CN112119251A - 用于节点到节点连接的单剪切接头 - Google Patents

用于节点到节点连接的单剪切接头 Download PDF

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CN112119251A
CN112119251A CN201980032736.8A CN201980032736A CN112119251A CN 112119251 A CN112119251 A CN 112119251A CN 201980032736 A CN201980032736 A CN 201980032736A CN 112119251 A CN112119251 A CN 112119251A
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adhesive
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卡尔文·雷·麦克莱恩
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Divergent Technologies Inc
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Abstract

一方面涉及一种设备，包括具有第一结合表面的第一节点和具有第二结合表面的第二节点。该设备包括构造为用于接受粘合剂的特征和联接到构造为用于接受粘合剂的特征的粘合剂通道。该设备包括联接第一节点和第二节点的剪切接头，该剪切接头构造为在由第一结合表面和第二结合表面形成的粘合区域中接收粘合剂，该粘合剂用于通过构造为接受粘合剂的特征将第一结合表面联接到第二结合表面。

Description

用于节点到节点连接的单剪切接头
相关申请的交叉引用
本申请要求于2018年3月16日提交的、题为“用于节点到节点连接的单剪切接头”的美国专利申请No.15/924,133的权益，其全部内容通过引用明确地结合于本文。
技术领域
本公开总体上涉及在制造业中的设备和技术，更具体地，涉及可用于生产车辆、船只、飞机和其它机械结构的节点到节点连接。
背景技术
3D(三维)打印，还可以称为增材制造，是一种用于创建3D对象的过程。基于对象的数字模型数据，可以使用材料层来形成3D对象。3D打印机可以使用数字模型数据形成材料层，以一次打印一层。3D打印的对象几乎可以是任何形状或几何结构。
3D打印机可以在操作表面上散布粉末层(例如，粉末金属)。粉末层可以大约100微米厚。3D打印机然后可以将粉末层的特定区域结合到对象的层中，例如通过使用激光将粉末层的粉末结合在一起。可以重复这些步骤以循序地形成每一层。因此，可以逐层建立3D打印对象以形成3D对象。
3D打印的部件可以用于生产用于各种装置或设备的子部件。3D打印的子部件可能需要附接或连接到其它子部件，包括其它3D打印子部件、挤出子部件或其它子部件。
可以使用3D打印或其它制造技术来制造节点。这些节点可能需要附接在一起，以形成车辆、船只、飞机和其它机械结构。因此，节点到节点连接技术可以用于将节点附接在一起。
发明内容
在下文中将参考三维打印技术更全面地描述节点到节点单剪切连接的若干方面。
一方面是一种设备，其包括具有第一结合表面的第一节点和具有第二结合表面的第二节点。该设备还包括构造为用于接受粘合剂的特征和联接到构造为用于接受粘合剂的特征的粘合剂通道。该设备还包括联接第一节点和第二节点的剪切接头。该剪切接头构造为在由第一结合表面和第二结合表面形成的粘合区域中接收粘合剂。此外，粘合剂通过构造为用于接受粘合剂的特征将第一结合表面联接到第二结合表面。
一方面是制造方法。该方法包括增材制造具有第一结合表面的第一节点和具有第二结合表面的第二节点。该方法还包括固定第一节点和第二节点以用于粘合剂注射。该方法包括抽真空以排空结合区域。该方法还包括通过构造为接受粘合剂的特征注射粘合剂以填充结合区域。结合区域由第一节点的结合表面和第二节点的结合表面形成。此外，粘合剂将第一结合表面联接到第二结合表面。
