CN210388786U - Grinding and conveying system for circuit board packaging device detection sample wafer - Google Patents
Grinding and conveying system for circuit board packaging device detection sample wafer Download PDFInfo
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- CN210388786U CN210388786U CN201920896476.6U CN201920896476U CN210388786U CN 210388786 U CN210388786 U CN 210388786U CN 201920896476 U CN201920896476 U CN 201920896476U CN 210388786 U CN210388786 U CN 210388786U
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Abstract
The utility model discloses a circuit board encapsulation device detects grinding conveying system of appearance piece is applied to the ruby that has the grinding station and presses and grinds the machine, grind conveying system includes: the feeding device comprises a first conveyor belt for loading circuit board micro-slices; the discharging device comprises a second conveying belt for accommodating circuit board micro-slices; the conveying device comprises a conveying belt arranged between the first conveying belt and the second conveying belt, the conveying direction of the first conveying belt faces the conveying belt, and the conveying direction of the second conveying belt faces away from the conveying belt; the feeding and transferring device is used for transferring the circuit board micro-slices on the first conveying belt to the conveying belt; and be used for with through the finish grinding back circuit board microtome on the conveyer belt shifts to material device is changeed to the ejection of compact on the second conveyer belt, the utility model discloses can do benefit to circuit board microtome's quick transport, do benefit to and improve circuit board microtome's transport efficiency.
Description
Technical Field
The utility model relates to a circuit board microtome processing technology field especially relates to a circuit board encapsulation device detects grinding conveying system of sample wafer.
Background
In the circuit board processing technology, a process of performing a fine grinding treatment on a circuit board micro-slice by using a manual grinding process is usually involved to meet the processing requirement of the circuit board, but the labor cost is high, and the conveying efficiency of the circuit board micro-slice in the grinding process is low, which affects the grinding efficiency.
SUMMERY OF THE UTILITY MODEL
The utility model discloses to the problem that the circuit board microtome's that has now in the grinding process conveying efficiency is low, a circuit board packaging device detects grinding conveying system of sample wafer is provided.
The utility model discloses technical scheme as to above-mentioned technical problem and propose as follows:
the utility model provides a circuit board encapsulation device detects grinding conveying system of appearance piece is applied to the ruby that has the grinding station and presses and grinds the machine, grind conveying system includes:
the feeding device is used for inputting circuit board micro-slices to be ground and comprises a first conveyor belt used for loading the circuit board micro-slices;
the discharging device is used for outputting the ground circuit board micro-slices and comprises a second conveying belt used for accommodating the circuit board micro-slices;
the conveying device is used for conveying circuit board micro-slices and comprises a conveying belt arranged between a first conveying belt and a second conveying belt, the conveying direction of the first conveying belt faces the conveying belt, and the conveying direction of the second conveying belt faces away from the conveying belt;
the feeding and transferring device is used for transferring the circuit board micro-slices on the first conveying belt to the conveying belt; and
and the discharging and material transferring device is used for transferring the circuit board micro-slices on the conveying belt to the second conveying belt after the circuit board micro-slices are subjected to fine grinding.
According to the grinding and conveying system for the circuit board packaging device detection sample wafer, the conveying belt is arranged on one side of the conveying tail end of the first conveying belt and is positioned on one side of the conveying starting end of the second conveying belt.
According to the grinding and conveying system for the circuit board packaging device detection sample wafer, the first conveying belt and the second conveying belt are arranged in parallel, and the conveying belts are perpendicular to the first conveying belt and the second conveying belt.
According to the grinding and conveying system for detecting the sample wafers of the circuit board packaging device, the feeding device is arranged on one side, far away from the first conveying belt, of the conveying belt;
the feeding and transferring device comprises a first transferring and carrying part and a first transferring clamping jaw arranged on the first transferring and carrying part, and the first transferring and carrying part is used for driving the first transferring clamping jaw to reciprocate between the first conveying belt and the conveying belt.
