TWM511121U - Passive component with the terminal electrode - Google Patents

Description

Passive component with terminal electrodes

The present invention relates to a passive component, and more particularly to a passive component having a terminal electrode.

For example, an inductor of a passive component currently on the market can be mainly classified into a thin film, a multilayer, and a wire wound. A laminated inductor 1 (see FIG. 1) and a method of manufacturing the same (see FIGS. 2 to 7) disclosed in Taiwan Patent Publication No. TW 201440090 A (hereinafter referred to as the first example).

The manufacturing method of the laminated inductor 1 includes the following steps: (A) sequentially laminating a first circuit ceramic mother substrate 110, a second circuit ceramic mother substrate 120, and a third circuit ceramic mother from bottom to top. a chip 130, and a fourth circuit ceramic mother chip 140 (shown in FIG. 2); (B) a surface coated with a carrier film 150 of an array of bonding pads 1501 facing the first circuit ceramic mother A first predetermined circuit pattern 1120 of the chip 110 is arranged in an array (as shown in FIG. 3); (C) an array of the pad electrode 1501 is transferred to the first predetermined circuit pattern 1120 on the first circuit ceramic mother substrate 110. Thereby forming an array of first circuit patterns 112 (as shown in FIG. 4); (D) stripping the carrier film 150 (as shown in FIG. 5); (E) sintering the circuit ceramic mother chips 110, 120, 130, 140 to form a collective substrate 100 (shown in FIG. 6), and the thickness of the collective substrate 100 is controlled to be less than 0.6 mm; and (F) to scribe the collective substrate 100 with a scribing tool 160, The collective substrate 100 is divided into a plurality of strip-shaped laminated bodies 10 and the first circuit pattern 112 array in the collective substrate 100 is divided into a plurality of first circuit patterns 112 and constitutes a laminated inductor as shown in FIG. Device 1.

As shown in FIG. 1 , the laminated inductor 1 delineated by the step (F) is sequentially included from bottom to top: a first circuit ceramic piece 11, a second circuit ceramic piece 12, and a third. The circuit ceramic piece 13, and a fourth circuit ceramic piece 14. The first circuit ceramic piece 11 has a non-magnetic body 111 and a first circuit pattern 112 disposed in the non-magnetic body 111 of the first circuit ceramic piece 11. The second circuit ceramic piece 12 and the third circuit ceramic piece 13 respectively have a magnetic body 121, 131, and a second circuit pattern 122 and a third circuit pattern 132 respectively disposed in the magnetic bodies 121, 131 thereof. The fourth circuit ceramic piece 14 has a non-magnetic body 141 and a fourth circuit pattern 142 disposed in the non-magnetic body 141 of the fourth circuit ceramic piece 14.

The laminated inductor 1 is formed by using the circuit patterns 112, 122, 132, and 142 of the circuit ceramic sheets 11, 12, 13, and 14 to form an inner winding type coil. However, in detail, before performing this step (A), a plurality of ceramic mother sheets (not shown) are sequentially formed to form a plurality of through holes for each ceramic mother sheet, and are filled in the respective through holes. The conductive paste is used to form a plurality of conductive conductors, and a conductive paste is applied on each of the ceramic mother sheets to form a plurality of circuits such as circuit patterns 112, 122, 132, and 142, so that the circuit ceramic mother sheets 110, 120, and 130 can be obtained. 140. In addition, after performing the sintering of this step (E) The appearance of the layered body 10 of each laminated inductor 1 can be obtained only after the characterization of the step (F).

In the case of the process surface, the coils constituting the inner winding type are subjected to four through-hole programs, four-way filling conductive paste programs, and four coated conductive pastes to form respective circuit patterns 112, 122, 132, and 142. The program, with a step (E) of the sintering process and other 13 procedures. Therefore, the production procedure of the first case 1 is rather cumbersome, resulting in an increase in the time and cost required for manufacturing. Furthermore, since the laminated body 10 is obtained by stacking and sintering the circuit ceramic mother sheets 110, 120, 130, and 140, the volume of the laminated inductor 1 (maximum thickness of 0.6 mm) is also The improvement is not conducive to the layout to the board. In addition, since the inner wound coil is composed of circuit patterns 112, 122, 132, and 142 of the circuit ceramic sheets 11, 12, 13, and 14, the circuit patterns 112, 122, 132, and 142 are different. Continuous interfaces tend to produce non-ohmic contacts or increase impedance to create additional Joule-heating, which is detrimental to the operation of the inductor.

In the manufacturing method of a thin film inductor, it is usually a five-step process such as a lower layer coil forming step, an intermediate layer forming step, a top electrode forming step, a bottom electrode forming step, and a protective layer forming step. To initially complete a thin film inductor array. In detail, the lower layer coil forming step, the top electrode forming step, and the bottom electrode forming step respectively require ten, six, and six passes, and the process is rather cumbersome.