一方面是一种设备，其包括用于增材制造具有第一结合表面的第一节点和具有第二结合表面的第二节点的装置。该设备还包括用于固定第一节点和第二节点以用于粘合剂注射的装置。该设备包括用于抽真空以排空粘合剂通道的装置。该设备还包括用于通过构造为接受粘合剂的特征注射粘合剂以填充结合区域的装置，该结合区域由第一节点的结合表面和第二节点的结合表面形成。粘合剂将第一结合表面联接到第二结合表面。
应当理解的是，3D打印部件和相关的紧固件的其它方面对于本领域技术人员将从以下详细描述中变得显而易见，其中仅通过说明的方式示出和描述若干实施例。如本领域技术人员将意识到的，3D打印部件和相关的紧固件能够具有其它且不同的实施例，并且其若干细节能够在各种其它方面进行修改，所有这些都不背离本发明。因此，附图和详细描述在本质上被认为是说明性的，而不是限制性的。
附图说明
现在将在附图中以示例的方式而非以限制的方式在详细描述中呈现3D打印部件和相关的紧固件的各个方面，其中：
图1A-D示出了在不同操作阶段期间的示例3D打印机系统；
图2是示出了示例连接特征的示意图；
图3是示出了用于接受密封剂的示例特征的示意图；
图4是示出了根据本文描述的系统和方法的示例方法的流程图；并且
图5是示出了根据本文描述的系统和方法的示例装置的示意图。
具体实施方式
下面结合附图阐述的详细描述旨在提供对3D打印部件和相关紧固件的各种示例性实施例的描述，并且不旨在表示本发明可以实践的唯一实施例。遍及本公开使用的术语“示例性”意味着“用作示例、实例或说明”，并且不应该被解释为相对于本公开中呈现的其它实施例是优选的或有利的。详细描述包括为了提供全面和完整的向本领域技术人员充分传达本发明的范围的公开的具体细节。然而，本发明可以在没有这些具体细节的情况下实践。在一些情况下，众所周知的结构和部件可以以框图形式示出，或者完全省略，以避免模糊遍及本公开呈现的各种概念。
3D打印在复合工具的背景下的使用提供了显著的灵活性，以使得机械结构和机械化组件的制造商能够制造具有复杂几何结构的零件。例如，3D打印技术为制造商提供了设计和构建通过传统制造工艺不可能制造的具有复杂内部网格结构和/或轮廓的零件的灵活性。
图1A-D示出了示例性3D打印机系统的相应的侧视图。在该示例中，3D打印机系统是粉末床融合(PBF)系统100。图1A-D示出了在不同操作阶段期间的PBF系统100。在图1A-D中所示的特定实施例是采用本公开原理的PBF系统的许多合适示例之一。还应该注意的是，本公开中的图1A-D和其它附图的元件不一定是按比例绘制的，而是为了更好地说明本文描述的概念可以绘制得更大或更小。PBF系统100可以包括能够沉积每层金属粉末的沉积器101、能够产生能量束的能量束源103、能够施加能量束以融合粉末材料的偏转器105以及能够支撑一个或多个构建件，例如构建件109的构建板107。PBF系统100还可以包括定位在粉末床容器内的构建底板111。粉末床容器112的壁通常限定粉末床容器的边界，粉末床容器从侧面夹置在壁112之间，并在下面贴靠构建底板111的一部分。构建底板111可以逐渐地降低构建板107，使得淀积器101可以淀积下一层。整个机构可以驻留在腔室113中，该腔室可以围住其它部件，从而保护设备，能够实现大气和温度调节并且减轻污染风险。淀积器101可以包括含有粉末117，例如金属粉末的送料器115，以及可以整平每层淀积粉末的顶部的整平器119。
具体参照图1A，该图示出了在构建件109的切片被融合之后，但在下一层粉末沉积之前的PBF系统100。事实上，图1A示出了PBF系统100已经沉积并融合多层切片，例如150层，以形成，例如由150个切片形成的构建件109的当前状态的时间。已经沉积的多层已经形成了粉末床121，该粉末床包括已沉积但未融合的粉末。
图1B示出了处于构建底板111可以降低粉末层厚度123的阶段的PBF系统100。构建底板111的降低导致构建件109和粉末床121下降粉末层厚度123，使得构建件和粉末床的顶部比粉末床容器壁112的顶部低等于粉末层厚度的量。以此方式，例如，可以在构建件109和粉末床121的顶部上方形成具有等于粉末层厚度123的一致厚度的空间。
