CN112437724A - 层叠体 - Google Patents
层叠体 Download PDFInfo
- Publication number
- CN112437724A CN112437724A CN201980048410.4A CN201980048410A CN112437724A CN 112437724 A CN112437724 A CN 112437724A CN 201980048410 A CN201980048410 A CN 201980048410A CN 112437724 A CN112437724 A CN 112437724A
- Authority
- CN
- China
- Prior art keywords
- plating
- layer
- catalyst
- resin
- laminate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 238000007747 plating Methods 0.000 claims abstract description 201
- 239000003054 catalyst Substances 0.000 claims abstract description 103
- 230000015572 biosynthetic process Effects 0.000 claims abstract description 58
- 229920005992 thermoplastic resin Polymers 0.000 claims abstract description 40
- 239000002270 dispersing agent Substances 0.000 claims abstract description 34
- 239000000758 substrate Substances 0.000 claims abstract description 33
- 239000000463 material Substances 0.000 claims abstract description 28
- 229920005989 resin Polymers 0.000 claims description 59
- 239000011347 resin Substances 0.000 claims description 59
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 55
- 229910052751 metal Inorganic materials 0.000 claims description 36
- 239000002184 metal Substances 0.000 claims description 36
- 239000009719 polyimide resin Substances 0.000 claims description 31
- 229910052763 palladium Inorganic materials 0.000 claims description 19
- 229920001721 polyimide Polymers 0.000 claims description 18
- 229920001187 thermosetting polymer Polymers 0.000 claims description 15
- 229920006259 thermoplastic polyimide Polymers 0.000 claims description 13
- 150000001875 compounds Chemical class 0.000 claims description 9
- 229910052709 silver Inorganic materials 0.000 claims description 6
- 239000004332 silver Substances 0.000 claims description 6
- 125000004429 atom Chemical group 0.000 claims description 3
- 125000000524 functional group Chemical group 0.000 claims description 3
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- 125000004433 nitrogen atom Chemical group N* 0.000 claims description 3
- 239000012466 permeate Substances 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 208
- 239000000243 solution Substances 0.000 description 25
- 229910000510 noble metal Inorganic materials 0.000 description 22
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 21
- -1 polyethylene terephthalate Polymers 0.000 description 20
- 238000000034 method Methods 0.000 description 16
- 229920005575 poly(amic acid) Polymers 0.000 description 16
- 229910000679 solder Inorganic materials 0.000 description 16
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 13
- 239000010949 copper Substances 0.000 description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 11
- 229910052802 copper Inorganic materials 0.000 description 11
- 150000004985 diamines Chemical class 0.000 description 11
- 238000003786 synthesis reaction Methods 0.000 description 11
- 239000002253 acid Substances 0.000 description 10
- 238000000576 coating method Methods 0.000 description 10
- 239000002994 raw material Substances 0.000 description 10
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 9
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 9
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 9
- 239000003960 organic solvent Substances 0.000 description 9
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 8
- 239000011575 calcium Substances 0.000 description 8
- 238000011156 evaluation Methods 0.000 description 8
- 239000000047 product Substances 0.000 description 8
- 238000001035 drying Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 7
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 6
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 238000004833 X-ray photoelectron spectroscopy Methods 0.000 description 6
- WKDNYTOXBCRNPV-UHFFFAOYSA-N bpda Chemical compound C1=C2C(=O)OC(=O)C2=CC(C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 WKDNYTOXBCRNPV-UHFFFAOYSA-N 0.000 description 6
- 238000007772 electroless plating Methods 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- 239000002243 precursor Substances 0.000 description 6
- 230000003014 reinforcing effect Effects 0.000 description 6
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 6
- XUSNPFGLKGCWGN-UHFFFAOYSA-N 3-[4-(3-aminopropyl)piperazin-1-yl]propan-1-amine Chemical compound NCCCN1CCN(CCCN)CC1 XUSNPFGLKGCWGN-UHFFFAOYSA-N 0.000 description 5
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
- 230000001747 exhibiting effect Effects 0.000 description 5
- 150000002736 metal compounds Chemical class 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- LVEYOSJUKRVCCF-UHFFFAOYSA-N 1,3-bis(diphenylphosphino)propane Chemical compound C=1C=CC=CC=1P(C=1C=CC=CC=1)CCCP(C=1C=CC=CC=1)C1=CC=CC=C1 LVEYOSJUKRVCCF-UHFFFAOYSA-N 0.000 description 4
- 229920000106 Liquid crystal polymer Polymers 0.000 description 4
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 4
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 4
- 239000003638 chemical reducing agent Substances 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 238000009713 electroplating Methods 0.000 description 4
