CN210428514U

CN210428514U - Smart card strip and smart card module

Info

Publication number: CN210428514U
Application number: CN201921932060.1U
Authority: CN
Inventors: 冯学裕
Original assignee: Chengtian Weiye Ningbo Chip Technology Co Ltd
Current assignee: Chengtian Weiye Ningbo Chip Technology Co Ltd
Priority date: 2019-11-11
Filing date: 2019-11-11
Publication date: 2020-04-28
Anticipated expiration: 2029-11-11

Abstract

The utility model provides a smart card strip and smart card module of using this smart card strip, wherein, this smart card strip is through laying at least one metal level in the surface that the carrier band deviates from copper foil line layer, and the chip is located the surface that the metal level deviates from carrier band one side, and gold thread electric connection is passed through in copper foil line layer to the pin of chip. In the work of smart card strip, the electrical interference of production is shielded by the metal level, meanwhile because the surface of metal level is located to the chip to connect copper foil circuit layer through the gold thread, the metal level is equal to ground metal layer this moment, promptly, the utility model discloses locate the back of carrier band with ground metal layer, so fully utilized the area that the carrier band deviates from copper foil circuit layer, when reaching the same anti-interference effect, can reduce the area of design ground metal layer on the copper foil circuit layer greatly when the design, consequently can be when guaranteeing anti-interference effect, the size of the reduction smart card strip volume of great degree.

Description

Smart card strip and smart card module

Technical Field

The utility model relates to a microelectronics semiconductor package technical field, in particular to smart card strip and smart card module.

Background

Smart Card (Smart Card): a generic term for a plastic card (usually the size of a credit card) with a microchip embedded therein. Some smart cards contain a microelectronic chip and require data interaction via a reader/writer. The smart card is equipped with CPU, RAM and I/O, and can process a large amount of data without interfering the operation of the CPU of the host computer. The smart card may also filter out erroneous data to relieve the host CPU of the burden. The method is suitable for occasions with more ports and higher communication speed requirements. The integrated circuit in the card comprises a central processing unit CPU, a programmable read-only memory EEPROM, a random access memory RAM and a card Operating system COS (chip Operating system) solidified in the read-only memory ROM. The data in the card is divided into an external reading part and an internal processing part.

The ISO face of traditional smart card strip needs to set up the GND metal level specially to avoid the signal interference that circuit work produced, the GND metal level area is big more generally, and the ability of anti-jamming is stronger, but if set up the GND metal level area too big, can influence the laying of other circuits, and the volume of cassette tape also can corresponding grow.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a smart card strip, when aiming at improving smart card strip interference killing feature, reduce the volume of cassette tape.

In order to achieve the above object, the utility model provides a smart card strip, include:

carrying a belt;

the copper foil circuit layer is laid on the surface of the carrier tape;

the metal layer is laid on the surface of the carrier tape, which is deviated from the copper foil circuit layer; and

the chip is arranged on the surface of the metal layer, which deviates from one side of the carrier tape, and pins of the chip are electrically connected with the copper foil circuit layer through gold wires.

Optionally, the metal layer is made of tin foil and/or aluminum foil.

Optionally, the number of the metal layers is multiple, and the multiple metal layers are sequentially stacked and applied on the surface of the carrier tape.

Optionally, the surface areas of the plurality of metal layers are arranged along a side of the carrier tape, which is away from the copper foil circuit, in a gradually decreasing manner.

Optionally, the copper foil circuit layer is provided with an avoiding hole penetrating through two opposite surfaces of the copper foil circuit layer, the avoiding hole and the carrier tape form a copper-free area, and the copper-free area corresponds to the chip.

Optionally, a projection of the chip formed on the surface of the carrier tape is located in the copper-free area.

The utility model discloses still provide a smart card module, the smart card module includes smart card strip and card base plate, the smart card strip bond in the card base plate, the smart card strip be as above the smart card strip.