图1C示出了处于某一阶段的PBF系统100，在该阶段中，淀积器101定位为将粉末117淀积在在构建件109和粉末床121的顶部表面上方产生的并且由粉末床容器壁112界定的空间中。在该示例中，淀积器101在限定的空间上方逐渐地移动，同时从送料器115中释放粉末117。整平器119可以整平释放的粉末，以形成具有基本上等于粉末层厚度123的厚度的粉末层125(见图1B)。因此，PBF系统中的粉末可以由粉末材料支撑结构支撑，该粉末材料支撑结构可以包括例如构建板107、构建底板111、构建件109、壁112等。应当注意的是，示出的粉末层125的厚度(即，粉末层厚度123(图1B))大于用于上面参考图1A讨论的包括150个先前沉积的层的实例的实际厚度。
图1D示出了PBF系统100处于粉末层125沉积(图1C)之后的阶段，能量束源103产生能量束127并且偏转器105施加能量束以融合构建件109中的下一个切片。在各种示例性实施例中，能量束源103可以是电子束源，在这种情况下能量束127构成电子束。偏转器105可以包括偏转板，该偏转板可以产生电场或磁场，该电场或磁场选择性地偏转电子束，以致使电子束扫描穿过指定要融合的区域。在各种实施例中，能量束源103可以是激光器，在这种情况下，能量束127是激光束。偏转器105可以包括光学系统，该光学系统使用反射和/或折射来操纵激光束以扫描待融合的选定区域。
在各种实施例中，偏转器105可以包括一个或多个万向节和致动器，其可以旋转和/或平移能量束源以定位能量束。在各种实施例中，能量束源103和/或偏转器105可以调制能量束，例如，当偏转器扫描时打开和关闭能量束，使得能量束仅施加在粉末层的适当区域中。例如，在各种实施例中，能量束可以由数字信号处理器(DSP)调制。
图2是示出了示例连接特征200的示意图。示例连接特征200可以是节点到节点连接202。节点到节点连接202可以通过包括单剪切粘合剂结合部222的接头204来实现。包括单剪切粘合剂结合部222的接头204可以是增材制造的节点(例如，第一节点206、第二节点208)之间的联结技术。节点206、208可以制造为具有基本平坦的特征210、212，以便于它们之间的粘合剂结合，从而形成连接(例如，单剪切接头204)。
形成接头的基本步骤可以是增材制造具有结合特征224、226(例如，结合接头204)的两个节点206、208。粘合剂入口端口和粘合剂出口端口(未示出)可以在节点206、208中的一个或两个上。粘合剂和真空端口可以是用于粘合剂和/或真空管的柱形连接点。粘合剂可以通过入口端口注入，并且粘合剂可以流入粘合剂区域并流出粘合剂出口端口。一方面可以依赖于粘合剂注射的压力。在另一方面，粘合剂出口端口可以连接到真空端口。节点206、208可以包括密封特征214。例如，密封特征214可以在节点208之一中。
形成接头的基本步骤可以包括将密封件216(例如，o形环或其它机械密封件)施加到密封特征214，并且固定节点206、208用于粘合剂注射。形成接头的基本步骤还可以包括抽真空以排空结合区域218，从而获得密封区段。此外，形成接头的基本步骤可以包括通过粘合剂端口注射粘合剂以填充结合区域218。形成接头的基本步骤还可以包括使粘合剂固化以获得连接。结合区域218可以由第一节点206的结合表面232和第二节点208的结合表面234形成。粘合剂可以用于将第一结合表面232联接到第二结合表面234。
图2的示例示出了包括单剪切粘合剂结合部222的示例接头204的横截面。在横截面中，第一节点206和第二节点208可以包括结合特征224、226(例如，结合接头204的结合特征)。结合特征224、226(例如，结合接头204的基本平坦的特征210、212)可以彼此平行。基本平坦的特征210、212可以以一定角度朝向负载路径定向，使得在施加粘合剂之前能够实现两个节点的初始装配。在一方面，角度可以是1度。在一方面，角度可以小于1度。在一方面，角度可以在1和2度之间。在一方面，角度可以在2和3度之间。在一方面，角度可以在3和4度之间。在一方面，角度可以在5和6度之间。在一方面，角度可以在6和7度之间。在一方面，角度可以在7和8度之间。在一方面，角度可以在8和9度之间。在一方面，角度可以在9和10度之间。在一方面，角度可以在1和10度之间。
