CN112259947B - Phased Array Antenna Test Module - Google Patents
Phased Array Antenna Test Module Download PDFInfo
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- CN112259947B CN112259947B CN202011268889.3A CN202011268889A CN112259947B CN 112259947 B CN112259947 B CN 112259947B CN 202011268889 A CN202011268889 A CN 202011268889A CN 112259947 B CN112259947 B CN 112259947B
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- 238000012360 testing method Methods 0.000 title claims abstract description 45
- 230000017525 heat dissipation Effects 0.000 claims abstract description 179
- 238000012546 transfer Methods 0.000 claims abstract description 17
- 238000009434 installation Methods 0.000 claims description 49
- 230000005855 radiation Effects 0.000 claims description 10
- 239000006185 dispersion Substances 0.000 claims 9
- 238000012935 Averaging Methods 0.000 claims 5
- 230000000694 effects Effects 0.000 description 14
- 239000000463 material Substances 0.000 description 11
- 238000010586 diagram Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 238000007789 sealing Methods 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
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- 230000002093 peripheral effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/02—Arrangements for de-icing; Arrangements for drying-out ; Arrangements for cooling; Arrangements for preventing corrosion
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R29/00—Arrangements for measuring or indicating electric quantities not covered by groups G01R19/00 - G01R27/00
- G01R29/08—Measuring electromagnetic field characteristics
- G01R29/10—Radiation diagrams of antennas
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- General Physics & Mathematics (AREA)
- Variable-Direction Aerials And Aerial Arrays (AREA)
Abstract
本发明的实施例提供了一种相控阵天线测试模组，涉及天线技术领域，相控阵天线测试模组包括相控阵天线板、散热均温板和鳍片散热板，散热均温板的正面安装在相控阵天线板的一侧表面，且散热均温板的正面与相控阵天线板之间还设置有第一导热垫，第一导热垫用于将相控阵天线板产生的热量传递至散热均温板，鳍片散热板设置在散热均温板的背面，且鳍片散热板上设置有多个散热鳍片。在实际测试时，相控阵天线板上产生的热量，通过第一导热垫后传递至散热均温板，散热均温板再将热量传递至鳍片散热板，并通过多个散热鳍片进行散热，由于采用散热鳍片进行散热，且传热效率高，有效解决了测试裸板的散热困难问题。
An embodiment of the present invention provides a phased array antenna test module, which relates to the field of antenna technology. The phased array antenna test module includes a phased array antenna board, a heat dissipation plate and a fin heat sink. The front of the heat dissipation plate is installed on a side surface of the phased array antenna board, and a first thermal pad is also arranged between the front of the heat dissipation plate and the phased array antenna board. The first thermal pad is used to transfer the heat generated by the phased array antenna board to the heat dissipation plate. The fin heat sink is arranged on the back of the heat dissipation plate, and a plurality of heat dissipation fins are arranged on the fin heat sink. During actual testing, the heat generated on the phased array antenna board is transferred to the heat dissipation plate through the first thermal pad, and the heat dissipation plate then transfers the heat to the fin heat sink, and dissipates the heat through a plurality of heat dissipation fins. Since the heat dissipation fins are used for heat dissipation and the heat transfer efficiency is high, the heat dissipation difficulty of the test bare board is effectively solved.
Description
Technical Field
The invention relates to the technical field of antennas, in particular to a phased array antenna test module.
Background
The existing flat-plate phased array antenna mainly comprises a multi-layer microwave plate and surface-mounted devices, and is required to be subjected to multi-procedure detection and debugging after processing is finished, but in the prior art, an antenna bare plate is usually adopted for debugging, a large number of high-heat-consumption devices are arranged on an antenna array surface, if the antenna array surface is not subjected to heat dissipation treatment in a debugging stage, a large number of devices can be possibly damaged, and in addition, the whole machine of the flat-plate phased array antenna is formed by splicing a plurality of antenna array surface units, so that the problem of difficulty in heat dissipation is accompanied by the increase of power consumption of the whole machine.
Disclosure of Invention
The invention aims to provide a phased array antenna test module, which has good heat dissipation effect, can alleviate the problem of difficult heat dissipation during testing and avoid the damage of devices.