According to the grinding and conveying system for detecting the sample wafer of the circuit board packaging device, the feeding and transferring device further comprises a feeding and transferring support frame, the first transferring carrying piece comprises a first transferring sliding table cylinder and a first transferring double-rod cylinder, the first transferring sliding table cylinder is arranged on the feeding and transferring support frame, and the fixed end of the first transferring double-rod cylinder is arranged on the movable block of the first transferring sliding table cylinder;
the first material transferring clamping jaw is arranged on the movable block of the first material transferring double-rod cylinder.
According to the grinding and conveying system for the detection sample wafers of the circuit board packaging device, the projection part of the movable path of the first material transferring double-rod cylinder and the projection part of the conveying path of the first conveying belt on the horizontal plane are overlapped.
According to the grinding and conveying system for the detection sample wafer of the circuit board packaging device, the discharging device is arranged on one side, away from the second conveying belt, of the conveying belt
The discharging and transferring device comprises a second transferring and carrying piece and a second transferring clamping jaw arranged on the second transferring and carrying piece, and the second transferring and carrying piece is used for driving the second transferring clamping jaw to reciprocate between the conveying belt and the second conveying belt.
According to the grinding and conveying system for detecting the sample wafer of the circuit board packaging device, the discharging and transferring device further comprises a discharging and transferring support frame, the second transferring and carrying piece comprises a second transferring sliding table cylinder and a second transferring double-rod cylinder, the second transferring sliding table cylinder is arranged on the discharging and transferring support frame, and the fixed end of the second transferring double-rod cylinder is arranged on the movable block of the second transferring sliding table cylinder;
the second material transferring clamping jaw is arranged on a movable block of the second material transferring double-rod cylinder.
According to the grinding and conveying system for the detection sample wafers of the circuit board packaging device, the projection part of the moving path of the second material transferring double-rod cylinder and the projection part of the conveying path of the second conveying belt on the horizontal plane are overlapped.
According to the grinding and conveying system for the circuit board packaging device detection sample wafers, a plurality of fixing pieces are arranged on the conveying belt and arranged at preset intervals, and grooves for placing circuit board micro-slices are formed in the fixing pieces.
The embodiment of the utility model provides a beneficial effect that technical scheme brought is:
the feeding and material transferring device is used for transferring circuit board micro-slices on the first conveying belt onto the conveying belt, and the discharging and material transferring device is used for transferring the circuit board micro-slices on the conveying belt after fine grinding onto the second conveying belt. From this, through material device, pan feeding commentaries on classics material device, conveyor, the ejection of compact of mutually supporting change material device and discharging device, can do benefit to circuit board microtome's quick transport, do benefit to and improve circuit board microtome's transport efficiency.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
Fig. 1 is an implementation schematic diagram of the grinding and milling machine of the intelligent fine grinding system including the circuit board packaging device of the present invention.
Fig. 2 is a schematic structural view of the grinding and polishing machine in fig. 1 in a top view.
Fig. 3 is a schematic perspective view of the feeding device in fig. 1.
Fig. 4 is a schematic perspective view of the material feeding and transferring device in fig. 1.
Fig. 5 is a side elevational view of the charge charging device of fig. 4.
Fig. 6 is a perspective view of the transfer device of fig. 1.
Fig. 7 is a perspective view of the turning device of fig. 1.
Fig. 8 is a schematic plan view of the first material taking device, the second material taking device and the third material taking device in fig. 1.
Fig. 9 is a side view of a second reclaimer assembly, shown in fig. 8.
Fig. 10 is a perspective view of the polishing apparatus of fig. 1.
Fig. 11 is a schematic perspective view of the discharging device in fig. 1.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, embodiments of the present invention will be described in further detail below with reference to the accompanying drawings.
