CN110277351B - Semiconductor chip package - Google Patents
Semiconductor chip package Download PDFInfo
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- CN110277351B CN110277351B CN201910545633.3A CN201910545633A CN110277351B CN 110277351 B CN110277351 B CN 110277351B CN 201910545633 A CN201910545633 A CN 201910545633A CN 110277351 B CN110277351 B CN 110277351B
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- gravity ball
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- shaped pad
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/562—Protection against mechanical damage
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- Condensed Matter Physics & Semiconductors (AREA)
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- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
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Abstract
The invention belongs to the technical field of semiconductor equipment, in particular to a semiconductor chip package; the sealing device comprises a shell and a sealing cover fixed on the top of the shell through a screw, wherein the bottom of the sealing cover is fixedly connected with a compression spring, the bottom of the compression spring is provided with a pressing plate, the bottom of the pressing plate is connected with an elastic rope, the bottom end of the elastic rope is connected with a gravity ball, a vacuum cavity is formed in the wall thickness of the bottom of the shell, and the gravity ball is arranged in the vacuum cavity; according to the invention, by arranging the gravity ball and the pressing plate, when the shell impacts other objects, the gravity ball has larger gravity, larger received inertia and can move towards the impact direction, the elastic rope is pulled by the gravity ball, and the pressing plate is driven by the elastic rope to press the component down to fix the component, so that the internal component is prevented from being loosened when impacted, and the working stability of the chip is improved.
Description
Technical Field
The invention belongs to the technical field of semiconductor equipment, and particularly relates to a semiconductor chip package.
Background
The shell for installing semiconductor integrated circuit chip has the functions of placing, fixing, sealing, protecting chip and enhancing electrothermal performance, and is also the bridge for communicating the internal world of chip with external circuit, and the contacts on the chip are connected to the pins of the package shell by wires, and these pins are connected with other devices by wires on the printed board. Therefore, the package plays an important role for both the CPU and other LSI integrated circuits.
In view of the fact that the top cover is fixed by the thin screw after the CPU and other LSI integrated circuits are packaged in the shell, and the thin screw is loosened after the CPU and other LSI integrated circuits are impacted, the CPU and other LSI integrated circuits fixed in the shell are easy to loosen after the impact of high-frequency words, the invention provides a semiconductor chip package which can fasten the interior of the top cover during impact after the top cover is loosened, and instability during operation is reduced.
Disclosure of Invention
The invention provides a semiconductor chip package which mainly comprises a gravity ball and a pressing plate, wherein the gravity ball pulls an elastic rope under inertia, the elastic rope drives the pressing plate to press down a component and fix the component, so that the problems in the background art are solved.
In order to achieve the purpose, the invention provides the following technical scheme: a semiconductor chip package comprises a shell and a sealing cover fixed on the top of the shell through screws, wherein the bottom of the sealing cover is fixedly connected with a compression spring, a pressing plate is arranged at the bottom of the compression spring, an elastic rope is connected to the bottom of the pressing plate, the bottom end of the elastic rope is connected with a gravity ball, a vacuum cavity is formed in the wall thickness of the bottom of the shell, and the gravity ball is arranged in the vacuum cavity; the during operation, after the screw of fixed closing cap on the shell produces not hard up because striking many times, when the shell strikes once more, the inside components and parts of unable lid of closing cap tightly, it is not hard up to cause inside encapsulation to glue, and then make inside components and parts follow the vibrations of encapsulation, the pin that causes components and parts and external contact causes not hard up, influence normal work, this moment is owing to there is the gravity ball to weigh down the clamp plate, when the shell strikes other objects on, gravity ball gravity is great, the inertia that receives is great, can remove to the striking direction, gravity ball pulling stretch cord, stretch cord drives the clamp plate and pushes down components and parts, fix components and parts, it is not hard up when preventing that inside components and parts from receiving the striking, the stability of chip during operation has been improved.
Preferably, a limiting pipe is arranged inside the vacuum cavity, a piston matched with the limiting pipe is arranged inside the limiting pipe, an extrusion rod is fixedly connected to one side of the piston, one end of the extrusion rod is arranged on the outer side of the limiting pipe, a bent pipe is arranged inside the shell and communicated with the vacuum cavity, and the top end of the bent pipe is located above the pressing plate and is bent towards the pressing plate; when the gravity ball is collided to one side, the extrusion rod can be extruded, the extrusion rod pushes the piston, the piston enables gas in the limiting pipe to pass through the top end of the bent pipe, the extruded gas is blown onto the pressing plate, the pressing plate is pressed downwards, and the fixing effect on an internal chip is further enhanced.
