball there are two suction block 15 on the arc-shaped pad 12, two suction blocks 15 are separately positioned on arc
Shape pads 12 both ends, and 15 top of suction block of top and the magnetic patch bottom of lower section are provided with soft iron, and soft iron is for reducing suction block
Suction or repulsion between the pole 15 and No.1 S 13 or No. two poles S 14；Push two poles No.1 S 13 mutual No. two poles S 14
When close, 12 both ends of arc-shaped pad are close to each other, after two suction blocks 15 reach magnetic force ranges, can mutually adsorb, drive arc-shaped pad
12 ends are tightly adjacent to gravitation ball 6, play better package action to gravitation ball 6, further enhance to the obstruction of gravitation ball 6
Effect, due to the setting of soft iron, soft iron shields magnetic, prevents suction block 15 from attracting the pole No.1 S 13 or No. two poles S 14, protects
The adsorption effect of two suction blocks 15 is demonstrate,proved.
12 surface of arc-shaped pad near the suction block 15 is provided with wedge 16, wedge 16 towards 6 center of gravitation ball, and up and down
The opposite one side frosted processing of two wedges 16；When arc-shaped pad 12 wraps up gravitation ball 6, wedge 16 is contacted with gravitation ball 6, is leaned on
16 surface frosted of the wedge processing of nearly gravitation ball 6, it is larger with the frictional force of gravitation ball 6,6 return of gravitation ball can be further increased
When resistance.
Vibration membrane 17 is provided on 1 inner wall of the shell at 11 apical position of bend pipe, vibration membrane 17 passes through pressing plate 4
It is close to shell 1, vibration membrane 17 is used to shake pronunciation when bend pipe 11 is free air-blowing to go out；After capping 2 loosens, gravitation ball
When 6 extruding pressure ram 10, when having gas blowout in bend pipe 11, when gas is blown on vibration membrane 17, the vibration hair of vibration membrane 17 can be made
Sound issues from the gap that capping 2 loosens, staff is allowed to find in time, while when the vibration of vibration membrane 17, can slowly downwards
It fills in the gap among chip and shell 1, the gap position between chip and shell 1 is filled in when chip is shaken
Tightly.
When work, after screw of the fixed capping 2 on shell 1 generates loosening due to multiple impact, shell 1 is hit again
When hitting, capping 2 can not cover tightly its internal component, cause internal packaging plastic to loosen, and then internal component is made to follow envelope
Glue vibration is filled, the pin for causing component to contact with the external world causes to loosen, influences normally to work, at this time due to there is gravitation ball 6
Pendant presses plate 4, and when shell 1 strikes on other objects, 6 gravity of gravitation ball is larger, and the inertia being subject to is larger, can be to shock side
To movement, gravitation ball 6 pulls stretch cord 5, and component is pushed with dynamic pressure plate 4, component is fixed, prevented by stretch cord 5
Loosening when internal component is hit improves stability when chip operation, when gravitation ball 6 is to a side impaction, can squeeze
Extrusion compression bar 10, pressure ram 10 push piston 9, and the gas in position-limiting tube 8 is passed through 11 top of bend pipe, the gas of extrusion by piston 9
Blow on pressing plate 4, have suppressing action to pressing plate 4, further enhance the fixed effect to inside chip, when gravitation ball 6 to squeeze
When mobile at compression bar 10, arc-shaped pad 12 can be squeezed first, when arc-shaped pad 12 is squeezed promotion, 12 top and bottom of arc-shaped pad
No. two S poles 14 of the pole 13 No.1 S in article putting groove, since polarity is identical, when arc-shaped pad 12 is close to No. two pole 14 S, two
The pole No.1 S 13 can be close to each other under the repulsion effect of No. two pole S 14, keeps 12 end of arc-shaped pad close to each other, rises to gravitation ball 6
There is certain resistance to gravitation ball 6 when stretch cord 5 pulls 6 return of gravitation ball to package action, extends 6 return of gravitation ball
Time, the time for deforming stretch cord 5 is longer, and stretch cord 5 is longer to the fall times of pressing plate 4, when can will hit latter section
Interior vibration is offset, and is guaranteed that inside chip is adjacent to shell 1 always, is improved fixed effect.
The basic principles, main features and advantages of the invention have been shown and described above.The technical staff of the industry should
Understand, the present invention is not limited to the above embodiments, and the above embodiments and description only describe originals of the invention
Reason, without departing from the spirit and scope of the present invention, various changes and improvements may be made to the invention, these changes and improvements
It all fall within the protetion scope of the claimed invention.The claimed scope of the invention is by appended claims and its equivalent circle
It is fixed.
Claims (6)
1. a kind of semiconductor chip packaging, including shell (1) and the capping (2) being fixed by screws at the top of it, feature exists
In: described capping (2) bottom is fixed with holddown spring (3), and holddown spring (3) bottom is provided with pressing plate (4), the pressing plate
(4) bottom is connected with stretch cord (5), and stretch cord (5) bottom end is connected with gravitation ball (6), in the wall thickness of shell (1) bottom
Portion offers vacuum chamber (7), and gravitation ball (6) setting is internal in vacuum chamber (7).