In addition, the thin film inductor array still needs to undergo a laser cut Cutting the program to form a plurality of longitudinal slits and lateral slots which are staggered with each other on the thin film inductor array, and then break the thin film inductor array along each longitudinal slit to form a plurality of strip inductor arrays ( Called strip stripping procedure; stick breaking). After the strip stripping process is performed, the end face filming process is continued on the end faces of the opposite two long sides of each strip inductor array to form two longitudinal end electrodes. Then, each transverse slot on each strip of inductor array is broken so that each strip of inductor array becomes a majority of granular bodies (called chip breaking), and the strip inductors are in situ. After the longitudinal end electrodes of the array are detached by granularity, they become the two longitudinal end electrode regions of each granule. Finally, a plating process is performed on the remaining two end faces of each granule to form a lateral electrode region on the remaining two end faces of each granule, so that the two longitudinal end electrode regions of each granule are common to the two lateral electrode regions. One of the opposite ends of the thin film inductor is formed. In this way, each of the thin film inductors can be passed through a surface mounting technology (SMT) to be bonded to a plurality of contacts on a circuit board for downstream manufacturers.

According to the detailed description of the manufacturing method of the above-mentioned thin film inductor, it is known that the formation of the thin film inductor array requires at least twenty-two steps or more. In particular, it is difficult for the opposite electrodes of the thin film inductors to be completed in the same process, which still requires a laser cutting process, a strip peeling process, a face filming process, a grain stripping process, and a plating process. The procedure is less effective for mass production.

It can be seen from the above description that simplifying the manufacturing method of the passive component and its terminal electrode to reduce the manufacturing cost is a related technical person in the technical field. The problem to be solved.

Therefore, it is an object of the present invention to provide a passive component having a terminal electrode.

Thus, the novel passive component having a terminal electrode comprises: a body, a component layer, and a pair of terminal electrodes. The body is formed by etching or stamping a substrate and includes a contoured surface. The contour surface has a top surface area and a bottom surface area disposed oppositely, a first end surface area and a second end surface area disposed oppositely, and a front area and a back side area disposed oppositely. The first end face region is coupled to the front face region, the top face region, the back face region and the bottom face region, and the second end face region is coupled to the front face region, the top face region, the back face region and the bottom face region To make the subject unity. The component layer is disposed on the body. The pair of opposite electrodes are not in contact with each other and are electrically connected to the element layer, respectively, and have at least two blocks, respectively. The two blocks of one of the opposite end electrodes are located in the first end face region of the main body, and are located in the top end region adjacent to the first end region and the bottom surface region adjacent to the first end face region Or one of the two opposite ends of the opposite end electrode is located in the second end face region of the main body and located adjacent to the top end region of the second end face region and adjacent to the second block One of the bottom regions of the end face region. The two blocks of the terminal electrodes are plated in the same step.

The effect of the novel is that the main body of the unitary structure can be plated on the three-dimensional contour surface of the main body in the same step, and the two parts of the opposite end electrode are plated. Strong structure High degree.