在一方面，轻微成角度(例如，角度θ)的定向可以被设计成使得粘合剂结合部222的一区段与负载路径220保持基本平行，以产生具有合适的机械性能的连接。
图3是示出了构造为接受密封剂的特征302、304的示例的图示300。特征302可以由一对节点306A、306B形成。在另一方面，构造为接受密封剂的特征304可以存在于节点312B之一上。在一方面，特征302可以是凹槽，O形环可以装配在该凹槽中。O形环(见示例O形环轮廓314)可以围绕第二节点312B的表面形成环，例如在凹槽内。在一方面，一个O形环可以在节点的四个相或侧部上弯曲。O形环可以构造为在节点的两个部分之间形成桥接件。该桥接件可以允许粘合剂从节点的一部分流到节点的另一部分，例如，在O形环的部分之间。例如，O形环的一部分可以围绕节点密封，同时在O形环部分之间留下可以充当桥接件的间隙。由O形环限定的区域308可以是两个节点312A、312B之间的粘合剂结合区域。密封件可以为粘合剂提供气密密封的环境(例如，在粘合剂结合区域310内)，以被抽吸来实现结合。此外，密封件(例如，粘合剂和/或O形环)可以用作隔离器，以防止两个节点306A、306B的物理接触或节点312A、312B被联结，从而减少或消除电偶腐蚀的可能性。
设计基于O形环的密封件时，设计考虑可以包括桥接。当粘合剂通过粘合剂端口被抽吸到密封区段中时，粘合剂可以填充密封区段并被真空抽吸(例如，被连接到真空端口的负压源抽吸)。桥接件可以确保粘合剂完全填充密封区段(例如，在粘合剂结合区域310内)，并且填充过程可以以平滑、稳定的方式继续。
在一方面，真空端口和粘合剂端口可以位于节点306、312中的任一个上。增材制造节点306、312可以提供设计端口和用于粘合剂的通道以及通过通道进行填充(或抽吸)的真空的能力，以首先排空密封腔室，然后将粘合剂引入腔室。这些端口可以被称为真空端口和/或真空端口。在一些方面，这些真空端口和/或真空端口可以是凸起或凹部。粘合剂可以通过入口端口注入，并且粘合剂可以流入粘合剂区域并流出粘合剂出口端口。一方面可以依赖于粘合剂注射的压力。在另一方面，粘合剂出口端口可以连接到真空端口。
图4是示出了根据本文描述的系统和方法的示例方法的流程图。在402，实施该方法的设备可以制造第一节点。第一节点可以具有第一结合表面。例如，实施该方法的设备可以增材制造第一节点206。第一节点206可以具有第一结合表面232。在一方面，下面关于图5讨论的设备500可以构造为使得关于图1A-1D讨论的PBF系统100增材制造具有第一结合表面232的第一节点206。
在404，实施该方法的设备可以制造具有第二结合表面的第二节点。例如，实施该方法的设备可以增材制造具有第二结合表面234的第二节点208。在一方面，关于图5讨论的设备500可以构造为使得关于图1A-1D讨论的PBF系统100增材制造具有第二结合表面234的第二节点208。
在406，实施该方法的设备可以固定第一节点和第二节点以用于粘合剂注射。例如，实施该方法的设备可以固定第一节点206以用于粘合剂注射。实施该方法的设备还可以固定第二节点208以用于粘合剂注射。在一方面，关于图5讨论的组装设备500可以构造为致使组装设备固定第一节点206和第二节点208以用于粘合剂注射。
在408，实施该方法的设备可以施加至少一个密封件。例如，实施该方法的设备可以施加多个密封件。在一方面，关于图5讨论的设备500可以构造为使得组装设备施加至少一个密封件。
在410，实施该方法的设备可以抽真空以排空粘合剂通道。例如，实施该方法的设备可以连接到真空线路，并且可以抽真空以排空粘合剂通道。在一方面，关于图5讨论的设备500可以构造为使得组装设备抽真空以排空粘合剂通道。例如，关于图5讨论的设备500可以使得组装设备内的真空泵抽真空，以排空正在制造的节点中的粘合剂通道。
