CN112038297A - Alumina ceramic part and manufacturing method thereof and manufacturing method of ceramic shell - Google Patents
Alumina ceramic part and manufacturing method thereof and manufacturing method of ceramic shell Download PDFInfo
- Publication number
- CN112038297A CN112038297A CN202010819028.3A CN202010819028A CN112038297A CN 112038297 A CN112038297 A CN 112038297A CN 202010819028 A CN202010819028 A CN 202010819028A CN 112038297 A CN112038297 A CN 112038297A
- Authority
- CN
- China
- Prior art keywords
- ceramic
- alumina
- porcelain
- electroplating
- piece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/14—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by boring or drilling
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/10—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on aluminium oxide
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
- C04B41/81—Coating or impregnation
- C04B41/85—Coating or impregnation with inorganic materials
- C04B41/88—Metals
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/60—Aspects relating to the preparation, properties or mechanical treatment of green bodies or pre-forms
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/60—Aspects relating to the preparation, properties or mechanical treatment of green bodies or pre-forms
- C04B2235/612—Machining
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Mining & Mineral Resources (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Coils Or Transformers For Communication (AREA)
Abstract
The invention provides an alumina porcelain piece and a manufacturing method thereof, and a manufacturing method of a ceramic shell, wherein the alumina porcelain piece comprises a plurality of layers of ceramic chips which are laminated, compacted and sintered into a whole, each layer of ceramic chip is printed with a plurality of metalized patterns, each layer of ceramic chip is provided with a plurality of metalized interconnecting holes which are respectively communicated with the metalized patterns correspondingly, each metalized pattern on the adjacent layer of ceramic chip is communicated into a plurality of interconnecting networks through the corresponding metalized interconnecting holes, one or more layers of ceramic chips are printed with a plurality of electroplating wires which are respectively communicated with the interconnecting networks correspondingly, the electroplating wires extend to the edge of the ceramic chip from the metalized interconnecting holes, and the edge of the ceramic chip is provided with an edge cutting area which is removed after the electroplating of the ceramic shell is finished; and the conducting lines are printed in the trimming area on the ceramic chip printed with the electroplating lines and conduct all the electroplating lines in the trimming area. The invention also provides a manufacturing method of the alumina ceramic part and the ceramic shell.
Description
Technical Field
The invention belongs to the technical field of ceramic packaging, and particularly relates to an alumina ceramic part and a manufacturing method thereof, and a manufacturing method of a ceramic shell.
Background
The ceramic shell is made of an alumina ceramic piece, and when the alumina ceramic piece is subjected to an electroplating process, all passages in the alumina ceramic piece are required to be in a conducting state.
With the increasing integration degree of integrated circuits, the wiring inside the ceramic shell is also more dense, under the condition of unchanged volume of the ceramic shell, the width of a single wire body of the wiring is inevitably reduced and the gap between adjacent wire bodies is reduced due to the increase of the wiring density, at present, the wiring width can be reduced to 60 μm along with the increase of the wiring density, which puts forward a higher requirement on the wiring printing difficulty, once the conduction between all the passages is poor due to the printing defect, the plating uniformity of the subsequent electroplating process can be influenced, and because the ceramic is a brittle material, the phenomenon of porcelain colliding and colliding with the porcelain is easy to occur in the process circulation, so that the edge of the ceramic body is provided with a notch, if the notch is the leading-out position of the electroplating wire, the conduction failure of the electroplating wire to each passage can be caused, so that the subsequent electroplating process can not be smoothly carried out, affecting the yield of the product.
Disclosure of Invention
The invention aims to provide an alumina ceramic part, a manufacturing method thereof and a manufacturing method of a ceramic shell, and aims to solve the problem that the yield of the ceramic shell in an electroplating plating process is low due to failure of an electroplating line of the alumina ceramic part in the prior art.
