CN112440389A - Turnover device and substrate processing system - Google Patents

Abstract

To a turn-over apparatus and a substrate processing system. The substrate inversion can be performed in a space-saving manner. The reversing device (54) is provided with shaft portions (541, 541') which are close to the side surfaces of the substrate small pieces (S); first hands (542, 542 ') movably attached to the shaft sections (541, 541 ') in the longitudinal direction of the shaft sections (541, 541 ') and moving toward the substrate small piece (S) side to hold the first main surface; second hands (543, 543 ') movably attached to the shaft portions (541, 541 ') in the longitudinal direction of the shaft portions (541, 541 ') and moving toward the substrate piece (S) side to hold the second main surface; and turning sections (544, 544 ') for turning over the substrate piece (S) by rotating the shaft sections (541, 541') around the shafts when the first hand section (542, 542 ') and the second hand section (543, 543') hold the substrate piece (S).

Description

Turnover device and substrate processing system

Technical Field

The present invention relates to a reversing device for reversing a substrate after cutting and processing, and a substrate processing system including the reversing device.

Background

A cutting apparatus for cutting a flat substrate such as glass into small substrate pieces is known. In addition, the cut substrate pieces may need to be transferred to the next process or the like with their surface orientations fixed. Conventionally, an operator takes out a small substrate piece from a cutting device, and reverses the substrate as necessary to fix the orientation of the surface of the small substrate piece.

On the other hand, there is known a reversing device that reverses a planar substrate by rotating a table with the substrate sandwiched between the two tables (for example, patent document 1).

Documents of the prior art

Patent document

Patent document 1: japanese laid-open patent publication No. 11-347779

Disclosure of Invention

Problems to be solved by the invention

The turnover device comprises the following components: when the substrate is sandwiched between the two tables, one table is moved in a direction perpendicular to the rotation axis to place the substrate, and thereafter, the other table is opposed to the one table to sandwich the substrate. In a configuration in which one table is moved in a direction perpendicular to a rotation axis of the table, a large space for movement of the table needs to be secured, and therefore, it is difficult to make the conventional turning device compact.

Therefore, it is difficult to dispose both the substrate cutting device and the conventional substrate inverting device in a work site where the installation space of the device is limited.

The invention aims to perform the turnover of a substrate in a space-saving manner.

Means for solving the problems

Hereinafter, a plurality of modes will be described as means for solving the problem. These modes can be arbitrarily combined as needed.

A reversing device according to an aspect of the present invention is a device for reversing a substrate. The turning device includes a shaft portion, a first hand portion, a second hand portion, and a turning portion.

The shaft portion is adjacent to a side surface of the substrate. The first hand is attached to the shaft so as to be movable in the longitudinal direction of the shaft, and moves toward the substrate side to hold the first main surface. The second hand is movably attached to the shaft in the longitudinal direction of the shaft, and moves toward the substrate side to hold the second main surface. The inverting section inverts the substrate by rotating the shaft section around the shaft section while the first hand and the second hand hold the substrate.

The turning device comprises the following components: the first hand and the second hand holding the substrate are attached to the shaft in a state of being movable in the longitudinal direction of the shaft, and are moved to the substrate side along the longitudinal direction of the shaft when holding the substrate. Thus, the above-described inverting apparatus can be performed in a small space until the substrate is held and inverted.

The first hand may have a first suction portion for vacuum-sucking and holding the first main surface. The second hand may have a second suction portion for vacuum-sucking and holding the second main surface. This enables the substrate to be easily held and detached.

When the substrate is held by the first hand and the second hand, the first main surface may be vacuum-sucked and held by the first suction unit or the second main surface may be vacuum-sucked and held by the second suction unit. This makes it possible to easily identify which hand holds the substrate.

A substrate processing system according to another aspect of the present invention includes: a cutting device for cutting the substrate into small substrate pieces; and a flip device that flips the substrate chip. The inverting device of the substrate processing system includes a shaft portion, a first hand portion, a second hand portion, and an inverting portion.

The shaft portion is adjacent to a side surface of the substrate chip. The first hand is attached to the shaft so as to be movable in the longitudinal direction of the shaft, and moves toward the substrate side to hold the first main surface of the substrate. The second hand is mounted on the shaft so as to be movable in the longitudinal direction of the shaft, and moves toward the substrate side to hold the second main surface of the substrate. The inverting section inverts the substrate by rotating the shaft section around the shaft section while the first hand and the second hand hold the substrate.