Embodiments of the invention may be implemented as follows:
In a first aspect, an embodiment of the present invention provides a phased array antenna testing module, including a phased array antenna board, a heat dissipation temperature equalizing board and a fin heat dissipation board, where the front surface of the heat dissipation temperature equalizing board is installed on a surface of one side of the phased array antenna board, and a first heat conduction pad is further disposed between the front surface of the heat dissipation temperature equalizing board and the phased array antenna board, the first heat conduction pad is used for transferring heat generated by the phased array antenna board to the heat dissipation temperature equalizing board, the fin heat dissipation board is disposed on the back surface of the heat dissipation temperature equalizing board, and a plurality of heat dissipation fins are disposed on the fin heat dissipation board.
In an optional embodiment, the front surface of the heat dissipation temperature equalization plate is provided with a plurality of first installation limit posts, the heights of the plurality of first installation limit posts relative to the front surface of the heat dissipation temperature equalization plate are the same, and the end part of each first installation limit post is used for propping against the surface of the phased array antenna plate, so that a first installation gap is formed between the heat dissipation temperature equalization plate and the phased array antenna plate, and the first heat conduction pad is arranged in the first installation gap.
In an alternative embodiment, the distance between the front surface of the heat dissipation and temperature equalization plate and the phased array antenna plate is 70% -80% of the thickness of the first heat conduction pad.
In an optional embodiment, the end face of each first installation limiting post is further provided with a first connecting hole, the phased array antenna board is provided with a plurality of first connecting pieces, the first connecting pieces are arranged in one-to-one correspondence with the first installation limiting posts, and each first connecting piece is detachably assembled in the corresponding first connecting hole.
In an alternative embodiment, the first thermal pad includes a plurality of thermal conductive strips spaced apart and disposed in parallel between the phased array antenna panel and the heat sink and temperature equalizing panel.
In an alternative embodiment, the phased array antenna test module further includes an electrically controlled heat conducting plate, the electrically controlled heat conducting plate is connected with the heat dissipation and temperature equalization plate, a radio frequency radiation area and a digital circuit area are arranged on the phased array antenna plate, the heat dissipation and temperature equalization plate is installed in the radio frequency radiation area, and the electrically controlled heat conducting plate is installed in the digital circuit area.
In an alternative embodiment, the edge of the heat dissipation temperature equalizing plate is provided with a dustproof protection surrounding strip, and the dustproof protection surrounding strip abuts against the edge of the phased array antenna so as to be blocked between the phased array antenna and the heat dissipation temperature equalizing plate.
In an optional embodiment, the edge of the fin heat dissipation plate is further provided with a spliced waterproof groove, and the spliced waterproof groove is located at the edge of one side surface of the fin heat dissipation plate away from the heat dissipation temperature equalizing plate.
In an optional embodiment, a second heat conducting pad is further arranged between the fin heat dissipation plate and the back surface of the heat dissipation temperature equalization plate, the second heat conducting pad is used for transferring heat on the heat dissipation temperature equalization plate to the fin heat dissipation plate, and the fin heat dissipation plate is detachably connected with the heat dissipation temperature equalization plate.
In an optional embodiment, a plurality of second installation limiting columns are arranged on the back surface of the heat dissipation temperature equalizing plate, the heights of the second installation limiting columns relative to the back surface of the heat dissipation temperature equalizing plate are the same, and the end parts of the second installation limiting columns are used for propping against the surface of the fin heat dissipation plate so that a second installation gap is formed between the heat dissipation temperature equalizing plate and the fin heat dissipation plate, and the second heat conduction pad is arranged in the second installation gap.
The beneficial effects of the embodiment of the invention include, for example:
According to the phased array antenna test module provided by the embodiment of the invention, the radiating temperature-equalizing plate is arranged on one side surface of the phased array antenna plate, the first heat conduction pad is arranged between the front surface of the radiating temperature-equalizing plate and the phased array antenna plate, the fin radiating plate is arranged on the back surface of the radiating temperature-equalizing plate, and the plurality of radiating fins are arranged on the fin radiating plate. During actual testing, heat generated on the phased array antenna board is transferred to the heat dissipation temperature equalization plate after passing through the first heat conduction pad, and the heat dissipation temperature equalization plate transfers the heat to the fin heat dissipation plate and dissipates the heat through the plurality of heat dissipation fins.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a phased array antenna testing module according to a first embodiment of the present invention under a first view angle;
Fig. 2 is a schematic structural diagram of a phased array antenna testing module according to a first embodiment of the present invention under a second view angle;
fig. 3 is a schematic structural diagram of the heat dissipation and temperature uniformity plate in fig. 1 at a first view angle;
fig. 4 is a schematic structural diagram of the heat dissipation and temperature uniformity plate in fig. 1 under a second view angle;
FIG. 5 is an enlarged partial schematic view of V in FIG. 3;
fig. 6 is a schematic diagram of an assembly structure of a phased array antenna test module according to a first embodiment of the present invention;
fig. 7 is a schematic structural diagram of a phased array antenna testing module according to a second embodiment of the present invention;
fig. 8 is a schematic structural diagram of the heat dissipation and temperature equalization plate in fig. 7.
