CN215171820U

CN215171820U - Packaging damping mechanism for integrated circuit components

Info

Publication number: CN215171820U
Application number: CN202121127729.7U
Authority: CN
Inventors: 刘伟东; 王文振
Original assignee: Shenzhen Ruisi Semiconductor Co ltd
Current assignee: Shenzhen Ruisi Semiconductor Co ltd
Priority date: 2021-05-21
Filing date: 2021-05-21
Publication date: 2021-12-14
Anticipated expiration: 2031-05-21

Abstract

The utility model discloses an integrated circuit components's encapsulation damper relates to integrated circuit encapsulation technical field, including protection casing and integrated circuit components, integrated circuit components's top is fixed with first rubber pad, the top of first rubber pad is provided with damper, damper includes the movable sleeve, the movable sleeve top is fixed with first damping spring, telescopic inner wall top is fixed at telescopic inner wall top at first damping spring's top, the inner wall top at the protection casing is fixed at telescopic top, telescopic inner wall top is fixed with the extrusion ram, be provided with buffer gear in the movable sleeve, buffer gear includes the slider, the right side of slider is fixed with the connecting rod. This integrated circuit components and parts's encapsulation damper through the cooperation of first damping spring, second damping spring, sleeve, movable sleeve, and then can play absorbing effect, prevents that integrated circuit components and parts from vibrating for a long time and causing the damage.

Description

Packaging damping mechanism for integrated circuit components

Technical Field

The utility model relates to an integrated circuit encapsulation technical field specifically is an integrated circuit components and parts's encapsulation damper.

Background

The integrated circuit package is that the circuit pins on the silicon chip are connected to external joints by wires so as to facilitate the connection of other devices. The package form refers to a housing for mounting a semiconductor integrated circuit chip. The chip is not only used for mounting, fixing, sealing, protecting the chip and enhancing the electric heating performance, but also connected to pins of the packaging shell through the connection points on the chip by leads, and the pins are connected with other devices through the leads on the printed circuit board, thereby realizing the connection of the internal chip and an external circuit. Because the chip must be isolated from the outside to prevent the electrical performance degradation caused by the corrosion of the chip circuit by impurities in the air. On the other hand, the packaged chip is more convenient to mount and transport. The quality of the packaging technology is also of great importance since it directly affects the performance of the chip itself and the design and manufacture of the printed circuit board to which it is connected.

The integrated circuit adds damper seldom in the packaging process, and then when integrated circuit components and parts vibrate for a long time, causes integrated circuit components and parts not hard up or damage easily, however current damper generally all sets up damping spring, can make damping spring tensile or compression when damping spring receives violent vibration, can make damping spring vibration back and forth because of damping spring's bounce, and then causes integrated circuit components and parts to rock, can cause circuit components and parts impaired.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

Not enough to prior art, the utility model provides an integrated circuit components and parts's encapsulation damper has solved the problem that above-mentioned background art mentioned.

(II) technical scheme

In order to achieve the above purpose, the utility model discloses a following technical scheme realizes: the utility model provides an integrated circuit components and parts's encapsulation damper, includes protection casing and integrated circuit components and parts, integrated circuit components and parts's top is fixed with first rubber pad, the top of first rubber pad is provided with damper, damper includes the movable sleeve, the movable sleeve top is fixed with first damping spring, telescopic inner wall top is fixed at first damping spring's top, the inner wall top at the protection casing is fixed at telescopic top, telescopic inner wall top is fixed with the extrusion pole, be provided with buffer gear in the movable sleeve, buffer gear includes the slider, the right side of slider is fixed with the connecting rod, the right-hand member of connecting rod is fixed with the clutch blocks.

Preferably, a supporting plate is fixed at the bottom of the sliding block, and a spring is fixed on the right side of the supporting plate.

Preferably, the top of the sliding block is provided with an inclined plane which forms an included angle of 30 degrees with the sliding block.

Preferably, a friction plate is fixed on the top of the inner wall of the sleeve.

Preferably, a second rubber pad is fixedly mounted at the bottom of the integrated circuit component, and a second damping spring is fixed at the bottom of the second rubber pad.

Preferably, the second damping springs are arranged in two groups, and the two groups of second damping springs are symmetrically arranged by taking the central line of the integrated circuit component in the vertical direction as a symmetry axis.

(III) advantageous effects

The utility model provides an integrated circuit components and parts's encapsulation damper. The method has the following beneficial effects:

(1) this packaging damper of integrated circuit components and parts through the cooperation of first damping spring, second damping spring, sleeve, movable sleeve, and then can play absorbing effect, prevents that integrated circuit components and parts from vibrating for a long time and causing the damage.

(2) This integrated circuit components and parts's encapsulation damper, when the vibration that first damping spring received was too big, can make the movable sleeve rebound, make the depression bar pass the movable sleeve and make the depression bar extrusion slider move right, and then make the contact of clutch blocks and friction plate, and then make first damping spring play the effect of buffering, the vibration that prevents first damping spring and receive is too big, because of damping spring's bounce, makes damping spring make a round trip to rock.

Drawings

Fig. 1 is a schematic structural view of the front view of the present invention;

fig. 2 is an enlarged schematic view of the structure a of the present invention.