In order to achieve the purpose, the invention adopts the technical scheme that: providing an alumina porcelain piece, which comprises a plurality of layers of porcelain pieces which are laminated, compacted and sintered into a whole, wherein a plurality of metalized patterns are printed on each layer of porcelain piece, a plurality of metalized interconnection holes which are respectively communicated with the metalized patterns are formed in each layer of porcelain piece, each metalized pattern on the porcelain piece of the adjacent layer is respectively communicated into a plurality of interconnection networks through the corresponding metalized interconnection hole, a plurality of plating wires which are respectively communicated with the interconnection networks are printed on one or more layers of porcelain pieces, the plating wires extend to the edge of the porcelain piece from the metalized interconnection holes, and the edge of the porcelain piece is provided with an edge cutting area which is used for removing after the electroplating of a ceramic shell is finished; and the conducting lines are printed in the trimming area on the ceramic chip printed with the electroplating lines and conduct all the electroplating lines in the trimming area.
As another embodiment of the present application, the peripheral wall of the alumina porcelain piece is provided with a metallization layer, and the metallization layer conducts each plating line.
As another embodiment of the present application, the conduction line is located in the middle of the trimming area.
As another embodiment of the present application, the conduction line is located at an outer edge of the trimming region.
In another embodiment of the present application, the conducting lines are spaced apart from each other, and the conducting lines are conducted with each other.
As another embodiment of the present application, the line width of the via is 0.12mm or more.
The alumina porcelain provided by the invention has the beneficial effects that: compared with the prior art, the alumina porcelain piece of the invention conducts all the electroplating lines through the conducting lines in the edge cutting area, so that all the interconnection networks are conducted through all the electroplating lines, and the subsequent electroplating plating process is carried out on the alumina porcelain piece, because the periphery of the porcelain piece is provided with the edge cutting area, the conducting lines are printed in the edge cutting area, after the electroplating plating process is finished, the edge cutting area is cut off, and the printing line width of the conducting lines in the edge cutting area is not influenced by the density degree of wiring, wider conducting lines can be printed, the good conduction quality of each electroplating line is ensured, in addition, because the conducting lines are printed on one or more layers of porcelain pieces, when the porcelain knocking phenomenon occurs on the periphery or the side surface of the alumina porcelain piece, the conduction state among the interconnection networks in the alumina porcelain piece is not influenced, and the subsequent electroplating process can be ensured to be carried out smoothly, the yield is improved.
The invention also provides a manufacturing method of the alumina porcelain, which comprises the following steps:
cutting the raw alumina porcelain strip to obtain a raw alumina porcelain piece;
punching a hole on the alumina green ceramic wafer to obtain an interconnection hole;
carrying out metallization filling on the interconnection holes to obtain metallized interconnection holes;
printing a metallization pattern, an electroplating line and a conducting line on the aluminum oxide green ceramic chip with the obtained metallization interconnection holes;
laminating and compacting the multilayer aluminum oxide green ceramic chips printed with the metalized patterns, the electroplating lines and the conducting lines;
cutting the laminated and compacted multilayer alumina green ceramic chips to obtain alumina green ceramic pieces;
carrying out metallization treatment on the peripheral wall of the alumina green ceramic piece;
and (3) sintering the aluminum oxide green porcelain piece with the metalized peripheral wall at high temperature to obtain the aluminum oxide porcelain piece.
According to the method for manufacturing the alumina ceramic part, the manufactured alumina ceramic part has the same beneficial effects as the alumina ceramic part, and the description is omitted.
The invention also provides a manufacturing method of the ceramic shell, which comprises the following steps:
manufacturing the alumina porcelain piece;
welding metal parts on the alumina porcelain piece to obtain an assembly piece;
performing a plating process on the surface of the assembly to obtain a metal protection layer on the surface of the assembly;
and cutting off the trimming area of the alumina porcelain piece to obtain the ceramic shell.
As another embodiment of the present application, a metal part is welded on an alumina porcelain piece, and an assembly is obtained including: and (3) carrying out nickel electroplating on the aluminum oxide ceramic piece, and welding the metal part and the aluminum oxide ceramic piece subjected to nickel electroplating through alloy solder to obtain the assembly part.