The substrate processing system is composed of: in the inverting apparatus, the first hand and the second hand holding the substrate are attached to the shaft in a movable state in the longitudinal direction of the shaft, and are moved to the substrate side along the longitudinal direction of the shaft when holding the substrate.

Thus, the above-described inverting apparatus can be performed in a small space until the substrate is held and inverted. As a result, in the substrate processing system described above, the inverting device can be made compact, and the cutting device and the inverting device can be installed in a limited installation space.

Effects of the invention

It can be performed in a small amount of space until the substrate is held and turned over. As a result, the inverting apparatus can be made compact, and the cutting apparatus and the inverting apparatus can be installed in a limited installation space.

Drawings

Fig. 1 is a diagram showing a configuration of a substrate processing system.

Fig. 2 is a diagram showing the configuration of the inverting apparatus of the first embodiment.

Fig. 3A is (a) a diagram schematically showing a substrate-small-piece reversing operation performed by the reversing device.

Fig. 3B is a diagram schematically showing the turning operation of the substrate small piece by the turning device (second diagram).

Fig. 3C is a view schematically showing the turning operation of the substrate small piece by the turning device (third).

Fig. 3D is a diagram schematically showing the turning operation of the substrate small piece by the turning device (fourth).

Fig. 3E is a diagram schematically showing the turning operation of the substrate small piece by the turning device (the fifth drawing).

Fig. 4 is a diagram showing a configuration of the inverting apparatus of the second embodiment.

Fig. 5 is a diagram schematically showing a state where the reversing device of the second embodiment holds a substrate chip.

Description of the reference numerals

100 a substrate processing system; 1a cutting device; 3a first carrying device; 5a substrate turning part; 51a first mobile carrying device; 51a first moving part; 51b a first pad moving part; 51c a first adsorption pad; 52 second mobile carrying device; 52a second pad moving part; 52b a pad holding part; 52c a second adsorption pad; 53 aligning device; 54 a turnover device; 541. 541' shaft portion; 542. 542' first hand; 543. 543' a second hand; 544. 544' turning part; 545a first adsorption part; 545a first suction port; 545b a first suction device; 545c a first pressure gauge; 545d a first valve; 546a second adsorption part; 546a second suction port; 546b second suction device; 546c a second pressure gauge; 546d second valve; 55ID reading means; 56a third mobile carrying device; 56a third moving part; 56b a third pad moving part; 56c a third adsorption pad; 7 a second carrying device; 9 a controller; s, a substrate is small; s1 a first substrate; s2 second substrate.

Detailed Description

1. First embodiment

(1) Substrate processing system

Hereinafter, a substrate processing system 100 according to a first embodiment will be described with reference to fig. 1. Fig. 1 is a diagram showing a configuration of a substrate processing system. In fig. 1, the direction of conveyance of the substrate chips S by the first conveyance device 3 is indicated by an arrow as the X direction. The direction perpendicular thereto is the Y direction and indicated by an arrow. The substrate processing system 100 according to the first embodiment is a system for dividing a mother substrate such as glass into a plurality of substrate pieces S, inverting the front and back sides of each substrate piece S according to the application, and conveying the substrate pieces S to an apparatus for performing the next step. In the present embodiment, the mother substrate to be processed is a bonded substrate obtained by bonding two substrates.

The substrate processing system 100 mainly includes a cutting device 1, a first transfer device 3, a substrate inverting unit 5, a second transfer device 7, and a controller 9.

The cutting device 1 cuts the mother substrate into a plurality of substrate pieces S. The cutting device 1 includes, for example: a scribing line forming member (for example, a scribing wheel) provided on both the upper surface and the lower surface of the mother substrate; a fixing table for holding a mother substrate on which a scribe line is formed; and a cutting mechanism which inclines the tilting table upwards or downwards to apply bending moment to cut the mother substrate in a state that the scribing line is positioned in the interval between the fixed table and the tilting table, thereby cutting the substrate small piece S.

The substrate pieces S cut out by the cutting apparatus 1 are conveyed to the first conveying apparatus 3 for conveyance to the substrate reversing section 5.