The utility model provides a grinding and pressing grinder for grinding the designated slice surface of the circuit board micro-slice, and with reference to figures 1 to 11, the grinding and pressing grinder 3 can comprise a frame 31 and the devices and/or systems arranged on the frame 31, the frame 31 is provided with a feeding device 32, a conveying device 33, a grinding device 34, a first material taking device 35, a second material taking device 36, a third material taking device 37, a discharging device 38, a turnover device 39 and a control panel 311, wherein, the feeding device 32 comprises a first conveyor belt 322 for loading the circuit board micro-slices 4 and a feeding and material transferring device 323 for transferring the circuit board micro-slices 4 on the first conveyor belt 322 to the conveying device 22, specifically, the input device 33 includes a conveyor belt 331 for conveying the circuit board micro-slices 4, and the feeding and transferring device 323 is used for transferring the circuit board micro-slices 4 onto the conveyor belt 331. Similarly, the discharging device 38 includes a second conveyor 383 for loading the circuit board micro-cut sheets 4 and a discharging and transferring device 382 for transferring the circuit board micro-cut sheets 4 on the conveyor 331 after being finely ground onto the second conveyor 383. The grinding and polishing machine can also be called grinding and polishing machine, and is used for polishing the specified slice surface of the circuit board micro-slice.
The conveyor belt 331 of the conveyor device 33 includes a conveyance start end and a conveyance end, and a first processing station 332 and a second processing station 333 are provided in this order between the conveyance start end and the conveyance end. In this embodiment, the conveyer belt 331 drives the circuit board micro-section 4 to move in the length direction. More specifically, the transfer direction of the first conveyor belt 322 faces the conveyor belt 331, and the transfer direction of the first conveyor belt 322 may be perpendicular to the transfer direction of the conveyor belt 331. Referring to fig. 6, the conveying device 33 may further include a conveying rail 334 for guiding the conveying belt 331 to move in a specific direction, and a conveying driving motor 337 for driving the conveying belt 331 to rotate. A plurality of fixing pieces 335 are further arranged on the conveying belt 331, the fixing pieces 335 are uniformly distributed according to a preset interval, and the fixing pieces 335 comprise grooves for accommodating the circuit board micro-section 4.
Referring to fig. 4 and 5, in combination with fig. 1 and 2, the feeding device 32 may further include a feeding and transferring device 323 for transferring the circuit board micro-slices 4 on the first conveyor belt 322 onto the conveyor belt 331, the feeding and transferring device 323 may further include a feeding and transferring support frame 3231, the first transferring carrier 3232 is disposed on the feeding and transferring support frame 3231, and may specifically include a first transferring slide cylinder 3233 and a first transferring double-rod cylinder 3234, a fixed end of the first transferring double-rod cylinder 3234 is disposed on a movable block of the first transferring slide cylinder 3233, and the first transferring gripper 3235 is disposed on a movable block of the first transferring double-rod cylinder 3234. Here, the moving path of the first transfer double rod cylinder 3234 overlaps with a projection of the transfer path of the first transfer belt 322 on a horizontal plane.
The feeding and transferring device 323 is arranged at the conveying beginning end of the conveying belt 331. The feeding and transferring device 323 comprises a first transferring carrier 3232 and a first transferring gripper 3235 arranged on the first transferring carrier 3232, and the first transferring carrier 3232 is configured to drive the first transferring gripper 3235 to reciprocate between the first conveyor 322 and the conveyor 331. Here, the feeding and transferring device 323 may further include a sensor 3236 for acquiring a height position of the first transferring jaw 3235.
Further, the discharging device 38 may also include a discharging material transferring device 383 for transferring the circuit board micro-chips 4 on the conveyor belt 331 onto the second conveyor belt 382, the discharging material transferring device 383 is similar to the feeding material transferring device 323 in specific structure except that it is disposed at the conveying end of the conveyor belt 331, and the discharging material transferring device 383 includes a second material transferring carrier (not shown in the figure, which is the same as the first material transferring carrier 3232 in fig. 4) and a second material transferring jaw (not shown in the figure, which is the same as the first material transferring jaw in fig. 4) disposed on the second material transferring carrier, and the second material transferring carrier is configured to drive the second material transferring jaw to reciprocate between the conveyor belt and the second conveyor belt.
