CN112040671B - Manufacturing method of flexible board raised circuit structure and flexible board raised circuit structure - Google Patents
Manufacturing method of flexible board raised circuit structure and flexible board raised circuit structure Download PDFInfo
- Publication number
- CN112040671B CN112040671B CN202010891435.5A CN202010891435A CN112040671B CN 112040671 B CN112040671 B CN 112040671B CN 202010891435 A CN202010891435 A CN 202010891435A CN 112040671 B CN112040671 B CN 112040671B
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- China
- Prior art keywords
- flexible board
- circuit structure
- windowing
- manufacturing
- dry film
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Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 40
- 239000010410 layer Substances 0.000 claims abstract description 45
- 239000010408 film Substances 0.000 claims description 39
- 238000000034 method Methods 0.000 claims description 23
- 239000011347 resin Substances 0.000 claims description 18
- 229920005989 resin Polymers 0.000 claims description 18
- 238000001035 drying Methods 0.000 claims description 12
- 239000013039 cover film Substances 0.000 claims description 11
- 239000000945 filler Substances 0.000 claims description 10
- 238000007650 screen-printing Methods 0.000 claims description 10
- 239000012790 adhesive layer Substances 0.000 claims description 6
- 238000007639 printing Methods 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 238000005498 polishing Methods 0.000 claims description 3
- 238000012545 processing Methods 0.000 abstract description 15
- 239000011241 protective layer Substances 0.000 abstract description 10
- 238000004080 punching Methods 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 12
- 230000008569 process Effects 0.000 description 12
- 239000003292 glue Substances 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 8
- 239000010949 copper Substances 0.000 description 8
- 238000009713 electroplating Methods 0.000 description 6
- 230000008093 supporting effect Effects 0.000 description 4
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The invention discloses a manufacturing method of a flexible board raised line structure, which comprises the steps of carrying out windowing on a position, corresponding to a first covering film, where a raised line structure is to be manufactured, to form a first windowing region, carrying out punching processing on the first surface from the second surface of a flexible board on the position of the first windowing region, forming a concave position on the second surface, forming a raised bonding pad on the first surface, manufacturing a protective layer on the first surface, attaching a dry film on the second surface, forming a dry film layer, carrying out windowing processing on the position, corresponding to the concave position, of the dry film layer, forming a second windowing region, filling the concave position with the second windowing region, removing the dry film layer, removing redundant filling, attaching a second covering film on the second surface, and removing the protective layer to obtain the flexible board raised line structure. The invention has simple processing flow and low manufacturing cost, and effectively improves the reliability of the flexible board raised circuit structure.
Description
Technical Field
The invention relates to the field of circuit board manufacturing, in particular to a manufacturing method of a flexible board protruding circuit structure and the flexible board protruding circuit structure.
Background
Some chip components need to be in a circuit mode of compression joint, such as a circuit board corresponding to the plugging position of an IC chip of a bank card, and a bonding pad of the chip components needs to be made into a convex circuit structure so as to accurately combine the plugging position of the IC chip.
At present, a secondary (or multiple) accumulated electroplating mode is generally adopted for manufacturing, namely, a copper layer accumulated structure is formed by repeatedly pasting a dry film, repeatedly electroplating and repeatedly microetching at the position of a convex circuit structure to be manufactured, so that the convex circuit structure is formed.
The manufacturing method mainly has the following problems:
1. the manufacturing process is complex: the process flows of dry film pasting, electroplating and microetching are complex, and the complex process flows have more hidden troubles of bad occurrence;
2. the reliability of the product is insufficient: because the binding force between the copper layers is limited, the convex circuit structure formed by accumulating electroplating is easy to conceal liquid medicine in the attached covering film layer in the subsequent processing, so that the covering film is loose and falls off, or in the later application, the problem of loosening between the convex circuit structure and the copper layer of the plate surface body, the problem of falling off of a bonding pad, and the like are easily caused by repeated friction for a long time;
3. the manufacturing cost is high: the dry film pasting, electroplating and microetching belong to the high-cost working procedures of the circuit board manufacturing working procedures, and the cost is obviously increased by multiple times by the processing;
4. is not beneficial to subsequent processing: the bump pad manufactured by electroplating causes uneven circuit surface and brings certain difficulty to the processing of other subsequent procedures.