2‧‧‧ Passive components with terminal electrodes

20‧‧‧Substrate

200‧‧‧Base

201‧‧‧ upper surface

202‧‧‧lower surface

203‧‧‧ contour surface

204‧‧‧First side edge

205‧‧‧second side edge

21‧‧‧ Subject

210‧‧‧ contour surface

211‧‧‧Top area

212‧‧‧ bottom area

213‧‧‧First end zone

214‧‧‧second end zone

215‧‧‧ front area

216‧‧‧Back area

22‧‧‧Connecting Department

220‧‧‧ contour surface

221‧‧‧ first end

222‧‧‧ second end

2221‧‧‧ Groove

23‧‧‧Component layer

231‧‧‧ bottom electrode

232‧‧‧Dielectric layer

233‧‧‧ top electrode

24‧‧‧ terminal electrode

241‧‧‧ Block

25‧‧‧Preform

31‧‧‧Upper photoresist layer

310‧‧‧ appearance shape

32‧‧‧ lower photoresist layer

320‧‧‧ appearance shape

41‧‧‧Precursor layer for line

411‧‧‧Local area

42‧‧‧Precursor layer for terminal electrodes

421‧‧‧Local area

51‧‧‧Circuit photoresist layer

511‧‧‧Line pattern area

52‧‧‧Photoresist layer for terminal electrodes

521‧‧‧End electrode pattern area

7‧‧‧ boards

71‧‧‧Contacts

72‧‧‧ solder

X‧‧‧ first direction

Y‧‧‧second direction

Other features and effects of the present invention will be apparent from the following description of the drawings, wherein: FIG. 1 is an exploded perspective view showing a layer disclosed by the Taiwan Patent Publication No. TW 201440090 A. Figure 2 is a cross-sectional view showing a step (A) of the method of manufacturing the laminated inductor; Figure 3 is a cross-sectional view showing a step (B) of the method of manufacturing the laminated inductor; 4 is a cross-sectional view showing a step (C) of the method of manufacturing the laminated inductor; FIG. 5 is a cross-sectional view showing a step (D) of the method of manufacturing the laminated inductor; FIG. 7 is a cross-sectional view showing a step (F) of the manufacturing method of the laminated inductor; FIG. 8 is a perspective view showing a step (F) of the manufacturing method of the laminated inductor; A first embodiment of a passive component having a terminal electrode; FIG. 9 is a perspective view showing a second embodiment of the passive component having a terminal electrode; FIG. 10 is a top plan view showing the novel An embodiment having a terminal electrode Step (a) of one of the mass production methods of passive components; Figure 11 is a perspective view showing a preform formed by the step (a) of the mass production method of the first embodiment of the present invention; and Figure 12 is a top plan view showing the mass production of the first embodiment of the present invention The method is a detailed operation of the step (a); FIG. 13 is a cross-sectional view taken from the line XIII-XIII of FIG. 12; and FIG. 14 is a top plan view showing the amount of the first embodiment of the present invention. The production method is carried out by wet etching (a); FIG. 15 is a cross-sectional view taken from the line XV-XV of FIG. 14; FIG. 16 is a perspective view showing the first One step (b11) of step (b) of the mass production method of the embodiment; FIG. 17 is a perspective view showing a step (b12) of the step (b) of the mass production method of the first embodiment of the present invention. Figure 18 is a perspective view showing the first step (b13) of the step (b) of the mass production method of the first embodiment of the present invention; Figure 19 is a perspective view showing the amount of the first embodiment of the present invention One step (b') of the production method; FIG. 20 is a perspective view showing the first embodiment of the present invention One step (c) of the mass production method; FIG. 21 is a perspective view showing one step (d) of the mass production method of the first embodiment of the present invention; FIG. 22 is a perspective view showing the first embodiment of the present invention One step (e) of the mass production method; FIG. 23 is a perspective view showing one step (e') of the mass production method of the first embodiment of the present invention; Figure 24 is a top plan view showing one step (f) of the mass production method of the first embodiment of the present invention; Figure 25 is a front elevational view showing the first embodiment of the present invention bonded to the surface by adhesion technique (SMT) FIG. 26 is a perspective view showing one step (d) of the mass production method of the second embodiment of the present invention; FIG. 27 is a perspective view showing the second embodiment of the present invention. One step (e) of the mass production method; FIG. 28 is a perspective view showing a step (e') of the mass production method of the second embodiment of the present invention; FIG. 29 is a cross-sectional view showing the novel end A third embodiment of the passive component of the electrode; FIG. 30 is a perspective view showing a first step (b21) of step (b) of one of the mass production methods of the third embodiment of the present invention; FIG. 31 is a perspective view of A first step (b22) of the step (b) of the mass production method of the third embodiment of the present invention; FIG. 32 is a perspective view showing the step (b) of the mass production method of the third embodiment of the present invention. One step (b23).

Before the present invention is described in detail, it should be noted that in the following description, similar elements are denoted by the same reference numerals.

Referring to FIG. 8, a first embodiment of the passive component 2 having a terminal electrode includes a body 21, a component layer 23, and a pair of terminal electrodes 24.

The body 21 is formed by etching or stamping a substrate (not shown) and includes a contoured surface 210. The contour surface 210 has a top surface area 211 and a bottom surface area 212 disposed oppositely, a first end surface area 213 and a second end surface area 214 disposed opposite thereto, and a front surface area 215 and a back surface area 216 disposed opposite thereto. The first end face region 213 is coupled to the front face region 215, the top face region 211, the back face region 216 and the bottom face region 212, and the second end face region 214 is coupled to the front face region 215, the top face region 211 The back surface area 216 and the bottom surface area 215 are such that the main body 21 is integrated.

It should be additionally noted here that the passive component 2 having the terminal electrode is mainly mass-produced through a microelectromechanical system (MEMS) process. Therefore, the above-mentioned one is defined as a unitary structure. Further, the so-called integral structure means that the main body 21 is formed by etching or stamping a bulk matter, so that the main body 21 has a high structural strength and there is no problem of interlayer peeling inside. The block may be a plate-like block such as a quartz wafer. A related mass production method of the passive component 2 having the terminal electrode of the present invention will be described later.

The element layer 23 is disposed on the body 21. In the first embodiment of the present invention, the element layer 23 is exemplified by a coil as shown in FIG. 8, but is not limited thereto. The element layer (that is, the coil) 23 is surrounded by the front area 215 of the main body 21, the top surface area 211, the back surface area 216 and the bottom surface area 212, and the opposite ends of the element layer 23 are respectively connected At the opposite end electrode 24. In other words, the passive component 2 of the first embodiment of the present invention can be an inductor or a resistor. In the first embodiment of the present invention, the passive component 2 having the terminal electrode is exemplified by an inductor.

The opposite end electrodes 24 are not in contact with each other and are electrically connected to the element layer 23, respectively, and have at least two blocks 241 connected to each other. The two blocks 241 of the one of the pair of end electrodes 24 are located in the first end face region 213 of the main body 21, and are located adjacent to the top end region 211 of the first end region 213, and adjacent to the first One of the bottom regions 212 of the end regions 213, the other of the pair of electrodes 24, the second block 214, located in the second end face region 214 of the body 21, and adjacent to the first The top surface region 211 of the two end region 214 and one of the bottom surface regions 212 adjacent the second end region 214. In the first embodiment of the present invention, the two blocks 241 of one of the pair of terminal electrodes 24 (see the terminal electrode 24 shown on the left side of FIG. 8) are respectively located in the first end face region of the body 21. 213 and the bottom surface region 212 adjacent to the first end region 213, and the other of the opposite end electrodes 24 (see the terminal electrode 24 shown on the right side of FIG. 8) are located in the main body The second end face region 214 of the second end region 214 is adjacent to the bottom end region 212 of the second end region 214, and the two blocks 241 of the end electrodes 24 are plated in the same step.