Further, the discharging and transferring device 383 can also include a discharging and transferring support frame (the structure of which is the same as that of 3231 in fig. 4), the second transferring and carrying part can include a second transferring sliding table cylinder and two transferring double-rod cylinders, the second transferring sliding table cylinder is arranged on the discharging and transferring support frame, and the fixed end of the second transferring double-rod cylinder is arranged on the movable block of the second transferring sliding table cylinder; the second material transferring clamping jaw is arranged on a movable block of the second material transferring double-rod cylinder. It should be understood that the structure of the discharging transfer device 383 is similar to that of the feeding transfer device 323, and therefore, the description thereof will not be repeated here.
The grinding device 34 is used for providing a grinding station, which may include a rough grinding station 341 corresponding to the first processing station 332, a fine grinding station 342 corresponding to the second processing station 333, the grinding device 34 includes a first grinding surface 3411 providing the rough grinding station 341 and a second grinding surface 3421 providing the fine grinding station 342.
The first material taking device 35 is used for taking and placing the circuit board micro-cut pieces 4 at the position of the first processing station 332, and includes a first carrier 352 and a first picker 354 fixed on the first carrier 352, the first picker 354 is used for taking and placing the circuit board micro-cut pieces 4 and driving a preset piece surface of the circuit board micro-cut pieces 4 to contact with the surface of the first grinding surface 3411 during rough grinding, and the first carrier 352 is used for conveying the first picker 354 to reciprocate between the rough grinding station 341 and the first processing station 332. Specifically, the first carrier 352 may include a first lead screw and a first telescopic cylinder 353 disposed at a movable end of the first lead screw, and the first pickup 354 is disposed at a lifting movable end of the first telescopic cylinder 353.
Specifically, referring to fig. 8 and 9, the first material taking device 35 further includes a first support frame 351, and the second material taking device 36 and the third material taking device 37 can be supported by the first support frame 351. As seen from the axial direction in which the first carrier 352 drives the first pickup 354 to move, the first carrier 352 includes a first Y-axis module and a first Z-axis module disposed on the first Y-axis module, the first Y-axis module is configured to drive the first Z-axis module to move back and forth in the width direction, specifically, the first Y-axis module may be the aforementioned first lead screw, the first pickup 354 is disposed on the first Z-axis module, and the first Z-axis module is configured to drive the first pickup 354 to move back and forth in the height direction. Specifically, the first Z-axis module may be the first telescopic cylinder 353. Here, the movement path of the first Y-axis module driving the first Z-axis module to move intersects with the projection of the conveying path of the conveying belt 331 on the horizontal plane, so that the first material taking device 35 can pick up the circuit board micro-cut sheet 4 on the conveying belt 331.
Similarly, when viewed from the axial direction in which the second carrier 361 drives the second pickup 363 to move, the second carrier 361 includes a second Y-axis module and a second Z-axis module disposed on the second Y-axis module, the second Y-axis module is configured to drive the second Z-axis module to move back and forth in the width direction, specifically, the second Y-axis module may be a second lead screw cylinder, the second pickup 363 is disposed on the second Z-axis module, and the second Z-axis module is configured to drive the second pickup 363 to move back and forth in the height direction. Specifically, the second Z-axis module may be the second telescopic cylinder 362. Here, the movement path of the second Y-axis module driving the second Z-axis module to move intersects the projection of the conveying path of the conveying belt 331 on the horizontal plane, so that the second material taking device 36 can pick up the circuit board micro-cut sheet 4 on the conveying belt 331. It should be understood that the length direction, the width direction and the height direction are described based on the direction of the grinding mill placed in an ideal horizontal state, and the length and the height of the grinding mill can be observed from the front view of the grinding mill.