- 230000007774 longterm Effects 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- WMFOQBRAJBCJND-UHFFFAOYSA-M Lithium hydroxide Chemical compound [Li+].[OH-] WMFOQBRAJBCJND-UHFFFAOYSA-M 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-O ammonium group Chemical group [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 3
- 150000008064 anhydrides Chemical class 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 238000007865 diluting Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000011737 fluorine Substances 0.000 description 3
- 229910052731 fluorine Inorganic materials 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 239000002923 metal particle Substances 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- 239000011342 resin composition Substances 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- VLDPXPPHXDGHEW-UHFFFAOYSA-N 1-chloro-2-dichlorophosphoryloxybenzene Chemical compound ClC1=CC=CC=C1OP(Cl)(Cl)=O VLDPXPPHXDGHEW-UHFFFAOYSA-N 0.000 description 2
- UNIBAJHMJGXVHL-UHFFFAOYSA-N 3-phenylbenzene-1,2,4,5-tetracarboxylic acid Chemical compound OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C(C=2C=CC=CC=2)=C1C(O)=O UNIBAJHMJGXVHL-UHFFFAOYSA-N 0.000 description 2
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 2
- WUPRYUDHUFLKFL-UHFFFAOYSA-N 4-[3-(4-aminophenoxy)phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC(OC=2C=CC(N)=CC=2)=C1 WUPRYUDHUFLKFL-UHFFFAOYSA-N 0.000 description 2
- VQVIHDPBMFABCQ-UHFFFAOYSA-N 5-(1,3-dioxo-2-benzofuran-5-carbonyl)-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)=O)=C1 VQVIHDPBMFABCQ-UHFFFAOYSA-N 0.000 description 2
- IKHGUXGNUITLKF-UHFFFAOYSA-N Acetaldehyde Chemical compound CC=O IKHGUXGNUITLKF-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- BAVYZALUXZFZLV-UHFFFAOYSA-N Methylamine Chemical compound NC BAVYZALUXZFZLV-UHFFFAOYSA-N 0.000 description 2
- KWYHDKDOAIKMQN-UHFFFAOYSA-N N,N,N',N'-tetramethylethylenediamine Chemical compound CN(C)CCN(C)C KWYHDKDOAIKMQN-UHFFFAOYSA-N 0.000 description 2
- JGFZNNIVVJXRND-UHFFFAOYSA-N N,N-Diisopropylethylamine (DIPEA) Chemical compound CCN(C(C)C)C(C)C JGFZNNIVVJXRND-UHFFFAOYSA-N 0.000 description 2
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- AMQJEAYHLZJPGS-UHFFFAOYSA-N N-Pentanol Chemical compound CCCCCO AMQJEAYHLZJPGS-UHFFFAOYSA-N 0.000 description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 2
- 150000005215 alkyl ethers Chemical class 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical class [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N argon Substances [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- WRPSKOREVDHZHP-UHFFFAOYSA-N benzene-1,4-diamine Chemical compound NC1=CC=C(N)C=C1.NC1=CC=C(N)C=C1 WRPSKOREVDHZHP-UHFFFAOYSA-N 0.000 description 2
- MUALRAIOVNYAIW-UHFFFAOYSA-N binap Chemical group C1=CC=CC=C1P(C=1C(=C2C=CC=CC2=CC=1)C=1C2=CC=CC=C2C=CC=1P(C=1C=CC=CC=1)C=1C=CC=CC=1)C1=CC=CC=C1 MUALRAIOVNYAIW-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000002296 dynamic light scattering Methods 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 150000002170 ethers Chemical class 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- 238000000691 measurement method Methods 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- TZIHFWKZFHZASV-UHFFFAOYSA-N methyl formate Chemical compound COC=O TZIHFWKZFHZASV-UHFFFAOYSA-N 0.000 description 2
- KQSABULTKYLFEV-UHFFFAOYSA-N naphthalene-1,5-diamine Chemical compound C1=CC=C2C(N)=CC=CC2=C1N KQSABULTKYLFEV-UHFFFAOYSA-N 0.000 description 2
- DOBFTMLCEYUAQC-UHFFFAOYSA-N naphthalene-2,3,6,7-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C=C2C=C(C(O)=O)C(C(=O)O)=CC2=C1 DOBFTMLCEYUAQC-UHFFFAOYSA-N 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- NDVLTYZPCACLMA-UHFFFAOYSA-N silver oxide Chemical compound [O-2].[Ag+].[Ag+] NDVLTYZPCACLMA-UHFFFAOYSA-N 0.000 description 2
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 description 2
- 150000005846 sugar alcohols Polymers 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 2
- GETQZCLCWQTVFV-UHFFFAOYSA-N trimethylamine Chemical compound CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- KCTAHLRCZMOTKM-UHFFFAOYSA-N tripropylphosphane Chemical compound CCCP(CCC)CCC KCTAHLRCZMOTKM-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 description 1
- KZPYGQFFRCFCPP-UHFFFAOYSA-N 1,1'-bis(diphenylphosphino)ferrocene Chemical compound [Fe+2].C1=CC=C[C-]1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=C[C-]1P(C=1C=CC=CC=1)C1=CC=CC=C1 KZPYGQFFRCFCPP-UHFFFAOYSA-N 0.000 description 1
- QFMZQPDHXULLKC-UHFFFAOYSA-N 1,2-bis(diphenylphosphino)ethane Chemical compound C=1C=CC=CC=1P(C=1C=CC=CC=1)CCP(C=1C=CC=CC=1)C1=CC=CC=C1 QFMZQPDHXULLKC-UHFFFAOYSA-N 0.000 description 1
- GEYOCULIXLDCMW-UHFFFAOYSA-N 1,2-phenylenediamine Chemical compound NC1=CC=CC=C1N GEYOCULIXLDCMW-UHFFFAOYSA-N 0.000 description 1
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- PZHIWRCQKBBTOW-UHFFFAOYSA-N 1-ethoxybutane Chemical compound CCCCOCC PZHIWRCQKBBTOW-UHFFFAOYSA-N 0.000 description 1