Preferably, the main body 21 is made of a magnetic material or a non-magnetic material; the magnetic material is selected from a magnetic metal or a magnetic ceramic material, and the non-magnetic material is selected from a bismuth-based material or a metal. material.

The magnetic metal suitable for the first embodiment of the present invention may be iron (Fe), cobalt (Co) or nickel (Ni). The magnetic ceramic which is suitable for the first embodiment of the present invention may be a ferrite magnet (Fe ₃ O ₄ ) having an inverse spinel structure. For example, when the magnetic material of the body 21 constituting the inductor of the passive component of the first embodiment of the present invention is selected from a ferrite magnet, the inductor of the first embodiment of the present invention is a magnetic core inductor. (magnetic-core inductor). Moreover, the material based on the first embodiment of the present invention may be quartz, germanium wafer (Si wafer), tantalum nitride (Si ₃ N ₄ ) or tantalum carbide (SiC); The metal material of the new first embodiment may be copper (Cu). For example, when the non-magnetic material of the body 21 constituting the inductor of the passive component of the first embodiment of the present invention is selected from quartz; then, the inductor of the first embodiment of the present invention is a hollow core inductor. (air-core inductor).

As can be seen from the detailed description of the above two paragraphs, the material applicable to the main body 21 of the first embodiment of the present invention may be a magnetic material such as a magnetic metal or a magnetic ceramic, or a non-magnetic material such as a bismuth-based material or a metal material. material. However, it is a condition that when the magnetic material is selected from the magnetic metal or the non-magnetic material is selected from the metal material, the contour surface 210 of the main body 21 is covered with an insulating layer (not shown) to prevent the magnetic material from being selected from the metal material. The element layer (i.e., the coil) 23 causes a short circuit problem due to direct contact with the magnetic metal or the metal material.

Referring to FIG. 9, a second embodiment of the passive component 2 having a terminal electrode is substantially the same as the first embodiment, and the difference lies in the region of each terminal electrode 24 of the second embodiment of the present invention. The number of blocks 241 is three. The blocks 241 of one of the pair of electrodes 24 (see the terminal electrode 24 shown on the left side of FIG. 9) are respectively located in the first end face region 213 of the main body 21 adjacent to the first end region 213. The top surface region 211 and the bottom surface region 212 adjacent to the first end region 213, and the other of the pair of terminal electrodes 24 (see the terminal electrode 24 shown on the right side of FIG. 9) are The second end face region 214 of the main body 21, the top end region 211 adjacent to the second end region 214, and the bottom surface region 212 adjacent to the second end region 214 are respectively located.

The mass production method of the first embodiment of the novel passive element 2 having a terminal electrode is a passive electromechanical system (MEMS) process for producing a passive component 2 having a terminal electrode as shown in FIG. The mass production method of the first embodiment of the present invention comprises: a step (a), a step (b), a step (b'), a step (c), a step (d), and a step (e). ), one step (e'), and one step (f).

Referring to Figures 10 and 11, the step (a) is to form the substrate 20 into an array of preforms 25 by an etching method or a stamping method. Each of the preforms 25 has a base 200, at least one connecting portion 22, and a body 21 as described above, which are connected to each other along a first direction X. The bodies 21 in the array of preforms 25 are spaced apart from each other along the first direction X or along a second direction Y that is at a predetermined angle to the first direction X. Each of the susceptor 200 and each of the connecting portions 22 has a contoured surface 203, 220. The contoured surface 203 of each of the pedestals 200 includes a first side edge 204 and a second side edge 205 which are oppositely disposed, and the contoured surface 220 of each connecting portion 22 includes a first end 221 and a second end 222 which are oppositely disposed. . The first end 221 and the second end 222 of each connecting portion 22 are respectively connected to the second side edge 205 of each base 200 and the first end surface region 213 of each main body 21, so that the contour surface 220 of each connecting portion 22 is It is corresponding to the contour surface 210 of each main body 21 and the contour surface 203 of each susceptor 200.

In the mass production method of the first embodiment of the present invention, the material to which the substrate 20 is applied is the same as the main body 21, and no further description is provided herein. The predetermined angle is exemplified by 90 degrees, but is not limited thereto; the preforms 25 in the array of the preforms 25 are arranged along the first direction X as shown in FIG. 10, and The main bodies 21 of the preforms 25 in the array of the preforms 25 are spaced apart from each other along the second direction Y, and the susceptors 200 are connected to each other along the second direction Y; the connecting portions 22 of the pre-forms 25 are The number is two, and the connecting portions 22 of the preforms 25 are spaced apart from each other along the second direction Y, and a width of each connecting portion 22 is decreased along the first direction X.

