CN112372508A - 一种修整边缘抛光垫的系统及方法 - Google Patents
一种修整边缘抛光垫的系统及方法 Download PDFInfo
- Publication number
- CN112372508A CN112372508A CN202011238390.8A CN202011238390A CN112372508A CN 112372508 A CN112372508 A CN 112372508A CN 202011238390 A CN202011238390 A CN 202011238390A CN 112372508 A CN112372508 A CN 112372508A
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- Prior art keywords
- polishing pad
- dresser
- edge
- polishing
- new
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000005498 polishing Methods 0.000 title claims abstract description 134
- 238000000034 method Methods 0.000 title claims abstract description 30
- 238000009966 trimming Methods 0.000 title abstract description 10
- 230000033001 locomotion Effects 0.000 claims abstract description 21
- 238000007517 polishing process Methods 0.000 claims abstract description 16
- 238000012876 topography Methods 0.000 claims abstract description 7
- 230000005540 biological transmission Effects 0.000 claims description 14
- 230000003750 conditioning effect Effects 0.000 claims description 11
- 229910021641 deionized water Inorganic materials 0.000 claims description 5
- 239000008367 deionised water Substances 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 5
- 230000006866 deterioration Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 230000000737 periodic effect Effects 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202011238390.8A CN112372508A (zh) | 2020-11-09 | 2020-11-09 | 一种修整边缘抛光垫的系统及方法 |
Applications Claiming Priority (1)
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CN202011238390.8A CN112372508A (zh) | 2020-11-09 | 2020-11-09 | 一种修整边缘抛光垫的系统及方法 |
Publications (1)
Publication Number | Publication Date |
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CN112372508A true CN112372508A (zh) | 2021-02-19 |
Family
ID=74579004
Family Applications (1)
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CN202011238390.8A Pending CN112372508A (zh) | 2020-11-09 | 2020-11-09 | 一种修整边缘抛光垫的系统及方法 |
Country Status (1)
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CN (1) | CN112372508A (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113400176A (zh) * | 2021-06-21 | 2021-09-17 | 西安奕斯伟硅片技术有限公司 | 一种硅片边缘抛光装置以及方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011056615A (ja) * | 2009-09-09 | 2011-03-24 | Disco Abrasive Syst Ltd | 研磨パッドのドレッシング方法 |
CN102339742A (zh) * | 2011-09-01 | 2012-02-01 | 上海宏力半导体制造有限公司 | 多晶硅化学机械研磨工艺的研磨垫预研磨方法 |
JP2014033123A (ja) * | 2012-08-06 | 2014-02-20 | Disco Abrasive Syst Ltd | 研磨装置 |
CN109605207A (zh) * | 2018-12-27 | 2019-04-12 | 西安奕斯伟硅片技术有限公司 | 晶圆处理方法和装置 |
CN110064984A (zh) * | 2019-05-06 | 2019-07-30 | 西安奕斯伟硅片技术有限公司 | 一种晶圆处理方法及装置 |
-
2020
- 2020-11-09 CN CN202011238390.8A patent/CN112372508A/zh active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011056615A (ja) * | 2009-09-09 | 2011-03-24 | Disco Abrasive Syst Ltd | 研磨パッドのドレッシング方法 |
CN102339742A (zh) * | 2011-09-01 | 2012-02-01 | 上海宏力半导体制造有限公司 | 多晶硅化学机械研磨工艺的研磨垫预研磨方法 |
JP2014033123A (ja) * | 2012-08-06 | 2014-02-20 | Disco Abrasive Syst Ltd | 研磨装置 |
CN109605207A (zh) * | 2018-12-27 | 2019-04-12 | 西安奕斯伟硅片技术有限公司 | 晶圆处理方法和装置 |
CN110064984A (zh) * | 2019-05-06 | 2019-07-30 | 西安奕斯伟硅片技术有限公司 | 一种晶圆处理方法及装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113400176A (zh) * | 2021-06-21 | 2021-09-17 | 西安奕斯伟硅片技术有限公司 | 一种硅片边缘抛光装置以及方法 |
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PB01 | Publication | ||
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SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20220805 Address after: Room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi 710065 Applicant after: Xi'an yisiwei Material Technology Co.,Ltd. Applicant after: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. Address before: No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi 710065 Applicant before: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. Applicant before: Xi'an yisiwei Material Technology Co.,Ltd. |
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CB02 | Change of applicant information | ||
CB02 | Change of applicant information |
Address after: Room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi 710065 Applicant after: Xi'an Yisiwei Material Technology Co.,Ltd. Applicant after: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. Address before: Room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi 710065 Applicant before: Xi'an yisiwei Material Technology Co.,Ltd. Applicant before: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. |