- UHOPWFKONJYLCF-UHFFFAOYSA-N 2-(2-sulfanylethyl)isoindole-1,3-dione Chemical compound C1=CC=C2C(=O)N(CCS)C(=O)C2=C1 UHOPWFKONJYLCF-UHFFFAOYSA-N 0.000 description 1
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- QCDWFXQBSFUVSP-UHFFFAOYSA-N 2-phenoxyethanol Chemical compound OCCOC1=CC=CC=C1 QCDWFXQBSFUVSP-UHFFFAOYSA-N 0.000 description 1
- NUIURNJTPRWVAP-UHFFFAOYSA-N 3,3'-Dimethylbenzidine Chemical compound C1=C(N)C(C)=CC(C=2C=C(C)C(N)=CC=2)=C1 NUIURNJTPRWVAP-UHFFFAOYSA-N 0.000 description 1
- NFSQGQXKVFGKSO-UHFFFAOYSA-N 3-(2-phenylphenoxy)aniline Chemical group NC1=CC=CC(OC=2C(=CC=CC=2)C=2C=CC=CC=2)=C1 NFSQGQXKVFGKSO-UHFFFAOYSA-N 0.000 description 1
- ZBMISJGHVWNWTE-UHFFFAOYSA-N 3-(4-aminophenoxy)aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC(N)=C1 ZBMISJGHVWNWTE-UHFFFAOYSA-N 0.000 description 1
- TYKLCAKICHXQNE-UHFFFAOYSA-N 3-[(2,3-dicarboxyphenyl)methyl]phthalic acid Chemical compound OC(=O)C1=CC=CC(CC=2C(=C(C(O)=O)C=CC=2)C(O)=O)=C1C(O)=O TYKLCAKICHXQNE-UHFFFAOYSA-N 0.000 description 1
- DKKYOQYISDAQER-UHFFFAOYSA-N 3-[3-(3-aminophenoxy)phenoxy]aniline Chemical compound NC1=CC=CC(OC=2C=C(OC=3C=C(N)C=CC=3)C=CC=2)=C1 DKKYOQYISDAQER-UHFFFAOYSA-N 0.000 description 1
- WCXGOVYROJJXHA-UHFFFAOYSA-N 3-[4-[4-(3-aminophenoxy)phenyl]sulfonylphenoxy]aniline Chemical compound NC1=CC=CC(OC=2C=CC(=CC=2)S(=O)(=O)C=2C=CC(OC=3C=C(N)C=CC=3)=CC=2)=C1 WCXGOVYROJJXHA-UHFFFAOYSA-N 0.000 description 1
- NMGBFVPQUCLJGM-UHFFFAOYSA-N 3-ethylphthalic acid Chemical compound CCC1=CC=CC(C(O)=O)=C1C(O)=O NMGBFVPQUCLJGM-UHFFFAOYSA-N 0.000 description 1
- ZWQOXRDNGHWDBS-UHFFFAOYSA-N 4-(2-phenylphenoxy)aniline Chemical group C1=CC(N)=CC=C1OC1=CC=CC=C1C1=CC=CC=C1 ZWQOXRDNGHWDBS-UHFFFAOYSA-N 0.000 description 1
- LFBALUPVVFCEPA-UHFFFAOYSA-N 4-(3,4-dicarboxyphenyl)phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1C1=CC=C(C(O)=O)C(C(O)=O)=C1 LFBALUPVVFCEPA-UHFFFAOYSA-N 0.000 description 1
- AVCOFPOLGHKJQB-UHFFFAOYSA-N 4-(3,4-dicarboxyphenyl)sulfonylphthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1S(=O)(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 AVCOFPOLGHKJQB-UHFFFAOYSA-N 0.000 description 1
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 1
- IJJNNSUCZDJDLP-UHFFFAOYSA-N 4-[1-(3,4-dicarboxyphenyl)ethyl]phthalic acid Chemical compound C=1C=C(C(O)=O)C(C(O)=O)=CC=1C(C)C1=CC=C(C(O)=O)C(C(O)=O)=C1 IJJNNSUCZDJDLP-UHFFFAOYSA-N 0.000 description 1
- GEYAGBVEAJGCFB-UHFFFAOYSA-N 4-[2-(3,4-dicarboxyphenyl)propan-2-yl]phthalic acid Chemical compound C=1C=C(C(O)=O)C(C(O)=O)=CC=1C(C)(C)C1=CC=C(C(O)=O)C(C(O)=O)=C1 GEYAGBVEAJGCFB-UHFFFAOYSA-N 0.000 description 1
- JCRRFJIVUPSNTA-UHFFFAOYSA-N 4-[4-(4-aminophenoxy)phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC(C=C1)=CC=C1OC1=CC=C(N)C=C1 JCRRFJIVUPSNTA-UHFFFAOYSA-N 0.000 description 1
- UTDAGHZGKXPRQI-UHFFFAOYSA-N 4-[4-[4-(4-aminophenoxy)phenyl]sulfonylphenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=C(S(=O)(=O)C=2C=CC(OC=3C=CC(N)=CC=3)=CC=2)C=C1 UTDAGHZGKXPRQI-UHFFFAOYSA-N 0.000 description 1
- LVRNKEBRXQHJIN-UHFFFAOYSA-N 4-ethylphthalic acid Chemical compound CCC1=CC=C(C(O)=O)C(C(O)=O)=C1 LVRNKEBRXQHJIN-UHFFFAOYSA-N 0.000 description 1
- AQVOMFPTJXMAQE-UHFFFAOYSA-N 4-propylphthalic acid Chemical compound CCCC1=CC=C(C(O)=O)C(C(O)=O)=C1 AQVOMFPTJXMAQE-UHFFFAOYSA-N 0.000 description 1
- QQGYZOYWNCKGEK-UHFFFAOYSA-N 5-[(1,3-dioxo-2-benzofuran-5-yl)oxy]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(OC=2C=C3C(=O)OC(C3=CC=2)=O)=C1 QQGYZOYWNCKGEK-UHFFFAOYSA-N 0.000 description 1
- CIWBSHSKHKDKBQ-JLAZNSOCSA-N Ascorbic acid Natural products OC[C@H](O)[C@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-JLAZNSOCSA-N 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- 229910001124 EN series Inorganic materials 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 229910003767 Gold(III) bromide Inorganic materials 0.000 description 1
- 229910003803 Gold(III) chloride Inorganic materials 0.000 description 1
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- 229920010524 Syndiotactic polystyrene Polymers 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- 229920001646 UPILEX Polymers 0.000 description 1
- ULGYAEQHFNJYML-UHFFFAOYSA-N [AlH3].[Ca] Chemical compound [AlH3].[Ca] ULGYAEQHFNJYML-UHFFFAOYSA-N 0.000 description 1
- KXKVLQRXCPHEJC-UHFFFAOYSA-N acetic acid trimethyl ester Natural products COC(C)=O KXKVLQRXCPHEJC-UHFFFAOYSA-N 0.000 description 1
- TUVYSBJZBYRDHP-UHFFFAOYSA-N acetic acid;methoxymethane Chemical compound COC.CC(O)=O TUVYSBJZBYRDHP-UHFFFAOYSA-N 0.000 description 1
- 238000007754 air knife coating Methods 0.000 description 1
- 150000001299 aldehydes Chemical class 0.000 description 1
- 150000001334 alicyclic compounds Chemical class 0.000 description 1
- 150000007824 aliphatic compounds Chemical class 0.000 description 1
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 description 1
- ZIXLDMFVRPABBX-UHFFFAOYSA-N alpha-methylcyclopentanone Natural products CC1CCCC1=O ZIXLDMFVRPABBX-UHFFFAOYSA-N 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 229940045985 antineoplastic platinum compound Drugs 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 150000001491 aromatic compounds Chemical class 0.000 description 1