As another embodiment of the present application, performing a plating process on a surface of the assembly to obtain a metal protection layer on the surface of the assembly includes: and sequentially electroplating nickel and gold on the surface of the assembly part to obtain a nickel-gold structure protection layer on the surface of the assembly part.
The manufacturing method of the ceramic shell provided by the invention has the beneficial effects that: the manufacturing of the ceramic shell by the alumina porcelain piece is adopted, the situation that the conduction between each internal interconnection network of the alumina porcelain piece is failed due to the fact that the porcelain is knocked to collide with the porcelain in the flowing process of the alumina porcelain piece among all manufacturing processes of the ceramic shell can be avoided, and therefore the problem that the electroplating plating process of the ceramic shell cannot be smoothly carried out is solved, and the finished product ratio of the ceramic shell is improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed for the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
Fig. 1 is a schematic structural diagram of an alumina porcelain according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of an alumina porcelain according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram three of an alumina porcelain provided in an embodiment of the present invention;
FIG. 4 is a block flow diagram of a method for fabricating a ceramic shell according to an embodiment of the present invention;
fig. 5 is a flow chart of a method for manufacturing an alumina ceramic part according to an embodiment of the present invention.
In the figure: 1. a tile; 2. a trimming area; 3. a metallized interconnect hole; 4. electroplating wires; 5. and (6) a conducting wire.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the present invention more clearly apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Referring to fig. 1 to 3, the alumina porcelain according to the present invention will now be described. The alumina porcelain piece comprises a plurality of layers of ceramic chips 1 which are laminated, compacted and sintered into a whole, wherein a plurality of metalized patterns are printed on each layer of ceramic chip 1, a plurality of metalized interconnection holes 3 which are respectively communicated with the metalized patterns are respectively arranged on each layer of ceramic chip 1, each metalized pattern on the adjacent layer of ceramic chip 1 is respectively communicated into a plurality of interconnection networks through the corresponding metalized interconnection hole 3, a plurality of plating wires 4 which are respectively communicated with the interconnection networks are printed on one or more layers of ceramic chips 1, the plating wires 4 extend from the metalized interconnection holes 3 to the edge of the ceramic chip 1, and the edge of the ceramic chip 1 is provided with an edge cutting area 2 which is used for removing after the electroplating of a ceramic shell is completed; wherein, the trimming area 2 of the ceramic tile 1 printed with the plating lines 4 is printed with the conducting lines 5, and the conducting lines 5 conduct the plating lines 4 in the trimming area 2.
It should be noted that, as the prior art, the inside of the ceramic shell has metallization patterns with different functions, the metallization patterns are printed inside an alumina ceramic part used for manufacturing the ceramic shell, a plurality of metallization patterns with different functions are printed on each ceramic chip 1 forming the alumina ceramic part, each metallization pattern is correspondingly conducted with one or more metallization interconnection holes 3, and the metallization interconnection holes 3 can conduct the metallization patterns with functional interconnection relationship on the adjacent two layers of ceramic chips 1.
The purpose of providing the cut edge region 2 is to connect the respective interconnection networks inside the alumina porcelain by providing the conductive lines 5 during the electroplating process, and after the electroplating process is completed, the cut edge region 2 needs to be cut off, and the conductive lines 5 are also cut off in the cut edge region 2, so that the connection state between the respective interconnection networks is released, and the ceramic case product is obtained.
In addition, it should be noted that, the plating lines 4 are printed on one or more layers of the ceramic tiles 1, and the conducting lines 5 are printed in the trimming area 2 of the ceramic tile 1 printed with the plating lines 4 to conduct the plating lines 4 on the layer, when the plating lines 4 and the conducting lines 5 are printed on the multiple layers of the ceramic tiles 1, since the conducting lines 5 and the plating lines 4 on any layer of the ceramic tile 1 can conduct the interconnection networks, the plating lines 4 and the conducting lines 5 on any layer can be kept conducting as long as the porcelain colliding phenomenon occurs on the alumina ceramic, and thus the conduction of all the interconnection networks can be ensured; when only one layer of the ceramic chip 1 is printed with the electroplating line 4 and the conducting line 5, the layer of the ceramic chip 1 is positioned in the middle of the multiple layers of the ceramic chips 1, so that the phenomenon that the side surface of the alumina ceramic piece collides with the ceramic to damage the electroplating line 4 or the conducting line 5 in the process of sequence conversion is avoided.
