CN207217531U - A kind of dismountable encapsulating structure - Google Patents
A kind of dismountable encapsulating structure Download PDFInfo
- Publication number
- CN207217531U CN207217531U CN201721294562.7U CN201721294562U CN207217531U CN 207217531 U CN207217531 U CN 207217531U CN 201721294562 U CN201721294562 U CN 201721294562U CN 207217531 U CN207217531 U CN 207217531U
- Authority
- CN
- China
- Prior art keywords
- fin
- radiating
- plastic
- sealed body
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a kind of dismountable encapsulating structure, its drip irrigation device includes being used for the plastic-sealed body for encapsulating IC core bodys and MOS chips, three pins are respectively provided with left and right sides of the plastic-sealed body, the upside of the plastic-sealed body is provided with the radiating groove of frame type, the radiating groove is embedded with radiating frame, chuck is fixed with described a pair of relative external groove sidevalls of radiating groove, the chuck is hemispherical, the radiating frame includes a pair of the first relative fin and a pair of the second relative fin, described two first fin are provided with the neck coordinated with chuck, the utility model has heat abstractor dismantled and assembled, function easy to use.
Description
Technical field
A kind of encapsulating structure is the utility model is related to, more specifically it is related to a kind of dismountable encapsulating structure.
Background technology
Existing IC chip and MOS chips are all individually to be packaged into two SOT26 encapsulating structures, and cost is high, the PCB of occupancy
Plate suqare is larger, it is difficult to used in wearing electronics industry, for this, appearance is a kind of by together with IC chip and MOS chip packages
SOT26 encapsulating structures, this encapsulating structure reduce the area that IC chip is used together with MOS chips, can be useful in
Electronics industry is dressed, is as shown in Figure 1 a kind of existing encapsulating structure, including plastic-sealed body 1 and pin 2, is packaged with plastic-sealed body 1
IC chip and MOS chips, if but the IC chip inside such a encapsulating structure and the long-time running of MOS chips easily make SOT26
The increase of caused heat so that the exothermic temperature of plastic-sealed body 1 is too high and causes IC chip and MOS wafer damages, and existing does
Method is that heat abstractor is set up in the outer surface of plastic-sealed body 1, but heat abstractor is often fixedly connected with plastic-sealed body 1 so that people
Heat abstractor can not be dismounted according to the real needs of oneself so that the scope of application is smaller when in use for the encapsulating structure, unfavorable
Used in people.
Utility model content
In view of the deficienciess of the prior art, the purpose of this utility model is to provide a kind of dismountable encapsulating structure,
Function dismantled and assembled with heat abstractor, easy to use.
To achieve the above object, the utility model provides following technical scheme：A kind of dismountable encapsulating structure, including
For encapsulating the plastic-sealed body of IC core bodys and MOS chips, three pins, the plastic-sealed body are respectively provided with left and right sides of the plastic-sealed body
Upside be provided with the radiating groove of frame type, the radiating groove is embedded with radiating frame, on described a pair of relative external groove sidevalls of radiating groove
Chuck is fixed with, the chuck is hemispherical, and the radiating frame includes a pair of the first relative fin and a pair relative the
Two fin, described two first fin are provided with the neck coordinated with chuck.
By using above-mentioned technical proposal, by the side by pressure radiating frame chuck can be pressed to slip into neck, also may be used
Plastic-sealed body to be pinned to extract radiating frame so that chuck skids off from neck, and because chuck is that hemispherical causes chuck from neck
Obstruction is smaller when skidding off, so as to realize the dismounting of radiating frame and plastic-sealed body so that people can freely pacify according to the demand of oneself
Dress radiating frame, is easy to people to use.
The utility model is further arranged to：The deformation that described two internal groove side walls relative with chuck of radiating groove are provided with
Groove, the deformation groove is arc, and the radiating frame is made of copper.
By using above-mentioned technical proposal, radiating frame makes it have good heat-conducting effect and certain bullet using copper
Property, when radiating frame installs radiating frame, the fin of pressable first makes it become to deformation flute profile, so that chuck and neck mistake
Open, after the frame that radiates contacts with the bottom of radiating groove, unclamp the first fin so that chuck is caught in neck, and radiating frame is not easy to take
Go out, it is necessary to when taking out radiating frame, the first fin can be pressed again so that chuck staggers with neck, and radiating frame is taken out, taken
Go out to radiate frame when, be not easy to take up plastic-sealed body so that radiating frame with plastic-sealed body when it is more easy and convenient.
