CN112210765A - Vacuum chamber and substrate processing apparatus - Google Patents

Vacuum chamber and substrate processing apparatus Download PDF

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Publication number
CN112210765A
CN112210765A CN202010406402.7A CN202010406402A CN112210765A CN 112210765 A CN112210765 A CN 112210765A CN 202010406402 A CN202010406402 A CN 202010406402A CN 112210765 A CN112210765 A CN 112210765A
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China
Prior art keywords
substrate
block
vacuum chamber
blocks
chamber
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CN202010406402.7A
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Chinese (zh)
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CN112210765B (en
Inventor
江藤谦次
冈山智彦
龟崎厚治
阿部洋一
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Ulvac Inc
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Ulvac Inc
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/568—Transferring the substrates through a series of coating stations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C23C14/505—Substrate holders for rotation of the substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions

Abstract

The invention discloses a vacuum chamber and a substrate processing apparatus. The vacuum chamber is configured by arranging a plurality of blocks along a conveying direction of a substrate, wherein the blocks have an annular opening space when viewed from the conveying direction, the vacuum chamber is capable of switching an atmosphere of an internal space formed by communicating the opening spaces of the plurality of blocks into an atmospheric pressure atmosphere and a vacuum atmosphere, and the vacuum chamber includes: a first block as one of the plurality of blocks; a second block as one of the plurality of blocks, having a groove extending in a direction intersecting the conveying direction and formed on an inner lower surface of the open space, the second block being fixedly attached to the first block by a sealing member; a base member extending along an extending direction of the groove and fitted into the groove; and a plurality of substrate supporting pins having a supporting end contacting the substrate and a fixed end located at an opposite side of the supporting end and fixed to the base member, the plurality of substrate supporting pins supporting the substrate inside the vacuum chamber.

Description

Vacuum chamber and substrate processing apparatus
Technical Field
The present invention relates to a vacuum chamber and a substrate processing apparatus.
Background
Conventionally, a vacuum processing apparatus including a load lock chamber is known. The load lock chamber transports a substrate between the outside of the vacuum processing apparatus in an atmospheric pressure atmosphere and the inside in a vacuum atmosphere (see, for example, patent document 1).
Generally, a load lock chamber is configured by a chamber body having an opening with an area larger than that of a substrate to be transported, a lid closing an upper opening of the chamber body, and a gate valve disposed at an entrance and an exit of the load lock chamber. Sealing members such as O-rings are provided on the contact surface between the chamber body and the lid and the contact surface between the chamber body and the valve body of the gate valve, thereby making it possible to obtain the sealing property of the load lock chamber.
In the load lock chamber having such a structure, a vacuum atmosphere generated by driving the vacuum pump and an atmospheric pressure atmosphere generated by supplying an exhaust gas such as nitrogen gas are repeatedly generated.
By setting the inside of the load lock chamber to an atmospheric pressure atmosphere, the substrate can be transported between the atmospheric pressure side robot and the load lock chamber. The lift pins are moved in the vertical direction by driving a lift mechanism provided in the load lock chamber, and the substrate is transferred from the atmospheric-pressure-side robot to the lift pins or from the lift pins to the atmospheric-pressure-side robot.
By setting the inside of the load lock chamber to a vacuum atmosphere, the substrate can be transported between the load lock chamber and the vacuum-side robot provided in the transport chamber adjacent to the load lock chamber. The lift pins are moved in the vertical direction by driving the lift mechanism, and the substrate is transferred by the vacuum-side robot arm to the lift pins or by the lift pins to the vacuum-side robot arm.
Patent document 1: japanese patent No. 5462946
However, the above-described conventional load lock chamber has the following problems.
(1) If vibration occurs as a result of driving of a driving device such as a cylinder constituting the elevating mechanism, the vibration is transmitted to other members constituting the elevating mechanism or members adjacent to the elevating mechanism. This causes a problem that particles accumulated in the load lock chamber are lifted and scattered, and the particles are attached to the substrate.
(2) Since the vacuum atmosphere and the atmospheric pressure atmosphere are repeatedly generated, the O-ring is broken by the cover or the O-ring generates a restoring force. Thus, there are the following problems: particles are generated from the O-ring due to friction generated between the O-ring and the cover, and the particles scatter to the internal space of the load lock chamber and adhere to the substrate. Further, in recent years, the substrate to be transported tends to be large-sized, and for example, in order to transport a large substrate having a side larger than 1500mm, the load lock chamber also tends to be large-sized. Accordingly, the lid area increases, the amount of bending of the lid increases, and the amount of friction between the O-ring and the lid increases compared to the conventional case by repeating the generation of the vacuum atmosphere and the atmospheric pressure atmosphere. Further, there are problems as follows: that is, particles are generated not only by friction between the O-ring and the cover but also by friction due to contact between a member configuring the load lock chamber and the cover, and the particles adhere to the substrate.
Disclosure of Invention
The present invention has been made in view of such circumstances, and provides a vacuum chamber and a substrate processing apparatus including the vacuum chamber, which achieve the following objects.
1. Prevent particles from flying and scattering due to vibration generated by driving of the lifting mechanism, and prevent particles from adhering to the substrate to be conveyed.
2. Particles generated by a sealing member between the chamber body and the cover are prevented from occurring, and the particles are prevented from adhering to the conveyance-target substrate.
A vacuum chamber according to an aspect of the present invention is a vacuum chamber configured by a plurality of blocks arranged in a substrate conveyance direction, the blocks having an annular opening space when viewed from the conveyance direction, the vacuum chamber being capable of switching an atmosphere in an internal space formed by communicating the opening spaces of the plurality of blocks between an atmospheric pressure atmosphere and a vacuum atmosphere, the vacuum chamber including: a first block being one of the plurality of blocks; a second block which is one of the plurality of blocks, having a groove extending in a direction intersecting the conveying direction and formed on an inner lower surface of the open space, the second block being fixedly attached to the first block by a seal member; a base member extending in an extending direction of the groove and fitted into the groove; and a plurality of substrate supporting pins having a supporting end contacting the substrate and a fixed end located at an opposite side of the supporting end and fixed to the base member, the plurality of substrate supporting pins supporting the substrate inside the vacuum chamber.
In the vacuum chamber according to one aspect of the present invention, at least two blocks of the plurality of blocks may each have an exhaust portion provided at a position corresponding to four corner regions of the internal space of the vacuum chamber in a plan view of the vacuum chamber.
In the vacuum chamber according to one aspect of the present invention, the groove may be located between the first block and the second block, and a cover may be provided between the base member fitted into the groove and the fixed end of the substrate support pin, the cover covering a gap between the first block and the second block.
In the vacuum chamber according to one aspect of the present invention, a window may be formed in a side surface of at least one of the plurality of blocks in a side view viewed from a direction parallel to the substrate and intersecting the transport direction.
In the vacuum chamber according to an aspect of the present invention, at least two blocks of the plurality of blocks may each have a positioning mechanism provided at a position corresponding to four corners of the substrate arranged inside the vacuum chamber in a plan view of the vacuum chamber, and each positioning mechanism includes: a first roller rotatable about an axis parallel to the conveyance direction; and a second roller rotatable about an axis parallel to a direction orthogonal to the transport direction, the first roller and the second roller positioning a corner of the substrate in a state where the substrate is in contact with the support ends of the plurality of substrate support pins.