Has the advantages that:

the utility model discloses a smart card strip band-pass is through laying at least a metal level in the surface that the carrier band deviates from copper foil line layer, and the chip is located the surface that the metal level deviates from carrier band one side, and gold thread electric connection is passed through in copper foil line layer to the pin of chip. In the work of smart card strip, the electrical interference of production is shielded by the metal level, meanwhile because the surface of metal level is located to the chip to connect copper foil circuit layer through the gold thread, the metal level is equal to ground metal layer this moment, promptly, the utility model discloses locate the back of carrier band with ground metal layer, so fully utilized the area that the carrier band deviates from copper foil circuit layer, when reaching the same anti-interference effect, can reduce the area of design ground metal layer on the copper foil circuit layer greatly when the design, consequently can be when guaranteeing anti-interference effect, the size of the reduction smart card strip volume of great degree.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.

FIG. 1 is a front view of one embodiment of a smart card strip of the present invention;

FIG. 2 is a rear view of the smart card strip shown in FIG. 1;

FIG. 3 is a cross-sectional view of the smart card strip shown in FIG. 1;

fig. 4 is a flowchart of a method for manufacturing the smart card module of the present invention.

The reference numbers illustrate:

reference numerals	Name (R)	Reference numerals	Name (R)
				1	Smart card strip	20a	Avoiding hole
10	Carrier tape	30	Metal layer
				10a	Copper free region	40	Chip and method for manufacturing the same
20	Copper foil circuit layer	41	Contact point

The objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

It should be noted that all the directional indicators (such as upper, lower, left, right, front and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicator is changed accordingly.

In addition, the descriptions related to "first", "second", etc. in the present invention are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicit ly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.

Referring to fig. 1 to 3, the present invention provides a smart card strip 1.

In an embodiment of the present invention, the smart card strip 1 includes:

a carrier tape 10;

the copper foil circuit layer 20 is laid on the surface of the carrier tape 10;

at least one metal layer 30, wherein the metal layer 30 is laid on the surface of the carrier tape 10 departing from the copper foil circuit layer 20; and

and the chip 40 is arranged on the surface of one side, deviating from the carrier tape 10, of the metal layer 30, and pins of the chip 40 are electrically connected to the copper foil circuit layer 20 through gold wires.

The utility model discloses an in the embodiment, carrier band 10 is made by epoxy glass cloth material, the size of carrier band 10 designs as required to be double arrange or the single row is arranged, the both sides of carrier band 10 all the equipartition have the perforation, copper foil circuit layer 20 is made in carrier band 10 and through the etching process by the copper foil pressfitting, metal level 30 passes through adhesive pressfitting such as resin in the back of carrier band 10, carrier band 10 deviates from the surface of copper foil circuit layer 20 promptly, chip 40 connects in the surface of metal level 30 through solid crystal technology, and through drawing the gold thread and the copper foil circuit layer 20 electric connection of relative one side.

The utility model discloses a smart card strip 1 is through laying at least a metal level 30 on the surface that carrier band 10 deviates from copper foil circuit layer 20, and chip 40 locates the surface that metal level 30 deviates from carrier band 10 one side, and gold thread electric connection is passed through in copper foil circuit layer 20 to chip 40's pin. In the work of smart card strip 1, the electrical interference of production is shielded by metal level 30, meanwhile because chip 40 locates the surface of metal level 30, and connect copper foil circuit layer 20 through the gold thread, this moment metal level 30 is equal to ground metal layer 30, promptly, the utility model discloses locate the back of carrier band 10 with ground metal layer 30, so fully utilized carrier band 10 to deviate from the area of copper foil circuit layer 20, when reaching the same anti-interference effect, can reduce the area of design ground metal layer 30 on copper foil circuit layer 20 greatly when the design, consequently can be when guaranteeing the anti-interference effect, the reduction of great degree smart card strip 1 volumetric size.

Optionally, in order to achieve the anti-interference and shielding effects of the metal layer 30, the metal layer 30 is made of tin foil and/or aluminum foil. Specifically, in an embodiment of the present invention, the tin foil or the aluminum foil is pressed on the surface of the carrier tape 10 by a pressing process. It can be understood that the tin foil or the aluminum foil has the same anti-interference effect, and the material cost is lower than that of the copper foil, so that the manufacturing and production cost of the intelligent card strip 1 is reduced to a greater extent while the stable working performance and the reduced volume of the intelligent card strip 1 are ensured.