Under the condition that the first machining position 332 is located between the third machining position 334 and the second machining position 333, the grinding machine 3 further comprises the third material taking device 37, the grinding station further comprises an additional rough grinding station 343 corresponding to the third machining position 334, the grinding device 34 further comprises a third grinding surface 3431 providing the additional rough grinding station 343, and the additional rough grinding station 343 is used for rough grinding the back sliced surface of the circuit board micro-sliced sheet 4, wherein the back sliced surface is opposite to the preset sliced surface. It can be understood that, compared with the foregoing structure, only the second grinding is performed on the preset slice surface of the circuit board micro-slice 4, and the third material taking device 37 and the third grinding surface 3431 are added, so that the back slice surface of the circuit board micro-slice 4 can be ground, and the labor cost for manually grinding the back slice of the circuit board micro-slice 4 in the prior art is saved.
Here, the third material taking device 37 is used for taking and placing the circuit board micro-slice 4 at the position of the third processing station 334, and similarly to the structure of the first material taking device 35 and the second material taking device 36, the third material taking device 37 includes a third carrier 371 and a third picker 373 fixed on the third carrier 371, the third picker 373 is used for taking and placing the circuit board micro-slice 4, and drives the back slice surface of the circuit board micro-slice 4 to contact the surface of the third grinding surface 3431 during rough grinding; the third carrier 371 is used to transport the third picker 373 to and fro between the additional rough grinding station 343 and the third processing station. The third material taking device 37 is the same as the material taking actions and procedures of the first material taking device 35 and the second material taking device 36, and therefore, the description thereof is omitted here to avoid redundancy.
It can be understood that the surface to be ground of the circuit board micro-segment 4 picked by the third picking device 37 is different from the predetermined segment surface of the circuit board micro-segment 4, so that the circuit board micro-segment 4 on the conveyor belt 331 needs to be turned over before the circuit board micro-segment 4 is transported to the first processing station 332 by the conveyor belt 331, so that the predetermined segment surface of the circuit board micro-segment 4 picked by the first picking device 35 faces the first grinding surface 3411.
It is understood that the feeding device 32, the conveying device 33 and the discharging device 38 can form a grinding conveying system, and of course, the feeding material transferring device 323 and the discharging material transferring device 383 can be further included to form a grinding conveying system. The feeding device 32 can be used for inputting circuit board micro-slices 4 to be ground, and comprises a first conveyor belt 322 for loading the circuit board micro-slices 4; the discharging device 38 can be used for outputting the ground circuit board micro-slices, and comprises a second conveyor belt 382 for accommodating the circuit board micro-slices; the conveying belt 331 of the conveying device 33 is disposed between the first conveying belt 322 and the second conveying belt 382, the conveying direction of the first conveying belt 322 faces the conveying belt 331, and the conveying direction of the second conveying belt 382 faces away from the conveying belt 331.
The feeding and transferring device 323 is configured to transfer the circuit board micro-slices on the first conveyor belt 322 to the conveyor belt 331, and the discharging and transferring device 383 is configured to transfer the circuit board micro-slices on the conveyor belt 331 after being finely ground to the second conveyor belt 382. Therefore, the feeding device 32, the feeding material transferring device 323, the conveying device 33, the discharging material transferring device 383 and the discharging device 38 which are matched with each other can be used for facilitating quick conveying of circuit board micro-slices and improving conveying efficiency of the circuit board micro-slices.
Here, the conveyor belt 331 is disposed at a conveying end side of the first conveyor belt 322 and at a conveying start side of the second conveyor belt 382, and more specifically, the first conveyor belt and the second conveyor belt are disposed in parallel, and the conveyor belt 331 is perpendicular to both the first conveyor belt 322 and the second conveyor belt 382.
Referring to fig. 7, and referring to fig. 1, fig. 2 and fig. 6, the flipping unit 39 is used for flipping and placing the circuit board micro-slices 4, and may include a fourth picker 392 and a flipping structure 391 for flipping the fourth picker 392, where the fourth picker 392 intersects with the horizontal projection of the conveying path of the conveying belt 331, so that the fourth picker 392 may pick up the circuit board micro-slices on the conveying belt 331. The flipping structure 391 may include a displacement driver 393 for bringing the fourth picker 392 close to the circuit board micro-slices, and a rotation driver 394 disposed on an active end of the displacement driver 393, the fourth picker being disposed on a rotationally active end of the rotation driver 394.