在412，实施该方法的设备可以通过构造为用于接受粘合剂的特征来注射粘合剂以填充结合区域。结合区域可以由第一节点的结合表面和第二节点的结合表面形成。粘合剂可以用于将第一结合表面联接到第二结合表面。例如，关于图5讨论的设备500可以构造为使得组装设备通过构造为接受粘合剂的特征来注射粘合剂以填充结合区域218。结合区域218可以由第一节点206的结合表面228和第二节点208的结合表面230形成。粘合剂可以用于将第一结合表面232联接到第二结合表面232。
在414，实施该方法的设备可以使粘合剂固化。例如，实施该方法的设备可以暂停制造过程或者暂停关于要固化的部件的制造过程，以使粘合剂固化。在一方面，关于图5讨论的设备500可以构造为使得组装设备让粘合剂固化。例如，设备500可以暂停制造过程或者暂停关于要固化的部件的制造过程，以使粘合剂固化。
组装设备可以是构造为执行506、508、510、512和/或514中的一个或多个的一个或多个组装设备。
图5是示出了设备500的示意图，该设备可以构造为实施本文描述的系统和方法，例如图4中实施的方法。例如，设备500可以是基于处理器512的控制系统，其可以控制关于图1A-1D讨论的PBF系统100。设备500可以包括能够表示由处理器、软件、硬件或其组合(例如，固件)实施的功能的功能块。
如图所示，在图5中，(并返回参考图2)在一方面，设备500可以包括部件502，该部件控制具有第一结合表面232的第一节点的增材制造。例如，部件502可以控制关于图1A-1D讨论的PBF系统100。在一方面，设备500可以包括部件504，该部件控制具有第二结合表面的第二节点208的增材制造。例如，部件504可以控制关于图1A-1D讨论的PBF系统100。部件502和504可以是可以控制一个或多个PBF系统100的单独的部件502、504。例如，两个单独的部件502、504通常可以用于控制两个PBF系统100，即一个部件502、504针对每个PBF系统100。部件502和504可以是可以控制一个或多个PBF系统100的单个部件520。例如，单个部件520通常可以用于控制单个PBF系统，即一个部件520针对PBF系统100。
设备500可以包括控制第一节点206和第二节点208的固定以用于粘合剂注射的部件506。例如，部件506可以控制关于图1A-1D讨论的PBF系统100以控制固定。设备500可以包括控制真空的抽吸以排空粘合剂通道控制的部件508。例如，部件506可以控制关于图1A-1D讨论的PBF系统100以控制抽真空。设备500可以包括通过构造为接受粘合剂控制的特征来控制粘合剂的注射的部件510。例如，部件510可以控制关于图1A-1D讨论的PBF系统100来控制注射。设备500可以包括控制施加至少一个密封件的部件(例如，处理器512)。例如，部件(例如，处理器512)可以控制关于图1A-1D讨论的PBF系统100以控制施加至少一个密封件。设备500可以包括控制使粘合剂固化的部件514。例如，部件514可以控制关于图1A-1D讨论的PBF系统100以控制固化。
在相关方面，设备500可以可选地包括具有至少一个处理器516的处理器部件。处理器516可以经由总线522或类似的通信联接与部件502、504、506、508、510、512、514、520或类似的部件操作性地通信。处理器516可以产生由部件502、504、506、508、510、512、514、520执行的功能或过程的启动和调度。处理器516可以全部或部分地包含部件502、504、506、508、510、512、514、520。可选地，处理器516可以与部件502、504、506、508、510、512、514、518、520分开，这些部件可以包括一个或多个单独的处理器。
设备500可以可选地包括用于存储信息的部件，例如举例来说，存储器装置/部件518。计算机可读介质或存储器部件518可以经由总线522等操作性地联接到设备500的其它部件。存储器部件518可适于存储用于执行部件502、504、506、508、510、512、514、520及其子部件或处理器516或本文公开的方法的活动的计算机可读指令和数据。存储器部件518可以保留用于执行与部件502、504、506、508、510、512、514、520相关联的功能的指令。虽然被示出为在存储器部件518外部，但是应当理解的是，部件502、504、506、508、510、512、514、520可以存在于存储器部件518内。