The first conveying device 3 conveys the substrate pieces S cut out by the cutting device 1 to the substrate reversing section 5. The first transfer device 3 is a device capable of transferring a substrate, such as a belt conveyor.

The substrate reversing section 5 reverses the front and back sides of the substrate pieces S conveyed by the first conveying device 3 as necessary, and conveys the substrate pieces S to the second conveying device 7. The details of the substrate inverting section 5 will be described later.

The second conveying device 7 conveys the substrate pieces S having passed through the substrate reversing section 5 (that is, the substrate pieces S whose front and back sides are reversed as necessary) to a device or the like that performs the next process. The second conveying device 7 is a device capable of conveying substrates, such as a belt conveyor.

The controller 9 controls the components of the substrate processing system 100 (the components of the cutting apparatus 1, the first conveyance apparatus 3, the substrate inverting unit 5, the second conveyance apparatus 7, and the like). The controller 9 is, for example, a computer system including a CPU, a storage device (RAM, ROM, hard disk, SSD, etc.), various interfaces, and the like.

A part or all of the control of each component by the controller 9 may be realized by a program stored in a storage device of a computer system constituting the controller 9. Part or all of the control may be realized by hardware such as SoC (System on Chip).

(2) Concrete structure of substrate turnover part

Next, a specific configuration of the substrate inverting section 5 will be described with reference to fig. 1. As described above, when the front and back sides of the substrate S need to be reversed for the next step, the substrate reversing section 5 reverses the front and back sides of the substrate S conveyed by the first conveying device 3. As shown in fig. 1, the substrate inverting section 5 includes: a first moving carriage device 51, a second moving carriage device 52, a positioning device 53, a flipping device 54, an ID reading device 55, and a third moving carriage device 56.

The first moving and mounting device 51 moves and mounts the substrate chips S, which are transported to the vicinity of the substrate reversing section 5 by the first transport device 3, onto the second moving and mounting device 52. The first transfer device 51 is, for example, a single-axis robot that sucks and transfers the substrate chip S. Specifically, the first moving device 51 includes a first moving unit 51a, a first pad moving unit 51b, and a first suction pad 51 c.

The first moving portion 51a moves the first pad moving portion 51b in the X direction. The first pad moving portion 51b moves the first adsorption pad 51c in the Y direction. The first suction pad 51c is a member that sucks and holds the substrate small pieces S. In the present embodiment, a pair of first adsorption pads 51c are arranged in the X direction.

In the first moving device 51 having the above-described configuration, the first moving unit 51a moves the first pad moving unit 51b to a position where the substrate chip S to be moved and placed is placed, the first pad moving unit 51b moves the first suction pad 51c onto the substrate chip S, and the first suction pad 51c sucks and places the substrate chip S. Thereafter, in a state where the two substrate chips S are simultaneously sucked, the pair of first suction pads 51c are moved to the arrangement position of the aligning device 53, and the suction of the substrate chips S is released at the arrangement position of the aligning device 53. In this way, the first transfer device 51 can simultaneously transfer the two substrate chips S from the first transfer device 3 to the alignment device 53.

The second transfer device 52 is a device for transferring the substrate chips S transferred by the first transfer device 51 in the Y direction in the order of the positioning device 53, the reversing device 54, the ID reading device 55, and the buffer position B. The second transfer device 52 is, for example, a single-axis robot that sucks and transfers the substrate chip S. Specifically, the second transfer device 52 includes a second pad moving portion 52a, a pad holding portion 52b, and a second suction pad 52 c.

The second pad moving portion 52a moves the pad holding portion 52b in the Y direction. The pad holding portion 52b is a hand holding the second suction pad 52 c. In the present embodiment, the pad holding portion 52b has an E-shape including three rod-like members extending in the X direction. The two second suction pads 52c are arranged in the X direction and are disposed on each rod-shaped member. That is, the pad holding portion 52b can hold a total of six second suction pads 52 c. The arrangement intervals of the three rod-like members in the Y direction are the same as the arrangement intervals of the aligning device 53, the reversing device 54, and the ID reading device 55 in the Y direction. The second suction pad 52c is a member that sucks and holds the substrate chip S.