Preferably, one end of the extrusion rod, which is positioned outside the limiting pipe, is fixedly connected with an arc-shaped pad, the end part of the arc-shaped pad is provided with a first S pole, the shells at the two end parts of the arc-shaped pad are both provided with an object placing groove, and a second S pole is arranged inside the object placing groove; when the gravity ball moves to the extrusion rod, the arc-shaped pad can be extruded at first, when the arc-shaped pad is extruded and pushed, the first S poles at the top and the bottom of the arc-shaped pad are close to the second S poles in the storage groove, because the polarities are the same, when the arc-shaped pad is close to the second S poles, the two first S poles can be close to each other under the repulsion action of the second S poles, the end parts of the arc-shaped pad are close to each other, the gravity ball is wrapped, when the gravity ball is pulled to return by the elastic rope, certain resistance is provided for the gravity ball, the time for returning the gravity ball is prolonged, the time for deforming the elastic rope is longer, the time for pulling the pressing plate by the elastic rope is longer, the vibration within a period after the impact can be offset, the internal chip is ensured to be tightly attached to the shell all the time, and the.
Preferably, two suction blocks are arranged on the arc-shaped pad opposite to the gravity ball, the two suction blocks are respectively arranged at two end parts of the arc-shaped pad, soft iron is arranged at the top of the upper suction block and at the bottom of the lower magnetic block, and the soft iron is used for reducing the suction force or repulsion force between the suction block and the first S pole or the second S pole; when two S utmost points promote two S utmost points and are close to each other No. two S utmost points, the arc fills up both ends and is close to each other, two inhale the piece and reach the magnetic force scope after, can adsorb each other, drive arc pad tip and tightly paste tight gravity ball, play better parcel effect to the gravity ball, further strengthened the effect to the gravity ball hindrance, because the setting of soft iron, soft iron shields magnetism, prevent to inhale the piece and attract S utmost point or No. two S utmost points, guaranteed two adsorption effect of inhaling the piece.
Preferably, wedge plates are arranged on the surfaces of the arc-shaped pads near the suction blocks, face to the center of the gravity ball, and the opposite surfaces of the upper wedge plate and the lower wedge plate are subjected to frosting treatment; when the arc pad wraps the gravity ball, the wedge plate is contacted with the gravity ball, the surface of the wedge plate close to the gravity ball is subjected to frosting treatment, the friction force with the gravity ball is large, and the resistance force of the gravity ball during returning can be further increased.
Preferably, a vibration film is arranged on the inner wall of the shell at the position of the top end of the bent pipe, the vibration film is tightly attached to the shell through a pressing plate, and the vibration film is used for vibrating and sounding when air is blown out from the bent pipe; when the closing cap takes place not hard up back, during gravity ball extrusion pole, when having gas to blow off in the return bend, when gas blows on the vibrating diaphragm, can make vibrating diaphragm vibrations pronunciation, sends from the not hard up space department of closing cap, lets the staff in time discover, during the vibrating diaphragm vibrations simultaneously, can slowly fill in the space in the middle of chip and the shell downwards, fill up tightly to the space position between chip and shell when the chip receives vibrations.
The invention has the technical effects and advantages that:
1. according to the semiconductor chip package, the gravity ball and the pressing plate are arranged, when the shell impacts other objects, the gravity ball is high in gravity and high in inertia, the gravity ball can move towards the impacting direction, the elastic rope is pulled by the gravity ball, the pressing plate is driven by the elastic rope to press the component downwards, the component is fixed, the internal component is prevented from being loosened when impacted, and the stability of the chip during working is improved.
2. According to the semiconductor chip package, the bent pipe and the piston are arranged, when the gravity ball impacts towards one side, the extrusion rod can be extruded, the extrusion rod pushes the piston, the piston enables gas in the limiting pipe to pass through the top end of the bent pipe, the extruded gas is blown onto the pressing plate, the pressing plate is pressed down, and the fixing effect on an internal chip is further enhanced.
Drawings
The invention will be further explained with reference to the drawings.