The icons are 100-phased array antenna test module, 110-phased array antenna board, 111-radio frequency radiation area, 113-digital circuit area, 130-heat dissipation temperature equalizing board, 131-first installation limit column, 133-first connecting hole, 135-first connecting piece, 137-dustproof protection surrounding strip, 139-splice waterproof tank, 150-fin heat dissipation board, 151-heat dissipation fin, 153-second installation limit column, 155-second connecting hole, 157-second connecting piece, 170-electric control heat conduction board, 180-first heat conduction pad, 181-heat conduction strip and 190-second heat conduction pad.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments of the present invention. The components of the embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the invention, as presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
It should be noted that like reference numerals and letters refer to like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.
In the description of the present invention, it should be noted that, if the terms "upper", "lower", "inner", "outer", and the like indicate an azimuth or a positional relationship based on the azimuth or the positional relationship shown in the drawings, or the azimuth or the positional relationship in which the inventive product is conventionally put in use, it is merely for convenience of describing the present invention and simplifying the description, and it is not indicated or implied that the apparatus or element referred to must have a specific azimuth, be configured and operated in a specific azimuth, and thus it should not be construed as limiting the present invention.
Furthermore, the terms "first," "second," and the like, if any, are used merely for distinguishing between descriptions and not for indicating or implying a relative importance.
As disclosed in the background art, in the prior art, a bare board is generally adopted for debugging, so that the problem of difficult heat dissipation is caused, a large number of devices are possibly damaged, the problems are unavoidable because the phased array antenna array panel needs to undergo the stages of circuit debugging, darkroom testing, environment testing and the like, and the solutions adopted in the industry of the problems at the present stage mainly comprise the steps of manufacturing independent testing tools or adding some peripheral protection measures in each link, and meanwhile, the operation specification requirements on participants of each link are higher.
In addition, the exposed devices of the phased array antenna board are easily damaged or crashed in the testing process or the transferring process of each link, but the operation specification of a participant is improved, the occurrence probability of the damage or crashing of the devices can be increased only by increasing the transferring protection box, the problem that the devices are damaged or crashed can not be solved is solved, in addition, the whole panel phased array antenna is generally composed of a plurality of phased array antenna boards, the fixing screws of the antenna boards are limited by the structure, small-size screws are generally selected, the assembly and disassembly are not facilitated for many times, the problem of the heat dissipation of the antenna boards is solved, an interface material with high heat conductivity is usually arranged between the high-power consumption devices and the heat dissipation tools, the heat of the devices is dissipated through the main body frame, but the heat conduction interface material (heat conduction pad) is not applicable to the assembly and disassembly of the antenna for many times.
In order to solve the above-mentioned problems, the embodiment of the present invention provides another phased array antenna test module, and it should be noted that, without collision, features in the embodiment of the present invention may be combined with each other.
First embodiment
Referring to fig. 1 to 6, the present embodiment provides a phased array antenna testing module 100, which can alleviate the problem of difficult heat dissipation of an antenna during testing, avoid the damage of devices, and has good heat dissipation effect, good protection effect, simple processing, low processing cost, and simplified assembly process.
The phased array antenna test module 100 provided in this embodiment includes a phased array antenna board 110, a heat dissipation temperature equalizing board 130, a fin heat dissipation plate 150 and an electric control heat conduction plate 170, wherein the front surface of the heat dissipation temperature equalizing board 130 is installed on one side surface of the phased array antenna board 110, and a first heat conduction pad 180 is further provided between the front surface of the heat dissipation temperature equalizing board 130 and the phased array antenna board 110, the first heat conduction pad 180 is used for transferring heat generated by the phased array antenna board 110 to the heat dissipation temperature equalizing board 130, the fin heat dissipation plate 150 is disposed on the back surface of the heat dissipation temperature equalizing board 130, and a plurality of heat dissipation fins 151 are provided on the fin heat dissipation plate 150. The electric control heat-conducting plate 170 is connected with the heat dissipation temperature-equalizing plate 130, the phased array antenna plate 110 is provided with a radio frequency radiation area 111 and a digital circuit area 113, the heat dissipation temperature-equalizing plate 130 is arranged in the radio frequency radiation area 111, and the electric control heat-conducting plate 170 is arranged in the digital circuit area 113.