In the second moving carriage 52 having the above-described configuration, the second pad moving unit 52a moves the pad holding unit 52b so that the three bar-shaped members of the pad holding unit 52b are positioned on the aligning device 53, the reversing device 54, and the ID reading device 55, respectively. Thereafter, the second suction pad 52c sucks the substrate chip S existing in the aligning device 53, the reversing device 54, and the ID reading device 55. Thus, the spacer holding portion 52b can simultaneously hold a maximum of six substrate chips S.

Next, the pad holding portion 52B holding the six substrate pieces S at most moves in the Y direction, and simultaneously moves the substrate pieces S existing in the ID reading device 55 to the buffer position B, the substrate pieces S existing in the inverting device 54 move to the ID reading device 55, and the substrate pieces S existing in the aligning device 53 move to the inverting device 54. After that, the second suction pad 52c releases the suction of the substrate chip S.

In this way, the second transfer device 52 can simultaneously perform the transfer of the substrate chips S from the ID reader 55 to the buffer position B, the transfer of the substrate chips S from the reversing device 54 to the ID reader 55, and the transfer of the substrate chips S from the aligning device 53 to the reversing device 54.

The alignment device 53 is disposed at a position where the substrate chips S are transferred and placed by the first transfer device 51, and performs alignment of the substrate chips S transferred and placed from the first transfer device 3. The alignment device 53 can align the substrate small pieces S with the determined positions by pressing the substrate small pieces S from the side surface with a cylinder or the like, for example.

The reversing device 54 is disposed between the aligning device 53 and the ID reading device 55. The reversing device 54 reverses the front and back surfaces of the substrate pieces S to be reversed among the substrate pieces S aligned by the aligning device 53.

The reversing device 54 reverses the front and back surfaces of the substrate small pieces S by rotating the rotating shaft with the substrate small pieces S held between the two hands attached to the rotating shaft. The specific configuration of the turning device 54 will be described in detail later.

The ID reader 55 reads identification information (for example, a two-dimensional code such as a QR code (registered trademark), a barcode, or the like) of the substrate chip S that is moved and placed from the reversing device 54. The ID reading device 55 is, for example, a two-dimensional code reader, a barcode reader, or the like.

The third transfer device 56 transfers the substrate chips S transferred to the buffer position B to the second transfer device 7. The third transfer device 56 is, for example, a single-axis robot that adsorbs and transfers the substrate chips S. Specifically, the third transfer device 56 includes a third transfer unit 56a, a third pad transfer unit 56b, and a third suction pad 56 c.

The third moving portion 56a moves the third pad moving portion 56b in the X direction. The third pad moving unit 56b moves the third suction pad 56c in the Y direction. The third suction pad 56c is a member that sucks and holds the substrate chip S. In the present embodiment, a pair of third suction pads 56c are provided in an array in the X direction.

In the third transfer device 56 having the above-described configuration, the third moving unit 56a moves the third pad moving unit 56B to the buffer position B, the third pad moving unit 56B moves the third suction pad 56c to the substrate chip S at the buffer position B, and the third suction pad 56c sucks the substrate chip S. After that, in a state where the substrate chips S are sucked, the third suction pad 56c moves to the second conveying device 7, and the suction of the substrate chips S is released in the second conveying device 7. In this way, the third transfer device 56 can transfer the substrate chips S from the buffer position B to the second transport device 7.

The substrate reversing section 5 having the above-described configuration can simultaneously perform the alignment of the substrate small pieces S by the alignment device 53, the reversing of the substrate small pieces S by the reversing device 54, and the reading of the identification information of the substrate small pieces S by the ID reading device 55. Further, since the substrate chips S can be moved and placed by the second moving and placing device 52 by up to six, the substrate chips S after the completion of the three steps of the positioning of the substrate chips S by the positioning device 53, the reversing of the substrate chips S by the reversing device 54, and the reading of the identification information of the substrate chips S by the ID reading device 55 can be simultaneously moved and placed in the next step. As a result, the substrate reversing section 5 can efficiently reverse the substrate small pieces S.

(3) Concrete structure of turning device

Next, a specific configuration of the inverting unit 54 provided in the substrate inverting unit 5 will be described with reference to fig. 2. Fig. 2 is a diagram showing the configuration of the inverting apparatus of the first embodiment.