A substrate processing apparatus according to an aspect of the present invention includes: a vacuum chamber configured by a plurality of blocks arranged along a conveyance direction of a substrate, wherein the blocks have an annular opening space when viewed from the conveyance direction, the vacuum chamber being capable of switching an atmosphere of an internal space formed by communicating the opening spaces of the plurality of blocks to an atmospheric pressure atmosphere and a vacuum atmosphere; a transfer chamber connected to the vacuum chamber; a process chamber connected to the transfer chamber; and a transfer robot that performs transfer of the substrate between the vacuum chamber and the transfer chamber and between the transfer chamber and the process chamber, and is disposed inside the transfer chamber. The vacuum chamber includes: a first block being one of the plurality of blocks; a second block which is one of the plurality of blocks, having a groove extending in a direction intersecting the conveying direction and formed on an inner lower surface of the open space, the second block being fixedly attached to the first block by a seal member; a base member extending in a direction in which the groove extends and fitted into the groove; and a plurality of substrate supporting pins having a supporting end contacting the substrate and a fixed end located at an opposite side of the supporting end and fixed to the base member, the plurality of substrate supporting pins supporting the substrate inside the vacuum chamber.
In the substrate processing apparatus according to one aspect of the present invention, the transfer robot may include: a manipulator; an arm for moving the robot in the conveying direction; and an elevating mechanism for moving the robot in a vertical direction of the substrate, wherein the robot is moved between a lower position of the substrate and the transfer chamber by driving of the arm in the internal space of the vacuum chamber, and moved up and down between the lower position of the substrate and an upper position of the substrate by driving of the elevating mechanism.
According to the vacuum chamber of the above aspect of the present invention, the base member is fitted in the groove formed on the inner lower surface of the open space of the block (second block), and the substrate is supported by the plurality of substrate support pins fixed to the base member. According to this configuration, it is possible to prevent particles from being lifted and scattered due to vibration generated by driving of the lifting mechanism without using a lifting mechanism having a conventional configuration.
In addition, unlike the conventional structure in which the upper opening of the chamber body is closed by the lid, the vacuum chamber according to the above-described aspect of the present invention has an internal space formed by communicating annular opening spaces. That is, a coverless structure can be realized. According to this structure, the problem of the conventional structure in which particles are generated by the sealing member between the chamber body and the lid can be solved.
According to the vacuum chamber of the above aspect of the present invention, since the exhaust portions are provided at the positions corresponding to the four corner regions of the internal space of the vacuum chamber, the gas inside the vacuum chamber flows dispersedly toward the four exhaust portions. On the other hand, in the conventional structure in which only one exhaust portion is provided in the vacuum chamber, the gas in the vacuum chamber flows intensively toward the one exhaust portion. Therefore, according to the vacuum chamber of the above aspect of the present invention, the flow rate to each exhaust portion can be reduced, for example, to about 1/4 compared to the conventional vacuum chamber, and a distributed flow toward the four exhaust portions can be generated. Compared with the prior structure, the structure can relieve the airflow generated in the vacuum chamber and prevent the particles from rising and flying. As a result, particles can be prevented from adhering to the substrate to be conveyed.
According to the vacuum chamber of the above aspect of the present invention, since the cover is provided to cover the gap between the first block and the second block, it is possible to prevent particles accumulated in the gap between the first block and the second block from scattering into the vacuum chamber. As a result, particles can be prevented from adhering to the substrate to be conveyed.
According to the vacuum chamber of the above aspect of the present invention, since the window is formed in the side surface of the block body, it is possible to perform maintenance work such as replacement work of the base member to which the substrate support pins are fixed and cleaning of the internal space of the vacuum chamber through the window.
According to the vacuum chamber of the above aspect of the present invention, since the positioning mechanism is provided at the position corresponding to the four corners of the substrate disposed in the vacuum chamber, the position of the substrate can be prevented from being deviated in the vacuum chamber.
According to the vacuum processing apparatus of the above aspect of the present invention, the same effects as those of the vacuum chamber can be obtained.
Drawings
Fig. 1 is a plan view showing a schematic configuration of a substrate processing apparatus according to an embodiment of the present invention.
Fig. 2A is a perspective view showing a schematic configuration of a load lock chamber constituting a substrate processing apparatus according to an embodiment of the present invention.
Fig. 2B is a diagram showing a schematic configuration of a load lock chamber constituting a substrate processing apparatus according to an embodiment of the present invention, and is a front view of the load lock chamber in a state where an atmospheric side gate valve is removed, as viewed from a substrate conveying direction.
Fig. 3A is a diagram showing an internal structure of a load lock chamber constituting a substrate processing apparatus according to the embodiment of the present invention, and is a cross-sectional view taken along a line a-a shown in fig. 2B.
Fig. 3B is a perspective view showing a base member disposed inside a load lock chamber in which a substrate processing apparatus according to an embodiment of the present invention is constructed.
Fig. 4 is a view showing a main part of a block body, a base member, and substrate support pins constituting a load lock chamber of a substrate processing apparatus according to an embodiment of the present invention, and is a partial sectional view taken along line B-B shown in fig. 3A.
Fig. 5 is a diagram for explaining an exhaust system including pipes and valves provided between an exhaust unit and a vacuum pump provided in a load lock chamber configuring a substrate processing apparatus according to an embodiment of the present invention.
Fig. 6 is a sectional view showing a block constituting a load lock chamber of a substrate processing apparatus according to an embodiment of the present invention, and is a side view showing a positioning mechanism provided on an inner lower surface of the block.
Fig. 7A is a diagram for explaining substrate conveyance in a load lock chamber constituting a substrate processing apparatus according to the embodiment of the present invention.
Fig. 7B is a diagram for explaining substrate conveyance in the load lock chamber configuring the substrate processing apparatus according to the embodiment of the present invention.
Fig. 7C is a diagram for explaining substrate conveyance in the load lock chamber constituting the substrate processing apparatus according to the embodiment of the present invention.
Fig. 7D is a diagram for explaining substrate conveyance in the load lock chamber constituting the substrate processing apparatus according to the embodiment of the present invention.
Detailed Description
A substrate processing apparatus including a vacuum chamber according to an embodiment of the present invention will be described with reference to the drawings. In the drawings for explaining the present embodiment, the scale of each member is appropriately changed so that each member can be made into a recognizable size.
In the following description, the "plan view of the substrate processing apparatus" or the "plan view of the vacuum chamber" may be simply referred to as "plan view". The plan view is a plane viewed from above (in the Z direction in fig. 1) the substrate processing apparatus or the vacuum chamber, and has the same meaning as the plan view shown in fig. 1.
In the embodiments described below, ordinal numbers such as "first", "second", and "third" are given to avoid confusion of constituent elements, and are not limited to the numbers.
(substrate processing apparatus)
As shown in fig. 1, the substrate processing apparatus 1 of the present embodiment includes a transfer chamber 2, a load lock chamber 10, process chambers 1A to 1E, an atmospheric transport device 3, and a control unit 100.
The transfer chamber 2, the load lock chamber 10, and the process chambers 1A to 1E are connected to a vacuum pump (not shown) for maintaining the internal space in a vacuum state, and a gas supply unit for supplying gas to the internal space.