In this embodiment, the heat dissipation and temperature equalization plate 130 and the fin heat dissipation plate 150 are integrally arranged, that is, a plurality of heat dissipation fins 151 are arranged on the back surface of the heat dissipation and temperature equalization plate 130 to dissipate heat, and the integral structure simplifies the assembly structure, and only the heat dissipation and temperature equalization plate 130 and the phased array antenna plate 110 are required to be assembled together, which is quite convenient. Specifically, the heat dissipation and temperature uniformity plate 130, the fin heat dissipation plate 150 and the heat dissipation fins 151 are made of metal or alloy materials with high thermal conductivity, for example, aluminum alloy, wherein heat generated by the phased array antenna plate 110 is conducted to the heat dissipation and temperature uniformity plate 130 by the first heat conduction pad 180, the heat dissipation and temperature uniformity plate 130 plays roles of heat dissipation and uniform heat, and overhigh temperature caused by local heat concentration on the phased array antenna plate 110 is avoided.
In this embodiment, a plurality of integrated chips are mounted on a surface of a side of the phased array antenna board 110 connected to the heat dissipation and temperature equalization board 130, specifically, the plurality of integrated chips are mounted on the radio frequency radiation area 111 of the phased array antenna board 110, the top sides of the plurality of integrated chips are located in the same plane and form an installation plane of the phased array antenna board 110, the first heat conduction pad 180 is disposed on the installation plane, and a large amount of heat is generated by the plurality of integrated chips in a working or debugging state and is conducted to the heat dissipation and temperature equalization board 130 through the first heat conduction pad 180.
In this embodiment, the front surface of the heat dissipation and temperature equalization board 130 is provided with a plurality of first installation limit posts 131, the heights of the plurality of first installation limit posts 131 relative to the front surface of the heat dissipation and temperature equalization board 130 are the same, and the end of each first installation limit post 131 is used for propping against the surface of the phased array antenna board 110, so that a first installation gap is formed between the heat dissipation and temperature equalization board 130 and the phased array antenna board 110, and the first heat conduction pad 180 is disposed in the first installation gap. Through setting up a plurality of first installation spacing posts 131, a plurality of first installation spacing posts 131 are located between heat dissipation samming board 130 and phased array antenna board 110 when the equipment to support and hold the surface at phased array antenna board 110, make to have certain clearance between heat dissipation samming board 130 and the looks accuse needle antenna board, convenient holding first heat conduction pad 180, and restrict the deflection of first heat conduction pad 180, avoid first heat conduction pad 180 to be excessively extruded, influence heat transfer effect.
In this embodiment, the first thermal pad 180 is made of an interface material with high thermal conductivity, such as silica gel or a heat dissipation pad, which is not limited herein.
In this embodiment, the width of the first gap is smaller than the thickness of the first heat conducting pad 180, so that two sides of the first heat conducting pad 180 respectively abut against the heat dissipation temperature equalizing plate 130 and the phased array antenna plate 110 to ensure the heat transfer effect. Specifically, since the deformation of the interface material is maintained between 20% and 30% to exert the maximum performance thereof and the heat transfer effect is best, the distance between the front surface of the heat dissipation and temperature equalization plate 130 and the phased array antenna plate 110 is 70% to 80% of the thickness of the first heat conduction pad 180, so that the deformation of the interface material is controlled to ensure the heat transfer effect. I.e., the width of the first gap is 70% -80% of the thickness of the first thermal pad 180. Of course, the optimal deformation amount is different due to the difference of the interface materials, so the ratio between the first gap and the thickness of the first thermal pad 180 is merely illustrative and not limiting.
It should be noted that, the distance between the front surface of the heat dissipation and temperature equalization board 130 and the phased array antenna board 110 refers to the height of the first installation limit post 131 when the integrated chip is flush with the phased array antenna surface, and the distance between the installation plane and the heat dissipation and temperature equalization board 130 refers to the difference between the height of the first installation limit post 131 and the height of the integrated chip protrusion when the integrated chip protrusion is disposed on the phased array antenna surface.