Preferably, each connecting portion 22 has at least one groove 2221 adjacent to the second end 222 thereof, and each groove 2221 is a top surface area of the contour surface 220 of the connecting portion 22 and a bottom surface area thereof. One extends toward the other of the bottom surface region and its top surface region and is recessed in the second direction Y from the contoured surface 220 of the connecting portion 22. In the mass production method of the first embodiment of the present invention, the number of the grooves 2221 of each connecting portion 22 is two, and one of the two grooves 2221 of each connecting portion 22 (see the groove shown above the FIG. 11). 2221) extending from the top surface area of the contoured surface 220 of the connecting portion 22 toward the bottom surface area thereof, and the other of the two recesses 2221 of each connecting portion 22 (see the recess 2221 shown in the lower part of FIG. 11) is The bottom surface region of the contoured surface 220 of the connecting portion 22 extends toward its top surface region. The purpose of reducing the width of each connecting portion 22 along the first direction X and the recess 2221 located at each connecting portion 22 in the mass production method of the first embodiment of the present invention will be described later.

It should be noted that, in the mass production method of the first embodiment of the present invention, the step (a) is to form the preforms 25 by etching or stamping, mainly depending on the material of the substrate 20.

For example, when the non-magnetic material constituting the substrate 20 is selected from the quartz (refer to FIG. 12, FIG. 13, FIG. 14 and FIG. 15 together), the step (a) is suitable for one of the substrates 20. The surface 201 and the lower surface 202 respectively cover the upper upper photoresist layer 31 and the lower photoresist layer 32; wherein the upper photoresist layer 31 and the lower photoresist layer 32 have the same array of external shapes 310 and 320; After the upper photoresist layer 31 and the lower photoresist layer 32 are covered, the external shape 310 exposed to the upper photoresist layer 31 and the bare photoresist layer 32 are exposed by wet etching. The substrate 20 outside the appearance shape 320 is removed, and an array of preforms 25 as shown in FIG. 10 is rapidly formed, wherein the outer shape 310 of the upper photoresist layer 31 and the lower photoresist layer 32 are formed. The appearance shapes 320 are aligned to each other, and the outlines of the appearance shapes 310, 320 are identical to the top view of the perspective view of the preform 25 as shown in FIG.

In addition, when the substrate 20 is selected from the metal material or the magnetic metal, the step (a) is adapted to pass through a punching mold (not shown) having an array of cavities. A pressing means is applied to the substrate 20. More specifically, the cavity array of the stamping die is disposed facing the upper surface 201 of the substrate 20 to cause the stamping die to break the upper surface 201 and the lower surface 202 of the substrate 20 during the stamping process for the pre-preparation An array of bodies 25 is received in the array of cavities and thereby rapidly forms an array of preforms 25 as shown in FIG. It should be additionally noted here that when the step (a) is to form the array of the preforms 25 by stamping, the grooves 2221 at the respective connecting portions 22 are after stamping, and additionally etched or scribes. The method is formed on each of the connecting portions 22.

In the mass production method of the first embodiment of the present invention, the substrate 20 is exemplified by a quartz substrate. However, it should be additionally noted that when the magnetic material is selected from the magnetic ceramic, the magnetic ceramic must be a magnetic ceramic green, and the step (a) needs to be stamped by the stamping die. a substrate 20 made of a magnetic ceramic green body to form an array of the preforms 25, and sintering the array of the preforms 25 to densify the stamped magnetic ceramic green bodies. The structural strength of the array of preforms 25 is increased.

In the step (b), the element layer 23 is separately provided on each of the main bodies 21. In the mass production method of the first embodiment of the present invention, the passive component 2 is described by taking the inductor as an example; therefore, the component layer 23 is the coil, and as shown in FIG. 16, FIG. 17 and FIG. The step (b) sequentially includes the following steps: a step (b11), a step (b12), and a step (b13). It should be further noted that, when the magnetic material constituting the substrate 20 is selected from the magnetic metal or the non-magnetic material constituting the substrate 20 is selected from the metal material, before the step (b) is performed, It is also necessary to cover the contour surface 210 of each of the main bodies 21 with an insulating layer (not shown) to prevent the problem that the respective element layers (coils) 23 are short-circuited by direct contact with the metal.

Referring to Fig. 16, the step (b11) is to form a wiring precursor layer 41 on the contour surface 210 of each main body 21 (only a single main body 21 and a single-line precursor layer 41 are shown in Fig. 16 as an example).

Referring to FIG. 17 and FIG. 18, the step (b12) is to form a line photoresist layer 51 on the wiring layer 41 for the lines. The line photoresist layer 51 has a plurality of line pattern regions 511, and each of the line pattern regions 511 is correspondingly bare. A partial region 411 of each of the circuit precursor layers 41 is exposed. This step (b13) is to plate the element layer 23 on the partial region 411 of each of the wiring precursor layers 41 and form a coil as described in the first embodiment. 17 and 18 show only a partial region 411 of the single-line precursor layer 41, a single line pattern region 511 of the line photoresist layer 51, and a single element layer 23 as an example.