The control unit 100 controls the transfer chamber 2, the load lock chamber 10, the process chambers 1A to 1E, the vacuum transfer robot 2a (transfer robot), and the atmospheric transfer robot 3a, and the control unit 100 also controls opening and closing operations of the gate valve (not shown).
A load lock chamber 10 is connected to the transfer chamber 2 through a gate valve. Similarly, the transfer chamber 2 is connected to the process chambers 1A to 1E through gate valves.
(Transporter)
The transfer chamber 2 has a polygonal shape in plan view. A load lock chamber 10 and process chambers 1A to 1E are connected to each side of the transfer chamber 2 via gate valves.
The transfer chamber 2 may be polygonal and may be any shape from triangular to octagonal left or right in plan view.
A vacuum transfer robot 2a is provided in the transfer chamber 2, and can transfer substrates (can transfer substrates) between the transfer chamber 2 and the load lock chamber 10 and between the transfer chamber 2 and the process chambers 1A to 1E.
(vacuum transfer robot)
The vacuum transfer robot 2a transfers a substrate S (described later) between the load lock chamber 10 and the transfer chamber 2 and between the load lock chamber 10 and each process chamber.
The vacuum transfer robot 2a includes a rotary shaft, an arm 2b attached to the rotary shaft, a hand 2c attached to a distal end of the arm 2b, and a lifting mechanism 2d for moving the arm 2b and the hand 2c in the vertical direction. By rotating the arm 2b about the rotation axis, the robot 2c is disposed at a position corresponding to the load lock chamber 10 and one process chamber selected from the process chambers 1A to 1E. In this state, the robot 2c can move between the transfer chamber 2 and the selected process chamber by driving the arm 2 b. The robot 2c can move in the vertical direction by driving the lifting mechanism 2 d.
Further, a plurality of vacuum transfer robots 2a may be provided in the transfer chamber 2.
The arm 2b can move the robot 2c in a conveyance direction TD (described later) of the substrate S.
More specifically, the robot 2c can move between the transfer chamber 2 and a position below the substrate S in a state where the substrate S is placed on the robot 2c or in a state where the substrate S is not placed on the robot 2c by driving the arm 2 b.
The lifting mechanism 2d can move the robot 2c in a direction perpendicular to the substrate S (vertical direction, gravitational direction, Z direction, or directions LD and UD (described later)).
More specifically, the robot 2c can be moved between a position below the substrate S and a position above the substrate S by driving the elevating mechanism 2d in a state where the substrate S is placed on the robot 2c or in a state where the substrate S is not placed on the robot 2 c.
(Process Chamber)
Each of the process chambers 1A to 1E has a sealed internal space, and processes a substrate in the sealed internal space in a vacuum atmosphere or the like. Examples of the substrate processing performed in each of the process chambers 1A to 1E include film formation such as coating, sputtering, Deposition, various Chemical Vapor Deposition (CVD), etching, ashing, cleaning, and the like, but the substrate processing performed in the process chambers 1A to 1E is not limited to the above-described processing.
The types of processing performed in the process chambers 1A to 1E may be the same in two or more process chambers, or may be different.
The number of substrates disposed in the internal space of the process chambers 1A to 1E is not limited, and may be one or two or more.
(atmospheric transport device)
The air transport device 3 includes an air transport robot 3a and a substrate cassette 4.
The air transfer robot 3a includes a rotary shaft, an arm 3b attached to the rotary shaft, a hand 3c attached to a tip end of the arm 3b, and a lifting mechanism 3d for moving the arm 3b in the vertical direction. The robot 3c is disposed at a position facing the load lock chamber 10 or the substrate cassette 4 by rotating the arm 3b about the rotation axis. The robot 3c can move in the transport direction TD by driving the arm 3 b. The robot 3c can move in the vertical direction by driving the lifting mechanism 3 d.
A plurality of substrates are placed in the substrate cassette 4 in the Z direction. The plurality of substrates are parallel in a direction perpendicular to the Z direction. The substrate cassette 4 can mount a pre-processed substrate before processing in the process chambers 1A to 1E and a processed substrate after processing in the process chambers 1A to 1E.
The configuration of the substrate cassette is not limited to one in which two substrates, a pre-process substrate and a post-process substrate, are mounted on one substrate cassette. A configuration may be adopted in which a dedicated first substrate cassette for mounting only the pre-process substrate and a dedicated second substrate cassette for mounting only the post-process substrate are mounted.
(load lock chamber)
As shown in fig. 1, a load lock chamber 10 (vacuum chamber) is disposed between the atmospheric transfer robot 3a and the transfer chamber 2. An atmosphere-side gate valve AG (AG1, AG2) is provided between the atmosphere transfer robot 3a and the load lock chamber 10 via an O-ring or the like (seal member). A vacuum-side gate valve VG (VG1, VG2) is provided between the transfer chamber 2 and the load lock chamber 10 via an O-ring or the like.
Specifically, as shown in fig. 2A and 2B, the load lock chamber 10 includes two internal spaces 11(11U, 11L) arranged in the vertical direction (Z direction). Of the two internal spaces 11, an atmosphere-side gate valve AG1 and a vacuum-side gate valve VG1 are provided on both sides in the conveyance direction TD of the upper internal space 11U located above. The upper internal space 11U is sealed by closing two gate valves, i.e., the atmospheric-side gate valve AG1 and the vacuum-side gate valve VG 1. In this state, the atmosphere in the upper internal space 11U can be switched between an atmospheric pressure atmosphere and a vacuum atmosphere.
Similarly, of the two inner spaces 11, an atmosphere-side gate valve AG2 and a vacuum-side gate valve VG2 are provided on both sides in the conveyance direction TD of the lower inner space 11L located below. The lower internal space 11L is sealed by closing two gate valves, i.e., the atmospheric-side gate valve AG2 and the vacuum-side gate valve VG 2. In this state, the atmosphere in the lower internal space 11L can be switched between an atmospheric pressure atmosphere and a vacuum atmosphere.
The load lock chamber 10 is configured by a plurality of blocks arranged along the substrate transport direction TD. In the present embodiment, the number of blocks is five, and the load lock chamber 10 is configured by the first block 10A, the second block 10B, the third block 10C, the fourth block 10D, and the fifth block 10E. Two blocks adjacent to each other among the five blocks are connected and fixed by an O-ring SL (seal member, see fig. 4) press-fitted into the O-ring groove and a fastening member such as a bolt (not shown). The material of the block may be, for example, a metal such as aluminum.
Each of the plurality of blocks has an open space OP which is annular when viewed in the conveying direction TD, that is, each block has two open spaces OP1, OP 2.
Specifically, each of the open spaces OP1, OP2 IS a space surrounded by the inner lower surface IL, the inner upper surface IU, and the two inner side surfaces IS, and extends in the conveying direction TD.
The five block open spaces OP1 communicate in the conveying direction TD, thereby forming an upper side internal space 11U. Also, the five block open spaces OP2 communicate in the conveying direction TD, thereby forming the lower side internal space 11L.
That is, the load lock chamber 10 having the five block structures described above realizes a structure without a lid, unlike a conventional structure having a lid that closes an upper opening of a chamber in a plan view.
(internal structure of load lock chamber)
Next, the internal structure of the load lock chamber 10 (the internal structure of the upper internal space 11U) will be described with reference to fig. 3A to 4. Since the internal structure of the lower internal space 11L is the same as that of the upper internal space 11U, the description thereof is omitted. In fig. 3A, a substrate disposed in the upper internal space 11U is denoted by reference numeral S.
