CN112394621A - 一种cof曝光机内玻璃掩模版的异物检测和清除的方法 - Google Patents

一种cof曝光机内玻璃掩模版的异物检测和清除的方法 Download PDF

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CN112394621A
CN112394621A CN202011343986.4A CN202011343986A CN112394621A CN 112394621 A CN112394621 A CN 112394621A CN 202011343986 A CN202011343986 A CN 202011343986A CN 112394621 A CN112394621 A CN 112394621A
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foreign matter
glass mask
foreign
exposure machine
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CN112394621B (zh
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戚爱康
计晓东
孙彬
沈洪
李晓华
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Jiangsu Shangda Semiconductor Co ltd
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7085Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70925Cleaning, i.e. actively freeing apparatus from pollutants, e.g. using plasma cleaning

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  • Preparing Plates And Mask In Photomechanical Process (AREA)
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Abstract

本发明涉及一种COF曝光机内玻璃掩模版的异物检测和清除的方法,采用精密异物检测装置和异物清除装置,对COF曝光机内玻璃掩模版进行异物检测和异物清除;异物检测由入射光源发射入射光对玻璃掩模版进行照射,玻璃掩模版上的异物被照射后反射光生成异物坐标数据,将数据传输到处理器;异物清除采用异物清除装置,异物清除装置读取精密异物检测装置传出的数据,进行定点清除异物,由强力去静电离子风扇对异物进行吹风和静电去除,被去除静电的异物没有黏附性,同时异物吸取器强力把异物吸走,通过异物过滤器过滤后被异物储存器储存槽储存。本发明内置于曝光机内部,进行检测和清洁时不需要拆卸玻璃掩模版,能对小于1um的异物进行检测去除。

Description

一种COF曝光机内玻璃掩模版的异物检测和清除的方法
技术领域
本发明涉及一种COF曝光机内玻璃掩模版的异物检测和清除的方法,属于COF制造技术领域。
背景技术
随着科学技术的不断发展,电子产品越来越向小型化、智能化、高性能以及高 可靠性方向发展。封装基板由FPC像COF过渡,COF基板的PITCH值越来越小,供封装中的引脚也越来越,密集和精密,而集成电路封装不仅直接影响着集成电路、电子模块乃至整机的性能,而且还制约着整个电子系统的小型化、低成本和可靠性。COF基板的线路制作主要靠线路曝光来完成,良好的玻璃掩模版是精密线路制作的前提,提高玻璃掩模版质量是提高生产良率的前提保障。
现有的COF生产曝光用的玻璃掩模版表面出现异物都是人工从曝光机内取出,并放在显微镜的下面,人工目视检查,并用粘尘棉棒对异物进行粘取去除。每次从曝光机内部拿取安装玻璃掩模版,容易对玻璃掩模版造成划伤和保护膜(Pellicle)破损,并且造成玻璃掩模版二次异物污染。人工对玻璃掩模版进行异物检查时,小于10um的异物目视一般不容易不检查。往往这种异物是造成线路不良的关键因素。人工对玻璃掩模版进行异物清洁时,使用的粘尘棉棒粘除异物时,粘尘棒上的碎屑脱落在会玻璃掩模版上,会造成玻璃掩模版再次被污染。
发明内容
为了克服上述现有技术的不足之处,本发明提供一种COF曝光机内玻璃掩模版的异物检测和清除的方法,不用拆卸玻璃掩模版,在曝光机内部完成玻璃掩模版的异物自动检测和清洁。
本发明是通过如下技术方案实现的:一种COF曝光机内玻璃掩模版的异物检测和清除的方法,其特征在于:采用精密异物检测装置和异物清除装置,对COF曝光机内玻璃掩模版进行异物检测和异物清除;
所述异物检测的方法采用精密异物检测装置,精密异物检测装置包括入射光源、感应传感器和连接导线,首先由入射光源发射入射光对玻璃掩模版进行照射,玻璃掩模版上的异物被照射后会发生光反射,反射光会被感应传感器感应到,最终生成异物坐标数据,由连接导线将数据传输到处理器;
所述异物清除的方法采用异物清除装置,异物清除装置包括强力去静电离子风扇、异物吸取器、物清除装置框体和传输导线,异物吸取器包括异物过滤器和异物储存器,异物清除装置读取精密异物检测装置传出的数据,进行定点清除异物,由强力去静电离子风扇对异物进行吹风,并进行静电去除,被去除静电的异物没有黏附性,同时异物吸取器强力把异物吸走,通过异物过滤器过滤后被异物储存器储存槽储存。
本发明的有益效果是:本发明内置于曝光机内部,对玻璃掩模版进行检测和清洁时,不需要从曝光机内部拆卸玻璃掩模版,避免对玻璃掩模版造成划伤和保护膜破损,和造成玻璃掩模版二次异物污染。能对小于1um的异物进行检测和去除,做到无法人工完成的检测项目。检查效率和品质高,为生产效率和品质的提升,提供了强有力的保障。
附图说明
下面根据附图和实施例对本发明进一步说明。
图1是本发明的结构示意图;
图2是本发明的精密异物检测装置结构示意图;
图3是本发明的异物清除装置结构示意图。
图中:1、精密异物检测装置;2、异物清除装置;3、玻璃掩模版;4、异物;11、入射光源;12、感应传感器;13、连接导线;21、强力去静电离子风扇;22、异物吸取器;221、异物过滤器;222、异物储存器;23、异物清除装置框体;24、传输导线。
具体实施方式
如图1所示的一种COF曝光机内玻璃掩模版的异物检测和清除的方法,其特征在于:采用精密异物检测装置1和异物清除装置2,对COF曝光机内玻璃掩模版进行异物检测和异物清除;
如图2所示的异物检测的方法采用精密异物检测装置1,精密异物检测装置1包括入射光源11、感应传感器12和连接导线13,首先由入射光源1发射入射光对玻璃掩模版3进行照射,玻璃掩模版3上的异物4被照射后会发生光反射,反射光会被感应传感器12感应到,最终生成异物4坐标数据,由连接导线13将数据传输到处理器;
如图3所示的异物清除的方法采用异物清除装置2,异物清除装置2包括强力去静电离子风扇21、异物吸取器22、物清除装置框体23和传输导线24,异物吸取器22包括异物过滤器221和异物储存器222,异物清除装置2读取精密异物检测装置1传出的数据,进行定点清除异物4,由强力去静电离子风扇21对异物4进行吹风,并进行静电去除,被去除静电的异物4没有黏附性,同时异物吸取器22强力把异物吸走,通过异物过滤器221过滤后被异物储存器222储存槽储存。