In view of the above problems, no effective solution has been proposed at present.
Disclosure of Invention
The invention aims to solve the technical problems of providing a manufacturing method of a flexible board raised circuit structure and the flexible board raised circuit structure, which have the advantages of simple processing flow and low manufacturing cost, and effectively improve the reliability of the flexible board raised circuit structure.
In a first aspect, the present invention provides a method for manufacturing a bump circuit structure of a flexible board, the method comprising:
taking a flexible board, wherein a first surface of the flexible board is provided with a first covering film, and windowing is carried out on a position, corresponding to the first covering film, where a raised circuit structure is to be manufactured, so as to form a first windowing region;
stamping is carried out on the first surface of the flexible board from the second surface of the flexible board at the position of the first windowing area in a stamping mode, a concave position is formed on the second surface, and a convex bonding pad is formed on the first surface;
manufacturing a protective layer on the first surface, wherein the thickness of the protective layer is higher than the height of the bump pad;
attaching a dry film to the second surface to form a dry film layer, and performing windowing treatment on the position of the dry film layer corresponding to the concave position to form a second windowing region;
filling filler into the concave position through the second windowing area;
drying the filler, removing the dry film layer, and removing the redundant filler to enable the exposed surface of the filler in the concave position to be flush with the second surface;
attaching a second layer of cover film to the second surface;
and removing the protective layer to obtain the flexible board raised circuit structure.
Further, the protective layer is made of silk-screen blue glue and is subjected to drying treatment to form a blue glue layer.
Further, the thickness of the blue adhesive layer is 0.5-1.0 mm higher than the height of the bump pad.
Further, the temperature of the blue gel for drying treatment is 120-150 ℃.
Further, the time for drying the blue gel is 25-35 min.
Further, the second window opening area is 0.3-0.5 mm larger than the single side of the opening of the concave position.
Further, the filling filler is formed by printing filling resin ink to a concave position through a second window opening area in a screen printing mode, the window opening positions and the window opening sizes of the screen and the dry film layer are consistent, then the resin ink is dried, the dry film layer is removed, and the excessive resin ink is removed in a polishing mode, so that the exposed surface of the resin ink in the concave position is flush with the second surface;
further, the screen printing is screen printing or aluminum sheet printing.
In a second aspect, the invention further provides a flexible board raised line structure, which is manufactured by adopting the manufacturing method of the flexible board raised line structure.
By adopting the technical scheme, as the flexible board has certain toughness, the bump pad can be manufactured at one time in a mode of stamping from the back surface, the flexible board cannot be broken, and a mode of manufacturing the protective layer can be adopted to give a certain supporting and buffering effect to the bump pad, so that the bump pad is prevented from being pressed down in the subsequent processing, the filling of the concave position can effectively ensure that the problem that the bump pad is pressed down due to line cavities in the subsequent processing or using process is avoided, and the reliability of the bump line structure of the flexible board is effectively improved; the whole manufacturing flow design fully realizes that the circuit is manufactured under a flat condition, ensures that the raised circuit has a good filling and supporting effect, has relatively simple manufacturing flow and low manufacturing cost, and can not cause the problems of loosening, falling off and the like of the raised pad in the subsequent manufacturing process or application process because the copper of the raised pad and the copper of the circuit belong to the same copper layer, thereby effectively improving the reliability of the product.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions of the prior art, the drawings which are used in the description of the embodiments or the prior art will be briefly described, it being obvious that the drawings in the description below are only some embodiments of the invention, and that other drawings can be obtained according to these drawings without inventive faculty for a person skilled in the art.
FIG. 1 is a flow chart of a method for fabricating a bump circuit structure of a flexible board according to the present invention;
FIG. 2 is a schematic view of the structure of a first cover film according to the present invention;
FIG. 3 is a schematic diagram of the structure of the recessed locations and bump pads of the present invention;
FIG. 4 is a schematic diagram of a blue gel layer according to the present invention;
FIG. 5 is a schematic diagram of a dry film layer according to the present invention;
FIG. 6 is a schematic structural view of the resin ink of the present invention;
FIG. 7 is a schematic diagram of the structure of FIG. 6 after the dry film has been removed;
FIG. 8 is a schematic diagram of the structure of FIG. 7 after removing excess resin ink;
FIG. 9 is a schematic view of the structure of a second cover film of the present invention;
fig. 10 is a schematic structural view of a bump circuit structure of a flexible board according to the present invention.
