CN112394621A - 一种cof曝光机内玻璃掩模版的异物检测和清除的方法 - Google Patents
一种cof曝光机内玻璃掩模版的异物检测和清除的方法 Download PDFInfo
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- CN112394621A CN112394621A CN202011343986.4A CN202011343986A CN112394621A CN 112394621 A CN112394621 A CN 112394621A CN 202011343986 A CN202011343986 A CN 202011343986A CN 112394621 A CN112394621 A CN 112394621A
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- foreign matter
- glass mask
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- exposure machine
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- 239000011521 glass Substances 0.000 title claims abstract description 38
- 238000000034 method Methods 0.000 title claims abstract description 12
- 238000001514 detection method Methods 0.000 claims abstract description 23
- 230000003068 static effect Effects 0.000 claims abstract description 10
- 239000006096 absorbing agent Substances 0.000 claims description 9
- 238000003860 storage Methods 0.000 claims description 9
- 230000006698 induction Effects 0.000 claims description 6
- 230000005540 biological transmission Effects 0.000 claims description 4
- 230000005611 electricity Effects 0.000 claims description 4
- 238000004140 cleaning Methods 0.000 abstract description 2
- 238000001914 filtration Methods 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 description 4
- 229920000742 Cotton Polymers 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 206010063385 Intellectualisation Diseases 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
- G03F7/70925—Cleaning, i.e. actively freeing apparatus from pollutants, e.g. using plasma cleaning
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- General Physics & Mathematics (AREA)
- Environmental & Geological Engineering (AREA)
- Plasma & Fusion (AREA)
- Life Sciences & Earth Sciences (AREA)
- Atmospheric Sciences (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
Description
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202011343986.4A CN112394621B (zh) | 2020-11-26 | 2020-11-26 | 一种cof曝光机内玻璃掩模版的异物检测和清除的方法 |
Applications Claiming Priority (1)
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CN202011343986.4A CN112394621B (zh) | 2020-11-26 | 2020-11-26 | 一种cof曝光机内玻璃掩模版的异物检测和清除的方法 |
Publications (2)
Publication Number | Publication Date |
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CN112394621A true CN112394621A (zh) | 2021-02-23 |
CN112394621B CN112394621B (zh) | 2023-07-04 |
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CN202011343986.4A Active CN112394621B (zh) | 2020-11-26 | 2020-11-26 | 一种cof曝光机内玻璃掩模版的异物检测和清除的方法 |
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CN (1) | CN112394621B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114433570A (zh) * | 2022-04-06 | 2022-05-06 | 深圳市龙图光电有限公司 | 半导体芯片用掩模版膜下异物清理方法及设备 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6327021B1 (en) * | 1998-07-06 | 2001-12-04 | Mitsubishi Denki Kabushiki Kaisha | Mask inspection system and method of manufacturing semiconductor device |
CN108267936A (zh) * | 2018-03-22 | 2018-07-10 | 京东方科技集团股份有限公司 | 一种曝光机机台异物检测和去除装置及曝光机 |
CN109562417A (zh) * | 2016-06-17 | 2019-04-02 | 堺显示器制品株式会社 | 异物去除装置、异物去除系统和异物去除方法 |
CN210835584U (zh) * | 2019-11-29 | 2020-06-23 | 长鑫存储技术有限公司 | 曝光装置 |
-
2020
- 2020-11-26 CN CN202011343986.4A patent/CN112394621B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6327021B1 (en) * | 1998-07-06 | 2001-12-04 | Mitsubishi Denki Kabushiki Kaisha | Mask inspection system and method of manufacturing semiconductor device |
CN109562417A (zh) * | 2016-06-17 | 2019-04-02 | 堺显示器制品株式会社 | 异物去除装置、异物去除系统和异物去除方法 |
CN108267936A (zh) * | 2018-03-22 | 2018-07-10 | 京东方科技集团股份有限公司 | 一种曝光机机台异物检测和去除装置及曝光机 |
CN210835584U (zh) * | 2019-11-29 | 2020-06-23 | 长鑫存储技术有限公司 | 曝光装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114433570A (zh) * | 2022-04-06 | 2022-05-06 | 深圳市龙图光电有限公司 | 半导体芯片用掩模版膜下异物清理方法及设备 |
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CN112394621B (zh) | 2023-07-04 |
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Effective date of registration: 20210308 Address after: 518100 floors 1-4, 2-3, building a, Huangpu Runhe Industrial Park, South Ring Road, Huangpu Community, Shajing street, Bao'an District, Shenzhen City, Guangdong Province Applicant after: LEADER-TECH ELECTRONICS (SHENZHEN) Inc. Address before: 221300 north of Liaohe Road and west of Huashan Road, Pizhou Economic Development Zone, Xuzhou City, Jiangsu Province Applicant before: Jiangsu Shangda Electronics Co.,Ltd. |
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Effective date of registration: 20240122 Address after: 221300 north of Liaohe Road and west of Huashan Road, Pizhou Economic Development Zone, Xuzhou City, Jiangsu Province Patentee after: Jiangsu SHANGDA Semiconductor Co.,Ltd. Country or region after: China Address before: 518100 floors 1-4, 2-3, building a, Huangpu Runhe Industrial Park, South Ring Road, Huangpu Community, Shajing street, Bao'an District, Shenzhen City, Guangdong Province Patentee before: LEADER-TECH ELECTRONICS (SHENZHEN) Inc. Country or region before: China |
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