Compared with the prior art, the alumina porcelain piece provided by the invention has the advantages that each electroplated wire 4 is conducted through the conducting wire 5 positioned in the trimming area 2, so that all interconnection networks are conducted through each electroplated wire 4, and a subsequent electroplating coating process is carried out on the alumina porcelain piece, because the periphery of the porcelain piece 1 is provided with the trimming area 2 and the conducting wires 5 are printed in the trimming area 2, after the electroplating coating process is finished, the conduction state among the interconnection networks can be relieved by cutting off the trimming area 2, a ceramic shell finished product is obtained, and the printing line width of the conducting wires 5 in the trimming area 2 is not influenced by the dense degree of wiring, wider conducting wires 5 can be printed, the good conduction quality of each electroplated wire 4 is ensured, in addition, because the conducting wires 5 are printed on each layer of the porcelain piece 1 printed with the electroplated wires 4, when porcelain knocking occurs on the periphery or side surface of the alumina porcelain piece, the conduction state among all the internal interconnected networks is not influenced, so that the subsequent electroplating and plating process can be ensured to be smoothly carried out, and the yield is improved.
Referring to fig. 1, a metallization layer is disposed on the peripheral wall of the alumina ceramic part, and the metallization layer connects the plating lines 4. Each of the plating lines inside the alumina porcelain piece can be conducted through the conducting line 5 on the ceramic chip of the corresponding layer, can also be conducted through the metallization processing layer of locating the alumina porcelain piece perisporium, when the lateral wall of the alumina porcelain piece leads to inside conducting line 5 fracture because the porcelain is collided with seriously to the porcelain, each plating line 4 still can be conducted under the connection of metallization processing layer, thereby ensure the conduction of inside each interconnection network, thereby it can go on smoothly to have guaranteed that subsequent electroplating plating process can go on, conducting line 5 and metallization processing layer can realize the double conduction effect to each plating line 4, the improvement switches on reliability and stability.
As a specific implementation manner of the embodiment of the present invention, please refer to fig. 1, the conducting line 5 is located in the middle of the trimming area 2. Because the alumina porcelain spare flows the in-process between each process of follow-up preparation ceramic package, its corner position takes place to collide with the porcelain phenomenon most easily, set up the lead-through 5 here in the middle part of side cut region 2, can avoid the corner position of alumina porcelain spare, thereby can reduce and collide with the porcelain because of colliding with the porcelain and cause the cracked probability of lead-through 5, guarantee that the conduction between each inside interconnection network of alumina porcelain spare is reliable, guarantee going on smoothly of follow-up electroplating coating technology, improve the yield.
As a specific implementation manner of the embodiment of the present invention, referring to fig. 2, the via 5 is located at the outer edge of the trimming area 2. Because need amputate 5 leading-through wires in the lump when cutting off the side cut region 2 after the electroplating coating technology is accomplished, for ensuring that 5 amputation of leading-through wires is thorough, it is better to make 5 position of leading-through wires apart from the inward flange of side cut region 2 more far away, therefore, 5 leading-through wires set up the outward flange at side cut region 2, can ensure on the one hand to amputate 5 leading-through wires after cutting off side cut region 2 completely, on the other hand also is favorable to improving 5 line width of leading-through wires, thereby improve 5 leading-through wire to the quality of switching on of each electric plate wire 4, and reduce and lead to the probability of conducting failure because of colliding with the porcelain, improve the yield of product.