The fourth picker 392 is configured to pick up the roughly ground circuit board micro-slices 4 placed on the third processing station 334, and place the circuit board micro-slices 4 on the third processing station 334 after the circuit board micro-slices 4 are flipped under the driving action of the flipping structure 391. Here, the displacement driver 393 is a lifting driver, and the rotation driver 394 is disposed on a lifting movable end of the lifting driver, where the lifting driver may be a sliding table cylinder or a lead screw. The fourth picker 392 includes a fourth jaw 3921 and a fourth jaw driver 3922 for driving the jaws to pick and place. Fourth clamping jaw 3921 includes first clamping part and the second clamping part that is used for forming the centre gripping complex, first clamping part with all be equipped with the concave part that matches with circuit board microtome section edge shape on the second clamping part.
It can be understood that the turning device 39 can be disposed at any position between the third processing station 334 and the second processing station 332 to turn the circuit board micro-section 4 conveyed by the conveyor 331 through the back section side of the rough-ground circuit board micro-section 4, thereby realizing the automatic double-side grinding processing of the circuit board micro-section 4, which is beneficial to improving the grinding efficiency.
Referring to fig. 10, the grinding device 34 includes three rough grinding stations 341, finish grinding stations 342, and additional rough grinding stations 343 corresponding to the first material-taking device 35, the second material-taking device 36, and the third material-taking device 37, respectively, and when grinding is performed, the grinding driver can be used to drive the first grinding surface 3411, the second grinding surface 3421, and the third grinding surface 3431 to rotate, so as to grind the circuit board micro-chip 4, thereby achieving the grinding function. In the grinding process, the liquid injected by the injector 3412 can be used for grinding, so as to achieve the corresponding grinding purpose. Here, the first abrasive surface 3411 may be provided by a first abrasive disk (not shown, but having a disk-like structure), the second abrasive surface 3421 may be provided by a second abrasive disk, and the third abrasive surface 3431 may be provided by a third abrasive disk.
Referring to fig. 11 in conjunction with the previous figures, the discharging device 38 includes a second conveyor belt 382 for loading the circuit board micro-cut sheets 4, the conveying direction of the second conveyor belt 382 is away from the conveyor belt 331, and the conveying direction of the second conveyor belt 382 is perpendicular to the conveying direction of the conveyor belt 311. Here, the second conveyor belt 382 is driven by an outfeed drive 385, and further, the outfeed device 38 further includes an outfeed support 384, the outfeed support 384 being disposed below the second conveyor belt 382, and the outfeed drive 385 being disposed on the outfeed support.
It can be understood that, on the basis of the above description, the conveying belt 311 is perpendicular to the first conveying belt 322 and the second conveying belt 382, so that the grinding device 34 and other devices can be disposed in the space between the first conveying belt 322 and the second conveying belt 382, so as to improve the integration of the grinding and polishing machine 3, and reduce the machine volume of the grinding and polishing machine 3.
The above description is only for the preferred embodiment of the present invention, and is not intended to limit the present invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included within the protection scope of the present invention.
Claims (10)
1. The utility model provides a circuit board packaging device detects grinding conveying system of sample wafer, is applied to and grinds the machine to the ruby pressure that has the grinding station on, its characterized in that, grinding conveying system includes:
the feeding device is used for inputting circuit board micro-slices to be ground and comprises a first conveyor belt used for loading the circuit board micro-slices;
the discharging device is used for outputting the ground circuit board micro-slices and comprises a second conveying belt used for accommodating the circuit board micro-slices;
the conveying device is used for conveying circuit board micro-slices and comprises a conveying belt arranged between a first conveying belt and a second conveying belt, the conveying direction of the first conveying belt faces the conveying belt, and the conveying direction of the second conveying belt faces away from the conveying belt;
the feeding and transferring device is used for transferring the circuit board micro-slices on the first conveying belt to the conveying belt; and
and the discharging and material transferring device is used for transferring the circuit board micro-slices on the conveying belt to the second conveying belt after the circuit board micro-slices are subjected to fine grinding.