(first Block)
As shown in fig. 3A, the first block 10A has a seal surface 11a that is in contact with the atmosphere-side gate valve AG1 via a seal member such as an O-ring. On both sides of the upper internal space 11U in the X direction, the inner lower surface IL of the first block 10A is provided with exhaust portions 11b and 11 c. Here, the exhaust portions 11b and 11c are holes (exhaust ports) formed in the first block 10A.
The positioning mechanisms 41 and 42 are disposed on the inner lower surface IL of the first block 10A at positions further inward than the positions of the two exhaust portions 11b and 11 c. An atmosphere-side substrate support pin 30a (a substrate support pin close to the atmosphere-side gate valve AG 1) standing upright from the inner lower surface IL is provided in a region close to the sealing surface 11a and at a position overlapping with an end region of the substrate S. In the present embodiment, the number of the atmosphere-side substrate support pins 30a is two, but the number is not limited thereto.
(second Block)
As shown in fig. 3A, the second block 10B is fixedly connected to the first block 10A by an O-ring SL (seal member). Windows 12a are provided on the inner side surface IS of the second block 10B on both sides in the X direction in the upper internal space 11U.
In other words, the window 12a is formed on the side surface of the second block body 10B in a side view viewed from a direction (X direction) parallel to the substrate S and intersecting the transport direction TD. A flange 12b is fixed to the outer side (outer wall portion) of the window 12a by an O-ring so as to cover the window 12 a. That is, even if the window 12a is formed in the second block 10B, the upper internal space 11U is sealed by the flange 12B. The flange 12b can be detached. As long as the flange 12b is constructed of a transparent material, the operator can observe the inside of the load lock chamber 10 through the flange 12 b.
As shown in fig. 4, a groove 12G extending in a direction (X direction) intersecting the transport direction TD is formed in the inner lower surface IL of the second block 10B. The groove 12G has an inverted L-shape having a vertical surface 12GV and a horizontal surface 12GH formed in the second block 10B. By connecting the first block 10A and the second block 10B, a substantially U-shaped fitting groove FG is formed by the end surface 11E of the first block 10A and the groove 12G. That is, the fitting groove FG is located between the first block 10A and the second block 10B.
(base member 20)
The base member 20 shown in fig. 3B is fitted into the fitting groove FG. The base member 20 extends in the direction (X direction) in which the fitting groove FG extends, that is, the base member 20 is provided so as to fill the formation portion of the fitting groove FG. A plurality of substrate support pins 30 are fixed to the base member 20.
As a material of the base member 20, Polytetrafluoroethylene (PTFE) known as teflon (registered trademark) can be cited. Since the base member 20 uses teflon, the base member 20 slides smoothly with respect to the surface of aluminum used as a bulk structural material. Therefore, the base member 20 can be easily inserted into the fitting groove FG. Further, since the base member 20 can be attached to and detached from the fitting groove FG while the base member 20 is slid on the inner surface of the fitting groove FG, the maintenance performance such as the replacement work of the base member 20 is excellent.
The material of the base member 20 is not limited to teflon, and the base member 20 may be made of other materials as long as the above-described advantages are obtained.
(substrate supporting pin)
As shown in fig. 4, each substrate support pin 30 includes: a rod 31; a ball bearing 32 (support end) rotatably supported to the upper portion 31U of the rod 31; a fixed end 33 positioned on the opposite side of the ball bearing 32 and fixed to the base member 20; and bolts 34 (fastening portions) fixed to screw holes 20S formed in the base member 20.
The upper end 32T of the ball bearing 32 is a portion that contacts the substrate S. When the substrate S is supported by the substrate support pins 30, the ball bearings 32 come into contact with the substrate S. At this time, the substrate S can be smoothly moved in the horizontal direction (X direction, Y direction) by the rotation of the ball bearing 32, and therefore, the substrate S can be prevented from being scratched.
In the present embodiment, the number of the substrate support pins 30 fixed to one base member 20 is four. The number of substrate support pins 30 is not limited to four. The number of substrate support pins 30 and the arrangement pitch of the substrate support pins 30 are determined so as to avoid interference with the robots 2c and 3c and to minimize the amount of bending due to the weight of the substrate S supported by the substrate support pins 30. The length of the lever 31, that is, the height of the substrate support pin 30 is determined based on the vertical movement amount of the substrate S by the robots 2c and 3c, the opening height of the open space OP1, and the like.
The atmospheric-side substrate support pins 30a, the vacuum-side substrate support pins 30b (described later), and the substrate corner support pins 30c (described later) are also configured in the same manner as the substrate support pins 30. However, the heights of the substrate support pins 30, the vacuum-side substrate support pins 30b, and the substrate corner support pins 30c are adjusted so that the substrate S is kept horizontal with respect to the inner lower surface IL.
(tank cover)
As shown in fig. 3B and 4, a groove cover 21 (cover) is disposed between the fixed end 33 of the substrate support pin 30 and the base member 20. The groove cover 21 extends in the extending direction (X direction) of the fitting groove FG, and the width of the groove cover 21 in the Y direction is larger than the width of the base member 20 in the Y direction. As described above, although the base member 20 is fitted into the fitting groove FG, the groove cover 21 is not provided inside the fitting groove FG.
The tank cover 21 has a through hole 21P. The through-holes 21P are provided at positions corresponding to the screw holes 20S formed in the base member 20. The size of the through hole 21P is larger than the diameter of the bolt 34. The bolt 34 is fixed to the screw hole 20S through the through hole 21P. The slot cover 21 is fixed to the base member 20 by the fastening force of the bolt 34 to the screw hole 20S.
The lower surface 21L of the groove cover 21 contacts the inner lower surfaces IL of the first block 10A and the second block 10B. The upper surface 21U of the chute cover 21 is exposed to the upper internal space 11U, and has a shape inclined from the corner of the fixed end 33 toward the inner lower surface IL of the first block 10A and the second block 10B.
Since the width of the groove cover 21 is larger than the width of the base member 20, the gap G between the first block 10A and the second block 10B is covered by the groove cover 21 when viewed from the Z direction. The material of the tank cover 21 may be the same as the base member 20 or may be different from the base member 20.
Further, in the structure shown in fig. 4, the tank cover 21 is a separate body from the base member 20. In this case, the groove cover 21 functions as a spacer for adjusting the length (height) of the substrate support pin 30.
The tank cover 21 may be an integral member integrally formed with the base member 20. In this case, the tank cover 21 is formed of the same material as the base member 20. In this configuration, a screw hole may be formed in the through-hole 21P.
In the third block 10C, the fourth block 10D, and the fifth block 10E described below, the base member 20 is fitted into the fitting groove FG, and the gap G between the adjacent two blocks is covered by the groove cover 21.
(third Block)
As shown in fig. 3A, the third block 10C is fixedly connected to the second block 10B by an O-ring SL (see fig. 4). On both sides in the X direction in the upper internal space 11U, an opening 13a IS provided on the inner side surface IS of the third block 10C. An exhaust gas filter 13b is provided inside the opening 13 a. A gas supply portion 13c is provided outside (outer wall portion) the opening 13 a.