The utility model is further arranged to：The first fin of connection and second is fixed with the corner of the radiating frame to dissipate
The stiffening piece of backing, the stiffening piece are located at the upper end of fin.
By using above-mentioned technical proposal, stiffening piece enables to the first fin to be more easy to restore after being pressed, and prevents
Only fin excessive deformation.
The utility model is further arranged to：It is provided between described two second fin and is dissipated with what the second fin was fixed
Hot plate, the heat sink is between stiffening piece.
By using above-mentioned technical proposal, can be transferred to by the heat to radiate on frame on heat sink, and heat sink
It is larger with the area of air contact, and then improve the heat-sinking capability of plastic-sealed body so that IC chip and MOS chips are not easy because dissipating
Heat is damaged not in time.
The utility model is further arranged to：The heat sink is waveform.
By using above-mentioned technical proposal, the area of corrugated heat sink and air contact is bigger, and radiating is faster.
The utility model is further arranged to：One end of the heat sink towards plastic-sealed body is fixed with connection sheet, the company
In the link slot of contact pin insertion plastic-sealed body.
By using above-mentioned technical proposal, pass through the contact area of connection sheet increase heat sink and plastic-sealed body so that plastic packaging
Heat on body can faster be transferred on fin and shed.
In summary, the utility model has advantages below：
The frame that radiates is fixed and quick detachable by the cooperation realization of hemispherical chuck and neck with plastic-sealed body, and can pass through deformation
The groove frame that to radiate separates easy and convenient with plastic-sealed body, and when the frame that radiates is removed, connection sheet and plastic-sealed body are also with the frame one that radiates
Rise and be removed, while corrugated heat sink improves plastic packaging and mentions radiating rate.
Brief description of the drawings
Fig. 1 is a kind of structural representation of encapsulating structure of the prior art；
Fig. 2 is the structural representation of the present embodiment；
Fig. 3 is the exploded perspective view of the present embodiment.
Description of reference numerals：1st, plastic-sealed body；2nd, pin；3rd, radiating groove；4th, radiate frame；5th, chuck；6th, the first fin；7、
Second fin；8th, neck；9th, groove is deformed；10th, stiffening piece；11st, heat sink；12nd, connection sheet；13rd, link slot.
Embodiment
The utility model is described in further detail below in conjunction with accompanying drawing.
The present embodiment discloses a kind of dismountable encapsulation, as shown in Fig. 2 including for encapsulating IC chip and MOS chips
Plastic-sealed body 1, be each side connected with three pins 2 in plastic-sealed body 1.
As shown in Figure 2 and Figure 3, the radiating groove 3 of frame type is provided with the upside of plastic-sealed body 1, radiating groove 3 is embedded with radiating frame
4, radiating frame 4 is made of copper, and has good heat-conducting effect and certain elasticity, it is possible to increase the heat-sinking capability of plastic-sealed body 1,
Chuck 5 is fixed with a pair of the relative external groove sidevalls of radiating groove 3, chuck 5 is hemispherical, and radiating frame 4 includes a pair relative first
Fin 6 and a pair of the second relative fin 7, the neck 8 coordinated with chuck 5 is provided with two the first fin 6.
As shown in Figure 2 and Figure 3, the deformation groove 9 that two internal groove side walls relative with chuck 5 are provided with radiating groove 3, groove 9 is deformed
For arc, when frame 4 is radiated in installation, the first fin of pressable 6, make it to the deformation deformation of groove 9, so that chuck 5 and card
Groove 8 staggers, and after the frame 4 that radiates contacts with the bottom of radiating groove 3, unclamps the first fin 6 so that chuck 5 is caught in neck 8, dissipates
Hot frame 4 is not easily taken out, it is necessary to when taking out radiating frame 4, can press the first fin 6 again so that chuck 5 staggers with neck 8, will
Radiating frame 4 takes out, and when frame 4 is radiated in taking-up, is not easy to take up plastic-sealed body 1 so that more easily square when radiating frame 4 and plastic-sealed body 1
Just.The stiffening piece 10 of the first fin 6 of connection and the second fin 7 is fixed with the corner of radiating frame 4, stiffening piece 10 is located at
The upper end of fin, stiffening piece 10 enable to the first fin 6 to be more easy to restore after being pressed, prevent fin from excessively becoming
Shape.