- 150000004984 aromatic diamines Chemical class 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 150000008378 aryl ethers Chemical class 0.000 description 1
- 239000011668 ascorbic acid Substances 0.000 description 1
- 235000010323 ascorbic acid Nutrition 0.000 description 1
- 229960005070 ascorbic acid Drugs 0.000 description 1
- 238000007611 bar coating method Methods 0.000 description 1
- HFACYLZERDEVSX-UHFFFAOYSA-N benzidine Chemical compound C1=CC(N)=CC=C1C1=CC=C(N)C=C1 HFACYLZERDEVSX-UHFFFAOYSA-N 0.000 description 1
- 229910052790 beryllium Inorganic materials 0.000 description 1
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 239000013256 coordination polymer Substances 0.000 description 1
- 238000007766 curtain coating Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- BGTOWKSIORTVQH-UHFFFAOYSA-N cyclopentanone Chemical compound O=C1CCCC1 BGTOWKSIORTVQH-UHFFFAOYSA-N 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000007607 die coating method Methods 0.000 description 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005188 flotation Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 150000002344 gold compounds Chemical class 0.000 description 1
- OVWPJGBVJCTEBJ-UHFFFAOYSA-K gold tribromide Chemical compound Br[Au](Br)Br OVWPJGBVJCTEBJ-UHFFFAOYSA-K 0.000 description 1
- 229940014053 gold tribromide Drugs 0.000 description 1
- RJHLTVSLYWWTEF-UHFFFAOYSA-K gold trichloride Chemical compound Cl[Au](Cl)Cl RJHLTVSLYWWTEF-UHFFFAOYSA-K 0.000 description 1
- 229940076131 gold trichloride Drugs 0.000 description 1
- IZLAVFWQHMDDGK-UHFFFAOYSA-N gold(1+);cyanide Chemical compound [Au+].N#[C-] IZLAVFWQHMDDGK-UHFFFAOYSA-N 0.000 description 1
- 238000007756 gravure coating Methods 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 150000002429 hydrazines Chemical class 0.000 description 1
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical compound I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 description 1
- 150000002443 hydroxylamines Chemical class 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- TYQCGQRIZGCHNB-JLAZNSOCSA-N l-ascorbic acid Chemical compound OC[C@H](O)[C@H]1OC(O)=C(O)C1=O TYQCGQRIZGCHNB-JLAZNSOCSA-N 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000012280 lithium aluminium hydride Substances 0.000 description 1
- 239000001630 malic acid Substances 0.000 description 1
- 235000011090 malic acid Nutrition 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- GNVRJGIVDSQCOP-UHFFFAOYSA-N n-ethyl-n-methylethanamine Chemical compound CCN(C)CC GNVRJGIVDSQCOP-UHFFFAOYSA-N 0.000 description 1
- OBKARQMATMRWQZ-UHFFFAOYSA-N naphthalene-1,2,5,6-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C=CC2=C(C(O)=O)C(C(=O)O)=CC=C21 OBKARQMATMRWQZ-UHFFFAOYSA-N 0.000 description 1
- GOGZBMRXLADNEV-UHFFFAOYSA-N naphthalene-2,6-diamine Chemical compound C1=C(N)C=CC2=CC(N)=CC=C21 GOGZBMRXLADNEV-UHFFFAOYSA-N 0.000 description 1
- 150000002816 nickel compounds Chemical class 0.000 description 1
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 1
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 1
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- HBEQXAKJSGXAIQ-UHFFFAOYSA-N oxopalladium Chemical compound [Pd]=O HBEQXAKJSGXAIQ-UHFFFAOYSA-N 0.000 description 1
- 150000002941 palladium compounds Chemical class 0.000 description 1
- 229910003445 palladium oxide Inorganic materials 0.000 description 1
- BHZSLLSDZFAPFH-UHFFFAOYSA-L palladium(2+);difluoride Chemical compound F[Pd]F BHZSLLSDZFAPFH-UHFFFAOYSA-L 0.000 description 1
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 1
- INIOZDBICVTGEO-UHFFFAOYSA-L palladium(ii) bromide Chemical compound Br[Pd]Br INIOZDBICVTGEO-UHFFFAOYSA-L 0.000 description 1
- GPNDARIEYHPYAY-UHFFFAOYSA-N palladium(ii) nitrate Chemical compound [Pd+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O GPNDARIEYHPYAY-UHFFFAOYSA-N 0.000 description 1
- 229960005323 phenoxyethanol Drugs 0.000 description 1
- 150000003003 phosphines Chemical class 0.000 description 1
- CLYVDMAATCIVBF-UHFFFAOYSA-N pigment red 224 Chemical compound C=12C3=CC=C(C(OC4=O)=O)C2=C4C=CC=1C1=CC=C2C(=O)OC(=O)C4=CC=C3C1=C42 CLYVDMAATCIVBF-UHFFFAOYSA-N 0.000 description 1
- 150000003058 platinum compounds Chemical class 0.000 description 1
- CLSUSRZJUQMOHH-UHFFFAOYSA-L platinum dichloride Chemical compound Cl[Pt]Cl CLSUSRZJUQMOHH-UHFFFAOYSA-L 0.000 description 1
- PQTLYDQECILMMB-UHFFFAOYSA-L platinum(2+);sulfate Chemical compound [Pt+2].[O-]S([O-])(=O)=O PQTLYDQECILMMB-UHFFFAOYSA-L 0.000 description 1
- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
- 229920001643 poly(ether ketone) Polymers 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001748 polybutylene Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 229920000306 polymethylpentene Polymers 0.000 description 1
- 239000011116 polymethylpentene Substances 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- NRTDAKURTMLAFN-UHFFFAOYSA-N potassium;gold(3+);tetracyanide Chemical compound [K+].[Au+3].N#[C-].N#[C-].N#[C-].N#[C-] NRTDAKURTMLAFN-UHFFFAOYSA-N 0.000 description 1