In the figure: 1. a protective cover; 2. an integrated circuit component; 3. a first rubber pad; 4. a damping mechanism; 41. a movable sleeve; 42. a sleeve; 43. a first damping spring; 5. a buffer mechanism; 51. a slider; 52. a connecting rod; 53. a friction block; 6. a support plate; 7. a spring; 8. an extrusion stem; 9. a friction plate; 10. a second rubber pad; 11. a second damping spring.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-2, the present invention provides a technical solution: a packaging damping mechanism for integrated circuit components comprises a protective cover 1, the integrated circuit components 2 are arranged in the protective cover 1, first rubber pads 3 are arranged on the tops of the integrated circuit components 2, damping mechanisms 4 are arranged on the tops of the first rubber pads 3, each damping mechanism 4 comprises a movable sleeve 41, the bottoms of the movable sleeves 41 are fixed on the tops of the first rubber pads 3, first damping springs 43 are fixed on the tops of the movable sleeves 41, sleeves 42 are fixed on the tops of the first damping springs 43, the tops of the sleeves 42 are fixed on the tops of the inner walls of the protective cover 1, second rubber pads 10 are fixedly arranged on the bottoms of the integrated circuit components 2, second damping springs 11 are fixed on the bottoms of the second damping springs 10, the bottoms of the second damping springs 11 are fixed on the bottoms of the inner walls of the protective cover 1, and the first damping springs 43 and the second damping springs 11 can achieve a damping effect on the integrated circuit components 2, the cushion mechanism 5 is provided inside the movable sleeve 41.

The buffer mechanism 5 comprises a slide block 51, a connecting rod 52 is fixed on the right side of the slide block 51, the connecting rod 52 penetrates through the inner wall of the right side of the movable sleeve 41, a friction block 53 is fixed on the right end of the connecting rod 52, a support plate 6 is fixed on the bottom of the slide block 51, the bottom of the support plate 6 can slide on the bottom of the inner wall of the movable sleeve 41, the support plate 6 plays a role of supporting the slide block 51, a spring 7 is fixed on the right side of the support plate 6, the right side of the spring 7 is fixed on the right side of the inner wall of the movable sleeve 41, and further when the amplitude of vibration of the first damping spring 43 is relatively large, the movable sleeve 41 is driven to ascend, the extrusion rod 8 on the top of the inner wall of the sleeve 42 penetrates through the upper surface of the movable sleeve 41, the extrusion rod 8 extrudes the slide block 51 to move towards the right side, and further drives the friction block 53 to move towards the right, and because the friction plate 9 is fixed on the top of the inner wall of the sleeve 42, the friction block 53 is in contact with the friction plate 9 to buffer the first damping spring 43, the vibration amplitude of the first damping spring 43 is prevented from being too large, and the first damping spring 43 is enabled to shake back and forth due to the rebound force of the first damping spring 43.

During operation (or during the use), can carry out the shock attenuation to integrated circuit components and parts 2 through first damping spring 43 and second damping spring 11, when the range of first damping spring 43 vibration is great, can make 8 extrusion sliders 51 of squeeze beam move rightly, and then drive friction block 53 and the contact of friction plate 9, and then carry out the friction buffering to first damping spring 43, prevent that the vibration range of first damping spring 43 is too big, avoid taking place because of first damping spring 43's bounce, make first damping spring 43 make a round trip to rock, cause the impaired phenomenon of integrated circuit components and parts 2, the effectual life who improves integrated circuit components and parts 2.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides an integrated circuit components and parts's encapsulation damper, includes protection casing (1) and integrated circuit components and parts (2), its characterized in that: the top of integrated circuit components and parts (2) is fixed with first rubber pad (3), the top of first rubber pad (3) is provided with damper (4), damper (4) are including movable sleeve (41), movable sleeve (41) top is fixed with first damping spring (43), the inner wall top at sleeve (42) is fixed at the top of first damping spring (43), the inner wall top at protection casing (1) is fixed at the top of sleeve (42), the inner wall top of sleeve (42) is fixed with extrusion pole (8), be provided with buffer gear (5) in movable sleeve (41), buffer gear (5) are including slider (51), the right side of slider (51) is fixed with connecting rod (52), the right-hand member of connecting rod (52) is fixed with clutch blocks (53).

2. A package shock absorbing mechanism for an integrated circuit device as claimed in claim 1, wherein: the bottom of slider (51) is fixed with backup pad (6), the right side of backup pad (6) is fixed with spring (7).

3. A package shock absorbing mechanism for an integrated circuit device as claimed in claim 1, wherein: the top of the sliding block (51) is provided with an inclined plane which forms an included angle of 30 degrees with the sliding block (51).

4. A package shock absorbing mechanism for an integrated circuit device as claimed in claim 1, wherein: and a friction plate (9) is fixed on the top of the inner wall of the sleeve (42).

5. A package shock absorbing mechanism for an integrated circuit device as claimed in claim 1, wherein: and a second rubber pad (10) is fixedly mounted at the bottom of the integrated circuit component (2), and a second damping spring (11) is fixed at the bottom of the second rubber pad (10).

6. A package shock absorbing mechanism for an integrated circuit device as claimed in claim 5, wherein: the two groups of second damping springs (11) are arranged, and the two groups of second damping springs (11) are symmetrically arranged by taking the central line of the integrated circuit component (2) in the vertical direction as a symmetry axis.