CN112236857A - 半导体装置及半导体装置的制造方法 - Google Patents

半导体装置及半导体装置的制造方法 Download PDF

Info

Publication number
CN112236857A
CN112236857A CN201980036901.7A CN201980036901A CN112236857A CN 112236857 A CN112236857 A CN 112236857A CN 201980036901 A CN201980036901 A CN 201980036901A CN 112236857 A CN112236857 A CN 112236857A
Authority
CN
China
Prior art keywords
conductive
semiconductor device
heat
sheet
conductive sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201980036901.7A
Other languages
English (en)
Chinese (zh)
Inventor
博洛托夫·谢尔盖
久保佑介
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Chemical Co Ltd
Original Assignee
Diruihe Electronic Material Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Diruihe Electronic Material Co ltd filed Critical Diruihe Electronic Material Co ltd
Publication of CN112236857A publication Critical patent/CN112236857A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • H10W40/70—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H10W40/22—
    • H10W40/251—
    • H10W40/255—
    • H10W40/258—
    • H10W42/20—
    • H10W42/60—
    • H10W70/02—
    • H10W72/073—
    • H10W99/00—
    • H10W40/25—
    • H10W40/259—

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
CN201980036901.7A 2018-06-21 2019-06-19 半导体装置及半导体装置的制造方法 Pending CN112236857A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018-118080 2018-06-21
JP2018118080A JP7208720B2 (ja) 2018-06-21 2018-06-21 半導体装置及び半導体装置の製造方法
PCT/JP2019/024363 WO2019244950A1 (ja) 2018-06-21 2019-06-19 半導体装置及び半導体装置の製造方法

Publications (1)

Publication Number Publication Date
CN112236857A true CN112236857A (zh) 2021-01-15

Family

ID=68982615

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201980036901.7A Pending CN112236857A (zh) 2018-06-21 2019-06-19 半导体装置及半导体装置的制造方法

Country Status (5)

Country Link
US (1) US11329005B2 (enExample)
JP (1) JP7208720B2 (enExample)
KR (1) KR102432180B1 (enExample)
CN (1) CN112236857A (enExample)
WO (1) WO2019244950A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11240944B2 (en) * 2019-07-16 2022-02-01 Ford Global Technologies, Llc Rear method of heat sinking screens and electronics in enclosed areas
JP7389635B2 (ja) 2019-12-05 2023-11-30 カヤバ株式会社 作動流体供給システム
JP7396204B2 (ja) * 2020-06-01 2023-12-12 株式会社デンソー 冷却装置
CN120581525B (zh) * 2025-08-01 2025-10-28 成都天锐星通科技股份有限公司 一种屏蔽结构与射频芯片封装器件及电子设备

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201104378Y (zh) * 2007-04-04 2008-08-20 华为技术有限公司 屏蔽和散热装置
US20150282392A1 (en) * 2014-04-01 2015-10-01 Baomin Liu Combined electromagnetic shield and thermal management device
CN205389320U (zh) * 2016-03-23 2016-07-20 乐视控股（北京）有限公司 一种散热屏蔽装置
CN105828571A (zh) * 2015-10-21 2016-08-03 维沃移动通信有限公司 一种电子设备芯片的屏蔽散热结构及电子设备
CN206077940U (zh) * 2015-10-16 2017-04-05 莱尔德电子材料(深圳)有限公司 导热电磁干扰emi吸收器
CN206181696U (zh) * 2016-10-28 2017-05-17 中科创达软件科技（深圳）有限公司 一种低热阻的手机屏蔽散热结构及具有该结构的手机
US20170290209A1 (en) * 2016-04-04 2017-10-05 Commscope Technologies Llc Systems and methods for thermal management for high power density emi shielded electronic devices