In an embodiment of the present invention, the metal layers 30 are multiple, that is, the tin foil or the aluminum foil is multiple, the metal layers 30 are sequentially stacked and applied on the surface of the carrier tape 10, and the surface area of the metal layers 30 is along the carrier tape 10 deviates from one side of the copper foil circuit and is a gradually decreasing setting. It can be understood that, by laminating a plurality of metal layers 30 on the back surface of the carrier tape 10, the area of the metal layers 30 is increased, thereby improving the guiding efficiency of leakage current, static charge and interference signals in the circuit and the coupling efficiency of the smart card strip 1. Meanwhile, the surfaces of the metal layers 30 are gradually reduced, so that the metal layers 30 of each layer can partially leak outwards, and the heat dissipation performance of the metal layers 30 is improved, thereby avoiding the risk of burning out the chip 40 to a greater extent and prolonging the service life of the smart card strip 1.

Optionally, the copper foil circuit layer 20 is provided with an avoiding hole 20a penetrating through two opposite surfaces of the copper foil circuit layer, the avoiding hole 20a and the carrier tape 10 form a copper-free area 10a, and the copper-free area 10a is arranged corresponding to the chip 40.

The projection of the chip 40 formed on the surface of the carrier tape 10 is located in the copper-free region 10 a.

Particularly, since the smart card strip 1 of the present invention is grounded through the metal layer 30 disposed on the back of the carrier tape 10, the copper foil of the copper foil circuit layer 20 can be eliminated relative to the position of the chip 40, and the copper-free area 10a is formed, so as to further reduce the amount of copper used by the smart card strip 1. That is, before the copper foil is laminated on the surface of the carrier tape 10, the relief hole 20a may be formed in the copper foil by stamping, cutting or pre-forming, and the size of the relief hole 20a is at least larger than that of the chip 40, so that the cut copper foil scrap can be recycled. This may further save the production costs of the smart card ribbon.

The utility model discloses still provide a smart card module, this smart card module includes card base plate and smart card strip 1, and the concrete structure of this smart card strip 1 refers to above-mentioned embodiment, because this smart card module has adopted the whole technical scheme of above-mentioned all embodiments, consequently has all beneficial effects that the technical scheme of above-mentioned embodiment brought at least, and the repeated description is no longer given here. The smart card module is manufactured by packaging the smart card strip 1 on a card substrate.

Please refer to fig. 4 in combination, the present invention further provides a method for manufacturing a smart card module, which includes the following steps:

s10, providing a carrier tape 10, copper foil, at least one metal layer 30, chip 40 and card substrate;

s20, respectively pressing the copper foil and the metal layer 30 on two opposite surfaces of the carrier tape 10, and etching the copper foil to form a circuit on the surface of the copper foil to obtain a copper foil circuit layer 20;

s30, attaching the chip 40 to the surface of the metal layer 30 through a die bonding process, connecting the chip 40 to the corresponding contact 41 of the copper foil circuit layer 20 through a gold wire, coating ultraviolet curing glue on the surface of the chip 40, and curing the ultraviolet curing glue through a UV furnace to obtain an intelligent card strip 1;

and S40, packaging the intelligent card strip 1 to obtain an intelligent card module.

The above only be the preferred embodiment of the utility model discloses a not consequently restriction the utility model discloses a patent range, all are in the utility model discloses a conceive, utilize the equivalent structure transform of what the content was done in the description and the attached drawing, or direct/indirect application all is included in other relevant technical field the utility model discloses a patent protection within range.

Claims

1. A smart card strip, comprising:

carrying a belt;

the copper foil circuit layer is laid on the surface of the carrier tape;

2. The smart card strip of claim 1 wherein the metal layer is tin foil and/or aluminum foil.

3. The smart card strip of claim 1 wherein said metal layer is a plurality of metal layers, and a plurality of said metal layers are sequentially laminated and applied to a surface of said carrier tape.

4. The smart card strip of claim 3 wherein the plurality of metal layers have a surface area that tapers along a side of the carrier tape facing away from the copper foil traces.

5. The smart card strip of any one of claims 1 to 4, wherein the copper foil circuit layer is provided with avoiding holes penetrating opposite surfaces thereof, the avoiding holes and the carrier tape forming a copper-free area, the copper-free area being disposed corresponding to the chip.

6. The smart card strip of claim 5 wherein a projection of the chip onto the carrier tape surface is located within the copper-free region.

7. A smart card module, characterized in that the smart card module comprises a smart card strip and a card substrate, the smart card strip being glued to the card substrate, the smart card strip being a smart card strip as claimed in any one of claims 1 to 6.