CN206442587U - A kind of FPC of hemispherical pad - Google Patents
A kind of FPC of hemispherical pad Download PDFInfo
- Publication number
- CN206442587U CN206442587U CN201720161047.5U CN201720161047U CN206442587U CN 206442587 U CN206442587 U CN 206442587U CN 201720161047 U CN201720161047 U CN 201720161047U CN 206442587 U CN206442587 U CN 206442587U
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- China
- Prior art keywords
- pad
- fpc
- hemispherical
- copper foil
- rolled copper
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Abstract
The utility model provides a kind of FPC of hemispherical pad, is base material with Kapton, and substrate upper surface is covered with rolled copper foil, and rolled copper foil upper surface is covered with cover layer, cover layer windowing position exposed pad, it is characterised in that：Pad has elevated regions, the hemispherical configuration that rolled copper foil and the base material formation in elevated regions position raise up, and the upper surface of the raised hemispherical configuration of rolled copper foil has the electrodeposited coating of nickel and hard alloy material.Hemispherical pad on this FPC of the utility model, utilize the characteristic of FPC Bendable telescopic itself, the function of the slideable contact of hemispherical pad is utilized again, it is connected by FPC with other circuits, used as the circuit for needing telescopic slide to contact, some bridgt circuits can be saved, reliability is improved, and is adapted to smaller assembly space and install.Such as printer, digital camera electronic product is used.
Description
Technical field
The utility model belongs to a kind of wiring board, more particularly to a kind of FPC.
Background technology
Conventional FPC pad is all circular or square plane, or planar central has hole, so needs more
Connection circuit and bridgt circuit realize assembling, it is impossible to meet intellectuality, the multifunction of some modern electronic products, and
Short, thin, small demand.
The content of the invention
The utility model provides a kind of FPC of hemispherical pad, and the purpose is to be applied to telescopic slide to connect
Tactile circuit is used, and can save some bridgt circuits, is improved reliability, and is adapted to the smaller assembly space of electronic product and installs.
The utility model solves the technical scheme that its technical problem used：
A kind of FPC of hemispherical pad, is base material with Kapton, and substrate upper surface is covered with pressure
Prolong copper foil, rolled copper foil upper surface is covered with cover layer, cover layer windowing position exposed pad, it is characterised in that：Pad has
Elevated regions, the hemispherical configuration that raises up of rolled copper foil and base material formation in elevated regions position, rolled copper foil it is convex
The upper surface of the hemispherical configuration risen has the electrodeposited coating of nickel and hard alloy material.
It is of the present utility model to be beneficial in that：
Hemispherical pad on this FPC of the utility model, utilizes FPC Bendable telescopic itself
Characteristic, again using the function of the slideable contact of hemispherical pad, is connected with other circuits by FPC, is used as needs
The circuit of telescopic slide contact is used, and can save some bridgt circuits, improves reliability, and be adapted to smaller assembly space peace
Dress.Such as printer, digital camera electronic product is used.
Brief description of the drawings
The utility model is further illustrated with reference to the accompanying drawings and examples.
Fig. 1 is the undressed raised pre-structure figure of pad of the present utility model；
Fig. 2 is structure chart after pad processing projection of the present utility model.
Embodiment
In order to illustrate more clearly of the technical solution of the utility model, the required accompanying drawing used in description will be made below
Simply introduce, it should be apparent that, drawings in the following description are only some embodiments of the present utility model, for this area
For those of ordinary skill, on the premise of not paying creative work, other implement can also be obtained according to these accompanying drawings
Example.
As shown in Figure 1 and Figure 2：
The utility model is FPC, uses 0.05mm polyimides（Abbreviation PI）Film is base material 1, covers last layer
The single-side coated copper plate of rolled copper foil 2 thick 18um, be fabricated to single-sided flexible circuit board, exposed pad 4 after cover layer 3 opens a window and such as
Fig. 1 structure.
Such as Fig. 2, then carry out punching press to the base material 1 and copper foil 2 at the position of pad 4 with special dies, goes out pad hemispherical convex
Region 41 is played, the hemispherical knot that rolled copper foil 2 and base material 1 formation in the position of pad hemispherical protuberances region 41 raise up
Structure, so just forms the hemispherical pad FPC of one side.The upper surface of these hemispherical pads is thick by plating 15-20um
Nickel and the thick hard gold of 0.075-0.090um after, namely the raised hemispherical configuration of rolled copper foil 2 upper surface have nickel and
The electrodeposited coating 5 of hard alloy material, just has certain smoothness and hardness, with slidability and wearability.The utility model
Hemispherical pad FPC, by being connected with other circuits, uses as the circuit for needing telescopic slide to contact, saves
Bridgt circuit, makes circuit simpler, better reliability, and is adapted to this baroque assembly space installation of printer.
The embodiment of each in this specification is described by the way of progressive, and what each embodiment was stressed is and other
Between the difference of embodiment, each embodiment identical similar portion mutually referring to.To the upper of the disclosed embodiments
State bright, professional and technical personnel in the field is realized or use the utility model.A variety of modifications pair to these embodiments
It will be apparent for those skilled in the art, generic principles defined herein can not depart from this reality
In the case of with new spirit or scope, realize in other embodiments.Therefore, the utility model is not intended to be limited to this
These embodiments shown in text, and it is to fit to the most wide scope consistent with features of novelty with principles disclosed herein.
Claims (1)
1. a kind of FPC of hemispherical pad, is base material with Kapton, substrate upper surface is covered with calendering
Copper foil, rolled copper foil upper surface is covered with cover layer, cover layer windowing position exposed pad, it is characterised in that：Pad has convex
Region is played, the hemispherical configuration that rolled copper foil and the base material formation in elevated regions position raise up, the projection of rolled copper foil
The upper surface of hemispherical configuration there is the electrodeposited coating of nickel and hard alloy material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720161047.5U CN206442587U (en) | 2017-02-23 | 2017-02-23 | A kind of FPC of hemispherical pad |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720161047.5U CN206442587U (en) | 2017-02-23 | 2017-02-23 | A kind of FPC of hemispherical pad |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206442587U true CN206442587U (en) | 2017-08-25 |
Family
ID=59633947
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720161047.5U Active CN206442587U (en) | 2017-02-23 | 2017-02-23 | A kind of FPC of hemispherical pad |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206442587U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112040671A (en) * | 2020-08-30 | 2020-12-04 | 深圳市实锐泰科技有限公司 | Manufacturing method of flexible board raised circuit structure and flexible board raised circuit structure |
| WO2022261970A1 (en) * | 2021-06-18 | 2022-12-22 | 庆鼎精密电子（淮安）有限公司 | Circuit board assembly and manufacturing method therefor |
-
2017
- 2017-02-23 CN CN201720161047.5U patent/CN206442587U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112040671A (en) * | 2020-08-30 | 2020-12-04 | 深圳市实锐泰科技有限公司 | Manufacturing method of flexible board raised circuit structure and flexible board raised circuit structure |
| CN112040671B (en) * | 2020-08-30 | 2024-03-15 | 深圳市实锐泰科技有限公司 | Manufacturing method of flexible board raised circuit structure and flexible board raised circuit structure |
| WO2022261970A1 (en) * | 2021-06-18 | 2022-12-22 | 庆鼎精密电子（淮安）有限公司 | Circuit board assembly and manufacturing method therefor |
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| GR01 | Patent grant |