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is an enlarged view of portion A of FIG. 1 according to the present invention;
FIG. 3 is a schematic diagram of the invention in operation at impact;
FIG. 4 is an enlarged view of portion B of FIG. 3 according to the present invention;
in the figure: the device comprises a shell 1, a sealing cover 2, a compression spring 3, a pressure plate 4, an elastic rope 5, a gravity ball 6, a vacuum cavity 7, a limiting pipe 8, a piston 9, an extrusion rod 10, a bent pipe 11, an arc-shaped pad 12, a first S pole 13, a second S pole 14, an absorption block 15, a wedge plate 16 and a vibration film 17.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.
As shown in fig. 1-4, the semiconductor chip package of the present invention comprises a housing 1 and a sealing cover 2 fixed on the top of the housing 1 through screws, wherein the bottom of the sealing cover 2 is fixedly connected with a compression spring 3, the bottom of the compression spring 3 is provided with a pressing plate 4, the bottom of the pressing plate 4 is connected with an elastic rope 5, the bottom end of the elastic rope 5 is connected with a gravity ball 6, a vacuum cavity 7 is arranged inside the wall thickness of the bottom of the housing 1, and the gravity ball 6 is arranged inside the vacuum cavity 7; during operation, after the screw of fixed closing cap 2 on shell 1 produced not hard up because striking many times, when shell 1 strikes once more, closing cap 2 can't cover tight inside components and parts, it is not hard up to cause inside encapsulation to glue, and then make inside components and parts follow the encapsulation and glue vibrations, cause components and parts and external contact's pin to cause not hard up, influence normal work, this moment because there is gravity ball 6 to weigh down clamp plate 4, when shell 1 strikes other objects on, gravity ball 6 gravity is great, the inertia that receives is great, can remove to the striking direction, gravity ball 6 pulling stretch cord 5, stretch cord 5 drives clamp plate 4 and pushes down components and parts, fix components and parts, it is not hard up when preventing that inside components and parts from receiving the striking, the stability of chip during operation has been improved.
A limiting pipe 8 is arranged in the vacuum cavity 7, a piston 9 matched with the limiting pipe 8 is arranged in the limiting pipe 8, one side of the piston 9 is fixedly connected with an extrusion rod 10, one end of the extrusion rod 10 is arranged on the outer side of the limiting pipe 8, a bent pipe 11 is arranged in the shell 1, the bent pipe 11 is communicated with the vacuum cavity 7, and the top end of the bent pipe 11 is positioned above the pressing plate 4 and is bent towards the pressing plate 4; when gravity ball 6 is to one side striking, can extrude squeeze stem 10, squeeze stem 10 promotes piston 9, and piston 9 passes through return bend 11 top with the gas in the spacing pipe 8, and the gas of extruding blows to clamp plate 4 on, has the effect of pushing down to clamp plate 4, has further strengthened the fixed effect to inside chip.
An arc-shaped pad 12 is fixedly connected to one end, located on the outer side of the limiting pipe 8, of the extrusion rod 10, a first S pole 13 is arranged at the end portion of the arc-shaped pad 12, article placing grooves are formed in the shells 1 at the two end portions of the arc-shaped pad 12, and a second S pole 14 is arranged inside the article placing grooves; when the gravity ball 6 moves to the extrusion rod 10, the arc-shaped pad 12 can be extruded at first, when the arc-shaped pad 12 is extruded and pushed, the first S pole 13 at the top and the bottom of the arc-shaped pad 12 is close to the second S pole 14 in the storage groove, because the polarities are the same, when the arc-shaped pad 12 is close to the second S pole 14, the two first S poles 13 are close to each other under the repulsive force of the second S pole 14, so that the end parts of the arc-shaped pad 12 are close to each other, the gravity ball 6 is wrapped, when the gravity ball 6 is pulled by the elastic rope 5 to return, a certain resistance is provided for the gravity ball 6, the return time of the gravity ball 6 is prolonged, the deformation time of the elastic rope 5 is longer, the pull-down time of the elastic rope 5 to the pressing plate 4 is longer, the vibration in a period after impact can be counteracted, the inner chip is ensured to be always attached to the shell 1, and the.