2. The system of claim 1, wherein the conveyor belt is disposed at a side of a transfer end of the first conveyor belt and at a side of a transfer start of the second conveyor belt.
3. The system of claim 2, wherein the first conveyor belt is parallel to the second conveyor belt, and the conveyor belts are perpendicular to the first conveyor belt and the second conveyor belt.
4. The system of claim 2, wherein the feeding device is disposed on a side of the conveyor belt away from the first conveyor belt;
the feeding and transferring device comprises a first transferring and carrying part and a first transferring clamping jaw arranged on the first transferring and carrying part, and the first transferring and carrying part is used for driving the first transferring clamping jaw to reciprocate between the first conveying belt and the conveying belt.
5. The grinding and conveying system for the detection sample wafers of the circuit board packaging device as claimed in claim 4, wherein the feeding and transferring device further comprises a feeding and transferring support frame, the first transferring carrying member comprises a first transferring sliding table cylinder and a first transferring double-rod cylinder, the first transferring sliding table cylinder is arranged on the feeding and transferring support frame, and a fixed end of the first transferring double-rod cylinder is arranged on a movable block of the first transferring sliding table cylinder;
the first material transferring clamping jaw is arranged on the movable block of the first material transferring double-rod cylinder.
6. The system for lapping and conveying circuit board packaging device test coupons according to claim 5, wherein the active path of said first transfer dual rod cylinder overlaps the horizontal projection of the transport path of said first conveyor.
7. The system for grinding and conveying the circuit board packaging device detection sample wafer as claimed in claim 1, wherein the discharging device is disposed on a side of the conveyor belt away from the second conveyor belt;
the discharging and transferring device comprises a second transferring and carrying piece and a second transferring clamping jaw arranged on the second transferring and carrying piece, and the second transferring and carrying piece is used for driving the second transferring clamping jaw to reciprocate between the conveying belt and the second conveying belt.
8. The system for grinding and conveying the detection sample wafers of the circuit board packaging device according to claim 7, wherein the discharging and transferring device further comprises a discharging and transferring support frame, the second transferring and carrying piece comprises a second transferring sliding table cylinder and a second transferring double-rod cylinder, the second transferring sliding table cylinder is arranged on the discharging and transferring support frame, and a fixed end of the second transferring double-rod cylinder is arranged on a movable block of the second transferring sliding table cylinder;
the second material transferring clamping jaw is arranged on a movable block of the second material transferring double-rod cylinder.
9. The system of claim 8, wherein the moving path of the second transferring dual-rod cylinder overlaps the projection of the second conveyor belt on the horizontal plane.
10. The system for grinding and conveying the detection sample wafer of the circuit board packaging device according to any one of claims 1 to 9, wherein a plurality of fixing members are arranged on the conveying belt, the fixing members are arranged at preset intervals, and grooves for placing the circuit board micro-slices are arranged on the fixing members.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920444967 | 2019-04-03 | ||
| CN2019204449677 | 2019-04-03 |
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| CN210388786U true CN210388786U (en) | 2020-04-24 |
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| CN201920896476.6U Active CN210388786U (en) | 2019-04-03 | 2019-06-14 | Grinding and conveying system for circuit board packaging device detection sample wafer |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110238750A (en) * | 2019-04-03 | 2019-09-17 | 墨芯科技(深圳)有限公司 | The Intelligent fine grinding system and method for circuit board package device |
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2019
- 2019-06-14 CN CN201920896476.6U patent/CN210388786U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110238750A (en) * | 2019-04-03 | 2019-09-17 | 墨芯科技(深圳)有限公司 | The Intelligent fine grinding system and method for circuit board package device |
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