The gas supply unit 13c supplies exhaust gas (for example, nitrogen gas) to the inside of the load lock chamber 10 through the exhaust gas filter 13 b. The exhaust gas filter 13b also disperses the flow of the gas supplied from the gas supply portion 13c to the upper internal space 11U.
As shown in fig. 4, a groove 13G extending in a direction (X direction) intersecting the conveyance direction TD is formed in the inner lower surface IL of the third block 10C. Like the groove 12G, the groove 13G has an inverted L-shape having a vertical surface 13GV and a horizontal surface 13 GH. By connecting the second block 10B and the third block 10C, a substantially U-shaped fitting groove FG is formed by the end face 12E of the second block 10B and the groove 13G. The base member 20 shown in fig. 3B is fitted into the fitting groove FG.
In the explanation of the relative relationship between the second block 10B and the third block 10C, the second block 10B corresponds to the "first block" of the present invention, and the third block 10C corresponds to the "second block" of the present invention. That is, the third block 10C attached and fixed to the second block 10B corresponds to the "second block attached and fixed to the first block" of the present invention. The groove 13G formed in the third block 10C corresponds to the "groove provided in the second block" of the present invention, and the fitting groove FG formed by the end surface 12E of the second block 10B and the groove 13G corresponds to the "groove located between the first block and the second block" of the present invention.
(fourth Block)
As shown in fig. 3A, the fourth block 10D is fixedly connected to the third block 10C by an O-ring SL (see fig. 4). Windows 14a are provided on the inner side surface IS of the fourth block 10D on both sides in the X direction in the upper internal space 11U. A flange 14b is fixed to the outside (outer wall portion) of the window 14a by an O-ring so as to cover the window 14 a. The window 14a and the flange 14b have the same structure as the window 12a and the flange 12 b.
As shown in fig. 4, a groove 14G extending in a direction (X direction) intersecting the conveyance direction TD is formed in the inner lower surface of the fourth block 10D. The groove 14G has an inverted L-shape having a vertical surface 14GV and a horizontal surface 14GH, similarly to the grooves 12G and 13G. By connecting the third block 10C and the fourth block 10D, a substantially U-shaped fitting groove FG is formed by the end surface 13E of the third block 10C and the groove 14G. The base member 20 shown in fig. 3B is fitted into the fitting groove FG.
In the explanation of the relative relationship between the third block 10C and the fourth block 10D, the third block 10C corresponds to the "first block" of the present invention, and the fourth block 10D corresponds to the "second block" of the present invention. That is, the fourth block 10D attached and fixed to the third block 10C corresponds to the "second block attached and fixed to the first block" of the present invention. The groove 14G formed in the fourth block 10D corresponds to the "groove provided in the second block" of the present invention, and the fitting groove FG formed by the end surface 13E of the third block 10C and the groove 14G corresponds to the "groove located between the first block and the second block" of the present invention.
(fifth Block body)
As shown in fig. 3A, the fifth block 10E has a sealing surface 15a that is in contact with the vacuum-side gate valve VG1 via a sealing member such as an O-ring. The exhaust portions 15b and 15c are provided on the inner lower surface IL of the fifth block 10E on both sides in the X direction in the upper internal space 11U. Here, the exhaust portions 15b and 15c are holes (exhaust ports) formed in the fifth block 10E.
The positioning mechanisms 43 and 44 are disposed on the inner lower surface IL of the fifth block 10E at positions inward of the positions of the two exhaust portions 15b and 15 c. A vacuum side substrate support pin 30b (a substrate support pin close to the vacuum side gate valve VG 1) standing upright from the inner lower surface IL is provided in a region close to the sealing surface 15a and at a position overlapping with an end region of the substrate S. In the present embodiment, the number of the vacuum-side substrate support pins 30b is two, but the number is not limited thereto.
As shown in fig. 4, a groove 15G extending in a direction (X direction) intersecting the conveyance direction TD is formed in the inner lower surface IL of the fifth block 10E. The groove 15G has an inverted L-shape having a vertical surface 15GV and a horizontal surface 15GH, similarly to the grooves 12G, 13G, and 14G. By connecting the fourth block 10D and the fifth block 10E, a substantially U-shaped fitting groove FG is formed by the end surface 14E of the fourth block 10D and the groove 15G. The base member 20 shown in fig. 3B is fitted into the fitting groove FG.
In the explanation of the relative relationship between the fourth block 10D and the fifth block 10E, the fourth block 10D corresponds to the "first block" of the present invention, and the fifth block 10E corresponds to the "second block" of the present invention. That is, the fifth block 10E connected and fixed to the fourth block 10D corresponds to the "second block connected and fixed to the first block" of the present invention. The groove 15G formed in the fifth block 10E corresponds to the "groove provided in the second block" of the present invention, and the fitting groove FG formed by the end surface 14E of the fourth block 10D and the groove 15G corresponds to the "groove located between the first block and the second block" of the present invention.
(exhaust system)
As shown in fig. 3A, two blocks of the five blocks configuring the load lock chamber 10, namely, the first block 10A and the fifth block 10E have exhaust portions. The four exhaust portions 11b, 11c, 15b, and 15c are provided at positions corresponding to the four corner regions K of the upper internal space 11U. In other words, the four exhaust portions are provided at positions corresponding to the four corners of the substrate S.
The shape of each of the exhaust portions is not particularly limited. Circular, elliptical, oblong, rectangular, etc. shapes may be used. The exhaust portions located in the four corner regions K may be configured by a plurality of exhaust ports. In this case, the number of the exhaust ports is also not limited. Specifically, in the configuration shown in fig. 3A, one exhaust port is formed in one corner region K, but a plurality of exhaust ports may be formed in one corner region K. The four exhaust portions 11B, 11c, 15B, and 15c may be provided in the lower internal space 11L shown in fig. 2B.
Next, an exhaust system in which two spaces, the upper internal space 11U and the lower internal space 11L, constituting the load lock chamber 10, include pipes and valves provided between the four exhaust portions and the vacuum pump 50P will be described with reference to fig. 5.
The four exhaust portions 11B, 11c, 15B, 15c formed in the upper internal space 11U are connected to the four branch pipes 50B through hole portions formed in the block, respectively. The four branch pipes 50B are connected to a collecting pipe 50M, and the collecting pipe 50M is connected to a vacuum pump 50P via a vacuum valve 50U.
Similarly, the four exhaust portions 11B, 11c, 15B, and 15c formed in the lower internal space 11L are connected to the four branch pipes 50B through holes formed in the block. The four branch pipes 50B are connected to a collecting pipe 50M, and the collecting pipe 50M is connected to a vacuum pump 50P via a vacuum valve 50L.
The vacuum valves 50U and 50L and the vacuum pump 50P are connected to the control unit 100. The controller 100 controls the opening and closing operations of the vacuum valves 50U and 50L, respectively. For example, the control unit 100 may open only the vacuum valve 50U and close only the vacuum valve 50L. In this case, the vacuum pump 50P can communicate with the upper internal space 11U, and can discharge the gas inside the upper internal space 11U to make the upper internal space 11U a vacuum atmosphere. On the other hand, the off gas can be supplied from the gas supply portion 13c to the lower internal space 11L in a state where the vacuum valve 50L is closed, and the lower internal space 11L can be set to the atmospheric pressure atmosphere.