The reversing device 54 includes a shaft portion 541, a first hand portion 542, a second hand portion 543, and a reversing portion 544. The shaft portion 541 is a central axis when the substrate chip S is turned upside down. The shaft portion 541 is, for example, a rod-shaped member. The shaft portion 541 is connected to an output rotation shaft of the turning portion 544, and is rotated around an axis by the rotation of the output rotation shaft.

The first hand 542 is a rod-shaped member that is attached to one side surface of the shaft 541 so as to be movable in the longitudinal direction of the shaft 541. Specifically, for example, a guide is provided on the one side surface of the shaft portion 541, and the first hand portion 542 is attached to the guide so as to be movable in the longitudinal direction of the shaft portion 541. The movement of the first hand 542 is realized by a known mechanism including a motor controlled by the controller 9.

The second hand 543 is movably attached to a side surface of the shaft portion 541 opposite to the side surface of the shaft portion 541 to which the first hand 542 is attached. Specifically, for example, a guide is provided on the opposite side surface of the shaft portion 541, and the second hand portion 543 is attached to the guide so as to be movable in the longitudinal direction of the shaft portion 541 while facing the first hand portion 542. The movement of the second hand 543 is realized by a known mechanism such as a motor controlled by the controller 9.

The turning part 544 causes the shaft 541 to rotate around the shaft by the control of the controller 9. The turning part 544 is, for example, a motor.

As shown in fig. 2, the first hand 542 is further provided with a first suction unit 545. The first suction unit 545 vacuum-sucks and holds one main surface of the substrate chip S held by the first hand 542. Specifically, for example, the first suction unit 545 includes a first suction port 545a, a first suction device 545b, a first pressure gauge 545c, and a first valve 545 d.

The first suction port 545a is an opening provided at the center of the first hand 542 and penetrating the first hand 542. The first suction port 545a may be formed of a plurality of openings. The first suction port 545a is connected to the first suction device 545b via a first pressure gauge 545c and a first valve 545 d.

The first suction means 545b is a means for sucking the first suction port 545 a. The first suction device 545b is a device capable of sucking gas, such as a vacuum pump. When the first suction port 545a is closed by the main surface of the substrate chip S, the first suction device 545b sucks the first suction port 545a, and the substrate chip S is held by the first hand 542.

The first pressure gauge 545c measures the pressure of the first suction port 545a and outputs the result to the controller 9. When the first pressure gauge 545c detects that the first suction port 545a is at a predetermined negative pressure, the controller 9 determines that the substrate small pieces S are held by the first hand 542. On the other hand, when the first pressure gauge 545c detects that the first suction port 545a is at substantially atmospheric pressure, it is determined that the substrate chip S is not held by the first hand 542.

The first valve 545d changes a gas path between the first suction port 545a and the first suction device 545b under the control of the controller 9. When gas can flow between the first suction port 545a and the first suction device 545b by the first valve 545d, suction of the first suction port 545a by the first suction device 545b is performed. On the other hand, when the first suction port 545a is connected to the atmosphere (or a gas atmosphere at the atmospheric pressure), the suction of the first suction port 545a by the first suction device 545b is stopped, and the first suction port 545a becomes substantially at the atmospheric pressure.

That is, the first valve 545d switches whether to hold the substrate small pieces S by the first hand 542 or to release the holding of the substrate small pieces S by the first hand 542 under the control of the controller 9. The first valve 545d is, for example, an electromagnetic three-way valve.

In addition, a second suction portion 546 is provided in the second hand portion 543. The second suction portion 546 vacuum-sucks and holds one main surface of the substrate piece S held by the second hand portion 543. Specifically, for example, the second suction unit 546 has a second suction port 546a, a second suction device 546b, a second pressure gauge 546c, and a second valve 546 d.

The second suction port 546a is an opening provided at the center of the second hand 543 and penetrating the second hand 543. The second suction port 546a may be formed by a plurality of openings. The second suction port 546a is connected to the second suction device 546b via a second pressure gauge 546c and a second valve 546 d.

The second suction device 546b is a device that sucks the second suction port 546 a. The second suction device 546b is a device capable of sucking gas, such as a vacuum pump. When the second suction port 546a is closed by the main surface of the substrate small piece S, the second suction device 546b sucks the second suction port 546a, and the substrate small piece S is held by the second hand portion 543.