The reference numerals are explained as follows:
a flexible board 1, a first surface 11, a second surface 12;
a first cover film 2, a first fenestration area 21;
a concave position 3;
bump pads 4;
a blue glue layer 5;
a dry film layer 6, a second fenestration area 61;
resin ink 7;
the second layer covers the film 8.
Detailed Description
The following describes the embodiments of the present invention further with reference to the drawings. The description of these embodiments is provided to assist understanding of the present invention, but is not intended to limit the present invention. In addition, the technical features of the embodiments of the present invention described below may be combined with each other as long as they do not collide with each other.
The invention provides a manufacturing method of a flexible board raised circuit structure, please refer to fig. 1, and the flow chart of the manufacturing method of the flexible board raised circuit structure of the invention in fig. 1 is shown, and the manufacturing method comprises the following steps:
s1: taking a flexible board, wherein a first surface of the flexible board is provided with a first covering film, and windowing is carried out on a position, corresponding to the first covering film, where a raised circuit structure is to be manufactured, so as to form a first windowing region;
s2: stamping is carried out on the first surface of the flexible board from the second surface of the flexible board at the position of the first windowing area in a stamping mode, a concave position is formed on the second surface, and a convex bonding pad is formed on the first surface;
s3: manufacturing a protective layer on the first surface, wherein the thickness of the protective layer is higher than the height of the bump pad;
s4: attaching a dry film to the second surface to form a dry film layer, and performing windowing treatment on the position of the dry film layer corresponding to the concave position to form a second windowing region;
s5: filling filler into the concave position through the second windowing area;
s6: and drying the filler, removing the dry film layer, and removing the redundant filler to enable the exposed surface of the filler in the concave position to be flush with the second surface.
S7: attaching a second layer of cover film to the second surface;
s8: and removing the protective layer to obtain the flexible board raised circuit structure.
The manufacturing method of the flexible board convex circuit structure fully realizes the processing of the circuit under the flat condition, ensures that the convex circuit structure has good filling and supporting effects, has simple processing flow and low manufacturing cost, and can not cause the problems of loosening, falling-off and the like of the convex bonding pad in the subsequent processing process or application process because the convex bonding pad and the flexible board belong to the same copper layer, thereby effectively improving the reliability of the flexible board convex circuit structure.
The present invention will be described in detail with reference to the accompanying drawings.
In this embodiment, the flexible board 1 is a flexible board having only one copper layer substrate, as shown in fig. 2, fig. 2 is a schematic structural diagram of a first cover film of the present invention, the first surface 11 of the flexible board 1 has a first cover film 2, and a first window opening area 21 is formed by performing a window opening process on a position corresponding to the first cover film 2 where a bump circuit structure is to be fabricated.
Referring to fig. 3, fig. 3 is a schematic structural diagram of the recess and bump pad of the present invention, in which a punching process is performed from the second surface 12 of the flexible board 1 to the first surface 11 of the flexible board 1, in which the recess 3 is formed on the second surface 12 and the bump pad 4 is formed on the first surface, by means of punching, for example, a punching machine, at the position of the first window area 21. In this embodiment, the shape of the bump pad 4 is a triangular prism, and the shape and the height of the bump pad 4 may be adjusted according to actual needs.
Fig. 4 is a schematic structural diagram of a blue glue layer according to the present invention, in order to protect the punched bump pad 4 from being pressed down in a subsequent process, blue glue with a sufficient thickness is silk-screened on the first surface 11, and a drying treatment is performed, wherein the drying treatment temperature is 120-150 ℃, the drying treatment time is 25-35 min, so as to form a blue glue layer 5, and the thickness of the blue glue layer 5 is higher than the height of the bump pad 4, and in this embodiment, the thickness of the blue glue layer 5 is 0.5-1.0 mm higher than the height of the bump pad 4, so as to protect and buffer the bump pad 4.