The atmosphere in both the upper internal space 11U and the lower internal space 11L may be a vacuum atmosphere or an atmospheric pressure atmosphere. The control section 100 controls the vacuum valves 50U, 50L in accordance with a substrate transfer operation in the load lock chamber 10 described later.
(positioning mechanism)
As shown in fig. 3A, two blocks of the five blocks configuring the load lock chamber 10, namely, the first block 10A and the fifth block 10E have positioning mechanisms.
The four positioning mechanisms 41, 42, 43, 44 are provided at positions corresponding to the four corner regions K of the upper internal space 11U. In other words, the four positioning mechanisms are provided at positions corresponding to the four corners of the substrate S.
In the following description, the positioning mechanism 42 will be described, but the other positioning mechanisms 41, 43, and 44 have the same configuration as the positioning mechanism 42, and therefore, the description thereof will be omitted.
As shown in fig. 6, the positioning mechanism 42 includes a base plate 45P fixed to the inner lower surface IL, a base plate corner support pin 30c erected on the base plate 45P, a first roller support portion 46Y and a second roller support portion 46X erected on the base plate 45P, a first roller 45Y rotatably supported on the first roller support portion 46Y via an axis AY, and a second roller 45X rotatably supported on the second roller support portion 46X via an axis AX.
The first roller 45Y is rotatable about an axis AY parallel to the conveyance direction TD. The inner end 45YE of the first roller 45Y can contact an end face of the substrate S extending in the Y direction as a corner of the substrate S.
The second roller 45X is rotatable about an axis AX parallel to an X direction orthogonal to the conveyance direction TD. The inner end 45XE of the second roller 45X can contact an end surface of the substrate S extending in the X direction as a corner of the substrate S.
The corner position of the substrate S is determined by the first roller 45Y and the second roller 45X in a state where the substrate S is in contact with the ball bearings 32 of the plurality of substrate support pins 30. In particular, the positioning mechanisms 41, 42, 43, and 44 are provided at positions corresponding to the four corners of the substrate S, respectively, and position the substrate S at four locations. Even if the inner ends 45YE and 45XE of the first and second rollers 45Y and 45X contact the end surface of the substrate S, the first and second rollers 45Y and 45X rotate, and therefore the substrate S can be prevented from being scratched.
The load lock chamber 10 having the above-described structure does not include a drive mechanism for moving the substrate in the vertical direction (Z direction). As described later, the substrate is moved in the vertical direction in the internal space 11 by driving the robot 3c or the robot 2 c.
(operation in load lock Chamber)
Next, referring to fig. 7A to 7D, the operation of transporting the substrate S (pre-process substrate SP, post-process substrate) to the load lock chamber 10 will be described in detail.
In the following description, the substrate conveyance in the upper internal space 11U will be described. Since the substrate transfer is performed also in the lower internal space 11L in the same manner as in the upper internal space 11U, the description thereof is omitted. Fig. 7A to 7D show only the main parts of the components configuring the load lock chamber 10 shown in fig. 1 to 3B.
First, the upper internal space 11U is sealed by the atmosphere-side gate valve AG1 and the vacuum-side gate valve VG, and the vacuum valve 50U is closed. In this state, the exhaust gas is supplied from the gas supply unit 13c to the upper internal space 11U through the exhaust gas filter 11b, and the internal pressure of the upper internal space 11U is controlled to be substantially equal to the atmospheric pressure. Then, the vacuum-side gate valve VG1 is closed, and the atmosphere-side gate valve AG1 is opened.
Next, as shown in fig. 7A, the pre-process substrate SP is conveyed to the upper internal space 11U.
Specifically, by driving the atmospheric transfer robot 3a, the robot arm 3c takes out the pre-process substrate SP from the substrate cassette 4. The robot 3c passes the pre-processed substrate SP through the open space OP1 in the conveyance direction TD, and conveys the pre-processed substrate SP to the inside of the upper internal space 11U.
Next, the lifting mechanism 3d of the atmospheric transfer robot 3a is driven, and the hand 3c is lowered in the direction LD. The pre-processing substrate SP held by the robot 3c is brought into contact with the ball bearings 32 of the substrate support pins 30(30a, 30b, 30c), and the pre-processing substrate SP is transferred to the substrate support pins 30 by the robot 3 c.
Thereby, as shown in fig. 7B, the pre-process substrate SP is disposed inside the upper internal space 11U. At this time, the four corners of the pre-processed substrate SP are brought into contact with the first roller 45Y and the second roller 45X of the four positioning mechanisms 41, 42, 43, and 44, and the pre-processed substrate SP is positioned.
Then, the robot hand 3c retreats from the upper internal space 11U, and closes the atmosphere-side gate valve AG 1.
Next, the upper internal space 11U is sealed by the atmosphere-side gate valve AG1 and the vacuum-side gate valve VG, and the vacuum valve 50U is opened. Thereby, the upper internal space 11U communicates with the vacuum pump 50P through the four exhaust portions, the four branch pipes 50B, and the collecting pipe 50M, and the gas in the upper internal space 11U is exhausted by the vacuum pump 50P.
If the internal pressure of the upper internal space 11U is substantially the same as the internal pressure of the transfer chamber 2, the vacuum-side gate valve VG is opened while the atmospheric-side gate valve AG1 is closed.
Next, as shown in fig. 7C, the pre-process substrate SP is transported from the upper internal space 11U to the transfer chamber 2.
Specifically, by driving the vacuum transfer robot 2a (arm 2b), the robot arm 2c enters the upper internal space 11U from the transfer chamber 2 and is disposed at a position below the pre-process substrate SP. At this time, a gap is formed between the pre-process substrate SP and the robot 2c so that the pre-process substrate SP does not contact the robot 2c, and in this state, the robot 2c is displaced from the transfer chamber 2 toward the lower side of the pre-process substrate SP.
Next, as shown in fig. 7D, the elevating mechanism 2D of the vacuum transfer robot 2a is driven, and the hand 2c is raised in the direction UD (direction from the lower position to the upper position of the pre-processed substrate SP). Then, the robot 2c supports the lower surface of the pre-processed substrate SP. If the robot 2c is raised in the direction UD, the pre-process substrate SP is separated from the substrate support pins 30(30a, 30b, 30c), and the pre-process substrate SP is handed over from the substrate support pins 30 to the robot 2 c. The robot 2c conveys the pre-process substrate SP from the upper internal space 11U into the transfer chamber 2 while holding the pre-process substrate SP. When the conveyance of the pre-process substrate SP is finished, the vacuum-side gate valve VG is closed.
The pre-processed substrate SP is processed in at least one of the process chambers 1A to 1E through the transfer chamber 2.
By performing the process in the process chamber, a processed substrate is obtained, and the processed substrate is returned from the transfer chamber 2 to the upper internal space 11U by the vacuum transfer robot 2 a. Here, the vacuum transfer robot 2a does not necessarily have to return the processed substrate to the upper internal space 11U, but may return the processed substrate to the lower internal space 11L. In the following description, a case where the processed substrate is returned to the upper internal space 11U will be described.
First, in a state where the internal atmosphere of the upper internal space 11U is a vacuum atmosphere, the vacuum-side gate valve VG1 is opened. Then, the processed substrate is held by the robot hand 2c, and in this state, the robot hand 2c of the vacuum transfer robot 2a transfers the processed substrate into the upper internal space 11U along the transfer direction TD.
