CN1120460C - 带有发光元件的指令及信号装置 - Google Patents

带有发光元件的指令及信号装置 Download PDF

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CN1120460C
CN1120460C CN00800216A CN00800216A CN1120460C CN 1120460 C CN1120460 C CN 1120460C CN 00800216 A CN00800216 A CN 00800216A CN 00800216 A CN00800216 A CN 00800216A CN 1120460 C CN1120460 C CN 1120460C
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light
emitting diode
signaling device
command
functional
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Expired - Fee Related
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CN1294669A (zh
Inventor
贝恩德·沃尔夫
约尔格·舍费尔
于尔根·福尔贝格
于尔根·赫格纳
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KLUEKNER-MOELLER GmbH
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KLUEKNER-MOELLER GmbH
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2111/00—Use or application of lighting devices or systems for signalling, marking or indicating, not provided for in codes F21W2102/00 – F21W2107/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/0999—Circuit printed on or in housing, e.g. housing as PCB; Circuit printed on the case of a component; PCB affixed to housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10446—Mounted on an edge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S362/00—Illumination
    • Y10S362/80—Light emitting diode

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Illuminated Signs And Luminous Advertising (AREA)
  • Led Device Packages (AREA)
  • Optical Communication System (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Semiconductor Lasers (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • User Interface Of Digital Computer (AREA)

Abstract

带发光元件的指令及信号装置或信号装置，由一个前部部件和一个固定转接器组成，其上可固定功能部件，为了使得成本地以及制造简单，仅仅一个带有发光二极管头(5)和连接线(4)的发光二极管(3)集成在功能部件(2)中，发光二极管头(5)被埋置在一个容纳部(6)中并且被固定住，发光二极管(3)具有30-45度的辐射角，发光二极管(3)的发光强度至少为0.5烛光，在壳体半部(1)的壳体内壁上固定着使用箔热压制法设置上的印制线路(11)，在该印制线路(11)上配置上电子电路。