As a specific implementation manner of the embodiment of the present invention, please refer to fig. 3, a plurality of through lines are provided at intervals, and a plurality of through lines 5 are conducted with each other. Any one conducting wire 5 can conduct each plating line 4, even if one or a plurality of conducting wires 5 are broken by touching porcelain due to colliding with porcelain in the circulation process of the alumina porcelain piece among the working procedures, only one conducting wire 5 is needed to be intact, the smooth proceeding of the subsequent electroplating plating process can be ensured, the influence of the porcelain colliding phenomenon of the alumina porcelain piece on the subsequent electroplating plating process is reduced by the plurality of conducting wires 5, and the yield of products can be improved.
As a specific implementation manner of the embodiment of the invention, the line width of the conducting line 5 is greater than or equal to 0.12 mm. Under the condition that the width of the trimming area 2 is not exceeded, the wider the line width of the conducting lines 5 is, the smaller the printing difficulty is, the more stable and reliable the conduction of each plating line 4 is, the smaller the influence of the porcelain collision phenomenon caused by porcelain collision is, and the higher the yield of the ceramic shell manufactured by the electroplating plating process is.
The invention also provides a method for manufacturing the alumina porcelain, please refer to fig. 1 to 3 and 5, which comprises the following steps:
step S101: cutting the raw alumina porcelain strip to obtain a raw alumina porcelain piece;
step S102: punching a hole on the alumina green ceramic wafer to obtain an interconnection hole;
step S103: carrying out metallization filling on the interconnection holes to obtain metallized interconnection holes;
step S104: printing a metallization pattern, a plating line 4 and a conducting line 5 on the alumina green ceramic chip with the obtained metallization interconnection holes;
step S105: laminating and compacting the multilayer aluminum oxide green ceramic chips printed with the metalized patterns, the electroplating lines 4 and the conducting lines 5;
step S106: cutting the laminated and compacted multilayer alumina green ceramic chips to obtain alumina green ceramic pieces;
step S107: carrying out metallization treatment on the peripheral wall of the alumina green ceramic piece;
step S108: and (3) sintering the aluminum oxide green porcelain piece with the metalized peripheral wall at high temperature to obtain the aluminum oxide porcelain piece.
In this embodiment, the alumina green porcelain tape material adopted in step S101 is obtained by a tape casting process according to a required thickness, and then the obtained alumina green porcelain tape material is cut according to a required size to obtain an alumina green porcelain sheet; in the step S104, the metallization pattern, the plating lines 4 and the conducting lines 5 are printed on the alumina green ceramic chip by printing conductor slurry according to the designed circuit pattern, the positions of the plating lines 4 and the positions of the conducting lines 5, so that the required metallization pattern, the plating lines 4 and the conducting lines 5 are formed, the plating lines 4 extend to the edge of the ceramic chip, and the conducting lines 5 are communicated with the plating lines 4; after the alumina green porcelain piece is metallized in step S107, each plating line 4 can be conducted through the metallization layer, so that each plating line 4 can be conducted with the internal conducting line 5, respectively, thereby forming a dual conducting effect; since the ceramic case is a fired ceramic, the alumina green ceramic is sintered at a high temperature in step S108, and the obtained alumina ceramic is a fired ceramic.
Compared with the prior art, the method for manufacturing the alumina porcelain piece has the advantages that the conducting wires 5 are printed on the alumina green porcelain piece, the plating wires 4 can be conducted through the conducting wires 5, and then the interconnection networks formed by the metallization patterns are conducted, so that an electroplating plating process is carried out when the ceramic shell is manufactured, and the conducting wires 5 are printed on all the layers of the porcelain pieces 1 printed with the plating wires 4 and can conduct all the plating wires 4 with the metallization processing layer, so that the double conduction effect is achieved, the conduction state among the interconnection networks in the alumina porcelain piece is not influenced when the porcelain knocking phenomenon happens on the periphery or the side surface of the alumina porcelain piece, the subsequent electroplating plating process can be smoothly carried out, and the yield is improved.
The invention also provides a manufacturing method of the ceramic shell. Referring to fig. 1 to 5, the method includes the following steps:
step S10: manufacturing the alumina porcelain piece;
step S20: welding metal parts on the alumina porcelain piece to obtain an assembly piece;
step S30: performing a plating process on the surface of the assembly to obtain a metal protection layer on the surface of the assembly;
step S40: and cutting off the trimming area 2 of the alumina porcelain piece to obtain the ceramic shell.