Next, the lift mechanism 2d is driven to lower the robot 2c in the direction LD, and the robot 2c positions the processed substrate on the substrate support pins 30(30a, 30b, and 30 c). Thus, the processed substrate is transferred to the substrate support pins 30(30a, 30b, 30c) by the robot 2 c. The processed substrates are positioned by positioning mechanisms 41, 42, 43, 44. Then, the arm 2b moves from the lower position of the processed substrate toward the transfer chamber 2 in a state where the processed substrate and the robot 2c are separated. That is, the robot 2c retreats from the load lock chamber 10 and closes the vacuum-side gate valve VG 1.
The upper internal space 11U is sealed by the atmosphere-side gate valve AG1 and the vacuum-side gate valve VG1, and the vacuum valve 50U is closed. In this state, the exhaust gas is supplied from the gas supply unit 13c to the upper internal space 11U through the exhaust gas filter 13b, and the internal pressure of the upper internal space 11U is controlled to be substantially equal to the atmospheric pressure. Then, the vacuum-side gate valve VG is closed, and the atmosphere-side gate valve AG1 is opened.
Then, by driving the atmospheric transfer robot 3a, the robot hand 3c enters the upper internal space 11U and is disposed at a position below the processed substrate.
The hand 3c is raised by driving the lifting mechanism 3d of the atmospheric transfer robot 3 a. Then, the robot 3c supports the lower surface of the processed substrate. If the robot 3c is raised, the processed substrate is separated from the substrate support pins 30(30a, 30b, 30c), and the processed substrate is transferred from the substrate support pins 30 to the robot 3 c. The robot 3c conveys the processed substrate from the upper internal space 11U to the substrate cassette 4 while holding the processed substrate. When the conveyance of the processed substrate is finished, the atmospheric side gate valve AG1 is closed.
According to the load lock chamber 10 of the substrate processing apparatus 1 of the above embodiment, the base member 20 is fitted in the fitting groove FG, and the substrate S (pre-process substrate SP, post-process substrate) can be supported by the plurality of substrate support pins 30 fixed to the substrate member 20. According to this configuration, it is not necessary to provide the elevating mechanism as in the conventional configuration to the load lock chamber 10, and it is possible to prevent the particles from being lifted and scattered due to the vibration generated by the driving of the elevating mechanism.
In addition, unlike the conventional structure in which the upper opening of the chamber body is closed by the lid, the load lock chamber 10 of the substrate processing apparatus 1 according to the embodiment has an internal space formed by communicating annular opening spaces. That is, a coverless structure can be realized. According to this structure, the problem of the conventional structure in which particles are generated from the O-ring between the chamber body and the cover can be solved.
In particular, when a large substrate having a side larger than 1500mm is used as the substrate S, the size of the load lock chamber 10 is increased, but since the load lock chamber 10 has a structure without a cover, it is possible to solve the problem of the conventional structure in which the amount of friction between the large cover and the O-ring is significantly increased.
Further, the conventional structure generates particles due to not only friction between the large cover and the O-ring but also friction between a member configuring the load lock chamber and the cover, and the particles adhere to the substrate, but the present invention can also solve such a problem.
According to the load lock chamber 10 of the substrate processing apparatus 1 of the present embodiment, the exhaust portions 11b, 11c, 15b, and 15c are provided at positions corresponding to the four corner regions K of the upper internal space 11U (the lower internal space 11L), so that the gas in the upper internal space 11U (the lower internal space 11L) flows toward the four exhaust portions in a scattered manner. On the other hand, in the conventional structure in which only one exhaust portion is provided in the load lock chamber, the gas inside the load lock chamber flows intensively toward the one exhaust portion. Therefore, according to the load lock chamber 10 of the substrate processing apparatus 1 of the present embodiment, the flow rate to each exhaust portion can be reduced, for example, the flow rate can be reduced to about 1/4 compared to the conventional case, and a distributed flow toward the four exhaust portions can be generated. Compared with the conventional structure, the occurrence of the airflow occurring in the upper internal space 11U (the lower internal space 11L) can be alleviated, and the rising and scattering of the particles can be prevented. As a result, the particles can be prevented from adhering to the substrate S.
According to the load lock chamber 10 of the substrate processing apparatus 1 of the present embodiment, by providing the groove cover 21 covering the gap G between the two adjacent blocks, it is possible to prevent the particles accumulated in the gap G between the two adjacent blocks from scattering into the upper internal space 11U (the lower internal space 11L). As a result, the particles can be prevented from adhering to the substrate S.
In the load lock chamber 10 of the substrate processing apparatus 1 according to the present embodiment, the windows 12a and 14a are formed in the side surfaces of the blocks 10B and 10D. Therefore, the replacement work of the base member 20 to which the substrate support pins 30 are fixed and the maintenance work such as cleaning of the upper internal space 11U (the lower internal space 11L) can be performed through the windows 12a and 14 a.
According to the load lock chamber 10 of the substrate processing apparatus 1 of the present embodiment, the positioning mechanisms 41, 42, 43, and 44 are provided at positions corresponding to the four corners of the substrate S disposed in the upper internal space 11U (the lower internal space 11L), so that the substrate S can be prevented from being displaced in the upper internal space 11U (the lower internal space 11L).
(modification example)
The "groove formed on the inner lower surface of the open space" in the present invention is not limited to the fitting groove FG (grooves 12G, 13G, 14G, 15G) formed at a position between two adjacent blocks.
A substantially U-shaped groove may be directly formed in the inner lower surface 1L of at least one of the five blocks at a position different from the position where the fitting groove G is formed. In other words, the grooves may be formed on the inner lower surface IL between the grooves 12G and 13G, between the grooves 13G and 14G, and between the grooves 14G and 15G, for example.
As in the above embodiment, the base member 20 is fitted in the groove, and the plurality of substrate support pins 30 are fixed to the base member 20.
That is, the load lock chamber 10 of the present embodiment may have two configurations, that is, a configuration in which the base member 20 is fitted in the fitting groove FG and a configuration in which the base member 20 is also fitted in a groove formed at a position different from the fitting groove FG.
Thus, the substrate S can be supported not only by the plurality of substrate support pins 30 fixed to the base member 20 fitted in the fitting groove FG but also by the plurality of substrate support pins 30 fixed to the base member 20 fitted in the groove formed directly on the inner lower surface IL. Therefore, in addition to the effects obtained by the above embodiment, the following effects can be obtained: that is, the number of the substrate support pins 30 for supporting the substrate S is increased, and even if the substrate S is further increased in size, the substrate S can be horizontally maintained in the load lock chamber 10 while reducing the amount of warpage of the substrate S.
While the preferred embodiments of the present invention have been described above, and as described above, it should be understood that these embodiments are illustrative of the present invention and are not to be considered as limiting the invention. Additions, omissions, substitutions, and other modifications can be made without departing from the scope of the present invention. Accordingly, the invention is not to be seen as limited by the foregoing description, but is only limited by the scope of the appended claims.
In the above embodiment, the case where the load lock chamber 10 is constructed by five blocks has been described, but the number of blocks is not limited. If the number of blocks is two or more, six or more may be used.
