CN1123466A - 曝光方法以及用该方法制造半导体集成电路器件的方法 - Google Patents

曝光方法以及用该方法制造半导体集成电路器件的方法 Download PDF

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Publication number
CN1123466A
CN1123466A CN 95116667 CN95116667A CN1123466A CN 1123466 A CN1123466 A CN 1123466A CN 95116667 CN95116667 CN 95116667 CN 95116667 A CN95116667 A CN 95116667A CN 1123466 A CN1123466 A CN 1123466A
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CN
China
Prior art keywords
mentioned
optical system
light
exposure
wafer
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Pending
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CN 95116667
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English (en)
Chinese (zh)
Inventor
小森谷进
町田贵裕
国吉伸治
入来信行
前岛央
小林正道
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Hitachi Ltd
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Hitachi Ltd
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Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of CN1123466A publication Critical patent/CN1123466A/zh
Pending legal-status Critical Current

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
CN 95116667 1994-08-25 1995-08-24 曝光方法以及用该方法制造半导体集成电路器件的方法 Pending CN1123466A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP200480/94 1994-08-25
JP6200480A JPH0864500A (ja) 1994-08-25 1994-08-25 信号処理方法および位置検出光学系の調整方法およびターゲットパターンならびに露光方法および露光装置

Publications (1)

Publication Number Publication Date
CN1123466A true CN1123466A (zh) 1996-05-29

Family

ID=16425021

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 95116667 Pending CN1123466A (zh) 1994-08-25 1995-08-24 曝光方法以及用该方法制造半导体集成电路器件的方法

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Country Link
EP (1) EP0701174A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JPH0864500A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
CN (1) CN1123466A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
TW (1) TW283254B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1311523C (zh) * 2003-07-01 2007-04-18 株式会社瑞萨科技 半导体晶片、半导体元件及其制造方法
CN101865706B (zh) * 2009-04-16 2012-12-12 上海华虹Nec电子有限公司 一种风车型划片槽的旋转测试方法
CN103098171A (zh) * 2010-09-13 2013-05-08 株式会社Orc制作所 投影曝光装置
CN113296354A (zh) * 2020-02-22 2021-08-24 长鑫存储技术有限公司 应用于半导体光刻工艺中的掩膜版及光刻工艺方法

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0841594A3 (en) * 1996-11-07 1999-08-25 Nikon Corporation Mark for position detection, mark detecting method and apparatus, and exposure system
JP4352614B2 (ja) * 1998-02-09 2009-10-28 株式会社ニコン 位置検出装置の調整方法
US6889162B1 (en) 2000-03-07 2005-05-03 Koninklijke Philips Electronics N.V. Wafer target design and method for determining centroid of wafer target
JP4611663B2 (ja) * 2004-05-07 2011-01-12 株式会社日立ハイテクノロジーズ 重ね合わせ誤差測定方法、重ね合わせ誤差測定装置、及び半導体デバイスの製造方法
US20050286052A1 (en) * 2004-06-23 2005-12-29 Kevin Huggins Elongated features for improved alignment process integration
US7763404B2 (en) * 2006-09-26 2010-07-27 Tokyo Electron Limited Methods and apparatus for changing the optical properties of resists
CN102483582B (zh) * 2009-08-24 2016-01-20 Asml荷兰有限公司 量测方法和设备、光刻设备、光刻处理单元和包括量测目标的衬底
NL2010458A (en) 2012-04-16 2013-10-17 Asml Netherlands Bv Lithographic apparatus, substrate and device manufacturing method background.
JP6285666B2 (ja) * 2013-09-03 2018-02-28 キヤノン株式会社 検出装置、リソグラフィ装置、物品の製造方法及び検出方法
TWI831502B (zh) * 2022-12-02 2024-02-01 鴻揚半導體股份有限公司 具有對準標記的板材及其製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4374915A (en) * 1981-07-30 1983-02-22 Intel Corporation High contrast alignment marker for integrated circuit fabrication
US4632557A (en) * 1985-01-23 1986-12-30 Harris Corporation Alignment target image enhancement for microlithography process
JP2897330B2 (ja) * 1990-04-06 1999-05-31 キヤノン株式会社 マーク検出装置及び露光装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1311523C (zh) * 2003-07-01 2007-04-18 株式会社瑞萨科技 半导体晶片、半导体元件及其制造方法
CN101865706B (zh) * 2009-04-16 2012-12-12 上海华虹Nec电子有限公司 一种风车型划片槽的旋转测试方法
CN103098171A (zh) * 2010-09-13 2013-05-08 株式会社Orc制作所 投影曝光装置
CN113296354A (zh) * 2020-02-22 2021-08-24 长鑫存储技术有限公司 应用于半导体光刻工艺中的掩膜版及光刻工艺方法

Also Published As

Publication number Publication date
JPH0864500A (ja) 1996-03-08
EP0701174A1 (en) 1996-03-13
TW283254B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1996-08-11

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