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06169188A (ja) * 1992-12-01 1994-06-14 Fujitsu Ltd 放熱が良好な電子装置
US6111313A (en) * 1998-01-12 2000-08-29 Lsi Logic Corporation Integrated circuit package having a stiffener dimensioned to receive heat transferred laterally from the integrated circuit
US6224711B1 (en) * 1998-08-25 2001-05-01 International Business Machines Corporation Assembly process for flip chip package having a low stress chip and resulting structure
JP3313682B2 (ja) 1999-11-18 2002-08-12 北川工業株式会社 電磁波シールドケース
US7575955B2 (en) * 2004-01-06 2009-08-18 Ismat Corporation Method for making electronic packages
JP2008166641A (ja) 2007-01-04 2008-07-17 Oita Univ 熱伝導性及び電気伝導性を有する電磁シールド用の膨張化炭素繊維複合材料とその製造方法
JP2012164852A (ja) 2011-02-08 2012-08-30 Murata Mfg Co Ltd 半導体パッケージのシールド構造
US20130256894A1 (en) * 2012-03-29 2013-10-03 International Rectifier Corporation Porous Metallic Film as Die Attach and Interconnect
JP6295238B2 (ja) 2014-10-31 2018-03-14 デクセリアルズ株式会社 熱伝導シート、熱伝導シートの製造方法、放熱部材及び半導体装置
JP2016096249A (ja) 2014-11-14 2016-05-26 富士通株式会社 シールドカバー及び電子装置
JP6704229B2 (ja) 2015-09-14 2020-06-03 リンテック オブ アメリカ インコーポレーテッドＬｉｎｔｅｃ ｏｆ Ａｍｅｒｉｃａ， Ｉｎｃ． 柔軟性シート、熱伝導部材、導電性部材、帯電防止部材、発熱体、電磁波遮蔽体、及び柔軟性シートの製造方法
JP6795375B2 (ja) 2016-10-26 2020-12-02 リンテック株式会社 電波吸収体、半導体装置および複合シート
JP6363687B2 (ja) 2016-12-26 2018-07-25 デクセリアルズ株式会社 半導体装置
JP6800129B2 (ja) * 2017-11-07 2020-12-16 古河電気工業株式会社 フィルム状接着剤、フィルム状接着剤を用いた半導体パッケージの製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201104378Y (zh) * 2007-04-04 2008-08-20 华为技术有限公司 屏蔽和散热装置
US20150282392A1 (en) * 2014-04-01 2015-10-01 Baomin Liu Combined electromagnetic shield and thermal management device
CN206077940U (zh) * 2015-10-16 2017-04-05 莱尔德电子材料(深圳)有限公司 导热电磁干扰emi吸收器
CN105828571A (zh) * 2015-10-21 2016-08-03 维沃移动通信有限公司 一种电子设备芯片的屏蔽散热结构及电子设备
CN205389320U (zh) * 2016-03-23 2016-07-20 乐视控股（北京）有限公司 一种散热屏蔽装置
US20170290209A1 (en) * 2016-04-04 2017-10-05 Commscope Technologies Llc Systems and methods for thermal management for high power density emi shielded electronic devices
CN206181696U (zh) * 2016-10-28 2017-05-17 中科创达软件科技（深圳）有限公司 一种低热阻的手机屏蔽散热结构及具有该结构的手机

Also Published As

Publication number Publication date
JP7208720B2 (ja) 2023-01-19
JP2019220614A (ja) 2019-12-26
US20210225777A1 (en) 2021-07-22
KR20210010553A (ko) 2021-01-27
KR102432180B1 (ko) 2022-08-16
WO2019244950A1 (ja) 2019-12-26
US11329005B2 (en) 2022-05-10

Similar Documents

Publication Publication Date Title
CN111937135B (zh) 半导体装置
KR102167531B1 (ko) 반도체 장치
CN112055513B (zh) 电磁波吸收导热片
KR102411432B1 (ko) 전자 기기
CN112236857A (zh) 半导体装置及半导体装置的制造方法
KR102445111B1 (ko) 반도체 장치 및 반도체 장치의 제조 방법
JP6379319B1 (ja) 半導体装置

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
CB02 Change of applicant information
CB02 Change of applicant information

Country or region after: Japan

Address after: Shimono City, Tochigi Prefecture, Japan

Applicant after: DEXERIALS Corp.

Address before: Tokyo, Japan

Applicant before: DEXERIALS Corp.

Country or region before: Japan

TA01 Transfer of patent application right
TA01 Transfer of patent application right

Effective date of registration: 20250804

Address after: Osaka City, Osaka of Japan

Applicant after: SEKISUI CHEMICAL Co.,Ltd.

Country or region after: Japan

Address before: Shimono City, Tochigi Prefecture, Japan

Applicant before: DEXERIALS Corp.

Country or region before: Japan