Referring to fig. 5, fig. 5 is a schematic structural diagram of a dry film layer of the present invention, in order to protect the second surface 12 in the subsequent process, a dry film layer 6 is formed by attaching a dry film to the second surface 12, and a second windowing region 61 is formed by performing windowing processing on a position of the dry film layer 6 corresponding to the recess 3. The second window area 61 is 0.3-0.5 mm larger than the opening of the recess 3.
As shown in fig. 6, fig. 6 is a schematic structural diagram of the resin ink of the present invention, in order to ensure that the bump pad 4 is not pressed down in the subsequent use process, a screen printing manner is adopted to print the resin ink 7 on the dry film layer 6, so as to fill the concave portion 3. The screen plate (not labeled in the figure) is consistent with the windowing position and the windowing size of the dry film layer 6. The screen printing is screen printing or aluminum sheet printing.
Referring to fig. 7 and 8, fig. 7 is a schematic structural diagram of fig. 6 after removing the dry film, fig. 8 is a schematic structural diagram of fig. 7 after removing the excessive resin ink, after drying the resin ink 7, removing the dry film layer 6, polishing with an abrasive belt or manually, and removing the excessive resin ink 7, so that the lower surface of the resin ink 7 in the recess 3 is flush with the second surface 12.
Referring to fig. 9 and 10, fig. 9 is a schematic structural view of a second layer of cover film according to the present invention, and fig. 10 is a schematic structural view of a bump circuit structure of a flexible board according to the present invention, wherein a second layer of cover film 8 is attached to the second surface 12, and the blue glue layer 5 is removed to obtain the bump circuit structure of the flexible board.
The invention also provides a flexible board raised line structure, which is manufactured by adopting the flexible board raised line structure manufacturing method in any embodiment.
The manufacturing method of the flexible board convex circuit structure realizes that the circuit is processed under a flat condition, and the flexible board has certain toughness, so that the convex bonding pad can be manufactured at one time in a mode of stamping from the back surface, and the flexible board cannot be broken. By means of the protection of the blue adhesive layer and the dry film layer in the manufacturing process, the filling resin ink has a good filling supporting effect on the bump pad, the problem that the bump pad is pressed down due to line cavities in the subsequent processing or using process is effectively avoided, the reliability of the bump line structure of the flexible board is improved, the manufacturing method is simple, and the manufacturing cost is low.
The embodiments of the present invention have been described in detail above with reference to the accompanying drawings, but the present invention is not limited to the described embodiments. It will be apparent to those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, and yet fall within the scope of the invention.
In the description of the present patent, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", "row", "column", etc. indicate orientations or positional relationships based on the drawings, are merely for convenience in describing the present patent and simplifying the description, and do not indicate or imply that the apparatus or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the patent.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present patent, the meaning of "plurality" is at least two, such as two, three, etc., unless explicitly defined otherwise.
In the patent of the invention, unless explicitly stated and limited otherwise, the terms "mounted," "connected," "secured," "fixedly connected," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present patent will be understood by those skilled in the art according to the specific circumstances.
In the present patent, unless expressly stated or limited otherwise, a first feature "up" or "down" on a second feature may be that the first and second features are in direct contact, or that the first and second features are in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.
Claims (7)
1. The manufacturing method of the flexible board convex circuit structure is characterized by comprising the following steps:
taking a flexible board, wherein a first surface of the flexible board is provided with a first covering film, and windowing is carried out on a position, corresponding to the first covering film, where a raised circuit structure is to be manufactured, so as to form a first windowing region;
stamping is carried out on the first surface of the flexible board from the second surface of the flexible board at the position of the first windowing area in a stamping mode, a concave position is formed on the second surface, and a convex bonding pad is formed on the first surface;
performing silk screen printing on the first surface and drying to form a blue adhesive layer, wherein the thickness of the blue adhesive layer is higher than the height of the bump pad;
attaching a dry film to the second surface to form a dry film layer, and performing windowing treatment on the position of the dry film layer corresponding to the concave position to form a second windowing region;
filling filler into the concave position through a second windowing area, namely printing resin ink into the concave position through the second windowing area in a screen printing mode, wherein the screen is consistent with the windowing position and the windowing size of the dry film layer, drying the resin ink, removing the dry film layer, and removing redundant resin ink in a polishing mode so that the exposed surface of the resin ink in the concave position is flush with the second surface;
attaching a second layer of cover film to the second surface;
and removing the blue adhesive layer to obtain the flexible board raised circuit structure.