2. a kind of semiconductor chip packaging according to claim 1, it is characterised in that: setting inside the vacuum chamber (7)
Have position-limiting tube (8), position-limiting tube (8) is internally provided with matched piston (9), and piston (9) side is fixed with pressure ram
(10), the setting of pressure ram (10) one end is on the outside of position-limiting tube (8), and the shell (1) is internally provided with bend pipe (11), bend pipe (11)
It is connected to vacuum chamber (7), bend pipe (11) top is located above pressing plate (4) and is bent to pressing plate (4).
3. a kind of semiconductor chip packaging according to claim 2, it is characterised in that: the pressure ram (10) is located at limit
One end on the outside of pipe (8) is fixed with arc-shaped pad (12), and arc-shaped pad (12) end is provided with the pole No.1 S (13), the arc
Article putting groove is offered on shell (1) at pad (12) both ends, the article putting groove is internally provided with No. two poles S (14).
4. a kind of semiconductor chip packaging according to claim 3, it is characterised in that: on the arc-shaped pad (12) and gravity
For the setting of ball (6) opposite face there are two suction block (15), two suction blocks (15) are separately positioned on arc-shaped pad (12) both ends, and top
The magnetic patch bottom of at the top of suction block (15) and lower section is provided with soft iron, soft iron for reducing suction block (15) and the pole No.1 S (13) or
Suction or repulsion between No. two poles S (14) of person.
5. a kind of semiconductor chip packaging according to claim 4, it is characterised in that: the arc of the suction block (15) nearby
Pad (12) surface is provided with wedge (16), wedge (16) towards gravitation ball (6) center, and upper and lower two wedges (16) it is opposite one
Face frosted processing.
6. a kind of semiconductor chip packaging according to claim 2, it is characterised in that: be located at bend pipe (11) apical position
The shell (1) inner wall on be provided with vibration membrane (17), vibration membrane (17) is close to by pressing plate (4) with shell (1), vibration membrane
(17) for shaking pronunciation when bend pipe (11) is free air-blowing to go out.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910545633.3A CN110277351B (en) | 2019-06-22 | 2019-06-22 | Semiconductor chip package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910545633.3A CN110277351B (en) | 2019-06-22 | 2019-06-22 | Semiconductor chip package |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110277351A true CN110277351A (en) | 2019-09-24 |
| CN110277351B CN110277351B (en) | 2020-12-22 |
Family
ID=67961463
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910545633.3A Active CN110277351B (en) | 2019-06-22 | 2019-06-22 | Semiconductor chip package |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110277351B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112490155A (en) * | 2020-11-27 | 2021-03-12 | 深圳名仕堂贸易有限公司 | Chip packaging system |
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| CN204688207U (en) * | 2015-04-21 | 2015-10-07 | 鹰潭九隆科技产业有限公司 | A kind of steering track rod assembly with shock-absorbing function |
| CN108895118A (en) * | 2018-08-03 | 2018-11-27 | 刘卫星 | One kind can torsional damper device |
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2019
- 2019-06-22 CN CN201910545633.3A patent/CN110277351B/en active Active
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| CN102047000A (en) * | 2008-05-30 | 2011-05-04 | 阿斯图里亚汽车系统股份公司 | Torsional vibration damper |
| CN203734440U (en) * | 2013-12-23 | 2014-07-23 | 浙江鸿达集团温岭市大丰电机有限公司 | Motor housing |
| CN203889984U (en) * | 2014-06-11 | 2014-10-22 | 无锡通用钢绳有限公司 | Steel wire rope loosening alarm device |
| CN104594520A (en) * | 2015-01-13 | 2015-05-06 | 山东大学 | Multi-dimensional adjustable collision energy dissipation device |
| CN204688207U (en) * | 2015-04-21 | 2015-10-07 | 鹰潭九隆科技产业有限公司 | A kind of steering track rod assembly with shock-absorbing function |
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| Title |
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| 许维军等: "轴向冲击作用下球柱组合结构的动力屈曲行为数值研究 ", 《武汉理工大学学报(交通科学与工程版)》 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112490155A (en) * | 2020-11-27 | 2021-03-12 | 深圳名仕堂贸易有限公司 | Chip packaging system |
| CN112490155B (en) * | 2020-11-27 | 2021-09-07 | 湖南长半科技有限公司 | Chip packaging system |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110277351B (en) | 2020-12-22 |
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| TA01 | Transfer of patent application right |
Effective date of registration: 20201130 Address after: Building 8, No. 102, Chongming West Road, Zhenjiang Development Zone, Jiangsu Province Applicant after: Jiangsu Jingdu Semiconductor Technology Co., Ltd Address before: 230000 New Villages of Weilou in Shushan District, Hefei City, Anhui Province, Phase I Applicant before: Wu Bin |
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