In this embodiment, the end surface of each first mounting spacing post 131 is further provided with a first connection hole 133, the phased array antenna board 110 is provided with a plurality of first connection members 135, the plurality of first connection members 135 are disposed in one-to-one correspondence with the plurality of first mounting spacing posts 131, and each first connection member 135 is detachably assembled in the corresponding first connection hole 133. Specifically, the first connecting members 135 are screws, and the first connecting holes 133 are screw holes, that is, the screws pass through the phased array antenna panel 110 and are assembled in the corresponding screw holes, so that the phased array antenna panel 110 is fixed on the plurality of first installation limiting posts 131 through the screws, and the fixation between the phased array antenna panel and the heat dissipation and temperature equalization plate 130 is realized. Of course, the first connector 135 may be a pin or other connector such as an insert.
In the present embodiment, the first thermal pad 180 includes a plurality of thermal conductive strips 181, and the plurality of thermal conductive strips 181 are disposed between the phased array antenna panel 110 and the heat dissipation and temperature equalization panel 130 at intervals and in parallel. The two sides of each heat conducting strip 181 are respectively contacted with the phased array antenna board 110 and the heat dissipation temperature equalizing board 130, so that the heat transfer function is realized, and the distance between two adjacent heat conducting strips 181 is matched with the distance of the integrated chip on the phased array antenna board 110, so that each heat conducting strip 181 is attached to the surface of the corresponding integrated chip, and the heat transfer effect is better.
In this embodiment, the electrically-controlled heat conducting plate 170 is a high heat conducting metal plate, is integrally disposed at the edge of the heat dissipation and temperature equalization plate 130, and is fixed to the digital circuit area 113 of the phased array antenna plate 110 by screws. Since the digital circuit area 113 of the phased array antenna board 110 is provided with a large number of copper layers and heat conducting metal holes, in this embodiment, the frame heat conducting copper layers of the digital circuit area 113 of the phased array antenna board 110 are tightly attached to the electric control heat conducting plate 170 by screws, and the surfaces of the two are smooth surfaces, so that the two can be effectively attached by the screws, and the interface thermal resistance between the two is reduced.
In this embodiment, the edge of the heat dissipation and temperature equalization plate 130 is provided with a dustproof protection enclosure strip 137, and the dustproof protection enclosure strip 137 abuts against the edge of the phased array antenna to be blocked between the phased array antenna plate 110 and the heat dissipation and temperature equalization plate 130. Specifically, the dustproof protection enclosure strip 137 is a rubber strip, and the height of the dustproof protection enclosure strip is greater than the distance between the heat dissipation temperature equalization plate 130 and the phased array antenna plate 110, so that the dustproof protection enclosure strip 137 can be propped against the phased array antenna plate 110, the first installation gap is isolated from the outside, impurities such as external dust are prevented from entering between the phased array antenna plate 110 and the heat dissipation temperature equalization plate 130, a protection effect can be achieved, and damage to the phased array antenna plate 110 in the transportation process is avoided.
In this embodiment, the edge of the fin heat dissipation plate 150 is further provided with a spliced waterproof groove 139, and the spliced waterproof groove 139 is located at the edge of the fin heat dissipation plate 150 away from the side surface of the heat dissipation temperature equalizing plate 130, so that a waterproof function can be achieved. Specifically, during actual debugging, the plurality of phased array antenna boards 110 are required to be spliced together and fixed by using a fixed mounting frame, and a sealing surface corresponding to the spliced waterproof groove 139 is arranged on the fixed mounting frame, so that waterproof sealing of each phased array antenna test module 100 is realized.
According to the phased array antenna test module 100 provided by the embodiment, only the integrated installation of the antenna array surface module is needed to be considered in the whole design, the heat dissipation of each phased array antenna test module 100 is not needed to be considered independently, various heat conduction interface materials and heat transfer structures are not needed to be installed in the installation, and as each module is provided with an independent waterproof sealing structure, only the corresponding sealing surface is needed to be arranged on the integral fixed installation frame of the structure, the whole splicing installation procedure is reduced to the greatest extent, the operation risk of each link is reduced, and the integrated installation reliability of the module is improved.