Claims (1)

1.一种COF曝光机内玻璃掩模版的异物检测和清除的方法,其特征在于:采用精密异物检测装置(1)和异物清除装置(2),对COF曝光机内玻璃掩模版进行异物检测和异物清除;
所述异物检测的方法采用精密异物检测装置(1),精密异物检测装置(1)包括入射光源(11)、感应传感器(12)和连接导线(13),首先由入射光源(1)发射入射光对玻璃掩模版(3)进行照射,玻璃掩模版(3)上的异物(4)被照射后会发生光反射,反射光会被感应传感器(12)感应到,最终生成异物(4)坐标数据,由连接导线(13)将数据传输到处理器;
所述异物清除的方法采用异物清除装置(2),异物清除装置(2)包括强力去静电离子风扇(21)、异物吸取器(22)、物清除装置框体(23)和传输导线(24),异物吸取器(22)包括异物过滤器(221)和异物储存器(222),异物清除装置(2)读取精密异物检测装置(1)传出的数据,进行定点清除异物(4),由强力去静电离子风扇(21)对异物(4)进行吹风,并进行静电去除,被去除静电的异物(4)没有黏附性,同时异物吸取器(22)强力把异物吸走,通过异物过滤器(221)过滤后被异物储存器(222)储存槽储存。
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114433570A (zh) * 2022-04-06 2022-05-06 深圳市龙图光电有限公司 半导体芯片用掩模版膜下异物清理方法及设备

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US6327021B1 (en) * 1998-07-06 2001-12-04 Mitsubishi Denki Kabushiki Kaisha Mask inspection system and method of manufacturing semiconductor device
CN108267936A (zh) * 2018-03-22 2018-07-10 京东方科技集团股份有限公司 一种曝光机机台异物检测和去除装置及曝光机
CN109562417A (zh) * 2016-06-17 2019-04-02 堺显示器制品株式会社 异物去除装置、异物去除系统和异物去除方法
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Publication number Priority date Publication date Assignee Title
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CN109562417A (zh) * 2016-06-17 2019-04-02 堺显示器制品株式会社 异物去除装置、异物去除系统和异物去除方法
CN108267936A (zh) * 2018-03-22 2018-07-10 京东方科技集团股份有限公司 一种曝光机机台异物检测和去除装置及曝光机
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114433570A (zh) * 2022-04-06 2022-05-06 深圳市龙图光电有限公司 半导体芯片用掩模版膜下异物清理方法及设备

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