It should be noted that the ceramic housing usually requires welding metal parts such as a metal ring and a heat sink according to its practical requirements, and the assembly in this embodiment refers to an integral body of an alumina porcelain piece and metal parts obtained after welding and assembling are completed.
Compared with the prior art, the method for manufacturing the ceramic shell has the advantages that the aluminum oxide porcelain piece with the conducting wires 5 for conducting the electroplating wires 4 is printed in the trimming area 2 to manufacture the ceramic shell, the problem that the electroplating coating process of the ceramic shell cannot be smoothly carried out due to the fact that the interconnected networks in the aluminum oxide porcelain piece are conducted and lose efficacy because the porcelain is collided with the porcelain in the circulation process of the manufacturing processes of the ceramic shell can be avoided, the trimming area 2 is removed after the electroplating coating process is finished, and the finished product rate of the ceramic shell in the electroplating coating process is high.
As a specific implementation of the embodiment of the present invention, a metal part is welded on an alumina porcelain piece, and an assembly is obtained that includes: and (3) carrying out nickel electroplating on the aluminum oxide ceramic piece, and welding the metal part and the aluminum oxide ceramic piece subjected to nickel electroplating through alloy solder to obtain the assembly part. The aluminum oxide porcelain piece is electroplated with nickel to form a welding metal layer, and then the aluminum oxide porcelain piece is conveniently welded with the metal part, so that the welding is firm and reliable.
As a specific implementation manner of the embodiment of the present invention, performing a plating process on a surface of an assembly to obtain a metal protection layer on the surface of the assembly includes: and sequentially electroplating nickel and gold on the surface of the assembly part to obtain a nickel-gold structure protection layer on the surface of the assembly part. It should be understood that the metal protection layer is only present in the region where the metal parts are welded, and other regions may not be plated with the metal protection layer for cost reduction, and the nickel-gold structure protection layer has good oxidation resistance and corrosion resistance.
As a specific implementation of the embodiment of the present invention, the cutting of the cut-edge area 2 of the alumina porcelain piece to obtain the ceramic shell comprises: after the assembly plating process is completed, the trimming area 2 is ground or cut away to obtain a ceramic shell. The trimming area 2 can be removed by grinding or cutting, the processing is simple and convenient, and the cost is saved.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (10)
1. The alumina porcelain piece is characterized by comprising a plurality of layers of laminated, compacted and sintered integrated porcelain pieces, wherein a plurality of metalized patterns are printed on each layer of porcelain piece, a plurality of metalized interconnection holes which are respectively communicated with the metalized patterns are formed in each layer of porcelain piece, each metalized pattern on the adjacent layer of porcelain piece is respectively communicated into a plurality of interconnection networks through the corresponding metalized interconnection hole, a plurality of electroplating wires which are respectively communicated with the interconnection networks are printed on one or more layers of porcelain pieces, and the electroplating wires extend to the edge of the porcelain piece from the metalized interconnection holes; the periphery of the ceramic chip is provided with a trimming area used for removing the ceramic shell after the electroplating is finished; the ceramic chip is printed with the electroplating lines, and the trimming area on the ceramic chip is printed with the conducting lines which conduct the electroplating lines in the trimming area.
2. The alumina porcelain of claim 1, wherein a peripheral wall of the alumina porcelain is provided with a metallization layer, the metallization layer conducting each of the plating lines.
3. The alumina porcelain of claim 1, wherein the feedthrough is located in the middle of the cut edge region.
4. The alumina porcelain of claim 1, wherein the feedthrough is located at an outer edge of the cut edge region.
5. The alumina porcelain according to claim 1, wherein a plurality of the conductive lines are provided at intervals, and the plurality of the conductive lines are in conduction with each other.