- 150000003138 primary alcohols Chemical class 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 238000006722 reduction reaction Methods 0.000 description 1
- 150000003333 secondary alcohols Chemical class 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- CQLFBEKRDQMJLZ-UHFFFAOYSA-M silver acetate Chemical compound [Ag+].CC([O-])=O CQLFBEKRDQMJLZ-UHFFFAOYSA-M 0.000 description 1
- 229940071536 silver acetate Drugs 0.000 description 1
- 229940100890 silver compound Drugs 0.000 description 1
- 150000003379 silver compounds Chemical class 0.000 description 1
- 229940096017 silver fluoride Drugs 0.000 description 1
- REYHXKZHIMGNSE-UHFFFAOYSA-M silver monofluoride Chemical compound [F-].[Ag+] REYHXKZHIMGNSE-UHFFFAOYSA-M 0.000 description 1
- 229910001961 silver nitrate Inorganic materials 0.000 description 1
- 229910001923 silver oxide Inorganic materials 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 229910000033 sodium borohydride Inorganic materials 0.000 description 1
- 239000012279 sodium borohydride Substances 0.000 description 1
- VMDSWYDTKFSTQH-UHFFFAOYSA-N sodium;gold(1+);dicyanide Chemical compound [Na+].[Au+].N#[C-].N#[C-] VMDSWYDTKFSTQH-UHFFFAOYSA-N 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- NRUVOKMCGYWODZ-UHFFFAOYSA-N sulfanylidenepalladium Chemical compound [Pd]=S NRUVOKMCGYWODZ-UHFFFAOYSA-N 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 238000010345 tape casting Methods 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 125000006158 tetracarboxylic acid group Chemical group 0.000 description 1
- 229920006345 thermoplastic polyamide Polymers 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- IFXORIIYQORRMJ-UHFFFAOYSA-N tribenzylphosphane Chemical compound C=1C=CC=CC=1CP(CC=1C=CC=CC=1)CC1=CC=CC=C1 IFXORIIYQORRMJ-UHFFFAOYSA-N 0.000 description 1
- TUQOTMZNTHZOKS-UHFFFAOYSA-N tributylphosphine Chemical compound CCCCP(CCCC)CCCC TUQOTMZNTHZOKS-UHFFFAOYSA-N 0.000 description 1
- WLPUWLXVBWGYMZ-UHFFFAOYSA-N tricyclohexylphosphine Chemical compound C1CCCCC1P(C1CCCCC1)C1CCCCC1 WLPUWLXVBWGYMZ-UHFFFAOYSA-N 0.000 description 1
- BDZBKCUKTQZUTL-UHFFFAOYSA-N triethyl phosphite Chemical compound CCOP(OCC)OCC BDZBKCUKTQZUTL-UHFFFAOYSA-N 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- QXJQHYBHAIHNGG-UHFFFAOYSA-N trimethylolethane Chemical compound OCC(C)(CO)CO QXJQHYBHAIHNGG-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
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Abstract
层叠体,其包含基材和镀敷形成层,所述镀敷形成层配置在所述基材的两面的至少一个面上且含有热塑性树脂及镀敷催化剂,所述镀敷形成层还满足下述条件(1)及/或条件(2)。(1)所述镀敷形成层含有使所述镀敷催化剂分散的分散剂。(2)所述镀敷形成层的表面侧的所述镀敷催化剂的存在量比所述镀敷形成层的所述基材侧的所述镀敷催化剂的存在量大。
Description
技术领域
本发明涉及层叠体。
背景技术
近年,与半导体电路的高集成化相伴,要求在印刷布线板上形成更加细微的布线电路。为了形成细微的布线电路,需要减少布线的厚度。但是,由于即使是薄金属箔,厚度也为2μm,因此细微电路形成性不充分,存在生产率降低的问题。
针对这样的问题,专利文献1公开了以下内容:高分子膜、含有具有结晶性的热塑性树脂的镀敷形成层、与镀敷层按该顺序层叠所得的层叠体是能形成细微电路的材料,并且可以提高镀敷形成层与镀敷层的粘接性与焊锡耐热性。
现有技术文献
专利文献
专利文献1:WO2009075212号说明书
发明内容
但是,对于专利文献1的层叠体而言,要求均衡性良好地进一步提高常态下的粘接性、与焊锡耐热性。
为此,本发明提供一种能均衡性良好地提高常态下的粘接性、和焊锡耐热性的层叠体。
解决课题的手段
本申请的发明人为了解决上述课题进行了深入研究,结果发现在包括基材、和配置在所述基材的两面中的至少一个面且含有热塑性树脂和镀敷催化剂的镀敷形成层的层叠体中,使镀敷形成层满足特定的条件,由此可以解决上述课题,从而完成了本发明。
即,本发明如以下所述。
〔1〕层叠体,其包含
基材和
镀敷形成层,其配置于所述基材的两面中的至少一个面,含有热塑性树脂和镀敷催化剂,
所述镀敷形成层还满足下述条件(1)及/或条件(2)。
(1)所述镀敷形成层含有使所述镀敷催化剂分散的分散剂
(2)所述镀敷形成层的表面侧的所述镀敷催化剂的存在量比所述镀敷形成层的所述基材侧的所述镀敷催化剂的存在量大
〔2〕如〔1〕所述的层叠体,其中,所述分散剂是与所述镀敷催化剂所含的金属原子相互作用而键合的化合物。
〔3〕如〔2〕所述的层叠体,其中,所述化合物的末端基团是含有氮原子的官能团。
〔4〕如〔1〕~〔3〕中任一项所述的层叠体,其中,所述镀敷形成层包含含有所述热塑性树脂的树脂层、和配置在所述树脂层上且含有所述镀敷催化剂的催化剂层。
〔5〕如〔4〕所述的层叠体,其中,所述催化剂层含有所述分散剂。
〔6〕如〔4〕或〔5〕所述的层叠体,其中,所述镀敷形成层还包含边界层,所述边界层配置在所述树脂层与所述催化剂层之间,在所述边界层中所述镀敷催化剂及所述分散剂渗透于热塑性树脂。
〔7〕如〔1〕~〔6〕中任一项所述的层叠体,其中,所述基材是热固性聚酰亚胺树脂。
〔8〕如〔1〕~〔7〕中任一项所述的层叠体,其中,所述热塑性树脂是热塑性聚酰亚胺树脂。
〔9〕如〔1〕~〔8〕中任一项所述的层叠体,其中,所述镀敷催化剂含有钯及/或银。
〔10〕如〔1〕~〔9〕中任一项所述的层叠体,其还包含配置在所述镀敷形成层上的金属镀敷层。
发明效果
根据本发明,可以提供能够均衡性良好地进一步提高常态下的粘接性、和焊锡耐热性的层叠体。
附图说明
[图1]图1表示实施例1中的使用扫描型电子显微镜观察到的层叠体的截面图。
具体实施方式
以下,详细记载用于实施本发明的方式(以下称为“本实施方式”。)。需要说明的是,本发明并不限定于以下的实施方式,可以在其主旨范围内进行各种变形来实施。
[层叠体]
本实施方式的层叠体包含基材和、配置在所述基材的两面中的至少一个面且含有热塑性树脂及镀敷催化剂的镀敷形成层。镀敷形成层还满足下述条件(1)及/或条件(2)。
(1)镀敷形成层含有使镀敷催化剂分散的分散剂
(2)镀敷形成层的表面侧的镀敷催化剂的存在量(Ca)比所述镀敷形成层的所述基材侧中的所述镀敷催化剂的存在量(Cb)大
镀敷形成层满足上述条件(1)及/或条件(2),由此包含该镀敷形成层的层叠体可以均衡性良好地提高常态下的粘接性、和焊锡耐热性,例如,预想了长期可靠性的粘接性优异。此处,所谓预想了长期可靠性的粘接性是指例如即使进行150℃的加热处理也能充分抑制粘接性降低的性质。
通过使镀敷形成层满足条件(1)及/或条件(2),从而层叠体可以均衡性良好地提高常态下的粘接性、预想了长期可靠性的粘接性、及焊锡耐热性的主要原因认为如下。
用于印刷布线板用材料等的层叠体由基材、形成在基材的一面且含有热塑性树脂及镀敷催化剂的镀敷形成层、和形成在镀敷形成层上的金属镀敷层构成。此处,这样的层叠体的粘接性(常态下的粘接性、预想了长期可靠性的粘接性)及焊锡耐热性不足的主要原因认为在于,镀敷催化剂所含的金属(催化剂金属)在镀敷形成层与金属镀敷层的界面附近的存在量小。并且,在上述界面附近,为了增加催化剂金属的存在量,使镀敷形成层含有用于分散镀敷催化剂的分散剂,或控制镀敷形成层中的镀敷催化剂的存在量。由此,镀敷金属与催化剂金属接触的比例增加。认为其结果是,催化剂金属与镀敷金属变得容易接触,层叠体的粘接性(常态下的粘接性、预想了长期可靠性的粘接性)及焊锡耐热性提高。
但是,其主要原因并不限定于此。
(基材)
作为基材中的树脂,没有特别限定,例如可以举出热固性聚酰亚胺树脂、液晶聚合物、聚苯硫醚、间规聚苯乙烯、聚对苯二甲酸乙二醇酯、聚萘二甲酸乙二醇酯、聚碳酸酯、聚对苯二甲酸丁二醇酯、聚醚醚酮、聚醚砜、聚苯醚及氟系树脂。上述树脂可以单独使用1种或者可以组合2种以上进行使用。这些树脂中,从机械特性、热特性及加热时的尺寸稳定性更优异的观点来看,优选为热固性聚酰亚胺树脂。另外,在传输高频信号的挠性印刷布线板中,从介电特性的观点来看,作为树脂,优选为液晶聚合物或氟系树脂。需要说明的是,液晶聚合物及氟系树脂由于吸水率低,所以耐湿热特性、高湿下的尺寸稳定性、及吸湿处理后的剥离强度也变得良好。
(热固性聚酰亚胺树脂)
所谓热固性聚酰亚胺树脂,是指例如300℃时的弹性模量相对于30℃时的弹性模量而言保持20%以上的聚酰亚胺树脂。弹性模量例如可以由DMA(动态粘弹性测定)法求出。作为热固性聚酰亚胺树脂,没有特别限定,例如可以举出将酸二酐与二胺共聚得到的缩合型聚酰亚胺树脂、双马来酰亚胺树脂、及马来酰亚胺树脂。
