CN112467047B - 发光设备及其制造方法、打印机、显示设备、光电转换设备、电子装备、照明设备和移动体 - Google Patents

发光设备及其制造方法、打印机、显示设备、光电转换设备、电子装备、照明设备和移动体 Download PDF

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Publication number
CN112467047B
CN112467047B CN202010915122.9A CN202010915122A CN112467047B CN 112467047 B CN112467047 B CN 112467047B CN 202010915122 A CN202010915122 A CN 202010915122A CN 112467047 B CN112467047 B CN 112467047B
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light emitting
groove
insulating layer
light
emitting element
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CN112467047A (zh
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梶本典史
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Canon Inc
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Canon Inc
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/844Encapsulations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/87Passivation; Containers; Encapsulations
    • H10K59/873Encapsulations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10Deposition of organic active material
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00Constructional details relating to the organic devices covered by this subclass

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
CN202010915122.9A 2019-09-06 2020-09-03 发光设备及其制造方法、打印机、显示设备、光电转换设备、电子装备、照明设备和移动体 Active CN112467047B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-163275 2019-09-06
JP2019163275A JP7386653B2 (ja) 2019-09-06 2019-09-06 発光装置及びその製造方法、プリンタ、表示装置、光電変換装置、電子機器、照明装置並びに移動体

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CN112467047A CN112467047A (zh) 2021-03-09
CN112467047B true CN112467047B (zh) 2024-03-22

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US (1) US11545647B2 (https=)
EP (1) EP3790066A1 (https=)
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WO2019214284A1 (zh) * 2018-05-11 2019-11-14 云谷(固安)科技有限公司 显示屏及显示屏的制备方法
KR102941504B1 (ko) * 2021-11-08 2026-03-20 삼성디스플레이 주식회사 표시 장치 및 이의 제조 방법
CN114464754B (zh) * 2022-01-25 2023-05-12 武汉华星光电半导体显示技术有限公司 一种显示面板及显示装置
WO2024080039A1 (ja) * 2022-10-14 2024-04-18 ソニーセミコンダクタソリューションズ株式会社 表示装置、電子機器及び表示装置の製造方法

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JP2012226891A (ja) * 2011-04-18 2012-11-15 Seiko Epson Corp 有機el装置およびその製造方法、電子機器
CN104254931A (zh) * 2012-07-31 2014-12-31 索尼公司 显示装置、电子设备、显示装置的制造方法和驱动方法
JP2017174811A (ja) * 2016-03-18 2017-09-28 株式会社半導体エネルギー研究所 表示装置
WO2018179047A1 (ja) * 2017-03-27 2018-10-04 シャープ株式会社 表示装置およびその製造方法
CN110137375A (zh) * 2019-05-29 2019-08-16 上海天马有机发光显示技术有限公司 一种有机发光显示面板、装置及方法

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JP5272343B2 (ja) 2007-07-17 2013-08-28 三菱化学株式会社 新規希土類錯体、希土類錯体蛍光体並びに該蛍光体を用いた蛍光体含有組成物、積層体、色変換フィルム、発光装置、照明装置及び画像表示装置
JP2010194764A (ja) * 2009-02-23 2010-09-09 Seiko Epson Corp ラインヘッドおよび画像形成装置
US20110108812A1 (en) * 2009-11-06 2011-05-12 Shiro Sumita Organic el device
US20150062963A1 (en) * 2012-03-31 2015-03-05 Noam Meir Illumination system and method for backlighting
KR102080296B1 (ko) * 2013-12-03 2020-02-21 엘지디스플레이 주식회사 유기 발광 장치
JP6608201B2 (ja) * 2015-07-10 2019-11-20 株式会社ジャパンディスプレイ 自発光表示装置
JP2018014200A (ja) 2016-07-20 2018-01-25 キヤノン株式会社 有機エレクトロニクス装置の製造方法
KR102764011B1 (ko) * 2016-12-23 2025-02-05 삼성전자주식회사 전자 소자 및 그 제조 방법
KR102792402B1 (ko) * 2017-01-31 2025-04-07 삼성디스플레이 주식회사 표시 장치
JP2019029303A (ja) 2017-08-03 2019-02-21 株式会社ジャパンディスプレイ 表示装置および表示装置の製造方法
CN111819693B (zh) * 2019-01-23 2024-08-27 京东方科技集团股份有限公司 阵列基板及其制造方法、显示面板和显示装置
KR102721171B1 (ko) * 2019-06-21 2024-10-25 삼성디스플레이 주식회사 표시 장치

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006102966A (ja) * 2004-09-30 2006-04-20 Seiko Epson Corp プリンタヘッド及びこれを備えた画像形成装置
JP2012226891A (ja) * 2011-04-18 2012-11-15 Seiko Epson Corp 有機el装置およびその製造方法、電子機器
CN104254931A (zh) * 2012-07-31 2014-12-31 索尼公司 显示装置、电子设备、显示装置的制造方法和驱动方法
JP2017174811A (ja) * 2016-03-18 2017-09-28 株式会社半導体エネルギー研究所 表示装置
WO2018179047A1 (ja) * 2017-03-27 2018-10-04 シャープ株式会社 表示装置およびその製造方法
CN110137375A (zh) * 2019-05-29 2019-08-16 上海天马有机发光显示技术有限公司 一种有机发光显示面板、装置及方法

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EP3790066A1 (en) 2021-03-10
JP2021044083A (ja) 2021-03-18
CN112467047A (zh) 2021-03-09
US20210074951A1 (en) 2021-03-11
US11545647B2 (en) 2023-01-03
JP7386653B2 (ja) 2023-11-27

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