As shown in Figure 2 and Figure 3, the heat sink 11 fixed with the second fin 7 is provided between two the second fin 7, is dissipated
Hot plate 11 is between stiffening piece 10 so that and heat sink 11 will not hinder the first fin 6 to deform, and heat sink 11 is waveform,
One end of heat sink 11 towards plastic-sealed body 1 is fixed with connection sheet 12, and connection sheet 12 is embedded in the link slot 13 of plastic-sealed body 1, radiating
Plate 11 can increase area of dissipation, and when plastic-sealed body 1 is by downward pressure, heat sink 11 can strengthen plastic-sealed body 1
Anti-pressure ability, heat sink 11 and connection sheet 12 are made of copper, rapid heat dissipation.
Specific work process：By radiating frame 4 and heat sink 11 radiates to plastic-sealed body 1, encapsulating structure is improved
Heat-sinking capability so that IC chip and MOS chips inside plastic-sealed body 1 can be hardly damaged with even running, and pressable plays the
One fin 6 causes chuck 5 to stagger with neck 8, so as to easily separate radiating frame 4 and heat sink 11 with plastic-sealed body 1, is tearing open
It is not easy to drive plastic-sealed body 1 during except radiating frame 4 and heat sink 11 so that people can install radiating frame 4 and dissipate according to oneself demand
Hot plate 11.
Preferred embodiment of the present utility model is the foregoing is only, is not limited to the utility model, it is all in this practicality
Within new design concept, any modification, equivalent substitution and improvements made etc., protection of the present utility model should be included in
Within the scope of.
Claims (6)
1. a kind of dismountable encapsulating structure, including for encapsulating the plastic-sealed body (1) of IC core bodys and MOS chips, the plastic-sealed body
(1) three pins (2) are respectively provided with left and right sides of, it is characterised in that：The upside of the plastic-sealed body (1) is provided with the radiating of frame type
Groove (3), the radiating groove (3) are embedded with radiating frame (4), chuck are fixed with described a pair of relative external groove sidevalls of radiating groove (3)
(5), the chuck (5) is hemispherical, and the radiating frame (4) includes a pair of relative the first fin (6) and a pair relative
Second fin (7), described two first fin (6) are provided with the neck (8) coordinated with chuck (5).
A kind of 2. dismountable encapsulating structure according to claim 1, it is characterised in that：The radiating groove (3) two with
The deformation groove (9) that the relative internal groove side wall of chuck (5) is provided with, the deformation groove (9) is arc, and the radiating frame (4) uses copper
It is made.
A kind of 3. dismountable encapsulating structure according to claim 2, it is characterised in that：The corner of the radiating frame (4)
On be fixed with the stiffening piece (10) of the first fin of connection (6) and the second fin (7), the stiffening piece (10) is located at fin
Upper end.
A kind of 4. dismountable encapsulating structure according to claim 3, it is characterised in that：Described two second fin
(7) heat sink (11) fixed with the second fin (7) is provided between, the heat sink (11) is located between stiffening piece (10).
A kind of 5. dismountable encapsulating structure according to claim 4, it is characterised in that：The heat sink (11) is wave
Shape.
A kind of 6. dismountable encapsulating structure according to claim 5, it is characterised in that：Heat sink (11) the direction modeling
One end of envelope body (1) is fixed with connection sheet (12), and the link slot (13) of the embedded plastic-sealed body (1) of the connection sheet (12) is interior.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721294562.7U CN207217531U (en) | 2017-10-09 | 2017-10-09 | A kind of dismountable encapsulating structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721294562.7U CN207217531U (en) | 2017-10-09 | 2017-10-09 | A kind of dismountable encapsulating structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207217531U true CN207217531U (en) | 2018-04-10 |
Family
ID=61820554
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721294562.7U Expired - Fee Related CN207217531U (en) | 2017-10-09 | 2017-10-09 | A kind of dismountable encapsulating structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207217531U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111916412A (en) * | 2020-08-06 | 2020-11-10 | 互升科技(深圳)有限公司 | MOS (Metal oxide semiconductor) tube and preparation method thereof |
-
2017
- 2017-10-09 CN CN201721294562.7U patent/CN207217531U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111916412A (en) * | 2020-08-06 | 2020-11-10 | 互升科技(深圳)有限公司 | MOS (Metal oxide semiconductor) tube and preparation method thereof |
| CN111916412B (en) * | 2020-08-06 | 2022-07-12 | 互升科技(深圳)有限公司 | MOS (Metal oxide semiconductor) tube and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180410 Termination date: 20191009 |