用于增材制造第一节点206的装置可以具有第一结合表面232，并且用于增材制造具有第二结合表面的第二节点208的装置可以是关于图1A-1D讨论的PBF系统100中的一个或多个。用于固定第一节点206和第二节点208以用于粘合剂注射的装置可以包括构造为保持第一节点206和第二节点208的固定件。用于抽真空以排空粘合剂通道的装置可以包括真空泵或能够抽真空的其它泵。用于通过构造为接受粘合剂的特征注射粘合剂以填充结合区域的装置可以是注射泵或能够注射粘合剂的一些其它类型的泵。在一方面，用于固定的装置、用于抽真空的装置或用于注射粘合剂的装置中的一个或多个可以与用于增材制造具有第一结合表面232的第一节点206的装置和用于增材制造具有第二结合表面的第二节点208的装置一起被结合到PBF系统100中。
根据本公开的各个方面，元件或元件的任何部分或元件的任何组合可以用包括一个或多个处理器的“处理系统”来实施。处理器的示例包括微处理器、微控制器、数字信号处理器(DSP)、现场可编程门阵列(FPGA)、可编程逻辑装置(PLD)、状态机、门逻辑、分立硬件电路，例如定制专用集成电路(ASIC)，以及构造为执行遍及本公开描述的各种功能的其它合适的硬件。处理系统中的一个或多个处理器可以执行软件。软件应广义地理解意为指令、指令集、代码、代码段、程序代码、程序、子程序、软件模块、应用程序、软件应用程序、软件包、例行程序、子例行程序、对象、可执行程序、执行线程、规程、函数等，无论是指软件、固件、中间件、微代码、硬件描述语言还是其它。软件可以驻留在计算机可读介质上。计算机可读介质可以是非暂时性计算机可读介质。举例来说，非暂时性计算机可读介质包括磁存储装置(例如，硬盘、软盘、磁条)、光盘(例如，压缩盘(CD)、数字多功能盘(DVD))、智能卡、闪存装置(例如，卡、棒、密钥驱动器)、随机存取存储器(RAM)、只读存储器(ROM)、可编程只读存储器(PROM)、可擦除可编程只读存储器(EPROM)、电可擦除可编程只读储器(EEPROM)、寄存器、可移动盘以及用于存储可以由计算机访问和读取的软件和/或指令的任何其它合适的介质。举例来说，计算机可读介质还可以包括载波、传输线和用于传输可以由计算机访问和读取的软件和/或指令的任何其它合适的介质。计算机可读介质可以驻留在处理系统中、在处理系统外部或者分布在包括处理系统的多个实体中。计算机可读介质可以在计算机程序产品中实施。举例来说，计算机程序产品可以包括包装材料中的计算机可读介质。本领域技术人员将认识到如何根据特定的应用和施加在整体系统上的整体设计约束来最好地实施遍及本公开呈现的所描述的功能。
应当理解的是，所公开的方法中的步骤的特定顺序或层次是为了示例的目的，而不是为了限制。基于设计偏好，可以理解的是，方法中的步骤的特定顺序或层次可以被重新安排。所附方法权利要求以示例顺序呈现各个步骤的元素，并且不意味着限制于所呈现的特定顺序或层次，除非在其中特别叙述。
前述描述被提供以使本领域的任何技术人员能够实践本文描述的各个方面。对这些方面的各种修改对于本领域技术人员来说将是显而易见的，并且本文限定的一般原理可以应用于其它方面。因此，权利要求并不旨在限制于本文所示的方面，而是要符合与权利要求的语言一致的全部范围，其中除非特别规定，否则以单数形式提及的元件并不意味着“一个且仅一个”，而是“一个或多个”除非特别规定，否则术语“一些”指一个或多个。提到项目的列表中的“至少一个”的短语是指那些项目的任何组合，包括单个成员。作为示例，“a、b或c中的至少一个”旨在涵盖：a；b；c；a和b；a和c；b和c以及a,b和c。本领域一般技术人员已知的或以后将会知道的贯遍及本公开所描述的各个方面的元件的所有结构和功能的等同物通过引用被清楚地包含在本文中，并且旨在被权利要求所包括。此外，本文公开的任何内容都不旨在致力于公众，无论这种公开是否在权利要求中明确叙述。任何权利要求要素都不得根据美国法典第35篇第112节第6段的规定进行解释，除非该要素明确地使用短语“用于……的手段(means for)”来叙述，或者在方法权利要求的情况下，该要素使用短语“用于……的步骤(step for)”来陈述。