Description

带有发光元件的指令及信号装置
技术领域
本发明涉及一种指令及信号装置或一种信号装置。
背景技术
在DE29800780中示出并描述了用于带有发光元件的信号装置的功能部件，其中，信号装置系由一个前部部件和一个固定转接器组成，在该转接器上可锁住功能部件。
功能部件具有一带有滑锁状支撑的发光体。发光体使用的是一个白炽灯。当然，白炽灯是有缺点的，即与其他的发光体(例如发光二极管)相比，其寿命比较短。绝缘材料外壳上具有印制线路。如在DE29800780中所述，该印制线路是借助于MID-技术的制造方法(两组分喷铸法)设置上的。
另外公知的是，用热压制法(Heisspraegeverfahren)将印制线路设置上，如在3D MID研究协会的公司样本中，在“立体电子组件”，5/98，第13页中示出。
如所周知，在信号装置中使用发光二极管。由于发光二极管的发光强度比白炽灯小，故至少使用两个发光二极管。
发明内容
本发明的任务是，提供一种指令及信号装置或者信号装置，该装置成本低，制造简单。
按照本发明，提出了一种带发光元件的指令及信号装置，由一个前部部件和一个固定转接器组成，其上可固定功能部件，其中，仅仅一个带有一个发光二极管头和连接线的发光二极管集成在功能部件中，其中，发光二极管头被埋置在一个容纳部中并且被固定住，发光二极管具有30-45度的辐射角，发光二极管的发光强度至少为0.5烛光，在壳体半部的壳体内壁上固定着使用箔热压制法设置上的印制线路，在该印制线路上配置上电子电路。
按照一种有利构型，在容纳部上有一个固定槽，发光二极管通过其凸缘固定在该槽中。
另外，有利的是，功能部件具有电子元器件。
还有利的是，功能部件具有至少一个卡接凸起部。
附图说明
借助图中所示实施例，对本发明及其进一步构型和改进以及进一步的优点进行详细的说明和解释。
其中，
图1：为仅带有壳体半部的功能部件的立体视图，
图2：为该敞开的功能部件的俯视图，
图3：是印制线路配置的外轮廓图，
图4：为带有余箔的压制印制线路图，
图5：为余箔图，
图6：带有元器件的印制线路图，
图7：带有箔的壳体视图，
图8：安装在壳体中的LED-元件视图，其中具有全部元器件。
具体实施方式
图1中示出了带有一个发光二极管3的功能部件2的壳体半部1。这个未完全示出的、可以是一个发光按键的指令及信号装置，或者可以是一个信号发光体的信号装置装有一个发光元件，并由一个前部部件和一个固定转接器组成，功能部件2可以卡接在其上。
按照本发明，只是将带有发光二极管头5和连接线4的发光二极管3组合在功能部件2上，其中，发光二极管头5埋置在容纳部6中并被固定住，发光二极管3的辐射角度是30-45度，发光二极管3的发光强度至少为0.5烛光(candela)。
由于辐射角为30-45度，因而光线聚束在发光二极管头的内表面上，使发光头显得特别亮。由于使用了发光强度至少为0.5烛光的发光二极管3，而使信号装置具有很好的照明。色彩再现明显好于白炽灯。
如图1所示，功能部件2另外还具有连接端子8，一个带有电子元件9的电子电路，并至少还有一个卡接凸起部10。
图3至图6示出了设置在壳体半部1内面上的印制线路11的形成过程。该方法称作热压制法并在“立体电子部件研究协会”3-D MID的样本中进行了详细说明。
首先，如图3所示，设置上由电解法获得的铜箔14，其中，铜箔14具有与壳体半部1匹配的外轮廓。
接着压制带有余箔12的印制线路11，如图4所示。将余箔取下后，如图5所示，印制线路11保持分布在壳体半部1上。如图6所示，在印制线路11上可将电子元器件9安置上。
由图7可知，在容纳部6处有一个固定槽7，发光二极管3的凸缘13卡在槽中而被固定住。
为了在将印制线路11压制到壳体半部1上去时能与余箔12脱开，热压头在压制区必须成锐边构型，通常余箔12应完全包围印制线路11，这样保证了在压制完后，余箔12能很好地从该壳体半部上取下来，并且在压制时热压头总是接触在箔体上，而不会直接碰触到该壳体半部1并因而被弄脏。
用于印制线路11的位置被加大。
为了使印制线路11能压制到壳体半部的角部上，在印制线路轮廓的外部上设置上圆弧半径。而余箔在这个区域上不需包围印制线路11。热压头相对于印制线路11的外轮廓可以退回一点，以避免接触到壳体半部1。
为了使取下余箔12的过程进一步优化，可使得箔14在压制前具有切口，例如为1/4圆的形式(见图3)。这些切口恰好处在压制头的锐边与倒圆部分之间的过渡处，并且与压制轮廓相交(见图4)。
                参考标号表
壳体半部     1                功能部件     2
发光二极管   3                连接线       4
发光二极管头 5                容纳部       6
固定槽       7                连接端子     8
电子元器件   9                卡接凸起部   10
印制线路     11               余箔         12
凸缘         13               箔           14

Claims (4)

1、带发光元件的指令及信号装置，由一个前部部件和一个固定转接器组成，其上可固定功能部件，其特征为：仅仅一个带有一个发光二极管头(5)和连接线(4)的发光二极管(3)集成在功能部件(2)中，其中，发光二极管头(5)被埋置在一个容纳部(6)中并且被固定住，发光二极管(3)具有30-45度的辐射角，发光二极管(3)的发光强度至少为0.5烛光，在壳体半部(1)的壳体内壁上固定着使用箔热压制法设置上的印制线路(11)，在该印制线路(11)上配置上电子电路。
2、如权利要求1的指令及信号装置，其特征为：在容纳部(6)上有一个固定槽(7)，发光二极管(3)通过其凸缘(13)固定在该槽中。
3、如上述权利要求之一的指令及信号装置，其特征为，功能部件(2)具有电子元器件(9)。
4、如权利要求2所述的指令及信号装置，其特征为，功能部件(2)具有至少一个卡接凸起部(10)。
CN00800216A 1999-02-27 2000-02-23 带有发光元件的指令及信号装置 Expired - Fee Related CN1120460C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19908574.9 1999-02-27
DE19908574A DE19908574B4 (de) 1999-02-27 1999-02-27 In ein Befehls- oder Meldegerät einrastbares Funktionselement mit einer Leuchtdiode