In summary, according to the phased array antenna testing module 100 provided in the present embodiment, the heat dissipation and temperature equalization board 130 is installed on one side surface of the phased array antenna board 110, the first heat conduction pad 180 is disposed between the front surface of the heat dissipation and temperature equalization board 130 and the phased array antenna board 110, the fin heat dissipation board 150 is disposed on the back surface of the heat dissipation and temperature equalization board 130, and the plurality of heat dissipation fins 151 are disposed on the fin heat dissipation board 150. During actual testing, heat generated on the phased array antenna board 110 is transferred to the heat dissipation temperature equalization board 130 after passing through the first heat conduction pad 180, the heat dissipation temperature equalization board 130 transfers the heat to the fin heat dissipation board 150, and the heat is dissipated through the plurality of heat dissipation fins 151, and the heat dissipation difficulty problem of the test bare board is effectively solved due to the fact that the heat dissipation fins 151 are adopted for dissipating the heat. In addition, by setting the dustproof protection enclosure 137 and the splice waterproof groove 139, waterproof and dustproof effects can be achieved, and damage to the phased array antenna panel 110 during transportation can be prevented. In addition, through modular phased array antenna test module 100, it is very convenient when assembling to greatly reduce the design processing degree of difficulty of antenna complete machine structure when assembling, can reduce 40% structure processing cost, also simplified complete machine installation process simultaneously, reduced complete machine equipment risk.
Second embodiment
Referring to fig. 7 and 8, the present embodiment provides a phased array antenna testing module 100, which has the same basic structure and principle and technical effects as those of the first embodiment, and for brevity, reference may be made to the corresponding contents of the first embodiment.
The phased array antenna test module 100 includes a phased array antenna board 110, a heat dissipation temperature equalizing board 130, a fin heat dissipation plate 150 and an electric control heat conduction plate 170, wherein the front surface of the heat dissipation temperature equalizing board 130 is installed on one side surface of the phased array antenna board 110, a first heat conduction pad 180 is further arranged between the front surface of the heat dissipation temperature equalizing board 130 and the phased array antenna board 110, the first heat conduction pad 180 is used for transferring heat generated by the phased array antenna board 110 to the heat dissipation temperature equalizing board 130, the fin heat dissipation plate 150 is arranged on the back surface of the heat dissipation temperature equalizing board 130, and a plurality of heat dissipation fins 151 are arranged on the fin heat dissipation plate 150. The electric control heat-conducting plate 170 is connected with the heat dissipation temperature-equalizing plate 130, the phased array antenna plate 110 is provided with a radio frequency radiation area 111 and a digital circuit area 113, the heat dissipation temperature-equalizing plate 130 is arranged in the radio frequency radiation area 111, and the electric control heat-conducting plate 170 is arranged in the digital circuit area 113.
In this embodiment, the heat dissipation and temperature equalization plate 130 and the fin heat dissipation plate 150 are separately disposed, and a second heat conduction pad 190 is further disposed between the fin heat dissipation plate 150 and the back surface of the heat dissipation and temperature equalization plate 130, the second heat conduction pad 190 is used for transferring heat on the heat dissipation and temperature equalization plate 130 to the fin heat dissipation plate 150, and the fin heat dissipation plate 150 is detachably connected with the heat dissipation and temperature equalization plate 130. Specifically, the second thermal pad 190 is made of an interface material with high thermal conductivity, such as silica gel or a heat dissipation pad, which is not limited herein.
In this embodiment, the back surface of the heat dissipation and temperature equalization plate 130 is provided with a plurality of second installation limit columns 153, the heights of the plurality of second installation limit columns 153 relative to the back surface of the heat dissipation and temperature equalization plate 130 are the same, and the end of each second installation limit column 153 is used for propping against the surface of the fin heat dissipation plate 150, so that a second installation gap is formed between the heat dissipation and temperature equalization plate 130 and the fin heat dissipation plate 150, and the second heat conduction pad 190 is disposed in the second installation gap. The width of the second gap is smaller than the thickness of the second heat conducting pad 190, so that two sides of the second heat conducting pad 190 are respectively abutted against the heat dissipation temperature equalizing plate 130 and the fin heat dissipation plate 150, so as to ensure the heat transfer effect. Specifically, the deformation of the interface material is maintained between 20% and 30% to exert the maximum performance and the heat transfer effect is best, so that the distance between the front surface of the heat dissipation and temperature uniformity plate 130 and the fin heat dissipation plate 150 is 70% to 80% of the thickness of the second heat conduction pad 190, thereby controlling the deformation of the interface material to ensure the heat transfer effect. I.e., the width of the second gaps is 70% -80% of the thickness of the second thermal pad 190, although the optimal deformation amount is different due to the difference of the interface materials, so the ratio between the thickness of each second gap and the thickness of the second thermal pad 190 is merely illustrative and not limiting.