6. The alumina porcelain according to any one of claims 1 to 5, wherein the line width of the via is 0.12mm or more.
7. The manufacturing method of the alumina porcelain piece is characterized by comprising the following steps:
cutting the raw alumina porcelain strip to obtain a raw alumina porcelain piece;
punching holes on the alumina green ceramic wafer to obtain interconnected holes;
carrying out metallization filling on the interconnection hole to obtain a metallization interconnection hole;
printing a metallization pattern, a plating line and a conducting line on the alumina green ceramic chip with the obtained metallized interconnection holes;
laminating and compacting a plurality of layers of the aluminum oxide green ceramic chips printed with the metalized patterns, the electroplating lines and the conducting lines;
cutting the stacked and compacted multiple layers of the alumina green ceramic chips to obtain alumina green ceramic pieces;
carrying out metallization treatment on the peripheral wall of the alumina green ceramic piece;
and sintering the aluminum oxide green porcelain piece with the metalized peripheral wall at high temperature to obtain the aluminum oxide porcelain piece.
8. The manufacturing method of the ceramic shell is characterized by comprising the following steps of:
making an alumina porcelain according to any one of claims 1 to 6;
welding a metal part on the alumina porcelain piece to obtain an assembly piece;
performing a plating process on the surface of the assembly to obtain a metal protection layer on the surface of the assembly;
and cutting off the trimming area of the alumina porcelain piece to obtain the ceramic shell.
9. The method of claim 8, wherein said welding of metal parts to said alumina-ceramic body to obtain an assembly comprises: and electroplating nickel on the aluminum oxide ceramic piece, and welding the metal part and the aluminum oxide ceramic piece subjected to electroplating nickel through alloy solder to obtain the assembly part.
10. The method of claim 8, wherein the plating process on the surface of the assembly to obtain a metal protection layer on the surface of the assembly comprises: and sequentially carrying out nickel electroplating and gold electroplating on the surface of the assembly part to obtain a nickel-gold structure protection layer on the surface of the assembly part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010819028.3A CN112038297B (en) | 2020-08-14 | 2020-08-14 | Alumina ceramic part and manufacturing method thereof and manufacturing method of ceramic shell |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010819028.3A CN112038297B (en) | 2020-08-14 | 2020-08-14 | Alumina ceramic part and manufacturing method thereof and manufacturing method of ceramic shell |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112038297A true CN112038297A (en) | 2020-12-04 |
| CN112038297B CN112038297B (en) | 2022-10-25 |
Family
ID=73577968
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010819028.3A Active CN112038297B (en) | 2020-08-14 | 2020-08-14 | Alumina ceramic part and manufacturing method thereof and manufacturing method of ceramic shell |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112038297B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114634366A (en) * | 2022-02-17 | 2022-06-17 | 福建闽航电子有限公司 | Preparation method of ceramic tube shell based on fiber alumina |
| CN115872783A (en) * | 2022-12-26 | 2023-03-31 | 河北中瓷电子科技股份有限公司 | Method for preparing ceramic tube shell |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3189978A (en) * | 1962-04-27 | 1965-06-22 | Rca Corp | Method of making multilayer circuits |
| US4590095A (en) * | 1985-06-03 | 1986-05-20 | General Electric Company | Nickel coating diffusion bonded to metallized ceramic body and coating method |
| JP2002016347A (en) * | 2000-06-27 | 2002-01-18 | Mitsui Chemicals Inc | Method for manufacturing printed circuit board |
| JP2003318511A (en) * | 2002-04-24 | 2003-11-07 | Kyocera Corp | Multiple-unit wiring board |
| CN1503354A (en) * | 2002-11-19 | 2004-06-09 | ���ǵ�����ʽ���� | Ceramic multi-layer substrate and mfg method thereof |