In the above embodiment, the fitting groove FG (grooves 12G, 13G, 14G, 15G) extends in the X direction. The groove does not necessarily have to extend in the X direction, and may be formed in a direction intersecting the conveying direction TD, that is, in a direction inclined at a predetermined angle with respect to the conveying direction TD. In this case, the base member 20 fitted into the fitting groove FG also extends in a direction inclined at a predetermined angle with respect to the conveyance direction TD.
In the above embodiment, the case where the windows 12a and 14a corresponding to the upper internal space 11U and the lower internal space 11L are formed in the respective side surfaces of the second block 10B and the fourth block 10D has been described. The windows may be provided in the first block 10A, the third block 10C, and the fifth block 10E.
In the above embodiment, the case where the load lock chamber 10 includes two inner spaces, the upper inner space 11U and the lower inner space 11L, has been described, but the number of inner spaces is not limited to two, and may be one, or may be three or more.
In the above embodiment, the positioning mechanisms 41, 42, 43, and 44 are provided at positions corresponding to the four corners of the substrate S disposed in the vacuum chamber, but the number of the positioning mechanisms is not limited. In addition to the four positioning mechanisms described above, a positioning mechanism including a roller that contacts an end surface of the substrate S parallel to the transport direction TD may be provided inside the load lock chamber 10.
Industrial applicability
The present invention can be widely applied to a vacuum chamber that prevents particles from flying and scattering due to vibration generated by driving of a lift mechanism, prevents particles from being generated from a sealing member between a chamber body and a cover, and prevents particles from adhering to a substrate to be conveyed.
Description of the reference numerals
1 substrate processing apparatus 1A, 1B, 1C, 1D, 1E Process Chamber
2 transfer chamber 2a vacuum transfer robot
2b, 3b arm 2c, 3c manipulator
2d, 3d elevating system 3 atmosphere conveyor
3a atmospheric transfer robot 4 substrate cassette
10 load lock chamber (vacuum chamber) 10A first block (block)
10B second Block (Block) 10C third Block (Block)
10D fourth Block (Block) 10E fifth Block (Block)
11 inner space 11a, 15a sealing surface
11b, 11c, 15b, 15c exhaust sections 11E, 12E, 13E, 14E end faces
11L lower side inner space (inner space) 11U upper side inner space
12a, 14a Window 12b, 14b Flange
12G, 13G, 14G, 15G tanks 12GH, 13GH, 14GH, 15GH horizontal planes
The vertical surfaces 13a of 12GV, 13GV, 14GV and 15GV are open
13b exhaust gas filter 13c gas supply section
20 base member 20S screw hole
21L lower surface of the groove cover 21
21P through hole 21U upper surface
30 substrate support pin 30a atmospheric side substrate support pin (substrate support pin)
30b vacuum side substrate support pins (substrate support pins) 30c substrate corner support pins (substrate support pins)
31 upper part of rod 31U
32 ball bearing (support end) 32T upper end
33 fixed end 34 bolt
41. 42, 43, 44 positioning mechanism 45P base plate
Inner ends of 45XE, 45YE second rollers 45XE, 45YE
45Y first roller 46X second roller support part
46Y first roller supporting part 50B branch pipe
50M collecting pipeline of 50L and 50U vacuum valve
50P vacuum pump 100 control unit
AG. AG1, AG2 atmosphere side gate valve AX, AY axis
Gap of FG fitting groove G
IL medial inferior surface IS medial side
IU inner upper surface K angle area
OP, OP1, OP2 open space S substrate
Substrate before SL O-ring (sealing member) SP treatment
Vacuum side gate valves VG, VG1, VG2 in TD conveying direction

Claims (7)

1. A vacuum chamber configured by a plurality of blocks arranged along a conveyance direction of a substrate, wherein the blocks have an annular opening space when viewed from the conveyance direction, the vacuum chamber being capable of switching an atmosphere of an internal space formed by communicating the opening spaces of the plurality of blocks into an atmospheric pressure atmosphere and a vacuum atmosphere, the vacuum chamber comprising:
a first block being one of the plurality of blocks;
a second block which is one of the plurality of blocks, having a groove extending in a direction intersecting the conveying direction and formed on an inner lower surface of the open space, the second block being fixedly attached to the first block by a seal member;
a base member extending in an extending direction of the groove and fitted into the groove; and
a plurality of substrate supporting pins having a supporting end contacting the substrate and a fixed end located at an opposite side of the supporting end and fixed to the base member, the plurality of substrate supporting pins supporting the substrate inside the vacuum chamber.
2. The vacuum chamber of claim 1,
at least two blocks of the plurality of blocks each have an exhaust portion provided at a position corresponding to four corner regions of the internal space of the vacuum chamber in a plan view of the vacuum chamber.
3. The vacuum chamber of claim 1,
the groove is located between the first block and the second block,
a cover is provided between the base member fitted to the groove and the fixed end of the substrate support pin, the cover covering a gap between the first block and the second block.
4. The vacuum chamber of any of claims 1-3,
in a side view viewed from a direction parallel to the substrate and intersecting the transport direction,
a window is formed on a side of at least one of the plurality of blocks.
5. The vacuum chamber of claim 1,
at least two blocks of the plurality of blocks each have a positioning mechanism provided at a position corresponding to four corners of the substrate arranged inside the vacuum chamber in a plan view of the vacuum chamber,
each positioning mechanism includes:
a first roller rotatable about an axis parallel to the conveyance direction; and
a second roller rotatable about an axis parallel to a direction orthogonal to the conveyance direction,
positioning a corner of the substrate by the first roller and the second roller in a state where the substrate is in contact with the support ends of the plurality of substrate support pins.
6. A substrate processing apparatus, comprising:
a vacuum chamber configured by a plurality of blocks arranged along a conveyance direction of a substrate, wherein the blocks have an annular opening space when viewed from the conveyance direction, the vacuum chamber being capable of switching an atmosphere of an internal space formed by communicating the opening spaces of the plurality of blocks to an atmospheric pressure atmosphere and a vacuum atmosphere;
a transfer chamber connected to the vacuum chamber;
a process chamber connected to the transfer chamber; and
a transfer robot that performs transfer of the substrate between the vacuum chamber and the transfer chamber and between the transfer chamber and the process chamber and is disposed inside the transfer chamber,
the vacuum chamber includes:
a first block being one of the plurality of blocks;
a second block which is one of the plurality of blocks, having a groove extending in a direction intersecting the conveying direction and formed on an inner lower surface of the open space, the second block being fixedly attached to the first block by a seal member;
a base member extending in a direction in which the groove extends and fitted into the groove; and
a plurality of substrate supporting pins having a supporting end contacting the substrate and a fixed end located at an opposite side of the supporting end and fixed to the base member, the plurality of substrate supporting pins supporting the substrate inside the vacuum chamber.
7. The substrate processing apparatus according to claim 6,
the transfer robot includes:
a manipulator;
an arm for moving the robot in the conveying direction; and
an elevating mechanism for moving the robot in a vertical direction of the substrate,
in the inner space of the vacuum chamber,
the robot is moved between a position below the substrate and the transfer chamber by driving of the arm,
and the manipulator moves up and down between the lower position of the substrate and the upper position of the substrate by the driving of the lifting mechanism.
CN202010406402.7A 2019-07-12 2020-05-14 Vacuum chamber and substrate processing apparatus Active CN112210765B (en)

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CN112210765B (en) 2022-11-18

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