2. The method for manufacturing a bump circuit structure of a flexible board according to claim 1, wherein the thickness of the blue adhesive layer is 0.5-1.0 mm higher than the height of the bump pad.
3. The method for manufacturing a raised circuit structure of a flexible board according to claim 1, wherein the temperature of the blue gel is 120-150 ℃.
4. The method for manufacturing the convex circuit structure of the flexible board according to claim 1, wherein the time for drying the blue gel is 25-35 min.
5. The method for manufacturing the convex circuit structure of the flexible board according to claim 1, wherein the second window opening area is 0.3-0.5 mm larger than the opening part of the concave position.
6. The method for manufacturing a bump circuit structure for a flexible board according to claim 1, wherein the screen printing is screen printing or aluminum sheet printing.
7. A flexible board bump wiring structure, characterized in that the flexible board bump wiring structure is manufactured by the flexible board bump wiring structure manufacturing method according to any one of claims 1 to 6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010891435.5A CN112040671B (en) | 2020-08-30 | 2020-08-30 | Manufacturing method of flexible board raised circuit structure and flexible board raised circuit structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010891435.5A CN112040671B (en) | 2020-08-30 | 2020-08-30 | Manufacturing method of flexible board raised circuit structure and flexible board raised circuit structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112040671A CN112040671A (en) | 2020-12-04 |
| CN112040671B true CN112040671B (en) | 2024-03-15 |
Family
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010891435.5A Active CN112040671B (en) | 2020-08-30 | 2020-08-30 | Manufacturing method of flexible board raised circuit structure and flexible board raised circuit structure |
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| Country | Link |
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| CN (1) | CN112040671B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5097101A (en) * | 1991-02-05 | 1992-03-17 | Tektronix, Inc. | Method of forming a conductive contact bump on a flexible substrate and a flexible substrate |
| US5147208A (en) * | 1991-06-28 | 1992-09-15 | Rogers Corporation | Flexible printed circuit with raised contacts |
| US6085414A (en) * | 1996-08-15 | 2000-07-11 | Packard Hughes Interconnect Company | Method of making a flexible circuit with raised features protruding from two surfaces and products therefrom |
| DE69938767D1 (en) * | 1998-03-27 | 2008-07-03 | Seiko Epson Corp | SEMICONDUCTOR COMPONENT AND ITS MANUFACTURING METHOD, COMPONENT SUBSTRATE, AND ELECTRONIC COMPONENT |
| CN206442587U (en) * | 2017-02-23 | 2017-08-25 | 福建世卓电子科技有限公司 | A kind of FPC of hemispherical pad |
-
2020
- 2020-08-30 CN CN202010891435.5A patent/CN112040671B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5097101A (en) * | 1991-02-05 | 1992-03-17 | Tektronix, Inc. | Method of forming a conductive contact bump on a flexible substrate and a flexible substrate |
| US5147208A (en) * | 1991-06-28 | 1992-09-15 | Rogers Corporation | Flexible printed circuit with raised contacts |
| US6085414A (en) * | 1996-08-15 | 2000-07-11 | Packard Hughes Interconnect Company | Method of making a flexible circuit with raised features protruding from two surfaces and products therefrom |
| DE69938767D1 (en) * | 1998-03-27 | 2008-07-03 | Seiko Epson Corp | SEMICONDUCTOR COMPONENT AND ITS MANUFACTURING METHOD, COMPONENT SUBSTRATE, AND ELECTRONIC COMPONENT |
| CN206442587U (en) * | 2017-02-23 | 2017-08-25 | 福建世卓电子科技有限公司 | A kind of FPC of hemispherical pad |
Also Published As
| Publication number | Publication date |
|---|---|
| CN112040671A (en) | 2020-12-04 |
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