Claims (23)

1.一种设备，包括：
具有第一结合表面的第一节点；
具有第二结合表面的第二节点；
构造为用于接受粘合剂的特征；
联接到构造为用于接受粘合剂的所述特征的粘合剂通道；以及
联接第一节点和第二节点的剪切接头，所述剪切接头构造为在由所述第一结合表面和所述第二结合表面形成的粘合区域中接收粘合剂，所述粘合剂用于通过构造为用于接受粘合剂的所述特征联接所述第一结合表面和所述第二结合表面。
2.根据权利要求1所述的设备，其中，构造为用于接受粘合剂的所述特征包括粘合剂入口和粘合剂出口。
3.根据权利要求2所述的设备，其中，所述粘合剂入口包括粘合剂端口，并且所述粘合剂出口包括真空端口。
4.根据权利要求2所述的设备，其中，所述粘合剂入口包括粘合剂端口，并且所述粘合剂出口包括用于粘合剂的出口。
5.根据权利要求3所述的设备，其中，所述真空端口位于所述第一节点或所述第二节点中的至少一个上，并且其中，所述粘合剂端口位于所述第一节点或所述第二节点中的至少一个上。
6.根据权利要求5所述的设备，其中，所述粘合剂端口和所述真空端口中的每一个包括凸起或凹部中的至少一个。
7.根据权利要求1所述的设备，还包括将所述第一结合表面联接到所述第二结合表面的粘合剂。
8.根据权利要求1所述的设备，所述剪切接头还包括密封剂特征。
9.根据权利要求8所述的设备，其中，所述密封剂特征包括第一密封剂和第二密封剂。
10.根据权利要求9所述的设备，其中，所述第一密封剂和所述第二密封剂附接到所述第一节点。
11.根据权利要求9所述的设备，其中，所述第一密封剂附接到所述第一节点，并且所述第二密封剂附接到所述第二节点。
12.根据权利要求8所述的设备，其中，所述密封剂包括机械密封剂特征。
13.根据权利要求12所述的设备，其中，所述机械密封剂特征包括O形环。
14.根据权利要求13所述的设备，其中，构造为用于接受密封剂的特征包括构造为用于接受所述O形环的凹槽。
15.根据权利要求8所述的设备，其中，所述密封剂为所述粘合剂提供气密密封的环境，所述密封剂在所述第一节点和所述第二节点之间提供隔离，以防止所述第一节点和所述第二节点的物理接触。
16.根据权利要求1所述的设备，其中，所述第一结合表面和所述第二结合表面彼此平行。
17.根据权利要求1所述的设备，其中，所述第一结合表面和所述第二结合表面以一定角度朝负载路径定向。
18.根据权利要求16所述的设备，其中，粘合剂结合区段与负载路径基本上保持平行。
19.一种方法，包括：
增材制造具有第一结合表面的第一节点；
增材制造具有第二结合表面的第二节点；
固定所述第一节点和所述第二节点以用于粘合剂注射；
抽真空以排空粘合剂通道；并且
通过构造为用于接受粘合剂的特征注射粘合剂以填充结合区域，所述结合区域由所述第一节点的结合表面和所述第二节点的结合表面形成，所述粘合剂用于将所述第一结合表面联接到第二结合表面。
20.根据权利要求19所述的方法，进一步包括将至少一个密封件施加到所述第一节点和所述第二节点中的至少一个。
21.根据权利要求19所述的方法，进一步包括使所述粘合剂固化以获得粘合剂结合。
22.一种设备，包括：
用于增材制造具有第一结合表面的第一节点的装置；
用于增材制造具有第二结合表面的第二节点的装置；
用于固定所述第一节点和所述第二节点以供粘合剂注射的装置；
用于抽真空以排空粘合剂通道的装置；以及
用于通过构造为接受粘合剂的特征注射粘合剂以填充结合区域的装置，所述结合区域由所述第一节点的结合表面和所述第二节点的结合表面形成，所述粘合剂用于将所述第一结合表面联接到所述第二结合表面。
23.根据权利要求22所述的设备，进一步包括用于将至少一个密封件施加到所述第一节点和所述第二节点中的至少一个的装置。
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