The second pressure gauge 546c measures the pressure of the second suction port 546a, and outputs the result to the controller 9. When the second pressure gauge 546c detects that the second suction port 546a has a predetermined negative pressure, the controller 9 determines that the substrate piece S is held by the second hand portion 543. On the other hand, when the second pressure gauge 546c detects that the second suction port 546a is at substantially atmospheric pressure, it is determined that the substrate piece S is not held by the second hand portion 543.

The second valve 546d changes the gas path between the second suction port 546a and the second suction device 546b by the control of the controller 9. When the second valve 546d allows gas to flow between the second suction port 546a and the second suction device 546b, the second suction device 546b performs suction to the second suction port 546 a. On the other hand, when the second suction port 546a is connected to the atmosphere (or the atmospheric gas atmosphere), the suction of the second suction port 546a by the second suction device 546b is stopped, and the second suction port 546a is at substantially atmospheric pressure.

That is, the second valve 546d switches between holding the substrate piece S by the second hand 543 and releasing the holding of the substrate piece S by the second hand 543 under the control of the controller 9. The second valve 546d is, for example, an electromagnetic three-way valve.

(4) Flipping action of substrate die

Next, the turning operation of the substrate chip S by the turning device 54 will be described with reference to fig. 3A to 3E. Fig. 3A to 3E are diagrams schematically showing the substrate die reversing operation by the reversing device. Hereinafter, the substrate small piece S is a substrate obtained by bonding two substrates. One of the substrate pieces S is referred to as a first substrate S1, and the other substrate is referred to as a second substrate S2. The main surface of the first substrate S1 is referred to as a first main surface, and the main surface of the second substrate S2 is referred to as a second main surface.

In fig. 3A to 3E, the up-down direction is indicated by an arrow, the direction indicated by the arrow "up" is defined as the up direction, and the direction indicated by the arrow "down" is defined as the down direction.

When the substrate small pieces S are transferred and mounted on the reversing device 54 by the second transfer device 52, the controller 9 brings the shaft portion 541 close to the side surface of the substrate small pieces S if it is determined that the substrate small pieces S need to be reversed. If it is determined that the substrate small pieces S do not need to be flipped, the controller 9 waits without performing the following flipping operation.

After the shaft 541 is brought close to the side surface of the substrate chip S, the controller 9 moves the first hand 542 to the substrate chip S side, and places the substrate chip S on the first hand 542. At this time, as shown in fig. 3A, the substrate chip S is mounted such that the first principal surface side faces the first hand portion 542. In fig. 3A, the small substrate pieces S are placed on the first hand 542 with the first substrate S1 (first main surface) facing downward and the second substrate S2 (second main surface) facing upward.

After the substrate chip S is placed on the first hand 542, the controller 9 instructs the first valve 545d to allow gas to flow between the first suction port 545a and the first suction device 545 b. Since the first suction port 545a is closed by the first main surface (the first substrate S1), the first suction port 545a is sucked by the first suction device 545b, and the first suction port 545a has a predetermined negative pressure. As a result, the substrate pieces S are held by the first hand portions 542 with the first main surface (the first substrate S1) held by the first hand portions 542.

The controller 9 determines that the first hand 542 holds the substrate pieces S by detecting that the measurement result of the first pressure gauge 545c is a predetermined negative pressure. Further, for example, when the controller 9 detects that the measurement result of the first pressure gauge 545c is abnormal due to the measurement result of the pressure such as the holding atmospheric pressure, the holding state of the substrate chip S may be inappropriate, and an error may occur.

The controller 9 moves the second hand portion 543 to the substrate chip S side in a state where the first main surface of the substrate chip S is held by the first hand portion 542. Thereafter, as shown in fig. 3B, the controller 9 instructs the turnover portion 544 to pivot the shaft portion 541 by 180 ° while the first hand portion 542 holds the first main surface of the substrate piece S.

As a result, as shown in fig. 3C, in a state where the first hand 542 holds the first main surface of the small substrate S, the first main surface (the first substrate S1) faces upward, and the second main surface (the second substrate S2) faces downward. That is, the front and back surfaces of the small substrate pieces S (the orientations of the first substrate S1 and the second substrate S2) are inverted before the shaft 541 is rotated 180 ° (the state shown in fig. 3A and 3B) and after the shaft 541 is rotated 180 °.