作为酸二酐及二胺,例如可以使用脂肪族化合物、脂环式化合物、芳香族化合物均可。从耐热性的观点来看,作为酸二酐,优选芳香族四羧酸二酐,作为二胺,优选芳香族二胺。
作为酸二酐,例如可以举出均苯四甲酸二酐、2,3,6,7-萘四甲酸二酐、3,3’,4,4’-联苯四甲酸二酐、1,2,5,6-萘四甲酸二酐、2,2’,3,3’-联苯四甲酸二酐、3,3’,4,4’-二苯甲酮四甲酸二酐、4,4’-氧双邻苯二甲酸二酐、2,2-双(3,4-二羧基苯基)丙烷二酐、3,4,9,10-苝四甲酸二酐、双(3,4-二羧基苯基)丙烷二酐、1,1-双(2,3-二羧基苯基)乙烷二酐、1,1-双(3,4-二羧基苯基)乙烷二酐、双(2,3-二羧基苯基)甲烷二酐、双(3,4-二羧基苯基)乙烷二酐、双(3,4-二羧基苯基)砜二酐、对亚苯基双(偏苯三甲酸单酯酸酐)、亚乙基二(偏苯三甲酸单酯酸酐)及双酚A双(偏苯三甲酸单酯酸酐)。上述酸二酐可以单独使用1种或组合使用2种以上。其中,从耐热性和尺寸稳定性的观点来看,优选从由均苯四甲酸二酐、2,3,6,7-萘四甲酸二酐、2,2’,3,3’-联苯四甲酸二酐、3,3’,4,4’-联苯四甲酸二酐及3,3’,4,4’-二苯甲酮四甲酸二酐组成的组中选择的至少1种酸二酐。
作为二胺,例如可以举出4,4’-二氨基二苯基丙烷、4,4’-二氨基二苯基甲烷、联苯胺、3,3’-二氯联苯胺、3,3’-二甲基联苯胺、2,2’-二甲基联苯胺、3,3’-二甲氧基联苯胺、2,2’-二甲氧基联苯胺、4,4’-二氨基二苯基硫醚、3,3’-二氨基二苯砜、4,4’-二氨基二苯砜、4,4’-二氨基二苯醚、3,3’-二氨基二苯醚、3,4’-二氨基二苯醚、1,5-二氨基萘、2,6-二氨基萘、4,4’-二氨基二苯基二乙基硅烷、4,4’-二氨基二苯基硅烷、4,4’-二氨基二苯基乙基氧化膦、4,4’-二氨基二苯基N-甲基胺、4,4’-二氨基二苯基N-苯基胺、1,4-二氨基苯(对苯二胺)、1,3-二氨基苯、1,2-二氨基苯、双{4-(4-氨基苯氧基)苯基}砜、双{4-(3-氨基苯氧基)苯基}砜、4,4’-双(4-氨基苯氧基)联苯、4,4’-双(3-氨基苯氧基)联苯、1,3-双(3-氨基苯氧基)苯、1,3-双(4-氨基苯氧基)苯、1,4-双(4-氨基苯氧基)苯、3,3’-二氨基二苯甲酮、4,4’-二氨基二苯甲酮、及2,2-双[4-(4-氨基苯氧基)苯基)]丙烷。上述二胺可以单独使用1种或组合2种以上进行使用。上述二胺中,从耐热性及尺寸稳定性的观点考虑,优选含有从由3,3’-二甲基联苯胺、2,2’-二甲基联苯胺、3,3’-二甲氧基联苯胺、2,2’-二甲氧基联苯胺、1,5-二氨基萘及1,4-二氨基苯(对苯二胺)组成的组中选择的至少1种二胺。
基材可以在不损害本发明的作用效果的范围内含有树脂以外的成分,也可以不含有树脂以外的成分。
基材优选为树脂膜,树脂膜较优选为热固性聚酰亚胺树脂膜。热固性聚酰亚胺树脂膜可以使用由已知的方法制备的制备品,也可以使用市售品。作为市售品,可以举出东丽·杜邦株式会社的产品“Kapton EN系列”、“Kapton H系列”、“Kapton V系列”、株式会社钟化的产品“Apical HP系列”、“Apical NPI系列”、及宇部兴产株式会社的产品“UpilexS”。
从搬送性、绝缘性、及耐热性等观点来看,基材的层叠方向的厚度优选为5μm~500μm。从同样的观点来看,厚度较优选为7.5μm~300μm,更优选为10μm~100μm。
(镀敷形成层)
镀敷形成层可以配置在基材的两面中的一个面上,也可以配置在基材的两面上。镀敷形成层包含热塑性树脂与镀敷催化剂。
(热塑性树脂)
所谓热塑性树脂,例如是指因在玻璃化转变温度(以下也称作Tg。)以上加热时发生软化而具有软化点温度的树脂。热塑性树脂可以是未固化的形态,也可以是固化的形态。作为热塑性树脂,例如可以举出热塑性聚酰亚胺树脂、芳香族聚醚酮、聚苯硫醚、聚乙烯、聚丙烯、聚丁烯、结晶性聚丁二烯、聚甲基戊烯、聚酰胺、聚酯、聚氨酯、液晶聚合物、聚苯乙烯等。上述热塑性树脂可以单独使用1种或组合2种以上进行使用。这些热塑性树脂中,从进一步提高焊锡耐热性的观点来看,优选为热塑性聚酰亚胺树脂。所谓热塑性聚酰亚胺树脂,例如是指300℃时的弹性模量相对于30℃时的弹性模量而言低于20%的聚酰亚胺树脂。
本实施方式的层叠体中,优选的是,基材为热固性聚酰亚胺树脂,镀敷形成层所含的热塑性树脂为热塑性聚酰亚胺树脂。由此,具有基材与镀敷形成层的密合性进一步提高的倾向。
作为热塑性聚酰亚胺树脂,例如可以举出使酸二酐与二胺共聚得到的聚酰亚胺树脂。作为酸二酐及二胺,可以举出与用于上述热固性聚酰亚胺树脂的酸二酐及二胺相同的酸二酐及二胺。
热塑性树脂相对于镀敷形成层整体的含量例如为1质量%~99质量%,优选为20质量%~95质量%,较优选为40质量%~90质量%。
(镀敷催化剂)
镀敷催化剂含有贵金属。作为镀敷催化剂,只要是通常用于镀敷处理(例如无电解电镀处理)的催化剂即可。作为贵金属,例如可以举出钯、银、铂、镍、金及它们的合金。这些贵金属可以以离子的形态存在于镀敷形成层中。这些贵金属可以单独使用1种,也可以组合2种以上进行使用。其中,贵金属优选为钯及/或银。通过使用这样的贵金属,在镀敷形成层上形成金属镀敷层(例如镀铜层)时,由于可以边减小金属镀敷层的厚度边形成镀敷,因此具有可以形成更微细的电路的倾向。
从使镀敷层在粘接层的表面均匀地析出的观点来看,镀敷催化剂优选贵金属在溶剂中成胶体状或均匀地分散。作为溶剂,没有特别限定,可以举出为了使贵金属粒子分散而通常使用的溶剂,例如可以举出水、甲醇、乙醇、异丙醇等醇、己烷、环己酮、甲基乙基酮、丙酮、N-甲基-2-吡咯烷酮、N,N-二甲基乙酰胺、N,N-二甲基甲酰胺、甲苯、乙醚、四氢呋喃(THF)、及它们的混合溶剂。
贵金属粒子的平均粒径(D50)例如可以为2nm~40nm左右。平均粒径是体积基准的平均粒径,例如利用基于动态光散射法(DLS)的粒径分布测定装置来求出。需要说明的是,所谓D50,是指体积累计50%的位置。
贵金属粒子的平均粒径(D50)为40nm以下时,贵金属的表面积增加,催化剂活性上升。从而具有镀敷反应性提高的倾向。
镀敷催化剂相对于镀敷形成层整体的含量例如为1质量%~99质量%,优选为5质量%~80质量%,较优选为10质量%~60质量%。
(分散剂)
镀敷形成层含有使镀敷催化剂分散的分散剂。但是,如果镀敷形成层满足下述条件,即,“(2)镀敷形成层的表面侧的镀敷催化剂的存在量(Ca)比所述镀敷形成层的所述基材侧的所述镀敷催化剂的存在量(Cb)大”,则并不一定需要分散剂。分散剂优选为与镀敷催化剂所含的金属原子(催化剂金属)相互作用而键合的化合物,该化合物较优选为化合物的末端基团是含有氮原子的官能团的化合物、具有不饱和键的化合物。作为键合形态,例如可以为配位键、离子键、共价键等。通过使用上述分散剂,催化剂金属均匀地分散于镀敷形成层中。并且,通过该分散,催化剂金属与镀敷金属接触的比例变得更大,所以镀敷金属的析出性提高。其结果,在镀敷形成层中针孔(pinhole)的发生大幅减少。
分散剂相对于镀敷形成层整体的含量例如为1质量%~99质量%,优选为10质量%~80质量%,较优选为20质量%~60质量%。
将镀敷形成层的表面侧的镀敷催化剂的存在量作为Ca,将镀敷形成层的基材侧的镀敷催化剂的存在量作为Cb时,镀敷形成层满足Ca>Cb。但是,镀敷形成层满足上述条件(1)时,并不必须满足Ca>Cb。Ca及Cb可以使用X射线光电子能谱分析装置求出。即,镀敷催化剂所含的贵金属为钯(Pd)时,就镀敷形成层的表面侧中的催化剂的存在量(钯存在量(Pd存在量))而言,使用X射线光电子能谱分析装置从表面侧进行测定,由检测出的Pd的原子%浓度求出。具体而言,将钯(Pd)的原子%浓度除以碳(C)的原子%浓度所得的数值作为催化剂的存在量(钯存在量(Pd存在量))Ca。镀敷形成层的基材侧的催化剂的存在量如下求出,从镀敷形成层的表面侧利用氩离子进行处理,处理至规定的部位后,使用X射线光电子能谱分析装置通过与上述同样的方法求出镀敷形成层的基材侧的镀敷催化剂的存在量(钯存在量(Pd存在量))Cb。
由此,镀敷金属与催化剂金属接触的比例变大。认为其结果是,催化剂金属与镀敷金属变得容易接触,层叠体的粘接性(常态下的粘接性、设想了长期可靠性的粘接性)及焊锡耐热性提高。
作为满足Ca>Cb的方法,例如,可以举出下述方法:在基材上形成含有热塑性树脂的树脂层,使含有上述分散剂的催化剂层层叠于该树脂层;等等。
镀敷形成层的厚度例如为10nm~10μm,从更有效且更确切地发挥本发明的作用效果的观点来看,优选为30nm~8μm,更优选为50nm~6μm。
镀敷形成层可以具有单层结构,也可以具有多层结构。镀敷形成层具有多层结构时,从进一步提高粘接性及焊锡耐热性的观点来看,优选多层结构包含含有热塑性树脂的树脂层、和含有镀敷催化剂的催化剂层,催化剂层还优选含有上述分散剂。镀敷形成层具有上述多层结构时,例如,在基材上配置(形成)有树脂层,在树脂层上配置(形成)有催化剂层。
(树脂层)
作为树脂层所含的热塑性树脂,可以举出与在上述镀敷形成层中所用的热塑性树脂同样的热塑性树脂。
树脂层的厚度例如为10nm~10μm,从更有效且确切地发挥本发明的作用效果的观点来看,优选为30nm~8μm,更优选为50nm~6μm。
(催化剂层)
催化剂层所含的镀敷催化剂及分散剂可以分别举出在镀敷形成层的项中所列举的镀敷催化剂及分散剂。
催化剂层的厚度例如为5nm~300nm,从更有效且确切地发挥本发明的作用效果的观点来看,优选为10nm~200nm,较优选为20nm~100nm。
多层结构可以仅由树脂层及催化剂层构成,也可以由树脂层、催化剂层、和除树脂层及催化剂层以外的1种以上的其他层构成。
上述结构中,镀敷形成层优选含有树脂层、催化剂层、以及配置在树脂层及催化剂层之间的边界层。边界层例如因镀敷催化剂及分散剂渗透于树脂层的表层而形成。通过包含这样的边界层,树脂层与催化剂层之间的层间密合性提高,其结果,具有剥离强度更优异的倾向。
边界层的厚度例如为0.5nm~300nm,从更有效且确切地发挥本发明的作用效果的观点来看,优选为1nm~200nm,较优选为2nm~100nm。
本实施方式的层叠体可以包含配置于镀敷形成层上的镀敷层,也可以不包含配置于镀敷形成层上的镀敷层。
(镀敷层)
作为镀敷层,例如可以举出通过金属镀敷处理而形成的金属镀敷层,作为金属镀敷层,可以举出镀铜层、镀金层、镀锡层、镀镍层、镀银层、镀钯层、镀焊锡层及无铅焊锡镀敷层。
从更有效且确切地发挥本发明的作用效果的观点来看,镀敷层的厚度优选为0.05μm~35μm,较优选为0.1μm~18μm,更优选为0.1μm~12μm。
本实施方式的层叠体可以具有镀敷形成层及镀敷层以这样的顺序在基材的一面侧层叠而得到的形态,也可以具有镀敷形成层及镀敷层以这样的顺序在基材的两面侧层叠而得到的形态。本实施方式的层叠体具有镀敷形成层及镀敷层以这样的顺序在基材的两面侧层叠而得到的形态时,镀敷形成层例如具有形成在基材的两面中的一个面上的第1镀敷形成层、和形成在基材的两面中的另一个面上的第2镀敷形成层,镀敷层具有形成在第1镀敷形成层的表面上的第1镀敷层、和形成在第2镀敷形成层表面上的第2镀敷层。第1镀敷形成层及第2镀敷形成层可以相同也可以不同。
(特性)
本实施方式的层叠体的常态下的粘接性优异,90度方向剥离的剥离强度例如为5.0N/cm以上(例如,5.0N/cm~8.0N/cm),优选为6.0N/cm以上,较优选为6.5N/cm以上。
另外,对于本实施方式的层叠体而言,设想了长期可靠性的粘接性优异。因此,投入到温度为150℃的干燥机中240小时后的剥离强度在90度剥离方向上例如为5.0N/cm以上(例如,5.0N/cm~8.0N/cm),优选为6.0N/cm以上,较优选为6.5N/cm以上。另外,投入到温度为85℃、湿度为85%的恒温恒湿器中240小时后的剥离强度在90度方向剥离时为例如5.0N/cm以上(例如,5.0N/cm~8.0N/cm),优选为6.0N/cm以上,较优选为6.5N/cm以上。