Two suction blocks 15 are arranged on the opposite surface of the arc-shaped pad 12 to the gravity ball 6, the two suction blocks 15 are respectively arranged at two end parts of the arc-shaped pad 12, soft iron is arranged at the top of the suction block 15 above and at the bottom of the magnetic block below, and the soft iron is used for reducing the suction force or the repulsion force between the suction block 15 and the first S pole 13 or the second S pole 14; when No. two S utmost point 14 promote two S utmost point 13 and be close to each other, arc pad 12 both ends are close to each other, two inhale piece 15 and reach the magnetic force scope after, can mutual adsorption, it tightly pastes tight gravity ball 6 to drive arc pad 12 tip, play better parcel effect to gravity ball 6, the effect to gravity ball 6 hindrance has further been strengthened, because the setting of soft iron, soft iron shields magnetism, prevent to inhale piece 15 and attract a S utmost point 13 or No. two S utmost point 14, two adsorption effect of inhaling piece 15 have been guaranteed.
The inner wall of the shell 1 at the top end of the elbow 11 is provided with a vibration film 17, the vibration film 17 is tightly attached to the shell 1 through a pressure plate 4, and the vibration film 17 is used for vibrating and sounding when air is blown out from the elbow 11; when the closing cap 2 takes place not hard up back, during the extrusion pole 10 is extruded to gravity ball 6, when having gas to blow off in the return bend 11, when gas blows on the vibrations membrane 17, can make vibrations membrane 17 vibrations pronunciation, sends from the not hard up space department of closing cap 2, lets the staff in time discover, and when vibrations membrane 17 vibrated simultaneously, can slowly fill in the space in the middle of chip and the shell 1 downwards, fill in tightly to the space position between chip and shell 1 when the chip receives vibrations.
When the device works, after a screw of the fixed sealing cover 2 on the shell 1 is loosened due to multiple times of impact, when the shell 1 impacts again, the sealing cover 2 cannot tightly cover the internal components, so that the internal packaging glue is loosened, further the internal components vibrate along with the packaging glue, so that pins of the components contacting with the outside are loosened, and normal work is influenced, at the moment, the pressing plate 4 is tightly pressed due to the gravity ball 6, when the shell 1 impacts other objects, the gravity ball 6 has higher gravity and larger received inertia and can move towards the impact direction, the gravity ball 6 pulls the elastic rope 5, the elastic rope 5 drives the pressing plate 4 to press the components downwards to fix the components, so that the internal components are prevented from being loosened when impacted, the stability of the chip during working is improved, when the gravity ball 6 impacts towards one side, the extrusion rod 10 can be extruded, the extrusion rod 10 pushes the piston 9, the piston 9 blows the gas in the limiting pipe 8 to the pressing plate 4 through the top end of the bent pipe 11, the extruded gas blows to the pressing plate 4, the pressing plate 4 is pressed, the fixing effect on the internal chip is further enhanced, when the gravity ball 6 moves to the extrusion rod 10, the arc-shaped pad 12 is firstly extruded, when the arc-shaped pad 12 is extruded and pushed, the first S poles 13 at the top and the bottom of the arc-shaped pad 12 are close to the second S poles 14 in the object placing groove, because the polarities are the same, when the arc-shaped pad 12 is close to the second S poles 14, the two first S poles 13 are close to each other under the repulsive force of the second S poles 14, the end parts of the arc-shaped pads 12 are close to each other, the gravity ball 6 is wrapped, when the gravity ball 6 is pulled by the elastic rope 5 to return, a certain resistance is provided for the gravity ball 6, the return time of the gravity ball 6 is prolonged, the deformation time of the elastic rope 5 to the pressing plate 4 is longer, and the pull-, can offset the vibrations in a period after the striking, guarantee that inside chip pastes closely with shell 1 always, improve fixed effect.
The foregoing illustrates and describes the principles, general features, and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (6)
1. A semiconductor chip package comprising a housing (1) and a cover (2) secured on top thereof by screws, characterized in that: closing cap (2) bottom has linked firmly pressure spring (3), pressure spring (3) bottom is provided with clamp plate (4), clamp plate (4) bottom is connected with stretch cord (5), stretch cord (5) bottom is connected with gravity ball (6), vacuum cavity (7) have been seted up to shell (1) bottom wall thickness inside, and gravity ball (6) set up inside vacuum cavity (7).
2. A semiconductor chip package according to claim 1, wherein: vacuum cavity (7) inside is provided with spacing pipe (8), and spacing pipe (8) inside is provided with rather than assorted piston (9), and piston (9) one side has linked firmly squeeze bar (10), and squeeze bar (10) one end sets up in spacing pipe (8) outside, shell (1) inside is provided with return bend (11), return bend (11) and vacuum cavity (7) intercommunication, and return bend (11) top is located clamp plate (4) top and is crooked to clamp plate (4).