After rotating the shaft 541 by 180 ° and inverting the front and back sides of the substrate small pieces S, the controller 9 instructs the second valve 546d to allow gas to flow between the second suction port 546a and the second suction device 546b, and instructs the first valve 545d to set the first suction port 545a to the atmospheric pressure.

As a result, as shown in fig. 3D, the first principal surface (first substrate S1) of the substrate piece S is separated from the first hand 542, and the holding of the substrate piece S by the first hand 542 is released. On the other hand, the second main surface (second substrate S2) of the substrate piece S is attracted to the second hand portion 543, and the substrate piece S is held by the second hand portion 543.

At this time, the controller 9 determines that the hand holding the substrate chip S is switched from the first hand 542 to the second hand 543 by detecting that the measurement result of the first pressure gauge 545c is substantially atmospheric pressure and the measurement result of the second pressure gauge 546c is a predetermined negative pressure.

For example, when the measurement results of the first pressure gauge 545c and the second pressure gauge 546c are not changed or when the measurement results of both the first pressure gauge 545c and the second pressure gauge 546c at substantially the atmospheric pressure are shown, the controller 9 switches the holding of the substrate piece S from the first hand 542 to the second hand 543 to be inappropriate, thereby causing an error.

After the substrate small piece S is held by the second hand 543, the controller 9 moves the first hand 542 from the substrate side to the reversing section 544 side, and instructs the second valve 546d to set the second suction port 546a to the atmospheric pressure (fig. 3E). After that, the controller 9 instructs the second transfer device 52 to transfer the substrate chip S with the front and back sides thereof reversed to the ID reading device 55.

(5) Summary of the invention

In the inverting device 54 of the first embodiment, the first hand 542 and the second hand 543 which hold the substrate piece S are attached to the shaft 541 so as to be movable in the longitudinal direction of the shaft 541. The first hand 542 and the second hand 543 are configured as follows: when holding the substrate chip S, the shaft portion 541 moves to the substrate chip S side along the longitudinal direction.

Thereby, the reversing device 54 can reverse the small substrate pieces S, and can perform in a small amount of space until the substrate pieces S are held and reversed.

The first major surface of the substrate small piece S is vacuum-sucked and held by the first suction portion 545 of the first hand 542, and the second major surface is vacuum-sucked and held by the second suction portion 546 of the second hand, whereby the substrate small piece S can be easily held and detached.

When the substrate is held by the first hand 542 and the second hand 543, the first main surface is vacuum-sucked and held by the first suction portion 545 or the second main surface is vacuum-sucked and held by the second suction portion 546, so that which hand holds the substrate small piece S can be easily recognized.

2. Second embodiment

In the first embodiment described above, the following configuration is adopted: the substrate piece S is held by the first hand 542 or the second hand 543 by suction performed by the first suction portion 545 provided in the first hand 542 or the second suction portion 546 provided in the second hand 543.

However, the structure for holding the substrate chip S by the hand is not limited to the above. In the inverting device 54 of the second embodiment, the substrate small pieces S can be held without being sucked to the hands. The inverting device 54 of the second embodiment has, for example, the configuration shown in fig. 4. Fig. 4 is a diagram showing a configuration of the inverting apparatus of the second embodiment.

As shown in fig. 4, the inverting apparatus 54 of the second embodiment includes a shaft portion 541 ', a first hand portion 542', a second hand portion 543 ', and an inverting portion 544'.

The shaft 541 'has a diameter d1 from the base end (the side connected to the turn-over portion 544') to a predetermined length, gradually decreases in diameter toward the tip end, and finally has a diameter d2 smaller than d1 in the vicinity of the tip end. Preferably, the diameter d2 near the tip of the shaft 541' is substantially the same as the thickness of the substrate piece S. For example, the diameter d2 near the tip may be larger than the thickness of the substrate piece S, and a buffer member may be provided on the side of the hand holding the substrate piece S.

In the example shown in fig. 4, the suction portions (first suction portion 545 and second suction portion 546) described in the first embodiment are not provided in the first hand 542 'and the second hand 543'. However, the present invention is not limited to this, and the first hand 542 'and the second hand 543' may be provided with suction portions in advance.