Preferably, the precursor layer 41 for each of the steps (b11) is an active material layer containing a catalytic metal element such as platinum (Pt), palladium (Pd), gold (Au), silver (Ag) or copper. (active layer), or a conductive seed layer. It should be noted here that when the precursor layer 41 for each line of the step (b11) is the active material layer, the element layers 23 of the step (b13) are plated by electroless plating. On the partial regions 411 of the precursor layers 41 of the respective lines; when the precursor layers 41 for the respective lines of the step (b11) are the conductive seed layers, the component layers 23 of the step (b13) are This partial region 411 of each of the wiring precursor layers 41 is plated by electroplating. In the mass production method of the first embodiment of the present invention, when the precursor layer 41 for each of the steps (b11) is the conductive seed layer, and the component layers 23 of the step (b13) are plated. The method is plated on the partial region 411 of each of the wiring precursor layers 41.

Referring to FIG. 17, FIG. 18 and FIG. 19, the step (b) is to remove the photoresist layer 51 for the line and the line pattern region 511 of the photoresist layer 51 for each of the circuit precursor layers 41. A remaining area covered.

Referring to FIG. 20, the step (c) is to form the precursor layer 42 for the one end electrode on the contour surface 210 of each body 21 (FIG. 20 shows only a single body). 21 and the single-end electrode precursor layer 42 are taken as an example for explanation).

Referring to FIG. 21, the step (d) is to form a photoresist layer 52 for an end electrode on the precursor layer 42 for the terminal electrodes, and the photoresist layer 52 for the terminal electrode has a plurality of pairs of terminal electrode pattern regions 521. Each of the pair of electrode pattern regions 521 is a two-part region 421 in which the precursor layers 42 for the respective end electrodes are exposed. One of the two partial regions 421 of the precursor electrode layer 42 (see the partial region 421 shown on the left side of FIG. 21) corresponds to the first end face region 213 of each body 21, and at least corresponds to The top surface region 211 of each of the main bodies 21 adjacent to the first end face region 213 and the bottom surface region 212 adjacent to the first end face region 213 thereof are each of the two partial regions 421 of the precursor electrode layer 42 for each end electrode. The other (see the partial area 421 shown on the right side of FIG. 21) corresponds to the second end face region 214 of each main body 21, and at least corresponds to the top surface area of each main body 21 adjacent to the second end face region 214 thereof. 211 is adjacent to one of the bottom surface regions 212 of the second end face region 214. Similarly, FIG. 21 also shows only a partial region 421 of the single-end electrode precursor layer 42 and a single-end electrode pattern region 521 of the terminal electrode photoresist layer 52 as an example.

In the mass production method of the first embodiment of the present invention, one of the two partial regions 421 of each of the end electrode precursor layers 42 (see the partial region 421 shown on the left side of FIG. 21) is correspondingly located in each body. The first end face region 213 of 21 is adjacent to the bottom face region 212 of the first end face region 213, and the other of the two partial regions 421 of the precursor layer 42 for each end electrode (see the right side shown in FIG. 21) The partial area 421) corresponds to the bottom surface of the second end surface region 214 of each main body 21 and the bottom surface of the second end surface area 214. Area 212.

Referring again to FIG. 21 and referring to FIG. 22, the step (e) is to apply a pair of the pair of terminal electrodes 24 as shown in FIG. 8 to the two partial regions 421 on the precursor layer 42 for each terminal electrode.

The material to which each of the terminal electrode precursors 42 of the step (c) is applied is substantially the same as the step (b11), and the means to which the step (e) is applied is substantially the same as the step (b13). In the mass production method of the first embodiment of the present invention, the precursor layer 42 for each end electrode of the step (c) is the active material layer, and the step (e) is plated at each end by electroless plating. The two second partial regions 421 of the precursor layer 42 for the electrodes.

Referring to FIG. 21 and FIG. 22 together with FIG. 23, the step (e') is to remove the photoresist layer 52 for the terminal electrode and the photoresist layer 42 for the terminal electrode 42 for each of the terminal electrodes. A remaining area covered by the end electrode pattern regions 521, thereby leaving a pair of end electrodes 24 on each of the main bodies 21, and opposite ends of the respective element layers 23 are correspondingly connected to the opposite end electrodes 24 (Fig. 23 also Only a single body 21, a single element layer 23 and a single counter electrode 24 are shown as an example. Preferably, each of the opposite electrode 24 of the step (e) contains nickel (Ni) and a metal selected from the group consisting of gold and tin (Sn).

According to the detailed description of the step (d) and the step (e), the mass production method of the first embodiment of the present invention can simultaneously directly plate the pair of end electrodes 24 in the single step of the step (e). The two blocks 241 do not need to be completed in the same process as the terminal electrodes of the thin film inductor.

Referring to FIG. 24, the step (f) is to apply an external force from the top to the bottom or from the bottom to the top of the connecting portion 22, so that the connecting portions 22 are respectively The two ends 222 are broken from the first end face regions 213 of the respective bodies 21, thereby detaching the main bodies 21 from the respective connecting portions 22 to produce the passive elements 2 having the terminal electrodes as shown in FIG.