3. A semiconductor chip package according to claim 2, wherein: an arc-shaped pad (12) is fixedly connected to one end, located on the outer side of the limiting pipe (8), of the extrusion rod (10), a first S pole (13) is arranged at the end portion of the arc-shaped pad (12), storage grooves are formed in the shells (1) at the two end portions of the arc-shaped pad (12), and a second S pole (14) is arranged in each storage groove; when the gravity ball (6) moves towards the extrusion rod (10), the arc-shaped pad (12) can be extruded firstly, when the arc-shaped pad (12) is extruded and pushed, the first S poles (13) at the top and the bottom of the arc-shaped pad (12) are close to the second S poles (14) in the storage groove, because the polarities are the same, when the arc-shaped pad (12) is close to the second S poles (14), the two first S poles (13) are close to each other under the repulsive force of the second S poles (14), so that the end parts of the arc-shaped pad (12) are close to each other, the gravity ball (6) is wrapped, when the gravity ball (6) is pulled by the elastic rope (5) to return, a certain resistance is provided for the gravity ball (6), the return time of the gravity ball (6) is prolonged, the deformation time of the elastic rope (5) is prolonged, the pull-down time of the elastic rope (5) to the pressing plate (4) is prolonged, and the vibration within a period after impact can be counteracted, the internal chip is ensured to be always tightly attached to the shell (1), and the fixing effect is improved.
4. A semiconductor chip package according to claim 3, wherein: the opposite surfaces of the arc-shaped pad (12) and the gravity ball (6) are provided with two suction blocks (15), the two suction blocks (15) are respectively arranged at two ends of the arc-shaped pad (12), the tops of the suction blocks (15) above and the bottoms of the magnetic blocks below are respectively provided with soft iron, and the soft iron is used for reducing suction force or repulsion force between the suction blocks (15) and the first S pole (13) or the second S pole (14).
5. A semiconductor chip package according to claim 4, wherein: wedge plates (16) are arranged on the surfaces of the arc-shaped pads (12) near the suction blocks (15), the wedge plates (16) face the center of the gravity ball (6), and the opposite surfaces of the upper wedge plate and the lower wedge plate (16) are subjected to sanding treatment.
6. A semiconductor chip package according to claim 2, wherein: be located return bend (11) top position department be provided with vibrating diaphragm (17) on shell (1) inner wall, vibrating diaphragm (17) are hugged closely through clamp plate (4) and shell (1), and vibrating diaphragm (17) are used for shaking pronunciation when return bend (11) have the air to blow out.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910545633.3A CN110277351B (en) | 2019-06-22 | 2019-06-22 | Semiconductor chip package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910545633.3A CN110277351B (en) | 2019-06-22 | 2019-06-22 | Semiconductor chip package |
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| CN110277351A CN110277351A (en) | 2019-09-24 |
| CN110277351B true CN110277351B (en) | 2020-12-22 |
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| CN201910545633.3A Active CN110277351B (en) | 2019-06-22 | 2019-06-22 | Semiconductor chip package |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112490155B (en) * | 2020-11-27 | 2021-09-07 | 湖南长半科技有限公司 | Chip packaging system |
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| CN108895118A (en) * | 2018-08-03 | 2018-11-27 | 刘卫星 | One kind can torsional damper device |
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| CN102047000A (en) * | 2008-05-30 | 2011-05-04 | 阿斯图里亚汽车系统股份公司 | Torsional vibration damper |
| CN203734440U (en) * | 2013-12-23 | 2014-07-23 | 浙江鸿达集团温岭市大丰电机有限公司 | Motor housing |
| CN203889984U (en) * | 2014-06-11 | 2014-10-22 | 无锡通用钢绳有限公司 | Steel wire rope loosening alarm device |
| CN104594520A (en) * | 2015-01-13 | 2015-05-06 | 山东大学 | Multi-dimensional adjustable collision energy dissipation device |
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Effective date of registration: 20201130 Address after: Building 8, No. 102, Chongming West Road, Zhenjiang Development Zone, Jiangsu Province Applicant after: Jiangsu Jingdu Semiconductor Technology Co., Ltd Address before: 230000 New Villages of Weilou in Shushan District, Hefei City, Anhui Province, Phase I Applicant before: Wu Bin |
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