(用途)
本实施方式的层叠体优选适用于要求形成微细的布线电路的挠性印刷布线板用材料。挠性印刷布线板例如优选用作用于IC芯片安装的所谓芯片封装(Chip On)挠性印刷布线板、用于形成高密度电路的挠性印刷布线板。
[层叠体的制造方法]
本实施方式的层叠体的制造方法例如包括镀敷形成层形成工序,即,在基材的至少一个面上涂布热塑性树脂、和根据需要而含有上述分散剂的镀敷催化剂原料,进行干燥,由此形成镀敷形成层,还可以包括镀敷层形成工序,即,通过在镀敷形成层的与基材相反一侧的面上进行镀敷处理,由此形成镀敷层。本实施方式的制造方法通过具备上述构成,具有能够提高所得层叠体的常态下的粘接性及焊锡耐热性的倾向。
(镀敷形成层形成工序)
镀敷形成层形成工序是通过在基材上涂布热塑性树脂、和镀敷催化剂原料,进行干燥,由此形成镀敷形成层的工序。
作为基材,没有特别限定,例如可以举出作为层叠体的项中的基材所列举的基材。
作为热塑性树脂,没有特别限定,例如可以举出作为层叠体的项中的热塑性树脂所列举的热塑性树脂。在镀敷形成层形成工序中,例如,热塑性树脂可以以溶解或分散在有机溶剂中的形态进行使用。作为有机溶剂,只要是能溶解或分散热塑性树脂的溶剂,就没有特别限定,例如可以举出醇类(例如甲醇、乙醇、丙醇、丁醇、戊醇、甘油、乙二醇、二甘醇、三甘醇、聚乙二醇、丙二醇、二丙二醇、三羟甲基乙烷及三羟甲基丙烷)、醚类(例如丁基乙基醚等烷基醚、乙二醇单正丁基醚等多元醇烷基醚类、及乙二醇单苯基醚等多元醇芳基醚类)、酮类(例如甲基乙基酮、甲基异丁基酮、及环戊酮)、酯类(例如乙酸丁酯、丙酸丙酯及甲基醚乙酸酯)、酰胺类(例如N,N-二甲基甲醛、N,N-二甲基乙酰胺)、胺类(例如单乙醇胺及二乙醇胺)、芳香族烃类(例如甲苯及二甲苯)、含硫化合物(例如二甲基亚砜)及含氮杂环化合物(例如N-甲基-2-吡咯烷酮、γ-丁内酯)。上述有机溶剂可以单独使用1种,也可以组合2种以上进行使用。有机溶剂中的热塑性树脂的浓度例如可以为0.1质量%~20质量%左右。
镀敷催化剂原料含有贵金属。作为贵金属,没有特别限定,例如可以举出钯、银、金、铂、镍及它们的合金。上述贵金属可以单独使用1种或组合2种以上进行使用。
镀敷催化剂原料可以直接添加贵金属,也可以添加贵金属化合物、和用于使贵金属化合物还原而得到贵金属的还原剂,在镀敷催化剂原料中,通过还原反应使贵金属析出。作为贵金属化合物,没有特别限定,例如可以举出钯化合物(例如氯化钯、氟化钯、溴化钯、碘化钯、硝酸钯、硫酸钯、氧化钯、及硫化钯)、银化合物(例如硝酸银、氟化银、氧化银、及乙酸银)、金化合物(例如氰化金、三氯化金、三溴化金、氯化金钾、氰化金钾、氯化金钠、及氰化金钠)、铂化合物(例如氯化铂及硫酸铂)及镍化合物(例如氯化镍及硫酸镍)。上述贵金属化合物可以单独使用1种或组合2种以上进行使用。
作为还原剂,没有特别限定,例如可以举出硼氢化金属盐(例如硼氢化钠及硼氢化钾)、氢化铝盐(例如氢化铝锂、氢化铝钾、氢化铝铯、氢化铝铍、氢化铝镁、及氢化铝钙)、肼化合物、羧酸类(例如柠檬酸、甲酸、乙酸、富马酸、苹果酸、琥珀酸、抗坏血酸及它们的盐)、伯醇或仲醇类(例如甲醇、乙醇、异丙醇及多元醇)、叔胺类(例如三甲基胺、三乙基胺、二异丙基乙基胺、二乙基甲基胺、四甲基乙二胺[TMEDA]及乙二胺四乙酸[EDTA])、羟基胺、酮类(例如丙酮及甲基乙基酮)、醚类(例如乙醚)、醛类(例如甲醛及乙醛)、酯类(例如甲酸甲酯、乙酸甲酯及乙酸乙酯)及膦类(例如三正丙基膦、三正丁基膦、三环己基膦、三苄基膦、三苯基膦、三乙氧基膦、1,2-双(二苯基膦基)乙烷[DPPE]、1,3-双(二苯基膦基)丙烷[DPPP]、1,1’-双(二苯基膦基)二茂铁[DPPF]及2,2’-双(二苯基膦基)-1,1’-联萘[BINAP])。上述还原剂可以单独使用1种或组合2种以上进行使用。
还原剂的使用量没有特别限定,例如,相对于贵金属化合物100质量份而言,可以为10质量份~1000质量份左右。
作为分散剂,例如,可以举出层叠体的项中作为分散剂所列举的分散剂。镀敷形成层形成工序中,例如,分散剂以溶解或分散于有机溶剂的形态进行使用。作为有机溶剂,例如可以举出作为能溶解或分散热塑性树脂的溶剂所列举的有机溶剂。有机溶剂中的分散剂的浓度例如可以为0.1质量%~10质量%左右。
镀敷形成层形成工序中,可以将混合了热塑性树脂、镀敷催化剂原料、和根据需要而含有的分散剂所得的混合原料涂布在基材的至少一个面上,进行干燥,由此形成镀敷形成层。另外,在镀敷形成层形成工序中,可以将热塑性树脂涂布在基材的至少一个面上,进行干燥,由此形成树脂层,将镀敷催化剂原料、和根据需要而含有的分散剂涂布在树脂层的表面上,进行干燥,由此形成催化剂层。这种情况下,镀敷形成层由树脂层与催化剂层构成。
在镀敷形成层形成工序中,作为分别涂布热塑性树脂、镀敷催化剂原料、和根据需要而含有的分散剂的方法,没有特别限定,例如可以举出辊涂方式、吻合辊式涂布方式、凹版涂布方式、反式涂布方式、辊刷涂布方式、喷涂方式、浸渍辊式涂布方式、棒涂方式、刀涂方式、气刀涂布方式、帘幕涂布方式、狭缝涂布方式及模涂方式。
镀敷形成层形成工序中的干燥条件可以根据使用的有机溶剂适当设定干燥温度和时间。作为干燥温度的范围,例如为60℃~300℃左右,作为干燥时间,例如为5分钟~60分钟左右。对于干燥温度而言,可以使其阶段性变化,也可以维持为一定温度。
(镀敷层形成工序)
镀敷层形成工序是通过在粘接层的与基材相反一侧的面上进行镀敷处理而形成镀敷层的工序。作为镀敷处理,可以举出无电解电镀处理、电镀处理及组合了这些处理的处理。上述镀敷处理中使用无电解电镀处理时,能适用于图案形成方法之一的半加成法,能应对两面窄间距化,故而优选。
作为无电解电镀处理及电镀处理的各处理条件,能采用已知的处理条件。更详细而言,能采用实施例所记载的处理条件。
需要说明的是,本说明书中的各物性只要没有特别明确记载,可以根据以下的实施例所记载的方法进行测定。
实施例
以下,根据实施例和比较例更具体地说明本发明,但本发明并不限定于这些实施例。
以下具体说明作为本发明树脂层的原料的热塑性树脂的合成例,但本发明并不限定于这些合成例。
用于合成热塑性树脂的酸二酐、二胺及溶剂如以下所示。
p-PDA:对苯二胺(关东化学株式会社制)
BAPP:2,2-双(4-氨基苯氧基苯基)异丙烷(和歌山精化工业株式会社制)
TPE-R:1,3-双(4-氨基苯氧基)苯(和歌山精化工业株式会社制)
4,4’-DPE:4,4’-二氨基二苯基醚(和歌山精化工业株式会社制)
BPDA:3,4,3’,4’-联苯四甲酸二酐(宇部兴产株式会社制)
DMAc:N,N-二甲基乙酰胺(关东化学株式会社制)
NMP:N-甲基-2-吡咯烷酮(关东化学株式会社制)
[合成例1]
在反应容器中添加85gDMAc、1.034g(0.003mol)BAPP、和6.628g(0.023mol)TPE-R后,室温搅拌,使BAPP、TPE-R溶解于DMAc。在所得的溶液中慢慢添加7.338g(0.025mol)BPDA。然后,在室温下搅拌3小时,由此得到树脂组合物(聚酰胺酸溶液)。以使所得的聚酰胺酸溶液的固态成分浓度成为2质量%的方式用DMAc稀释,得到聚酰胺酸溶液A。
[合成例2]
在反应容器中添加85gDMAc、5.645g(0.014mol)BAPP、和2.680g(0.009mol)TPE-R后,室温搅拌,使BAPP、TPE-R溶解于DMAc。在所得的溶液中缓慢添加6.675g(0.023mol)BPDA。然后,在室温下搅拌3小时,由此得到树脂组合物(聚酰胺酸溶液)。以使所得的聚酰胺酸溶液的固态成分浓度成为2质量%的方式用DMAc稀释,得到聚酰胺酸溶液B。
[合成例3]
在反应容器中添加85g DMAc、4.061g(0.038mol)p-PDA后,于40℃搅拌,使p-PDA溶解于DMAc。在所得的溶液中缓慢添加10.939g(0.037mol)BPDA。然后,在室温下搅拌3小时,由此得到树脂组合物(聚酰胺酸溶液)。以使所得的聚酰胺酸溶液的固态成分浓度成为2质量%的方式用DMAc稀释,得到聚酰胺酸溶液C。
[实施例1]
使用棒涂器在作为基材的具有38μm的厚度的热固性聚酰亚胺树脂膜(东丽·杜邦株式会社制品的“Kapton 150EN-C,线性热膨胀系数13ppm,玻璃化转变温度320℃,Ra0.03μm”)的一面涂布合成例1中合成的作为热塑性聚酰亚胺树脂的前体树脂溶液的2质量%聚酰胺酸溶液A,在60℃~250℃、10分钟左右的干燥条件下使其干燥,由此形成具有150nm的厚度的树脂层(树脂层形成工序)。然后,用棒涂器将含有Pd作为镀敷催化剂、且含有具有铵基的分散剂的药剂A(日产化学株式会社制CP系列)涂布在树脂层表面,使其于120℃干燥10分钟左右,进一步使其于250℃干燥15分钟左右,由此形成具有50nm的厚度的催化剂层(催化剂层形成工序)。将由此形成的形成体在奥野制药工业株式会社制品的OPC COPPER HFS(初始Cu浓度2.5g/l、浴槽容积500ml、40℃、40分钟)中浸渍5分钟左右,在催化剂层的表面形成具有0.3μm的厚度的金属镀敷层(化学镀工序)。进而,通过电解电镀处理将金属镀敷层的厚度从0.3μm增加至12μm(电解电镀工序)。由此,得到层叠体。使用扫描型电子显微镜,观察所得的层叠体的截面图,可知层叠体在树脂层与催化剂层之间形成边界层。所得的层叠体的截面图示于图1。如图1所示,该层叠体以树脂层、边界层、催化剂层这样的顺序层叠在基材上。
[实施例2]
在树脂层形成工序中,使用在合成例2中合成的作为热塑性聚酰胺树脂的前体树脂溶液的2质量%聚酰胺酸溶液B代替在合成例1中合成的作为热塑性聚酰亚胺树脂的前体树脂溶液的2质量%聚酰胺酸溶液A,除此以外,与实施例1相同地操作,得到层叠体。
[比较例1]
在树脂层形成工序中,使用在合成例3中合成的作为热固性聚酰亚胺树脂的前体树脂溶液的2质量%聚酰胺酸溶液C,代替在合成例1中合成的作为热塑性聚酰亚胺树脂的前体树脂溶液的2质量%聚酰胺酸溶液A,除此以外,与实施例1相同地操作,得到层叠体。
[比较例2]
不进行树脂层形成工序,在催化剂层形成工序中,将上述药剂A涂布于基材的一面,除此以外,与实施例1同样地操作,得到层叠体。
[实施例3]
使用棒涂器将在合成例1中合成的作为热塑性聚酰亚胺树脂的前体树脂溶液的2质量%聚酰胺酸溶液A、和实施例1的药剂A以质量比10:1混合得到的溶液(树脂浓度为0.5质量%,Pd浓度为0.136质量%)涂布于基材的一面,于120℃使其干燥10分钟左右,进一步于250℃使其干燥15分钟左右,由此形成具有100nm的厚度的镀敷形成层。将由此形成的形成体在奥野制药工业株式会社制品的OPC COPPER HFS(初始Cu浓度2.5g/l,浴槽容积500ml,40℃,40分钟)中浸渍5分钟左右,在催化剂层的表面形成具有0.3μm的厚度的金属镀敷层(化学镀工序)。进而,通过电解电镀处理将金属镀敷层的厚度从0.3μm增加到12μm(电解电镀工序)。由此,得到层叠体。
[实施例4]
作为基材,将热固性树脂层的两面具有热塑性聚酰亚胺树脂层的25μm的Bondply膜、株式会社钟化制品的“PIXEO FRS-142,线膨胀系数20ppm”在40℃的10wt%KOH水溶液中浸渍60分钟左右,使聚酰亚胺树脂层膨润后,在其一面,使用棒涂器在基材表面涂布含有Pd作为镀敷催化剂且含有具有铵基的分散剂的药剂A,于120℃使其干燥10分钟左右,进一步于250℃使其干燥15分钟左右,由此形成具有50nm的厚度的催化剂层。将由此形成的形成体与实施例1同样地操作,得到层叠体。
[实施例5]
作为基材,针对在热固性树脂层的两面具有热塑性聚酰亚胺树脂层的25μm的Bondply膜、株式会社钟化制品的“PIXEO FRS-142,线膨胀系数20ppm”的一面,使用棒涂器将含有Pd作为镀敷催化剂、且含有具有铵基的分散剂的药剂A涂布在基材表面,于120℃使其干燥10分钟左右,进而在氮气氛下于300℃使其干燥30分钟左右,由此形成具有50nm的厚度的催化剂层。将由此形成的形成体与实施例1同样地操作,得到层叠体。