According to the detailed description of the mass production method of the first embodiment, the purpose of the width of each preform 22 decreasing along the first direction X and the groove 2221 located at the connecting portion 22 of each preform 25 is that When the mass production method is performed, the utility of the step (f) is facilitated by being broken by the external force to achieve mass production. It should be noted that, in the mass production method of the first embodiment of the present invention, the step (f) is exemplified after the step (e') is performed; however, the step (f) It may be performed before the step (e'), and is not limited to the embodiment.

In addition, it is worth mentioning here (with reference to FIG. 25) that the passive element 2 having the terminal electrode of the first embodiment of the present invention is implemented by surface mount technology (SMT) for bonding to a circuit board 7. In the process of the two contacts 71, the opposite ends of the contacts 71 can be directly aligned with the two contacts 71 so that the two contacts 71 are partially exposed. After the contact and the contact with the opposite electrode 24, the two blocks 241 of the opposite electrode 24 are precisely bonded to the two contacts 71 on the circuit board 7 through the two solders 72.

Referring to FIG. 26, FIG. 27 and FIG. 28, the mass production method of the second embodiment of the passive component 2 having a terminal electrode is a passive component having a terminal electrode as shown in FIG. 9 by a MEMS process. 2. The mass production method of the second embodiment of the present invention is substantially the same as the first embodiment, and the difference is that, as shown in FIG. 26, the terminal electrodes of the step (d) are as shown in FIG. One of the two partial regions 421 of the precursor layer 42 (see the partial region 421 shown on the left side of FIG. 26) corresponds to the first end face region 213 of each body 21 adjacent to the first end face region 213 thereof. The top surface area 211 is adjacent to the bottom surface area 212 of the first end surface area 213, and the other of the two partial areas 421 of the front electrode precursors 42 (see the partial area 421 shown on the right side of FIG. 26) is Corresponding to the second end face region 214 of each main body 21, the top surface area 211 adjacent to the second end surface 214 and the bottom surface area 212 adjacent to the second end surface 214 thereof, so that the end electrodes plated in the step (e) are respectively 24 (see Fig. 27) after performing this step (e') (see Fig. 28), is the counter electrode 24 as shown in Fig. 9.

Referring to FIG. 29, a third embodiment of the passive component 2 of the present invention having a terminal electrode is substantially the same as the first embodiment except that the component layer 23 has a top formed on the body 21. a bottom electrode 231 of the surface region 211 and the first end surface region 213, a dielectric layer 232 formed on the bottom electrode 231, and a dielectric layer 232 formed on the dielectric layer 232 and the second end surface region 214 of the main body 21. Top electrode 233. The bottom layer 231 and the top electrode 233 are not in contact with each other, and the bottom electrode 231 and the top electrode 232 of the element layer 23 are respectively connected to the opposite electrode 24. In this embodiment, the passive component 2 having the terminal electrode is a capacitor.

Referring to FIG. 30, FIG. 31 and FIG. 32, the mass production method of the third embodiment of the passive component 2 having a terminal electrode is based on a MEMS process to produce a passive component having a terminal electrode as shown in FIG. 2. The mass production method of the third embodiment of the present invention is substantially the same as the first embodiment, and the difference is that the step (b) sequentially includes the following steps: one step Step (b21), one step (b22), and one step (b23).

As shown in FIG. 30, the step (b21) is to form the bottom electrode 231 on the top surface region 211 of each main body 21 and the first end surface region 213. As shown in FIG. 31, the step (b22) is to form the dielectric layer 232 on each of the bottom electrodes 231 and the top surface region 211 of each of the main bodies 21. As shown in FIG. 32, the step (b23) is to form the top electrode 233 on each of the dielectric layers 232 and the second end face region 214 of each of the main bodies 21. It should be noted that each of FIGS. 30 to 32 only shows a single body 21, a single bottom electrode 231, a single dielectric layer 232, and a single top electrode 233 as an example. In the mass production method of the third embodiment of the present invention, the dielectric layer 232 of each element layer 23 has its bottom electrode 231 and its top electrode 233 not in contact with each other. In addition, in the mass production method of the third embodiment of the present invention, after the step (b) is completed, the bottom electrode 231 of each component layer 23 is further completed after the steps (c) to (e) are sequentially completed. The top electrodes 233 are respectively connected to the respective pair of terminal electrodes 24.

First of all, according to the detailed description of the mass production method of the various embodiments of the present invention, it can be seen that, in the example of the manufacturing process of the coil of the inductor, the present invention only needs to pass through the step (a), the step (b11), and the step ( B12), the step (b13) and the step (e'), and the like, the component layers (that is, the coils of the inductor) 23 as shown in FIG. 8 or FIG. 9 can be obtained. The mass production method of the first and second embodiments of the present invention does not need to be through the four-hole through-hole procedure, the four-way filling conductive paste program, and the four-way coating conductive paste to form each circuit. The pattern of the patterns 112, 122, 132, and 142, and the sintering process of the step (E), and the like, can constitute the inner winding type of the coil, and the manufacturing process is simple.