In this embodiment, the end surface of the second mounting spacing post 153 is further provided with a second connection hole 155, the fin heat dissipation plate 150 is provided with a plurality of second connection members 157, the second connection members 157 are in one-to-one correspondence with the second mounting spacing posts 153, and each second connection member 157 is detachably assembled in the corresponding second connection hole 155. Specifically, the second connection members 157 are screws, and the second connection holes 155 are screw holes, that is, the screws pass through the fin heat dissipation plate 150 and are assembled in the corresponding screw holes, so that the fin heat dissipation plate 150 is fixed on the plurality of second installation limiting columns 153 by the screws, thereby achieving the fixation with the heat dissipation temperature equalizing plate 130. Of course, the second connection element 157 may be any other connection element such as a pin or a plug.
In this embodiment, the second heat conducting pad 190 is of a monolithic structure and is laid between the fin heat dissipation plate 150 and the heat dissipation temperature equalizing plate 130, wherein a plurality of abdication holes are further formed on the second heat conducting pad 190 for the second mounting and limiting column 153 to pass through.
In summary, according to the phased array antenna test module 100 provided in this embodiment, the heat dissipation temperature equalizing plate 130 and the fin heat dissipation plate 150 are separately arranged and fixed by the screws, so that the weight of the individual module is reduced, the split design and manufacture are performed, the manufacturing difficulty is reduced, and meanwhile, the diversification of the heat dissipation mode of the whole antenna is provided.
The foregoing is merely illustrative of the present invention, and the present invention is not limited thereto, and any changes or substitutions easily contemplated by those skilled in the art within the scope of the present invention should be included in the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (8)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
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| US11778784B2 (en) * | 2021-03-19 | 2023-10-03 | Htc Corporation | Heat dissipation device with communication function |
| CN113991324B (en) * | 2021-12-01 | 2025-04-08 | 西安航天天绘数据技术有限公司 | A phased array architecture with separate transmitting and receiving and integrated thermal control |
| CN114966372A (en) * | 2022-05-20 | 2022-08-30 | 成都天锐星通科技有限公司 | Phased array chip test system architecture |
| CN115084822B (en) * | 2022-08-03 | 2023-10-20 | 西安航天天绘数据技术有限公司 | Phased array antenna assembly |
| CN115825594A (en) * | 2022-12-27 | 2023-03-21 | 成都天锐星通科技有限公司 | Phased array antenna test module and test system |
| CN116075082A (en) * | 2023-02-17 | 2023-05-05 | 苏州度风科技有限公司 | 5G communication prototype |
| CN116583096B (en) * | 2023-07-14 | 2023-09-12 | 四川天中星航空科技有限公司 | Totally-enclosed radio frequency comprehensive test equipment |
| CN117060041B (en) * | 2023-10-12 | 2023-12-29 | 成都天锐星通科技有限公司 | A phased array antenna and communication equipment |
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| CN109511253A (en) * | 2019-01-08 | 2019-03-22 | 安徽瞭望科技有限公司 | A kind of Connectors for Active Phased Array Radar assembly radiating temperature control technique |
| CN111769349A (en) * | 2020-08-18 | 2020-10-13 | 成都天锐星通科技有限公司 | Array Antenna Cooling Device |
| CN213366767U (en) * | 2020-11-13 | 2021-06-04 | 成都天锐星通科技有限公司 | Phased array antenna test module |
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| CN106304754B (en) * | 2015-05-22 | 2019-07-26 | 中兴通讯股份有限公司 | Single plate cooling device and method |
| CN111816975A (en) * | 2020-08-19 | 2020-10-23 | 成都天锐星通科技有限公司 | Phased array antenna cooling device and phased array antenna |
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| CN109511253A (en) * | 2019-01-08 | 2019-03-22 | 安徽瞭望科技有限公司 | A kind of Connectors for Active Phased Array Radar assembly radiating temperature control technique |
| CN111769349A (en) * | 2020-08-18 | 2020-10-13 | 成都天锐星通科技有限公司 | Array Antenna Cooling Device |
| CN213366767U (en) * | 2020-11-13 | 2021-06-04 | 成都天锐星通科技有限公司 | Phased array antenna test module |
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