The configuration and function of the other first hand 542 ' and second hand 543 ' are the same as those of the first hand 542 and second hand 543 described in the first embodiment, and the configuration and function of the turning part 544 ' are the same as those of the turning part 544 described in the first embodiment. Therefore, the other configurations and functions of the first hand 542 ' and the second hand 543 ' and the turning part 544 ' will not be described here.

In the inverting device 54 having the above configuration, as shown in fig. 5, the first hand 542 ' and the second hand 543 ' are moved to the substrate piece S side (the distal end side of the shaft 541 '), and the substrate piece S can be held without being sucked to the hands. Fig. 5 is a diagram schematically showing a state where the reversing device of the second embodiment holds a substrate chip.

3. Matters common to the embodiments

The first to second embodiments have the following configurations and functions in common.

The inverting device (e.g., the inverting device 54) is a device for inverting the substrate (e.g., the substrate small piece S). The turning device is provided with: a shaft portion (e.g., shaft portions 541, 541 '), a first hand portion (e.g., first hand portions 542, 542'), a second hand portion (e.g., second hand portions 543, 543 '), and a turning portion (e.g., turning portion 544, 544').

The shaft portion is adjacent to a side surface of the substrate. The first hand is movably attached to the shaft in the longitudinal direction of the shaft, and moves toward the substrate side to hold the first main surface (e.g., the main surface of the first substrate S1). The second hand is movably attached to the shaft in the longitudinal direction of the shaft, and moves toward the substrate side to hold the second main surface (e.g., the main surface of the second substrate S2). The inverting section inverts the substrate by rotating the shaft section around the shaft section while the first hand and the second hand hold the substrate.

The above-described inverting apparatus is configured as follows: the first hand and the second hand holding the substrate are attached to the shaft in a state of being movable in the longitudinal direction of the shaft, and are moved to the substrate side along the longitudinal direction of the shaft when holding the substrate. Thus, the above-described inverting apparatus can be performed in a small space until the substrate is held and inverted.

4. Other embodiments

While the embodiments of the present invention have been described above, the present invention is not limited to the above embodiments, and various modifications can be made without departing from the scope of the invention. In particular, the plurality of embodiments and modifications described in the present specification can be combined as desired.

(A) In the first and second embodiments described above, the substrate pieces S formed by bonding two substrates are set as targets for inversion. However, the substrate is not limited to this, and even a substrate small piece S composed of 1 substrate can be inverted by the inverting device 54.

(B) In the first embodiment described above, the first suction device 545b is provided in the first suction unit 545, and the second suction device 546b is provided in the second suction unit 546. That is, a suction device is provided for each suction portion. However, the present invention is not limited to this, and only one suction device shared by the first suction unit 545 and the second suction unit 546 may be provided.

Industrial applicability of the invention

The present invention can be widely applied to a device for inverting a substrate.

Claims (4)

1. A turnover device for turning over a substrate, comprising:

a shaft portion adjacent to a side surface of the substrate;

a first hand portion which is movably attached to the shaft portion in a longitudinal direction of the shaft portion, and which moves toward the substrate side to hold a first main surface of the substrate;

a second hand portion which is movably attached to the shaft portion in a longitudinal direction of the shaft portion, and which moves toward the substrate side to hold a second main surface of the substrate; and

and a turning section that turns the substrate by rotating the shaft section around an axis when the substrate is held by the first hand and the second hand.

2. The flipping device of claim 1,

the first hand portion has a first suction portion for vacuum-sucking and holding the first main surface,

the second hand portion has a second suction portion for vacuum-sucking and holding the second main surface.

3. The flipping mechanism of claim 2,

when the substrate is held by the first hand and the second hand, the first main surface is vacuum-sucked and held by the first suction unit, or the second main surface is vacuum-sucked and held by the second suction unit.

4. A substrate processing system is characterized by comprising:

a cutting device for cutting the substrate into small substrate pieces; and

a flip-over device for flipping over the substrate dice,

the turning device has:

a shaft portion adjacent to a side surface of the substrate chip;

a first hand portion which is movably attached to the shaft portion in a longitudinal direction of the shaft portion, and which moves toward the substrate side to hold a first main surface of the substrate;

a second hand portion which is movably attached to the shaft portion in a longitudinal direction of the shaft portion, and which moves toward the substrate side to hold a second main surface of the substrate; and

and a turning section that turns the substrate by rotating the shaft section around an axis when the substrate is held by the first hand and the second hand.

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