| JP2005317590A (en) * | 2004-04-27 | 2005-11-10 | Kyocera Corp | Multiple wiring board |
| CN105489559A (en) * | 2015-11-30 | 2016-04-13 | 中国电子科技集团公司第五十五研究所 | Aluminium nitride substrate for microwave power tube and manufacturing method therefor |
| CN109545771A (en) * | 2018-09-14 | 2019-03-29 | 中国电子科技集团公司第五十五研究所 | A kind of highly integrated module level encapsulation nitride multilayer aluminum substrate and its manufacturing method |
-
2020
- 2020-08-14 CN CN202010819028.3A patent/CN112038297B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3189978A (en) * | 1962-04-27 | 1965-06-22 | Rca Corp | Method of making multilayer circuits |
| US4590095A (en) * | 1985-06-03 | 1986-05-20 | General Electric Company | Nickel coating diffusion bonded to metallized ceramic body and coating method |
| JP2002016347A (en) * | 2000-06-27 | 2002-01-18 | Mitsui Chemicals Inc | Method for manufacturing printed circuit board |
| JP2003318511A (en) * | 2002-04-24 | 2003-11-07 | Kyocera Corp | Multiple-unit wiring board |
| CN1503354A (en) * | 2002-11-19 | 2004-06-09 | ���ǵ�����ʽ���� | Ceramic multi-layer substrate and mfg method thereof |
| JP2005317590A (en) * | 2004-04-27 | 2005-11-10 | Kyocera Corp | Multiple wiring board |
| CN105489559A (en) * | 2015-11-30 | 2016-04-13 | 中国电子科技集团公司第五十五研究所 | Aluminium nitride substrate for microwave power tube and manufacturing method therefor |
| CN109545771A (en) * | 2018-09-14 | 2019-03-29 | 中国电子科技集团公司第五十五研究所 | A kind of highly integrated module level encapsulation nitride multilayer aluminum substrate and its manufacturing method |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114634366A (en) * | 2022-02-17 | 2022-06-17 | 福建闽航电子有限公司 | Preparation method of ceramic tube shell based on fiber alumina |
| CN115872783A (en) * | 2022-12-26 | 2023-03-31 | 河北中瓷电子科技股份有限公司 | Method for preparing ceramic tube shell |
Also Published As
| Publication number | Publication date |
|---|---|
| CN112038297B (en) | 2022-10-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5535765B2 (en) | Manufacturing method of ceramic capacitor | |
| CN102543905B (en) | Semiconductor package and method of manufacturing the same | |
| CN112038297B (en) | Alumina ceramic part and manufacturing method thereof and manufacturing method of ceramic shell | |
| US10410960B1 (en) | Parallel seam welding leadless ceramic package | |
| US9999125B2 (en) | Method for fabricating ceramic insulator for electronic packaging | |
| CN103904050A (en) | Package substrate, manufacturing method of package substrate and packaging structure | |
| CN103681593A (en) | Leadless ceramic chip carrier packaging structure and process for manufacturing same | |
| US9338887B2 (en) | Core substrate, manufacturing method thereof, and structure for metal via | |
| CN104589738A (en) | Multilayer ceramic substrate and method for producing the same | |
| JP5559717B2 (en) | Manufacturing method of electronic parts | |
| CN113707634A (en) | Sheet type packaging shell | |
| JP2010283074A (en) | Method for manufacturing substrate, substrate and ceramic substrate | |
| US6461493B1 (en) | Decoupling capacitor method and structure using metal based carrier | |
| CN209544336U (en) | A kind of ceramic packaging substrate compoboard improving flatness | |
| CN213752692U (en) | Packaging base and packaging base combined board | |
| CN111945202B (en) | Blind hole electroplating method for ceramic leadless shell | |
| CN110785003A (en) | Stepped multi-layer PCB structure and preparation method thereof | |
| JP4458933B2 (en) | Multiple wiring board | |
| JP5524680B2 (en) | Manufacturing method of capacitor for wiring board | |
| CN216600230U (en) | Ceramic circuit board | |
| JP2001077498A (en) | Ceramic substrate and manufacture thereof | |
| CN114501848A (en) | PCB with side wall interconnection function and manufacturing method thereof | |
| CN115274567A (en) | Ceramic shell and preparation method thereof | |
| TW202117941A (en) | Printed circuit board | |
| TWM511121U (en) | Passive component with the terminal electrode |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |