CN112486300A8 - 一种可将热量传导到上盖的电子设备的散热装置 - Google Patents
一种可将热量传导到上盖的电子设备的散热装置 Download PDFInfo
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- CN112486300A8 CN112486300A8 CN202011443663.2A CN202011443663A CN112486300A8 CN 112486300 A8 CN112486300 A8 CN 112486300A8 CN 202011443663 A CN202011443663 A CN 202011443663A CN 112486300 A8 CN112486300 A8 CN 112486300A8
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- 230000005494 condensation Effects 0.000 abstract 3
- 238000009833 condensation Methods 0.000 abstract 3
- 230000008020 evaporation Effects 0.000 abstract 2
- 238000001704 evaporation Methods 0.000 abstract 2
- 230000017525 heat dissipation Effects 0.000 abstract 2
- 239000002184 metal Substances 0.000 abstract 2
- 238000010438 heat treatment Methods 0.000 abstract 1
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/206—Cooling means comprising thermal management
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/181—Enclosures
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
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- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
本发明涉及一种可将热量传导到上盖的电子设备的散热装置。本采用的技术方案是:散热装置包括第一导热件、第二导热件以及连接件,连接件是内腔的横截面为圆形的中空管件,其安装固定在显示屏的支撑底板的内部,第一导热件的蒸发端与发热元件贴合固定,第一导热件的冷凝端与连接件的一端可转动连接,连接件的另一端与第二导热件的蒸发端固定连接,第二导热件的冷凝端延伸到显示屏外部的金属上盖,并与金属上盖的内表面贴合固定。本发明的优点是:将安装在主机壳体内部的电子元件产生的热量通过热管和连接件传递到显示屏的上盖上,并将热量从上盖导出,由于上盖具有较大的外部表面积,可以增加辐射和热对流将热量较快的散发到周围空气中。
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CN202011443663.2A CN112486300A (zh) | 2020-12-08 | 2020-12-08 | 一种可将热量传导到上盖的电子设备的散热装置 |
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CN202011443663.2A CN112486300A (zh) | 2020-12-08 | 2020-12-08 | 一种可将热量传导到上盖的电子设备的散热装置 |
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CN112486300A CN112486300A (zh) | 2021-03-12 |
CN112486300A8 true CN112486300A8 (zh) | 2021-10-12 |
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CN202011443663.2A Pending CN112486300A (zh) | 2020-12-08 | 2020-12-08 | 一种可将热量传导到上盖的电子设备的散热装置 |
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Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
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TWI802979B (zh) * | 2021-09-02 | 2023-05-21 | 雙鴻科技股份有限公司 | 散熱裝置 |
WO2023184082A1 (zh) * | 2022-03-28 | 2023-10-05 | 深圳市大疆创新科技有限公司 | 摄像装置 |
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- 2020-12-08 CN CN202011443663.2A patent/CN112486300A/zh active Pending
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CI02 | Correction of invention patent application |
Correction item: Inventor Correct: Yang Qiang False: Zhang Qiang Number: 11-02 Page: The title page Volume: 37 Correction item: Inventor Correct: Yang Qiang False: Zhang Qiang Number: 11-02 Volume: 37 |
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CI02 | Correction of invention patent application |