测定各实施例及比较例的层叠体的各物性。测定结果如表1所示。由该测定结果可知,基材侧的树脂层中存在较少的作为镀敷及镀敷催化剂原料的金属的一者能抑制热处理后或湿热处理后的剥离强度降低。作为其原因之一,虽然为推测,但认为由于树脂层中的所述金属的存在少,故而施加在树脂上的热影响小。需要说明的是,关于各物性的测定方法,通过以下的方法来进行。
各评价方法及测定方法如以下所示。
[各层的厚度]
各层的厚度的测定如下进行,用超薄切片机EM UC6(LEICA公司制)以50~150nm的厚度将样品进行切削,用扫描型电子显微镜S-4800(日立公司制)观察截面透射图像,由此计算厚度。
[钯存在量]
关于钯存在量,使用X射线光电子能谱分析装置进行测定。更详细而言,关于镀敷形成层的表面侧的催化剂的存在量(钯存在量(Pd存在量)),使用X射线光电子能谱分析装置从表面侧进行测定,由检测出的Pd的原子%(atomic%)浓度求出。具体而言,将钯(Pd)的原子%浓度除以碳(C)的原子%浓度所得的数值作为催化剂的存在量(钯存在量(Pd存在量))。镀敷形成层的基材侧的催化剂的存在量如下求出,利用氩离子从基材侧进行处理,处理至规定的部位后,使用X射线光电子能谱分析装置用与上述同样的方法求出镀敷形成层的基材侧的镀敷催化剂的存在量(钯存在量(Pd存在量))。
(评价基准)
〇:确认了Pd的存在量是表面侧>基材侧(Ca>Cb)。
×:未能确认Pd的存在量是表面侧>基材侧(Ca>Cb)。
[常态下的剥离强度]
根据JIS C6471进行剥离强度的测定。更详细而言,在各层叠体的镀铜层表面以3mm宽度将抗蚀剂进行图案化后,通过蚀刻除去剩余的镀铜层,得到样品。将所得的样品用双面胶固定在增强板,从增强板向90°方向剥离镀铜层进行强度测定,由此测定剥离强度。剥离速度为50mm/分钟。表中的评价基准如以下所述。
(评价基准)
〇:剥离强度为5N以上。
△:剥离强度为3N以上且小于5N。
×:剥离强度小于3N。
[热处理后的剥离强度]
在各层叠体的镀铜层表面以3mm宽度将抗蚀剂进行图案化后,通过蚀刻除去剩余的镀铜层,得到样品。将该样品在温度调整为150℃的干燥机中保存240小时。将从干燥机中取出的样品用双面胶固定在增强板,从增强板向90°方向剥离镀铜层,测定剥离强度。剥离速度为50mm/分钟。表中的评价基准如下所述。
(评价基准)
〇:剥离强度为5N以上。
△:剥离强度为3N以上且小于5N。
×:剥离强度小于3N。
[湿热处理后的剥离强度]
在各层叠体的镀铜层表面以3mm宽度将抗蚀剂进行图案化后,通过蚀刻除去剩余的镀铜层,由此得到样品。将该样品在调整至温度85℃湿度85%的湿热机中保存240小时。将从干燥机取出的样品用双面胶固定在增强板,从增强板向90°方向剥离镀铜层,测定剥离强度。剥离速度为50mm/分钟。表中的评价基准如下所述。
(评价基准)
〇:剥离强度为5N以上。
△:剥离强度为3N以上且小于5N。
×:剥离强度小于3N。
[焊锡耐热试验]
将各层叠体切割成30mm×30mm。以各层叠体的镀铜层侧为焊锡浴槽侧,进行60秒浮选(float)处理。肉眼观察处理后的外观进行确认,确认了有无收缩、膨胀及剥离。从240℃至340℃每10℃进行试验,求出没有收缩、膨胀及剥离的最大温度。需要说明的是,表1中,于240℃发生收缩、膨胀及剥离中的任一者时,记载为“小于240℃”,于340℃,收缩、膨胀及剥离均未被观察到时,记载为“340℃<”。
[表1]
本申请基于2018年9月5日向日本专利局提出申请的日本专利申请(日本特愿2018-166271),其内容作为参考引入本文。
产业上的可利用性
本发明的层叠体具有作为能用于挠性印刷布线板的材料的产业上的可利用性。
Claims (10)
1.层叠体,其包含基材和镀敷形成层,所述镀敷形成层配置在所述基材的两面中的至少一个面且含有热塑性树脂及镀敷催化剂,
所述镀敷形成层还满足下述条件(1)及/或条件(2),
(1)所述镀敷形成层含有使所述镀敷催化剂分散的分散剂,
(2)所述镀敷形成层的表面侧的所述镀敷催化剂的存在量比所述镀敷形成层的所述基材侧的所述镀敷催化剂的存在量大。
2.如权利要求1所述的层叠体,其中,所述分散剂是与所述镀敷催化剂所含的金属原子相互作用而键合的化合物。
3.如权利要求2所述的层叠体,其中,所述化合物的末端基团是含有氮原子的官能团。
4.如权利要求1~3中任一项所述的层叠体,其中,所述镀敷形成层包含含有所述热塑性树脂的树脂层、和配置在所述树脂层上且含有所述镀敷催化剂的催化剂层。
5.如权利要求4所述的层叠体,其中,所述催化剂层含有所述分散剂。
6.如权利要求4或5所述的层叠体,其中,所述镀敷形成层还包含边界层,所述边界层配置在所述树脂层与所述催化剂层之间,在所述边界层中所述镀敷催化剂及所述分散剂渗透于热塑性树脂。
7.如权利要求1~6中任一项所述的层叠体,其中,所述基材是热固性聚酰亚胺树脂。
8.如权利要求1~7中任一项所述的层叠体,其中,所述热塑性树脂是热塑性聚酰亚胺树脂。
9.如权利要求1~8中任一项所述的层叠体,其中,所述镀敷催化剂含有钯及/或银。
10.如权利要求1~9中任一项所述的层叠体,其还包含配置在所述镀敷形成层上的金属镀敷层。
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JP2018-166271 | 2018-09-05 | ||
JP2018166271 | 2018-09-05 | ||
PCT/JP2019/034877 WO2020050338A1 (ja) | 2018-09-05 | 2019-09-04 | 積層体 |
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US (1) | US11946143B2 (zh) |
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KR (1) | KR20210053937A (zh) |
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5462773A (en) * | 1992-12-28 | 1995-10-31 | Xerox Corporation | Synchronized process for catalysis of electroless metal plating on plastic |
JP2005116745A (ja) * | 2003-10-07 | 2005-04-28 | Matsushita Electric Works Ltd | 導体被覆ポリイミドフィルムの製造方法及び導体被覆ポリイミドフィルム |
TW200710271A (en) * | 2005-04-28 | 2007-03-16 | Kaneka Corp | Material for plating and use thereof |
WO2018151073A1 (ja) * | 2017-02-14 | 2018-08-23 | 日産化学工業株式会社 | 配線形成方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4408295B2 (ja) * | 2000-05-12 | 2010-02-03 | 東レエンジニアリング株式会社 | ポリイミド樹脂前駆体溶液を用いた電子部品用基材及びその基材の製造方法 |
WO2002059209A1 (fr) | 2001-01-24 | 2002-08-01 | Toray Engineering Company,Limited | Solution de precurseur de resines polyimides, lamines pour composants electroniques fabriques a l'aide desdites solutions, et procede de production desdits lamines |
JP2004152852A (ja) * | 2002-10-29 | 2004-05-27 | Toray Eng Co Ltd | 電子部品用回路基材の製造方法 |
KR20160014113A (ko) | 2007-12-11 | 2016-02-05 | 가부시키가이샤 가네카 | 적층체, 적층체의 제조 방법, 및 연성 인쇄 배선판, 연성 인쇄 배선판의 제조 방법 |
JP5595363B2 (ja) * | 2011-09-30 | 2014-09-24 | 富士フイルム株式会社 | 穴付き積層体の製造方法、穴付き積層体、多層基板の製造方法、下地層形成用組成物 |
JP6072330B2 (ja) * | 2015-04-01 | 2017-02-01 | 宮城県 | パターンめっき用無電解めっき前処理インキ組成物及び無電解めっき皮膜の形成方法 |
JP6312766B2 (ja) * | 2016-09-23 | 2018-04-18 | 日本エレクトロプレイテイング・エンジニヤース株式会社 | 金属膜の積層構造 |
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- 2019-09-04 CN CN201980048410.4A patent/CN112437724A/zh active Pending
- 2019-09-04 KR KR1020217009517A patent/KR20210053937A/ko not_active Application Discontinuation
- 2019-09-04 US US17/273,908 patent/US11946143B2/en active Active
- 2019-09-04 JP JP2020541283A patent/JPWO2020050338A1/ja active Pending
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5462773A (en) * | 1992-12-28 | 1995-10-31 | Xerox Corporation | Synchronized process for catalysis of electroless metal plating on plastic |
JP2005116745A (ja) * | 2003-10-07 | 2005-04-28 | Matsushita Electric Works Ltd | 導体被覆ポリイミドフィルムの製造方法及び導体被覆ポリイミドフィルム |
TW200710271A (en) * | 2005-04-28 | 2007-03-16 | Kaneka Corp | Material for plating and use thereof |
WO2018151073A1 (ja) * | 2017-02-14 | 2018-08-23 | 日産化学工業株式会社 | 配線形成方法 |
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US20210348276A1 (en) | 2021-11-11 |
KR20210053937A (ko) | 2021-05-12 |
US11946143B2 (en) | 2024-04-02 |
TW202017442A (zh) | 2020-05-01 |
JPWO2020050338A1 (ja) | 2021-08-30 |
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