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CN1294669A CN1294669A (zh) 2001-05-09
CN1120460C true CN1120460C (zh) 2003-09-03

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US (1) US6409363B1 (zh)
EP (1) EP1086337B1 (zh)
CN (1) CN1120460C (zh)
AT (1) ATE403829T1 (zh)
AU (1) AU3281200A (zh)
CA (1) CA2328956A1 (zh)
DE (2) DE19908574B4 (zh)
ES (1) ES2311449T3 (zh)
HK (1) HK1036647A1 (zh)
WO (1) WO2000052383A1 (zh)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1217291B1 (en) * 2000-12-21 2007-05-30 Gamesman Limited Lamps
DE10102307C1 (de) * 2001-01-19 2002-05-23 Moeller Gmbh Lampenprüfschaltung
JP3985562B2 (ja) * 2002-02-25 2007-10-03 株式会社日立製作所 光ヘッド及び光ディスク装置
DE10348980A1 (de) * 2003-10-22 2005-06-16 Festo Ag & Co. Elektronisches Bauteil, beispielsweise Positionssensor
DE102005031268B3 (de) * 2005-07-05 2007-01-18 Moeller Gmbh Elektrische Schalteinrichtung
DE102015212177A1 (de) * 2015-06-30 2017-01-05 Osram Gmbh Schaltungsträger für eine elektronische Schaltung und Verfahren zum Herstellen eines derartigen Schaltungsträgers

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US4219172A (en) * 1978-06-26 1980-08-26 Nifco, Inc. Holder for electronic and electrical parts
JPS6181170U (zh) * 1984-10-31 1986-05-29
FR2576719B1 (fr) 1985-01-25 1987-04-30 Jaeger Support connecteur pour diode electroluminescente et tableau de bord de vehicule automobile utilisant celui-ci
FR2604829B3 (fr) * 1986-10-02 1988-12-02 Baco Const Elect Element lumineux pour auxiliaires de commande et de signalisation
DE3901533A1 (de) * 1989-01-20 1990-08-02 Elan Schaltelemente Gmbh Schalt- und/oder anzeigevorrichtung fuer die leiterplattenmontage
US5253144A (en) 1990-07-09 1993-10-12 Siemens Aktiengesellschaft Device housing having an integrated circuit board
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DE4438489C2 (de) * 1994-10-28 2000-10-19 Wolfgang Dammert Signalleuchte, insbsondere Baustellenleuchte oder Bakenleuchte
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JPH09308093A (ja) 1996-05-08 1997-11-28 Kinryu Sha 失効警告装置
DE29800780U1 (de) 1998-01-19 1998-04-02 Klöckner-Moeller GmbH, 53115 Bonn Isolierstoffgehäuse für elektrische Geräte

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Publication number Publication date
EP1086337A1 (de) 2001-03-28
DE19908574A1 (de) 2000-09-07
CA2328956A1 (en) 2000-09-08
HK1036647A1 (en) 2002-01-11
DE50015297D1 (de) 2008-09-18
EP1086337B1 (de) 2008-08-06
AU3281200A (en) 2000-09-21
DE19908574B4 (de) 2004-02-12
ATE403829T1 (de) 2008-08-15
WO2000052383A1 (de) 2000-09-08
CN1294669A (zh) 2001-05-09
US6409363B1 (en) 2002-06-25
ES2311449T3 (es) 2009-02-16

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