In addition, in the first and second embodiments of the present invention, the first and second embodiments of the present invention directly form the respective bodies 21 through the MEMS process, and the main body 21 has high structural strength, unlike FIG. In the case of the laminated inductor 1 shown, there is a problem that the strength is insufficient between the adjacent interfaces of the circuit ceramic sheets 11, 12, 13, and 14. Further, each element layer (i.e., the coil) 23 is directly plated/polished by the wiring precursor layer 41 formed on the contour surface 210 of each of the main bodies 21, and each element layer (coil) 23 is formed. Also in an integrated structure, there is no laminated inductor 1 as shown in FIG. 1, and each circuit pattern 112, 122, 132, 142 generates non-ohmic contact or increases impedance due to a discontinuous interface to generate an additional electrothermal effect. .

Most importantly, in the formation procedure of the terminal electrodes of the passive components, for example, the mass production method of the embodiments of the present invention only needs to simultaneously plate the opposite electrode 24 in a single step (e). These blocks 241, unlike the terminal electrodes of the thin mode inductors mentioned in the prior art, cannot be completed in the same procedure. In terms of the process surface, the new mass production method program is simplified; in terms of cost, the new mass production method can reduce the time cost required for the process due to the simplification of the program.

In summary, the passive component having the terminal electrode directly pre-forms the substrate 20 into the main body 21 with high structural strength and integral structure through the MEMS process, so that the precursor layer 41 and each end of each line are used. The electrode precursor layer 42 can be formed on the three-dimensional contoured surface 210 of each of the main bodies 21, and further in the single step of the steps (b13) and (e), respectively, the precursors for the lines can be used. Layer 41 and precursors for the same electrode Each of the element layers (coils) 23 and the opposite end electrodes 24 are respectively electroplated/chemically plated on the object layer 42; the structural strength is high in terms of the performance of the passive elements, and the manufacturing process is based on the process surface and the cost side. Simplify and reduce the time cost, so it can achieve the purpose of this new type.

However, the above is only the embodiment of the present invention, and when it is not possible to limit the scope of the present invention, all the simple equivalent changes and modifications according to the scope of the patent application and the contents of the patent specification are still This new patent covers the scope.

2‧‧‧ Passive components with terminal electrodes

21‧‧‧ Subject

210‧‧‧ contour surface

211‧‧‧Top area

212‧‧‧ bottom area

213‧‧‧First end zone

214‧‧‧second end zone

215‧‧‧ front area

216‧‧‧Back area

23‧‧‧Component layer

24‧‧‧ terminal electrode

241‧‧‧ Block

Claims (5)

A passive component having a terminal electrode, comprising: a body formed by etching or stamping a substrate and comprising a contoured surface having a top surface region and a bottom surface region disposed opposite to each other An end face region and a second end face region, and a front face region and a back face region disposed opposite to each other, wherein the first end face region is coupled to the front face region, the top face region, the back face region and the bottom face region, and the first end region a second end face region is connected to the front face region, the top face region, the back face region and the bottom face region to make the body integral; a component layer is disposed on the body; and a pair of end electrodes are not in contact with each other Electrically connected to the component layer and respectively having at least two blocks, the two blocks of one of the pair of electrodes being located in the first end face region of the body and located adjacent to the first end region One of the top surface region and the bottom surface region adjacent to the first end region, the two of the opposite end electrodes are located in the second end face region of the main body, and are located adjacent to the first end region The top end area of the second end zone and adjacent to the The bottom surface area of the two ends wherein one zone, the ends of these two electrodes are in the same block channel from plating step. The passive component having a terminal electrode according to claim 1, wherein the number of the blocks of each terminal electrode is three, and the blocks of one of the pair of electrodes are respectively located at the first of the body An end surface region, the top surface region adjacent to the first end region, and the bottom surface region adjacent to the first end region, and the other one of the opposite end electrodes is located in the main body The second end face region, the top face region adjacent to the second end region, and the bottom face region adjacent to the second end region. The passive component having a terminal electrode according to claim 2, wherein the opposite electrode comprises nickel and a group selected from the group consisting of gold and tin; the body is made of a magnetic material or a non-magnetic material. The magnetic material is selected from a magnetic metal or a magnetic ceramic material, and the non-magnetic material is selected from a bismuth-based material or a metal material; but conditionally, when the magnetic material is selected from the magnetic metal Or when the non-magnetic material is selected from the metal material, the contour surface of the body is covered with an insulating layer. The passive component having a terminal electrode according to claim 3, wherein the component layer is a coil, and the component layer surrounds the front area, the top surface area, the back surface area and the bottom surface area of the main body, and The opposite ends of the element layer are respectively connected to the opposite end electrodes. The passive component having a terminal electrode according to claim 3, wherein the component layer has a bottom electrode formed on a top surface region and a first end surface region of the body, and a dielectric layer formed on the bottom electrode. And a top electrode formed on the dielectric layer and on the second end face region of the body, the dielectric layer is such that the bottom electrode and the top electrode do not contact each other, and the bottom electrode and the top of the component layer The electrodes are respectively connected to the opposite end electrodes.